CN223520059U - Plastic packaging equipment for semiconductor chip production - Google Patents

Abstract

This utility model discloses a molding and encapsulation device for semiconductor chip production, including a frame; the frame has a support shaft rotatably connected to its front end, and a rotating frame slidably connected to the middle of the outer arc surface of the support shaft. Lower molds are provided inside both the front and rear ends of the rotating frame. A slide bar is slidably connected inside the upper end of the frame, and the lower end of the slide bar is fixedly connected to the upper surface of a filling shell. An upper mold is provided at the lower end of the filling shell. Two lower molds are configured to cooperate with the upper mold. A support frame is slidably connected to the outside of the slide bar, and evenly distributed circular shafts are provided on the lower surface of the support frame. This molding and encapsulation device for semiconductor chip production has two lower molds that can rotate and change positions. While molding, the other lower mold can perform material handling and preparation work, improving the molding and encapsulation efficiency of semiconductor chips. The flow channel is cut off above the upper mold by the circular shafts, reducing waste generation and making it convenient to use.

Description

Plastic packaging equipment for semiconductor chip production

Technical Field

The utility model relates to the technical field of semiconductor chip production, in particular to plastic packaging equipment for semiconductor chip production.

Background

In the prior art, the patent of the authorized publication number CN 220774285U discloses a semiconductor chip plastic package device, which comprises a fixed flat plate, a plastic package power unit, a chip fixing unit and a heating component fixing flat plate, wherein the upper side surface of the semiconductor chip plastic package device is provided with the plastic package power unit, the heating component is arranged on the bottom surface of the inner bottom of a fixed shell in the plastic package power unit, four corners of the lower side surface of the fixed flat plate are respectively and fixedly connected with a supporting leg chip fixing unit, the supporting leg chip fixing unit comprises a supporting fixing rod, a clamping plate, a lower plastic package mould, a sealing groove, an upper plastic package mould, a feeding pipeline and a sealing strip, the plastic package mould is convenient to detach and replace, the chip plastic package is not influenced, after plastic package is carried out, the plastic package device is more convenient to overhaul, but only one lower plastic package mould is required to take and put materials for a certain time in the processing process, the processing efficiency is further provided with a space which is lack of a plugging structure, and materials in the runner are in a communicating state with the materials in the mould when being solidified, projections are easy to be generated after solidification, and later-stage needs to be removed.

Disclosure of utility model

The utility model aims to overcome the prior art, and provides a plastic packaging device for semiconductor chip production, which is provided with two lower dies capable of rotating to change positions, and the other lower die can perform material taking and discharging preparation work during plastic packaging, so that the plastic packaging efficiency of the semiconductor chip is improved, the flow passage is cut off above the upper die through a circular shaft, the generation of waste is reduced, the use is convenient, and the problems in the background art can be effectively solved.

In order to achieve the aim, the utility model provides the technical scheme that the plastic packaging equipment for producing the semiconductor chip comprises a rack;

The frame, the front end is rotated and is connected with the back shaft, the middle part sliding connection of back shaft extrados has the swivel mount, the inside at both ends all is equipped with the lower mould around the swivel mount, the inside sliding connection of frame upper end has the draw runner, the lower extreme and the upper surface fixed connection of adding the material shell of draw runner, the lower extreme of adding the material shell is equipped with the mould, two lower moulds all cooperate with the upper mould to set up, the outside sliding connection of draw runner has the support frame, the lower surface of support frame is equipped with evenly distributed's circle axle, a plurality of circle axles all run through and add the material shell and all cooperate with the discharge opening of upper mould upper surface to set up, two lower moulds are by rotating the position of changing, the semiconductor chip is moulded with upper mould closure in turn, and then another lower mould can get material and put the preparation work in the plastic envelope, the efficiency of semiconductor chip has been promoted, cut off through circle axle convection current way in the top of upper mould, the production of convenient to control epoxy is discharged and is cut off in step, the convenience of use is good.

Further, the inside of frame front end is equipped with the PLC controller, and the external power source is connected to the input electricity of PLC controller, makes things convenient for the automatic control of electrical apparatus.

Further, the lower extreme of back shaft is equipped with the worm wheel, and the inside lower extreme of frame rotates and is connected with the worm, and the inside lower extreme of frame is equipped with the motor, and the output shaft of motor and the rear end fixed connection of worm, the output of PLC controller is connected to the input electricity of motor, the rotation of convenient control back shaft.

Further, the middle part of the outer cambered surface of the support shaft is provided with a pin shaft, the pin shaft is in sliding connection with a long sliding hole in the middle part of the rotating frame, the middle part of the outer cambered surface of the support shaft is movably sleeved with a spring, and the spring is positioned between the upper surface of the front end of the frame and the rotating frame, so that the rotating frame and the support shaft can synchronously rotate.

Further, the upper end of draw runner is equipped with big electric putter, and big electric putter's flexible end and the last fixed surface of frame are connected, and the output of PLC controller is connected to big electric putter's input electricity, the upper and lower removal of convenient control draw runner.

Further, the middle part of draw runner is equipped with little electric putter, and little electric putter's flexible end and the last fixed surface of support frame are connected, and the output of PLC controller is connected to little electric putter's input electricity, the convenient reciprocates of control support frame.

Further, the middle part of frame is equipped with electric heating piece one, and electric heating piece one is located the below of the lower mould of rear side, and electric heating piece one's front end is equipped with temperature sensor two, and the output of PLC controller is connected to electric heating piece one's input electricity, and the input of PLC controller is connected to temperature sensor two's output electricity, heats the solidification efficiency that promotes.

Further, the left and right sides of adding the material shell upper surface is equipped with electric heating piece two, and the middle part of adding the material shell upper surface is equipped with temperature sensor one, and the output of PLC controller is connected to electric heating piece two's input electricity, and the input of PLC controller is connected to temperature sensor one's output electricity, heats the viscosity that reduces epoxy, promotes mobility.

Compared with the prior art, the plastic packaging equipment for producing the semiconductor chip has the following advantages that:

1. The lower die is provided with two lower dies which can rotate to change positions, and the lower dies are alternately closed with the upper dies to carry out plastic packaging on the semiconductor chips, so that the other lower dies can carry out material taking and discharging preparation work while plastic packaging is carried out, and the plastic packaging efficiency of the semiconductor chips is improved.

2. The upper part of the upper die is cut off through the circular shaft, so that the synchronous discharge and the cut-off of the epoxy resin are conveniently controlled, the addition and the solidification of the epoxy resin in the die cavity are convenient, the generation of waste materials is reduced, and the convenience of plastic packaging equipment in the production of semiconductor chips is improved.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic cross-sectional view of the right side of the present utility model;

fig. 3 is an enlarged schematic view of the structure of the present utility model at a.

In the drawing, a frame 1, a supporting shaft 2, a rotating frame 3, a lower die 4, a sliding bar 5, a material adding shell 6, an upper die 7, a round shaft 8, an electric heating plate II, a temperature sensor I10, a supporting frame 11, a small electric push rod 12, a large electric push rod 13, a worm 14, a worm wheel 15, a motor 16, a pin shaft 17, a spring 18, a PLC controller 19, an electric heating plate I20 and a temperature sensor II 21 are arranged.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to FIGS. 1-3, the embodiment provides a technical scheme that a plastic package device for semiconductor chip production comprises a frame 1;

Frame 1: the front end of the semiconductor chip packaging machine is rotationally connected with a supporting shaft 2, the middle part of the outer cambered surface of the supporting shaft 2 is slidingly connected with a rotating frame 3, the inner parts of the front end and the rear end of the rotating frame 3 are respectively provided with a lower die 4, a semiconductor chip is placed in a groove of the lower die 4 on the front side, the inner part of the upper end of a rack 1 is slidingly connected with a sliding strip 5, the lower end of the sliding strip 5 is fixedly connected with the upper surface of a material adding shell 6, the lower end of the material adding shell 6 is provided with an upper die 7, the two lower dies 4 are respectively matched with the upper die 7, a feeding port at the upper end of the material adding shell 6 is connected with an external material injection pump, external epoxy resin is injected into the material adding shell 6, then enters between the upper die 7 and the lower die 4 through a discharging hole at the upper surface of the upper die 7 for packaging the semiconductor chip, the outer part of the sliding strip 5 is connected with a supporting frame 11, the lower surface of the supporting frame 11 is provided with evenly distributed round shafts 8, the round shafts 8 penetrate through the material adding shell 6 and are matched with the discharging holes on the upper surface of the upper die 7, the number of the round shafts 8 is more than three, the cutting of a plurality of flow channels is facilitated, the round shafts 8 are in sliding connection with the material adding shell 6 and are sealed, the supporting frame 11 drives the round shafts 8 to move downwards, the lower ends of the round shafts 8 are conical, the lower ends of the round shafts 8 are inserted into the discharging holes on the upper surface of the upper die 7 and are plugged, epoxy resin in the upper die 7 and the lower die 4 is separated from resin in the material adding shell 6, a PLC (programmable logic controller) 19 is arranged in the front end of the frame 1, the input end of the PLC 19 is electrically connected with an external power supply, a worm wheel 15 is arranged at the lower end of the supporting shaft 2, a worm 14 is rotatably connected with the lower end of the inside of the frame 1, a motor 16 is arranged at the lower end of the inside the frame 1, an output shaft of the motor 16 is fixedly connected with the rear end of the worm 14, the input end of the motor 16 is electrically connected with the output end of the PLC 19, the motor 16 runs, the output shaft of the motor 16 drives the worm 14 to rotate, the worm 14 drives the support shaft 2 to rotate through the worm wheel 15, the motor 16 controls the support shaft 2 to rotate for one hundred eighty degrees, the motor 16 stops running, the middle part of the outer cambered surface of the support shaft 2 is provided with a pin shaft 17, the pin shaft 17 is in sliding connection with a long sliding hole in the middle of the rotating frame 3, the support shaft 2 drives the rotating frame 3 and the lower die 4 to rotate through the pin shaft 17, the rotating frame 3 slides relatively with the pin shaft 17 and the support shaft 2 in the downward moving process, the middle of the outer cambered surface of the support shaft 2 is movably sleeved with a spring 18, the spring 18 is positioned between the upper surface of the front end of the frame 1 and the rotating frame 3, the spring 18 in a compressed state pushes the rotating frame 3 to move upwards to be separated from the frame 1, the upper end of the slide bar 5 is provided with a large electric push rod 13, the telescopic end of the large electric push rod 13 is fixedly connected with the upper surface of the frame 1, the input end of the large electric push rod 13 is electrically connected with the output end of the PLC 19, the large electric push rod 13 runs, the telescopic end of the large electric push rod 13 contracts to drive the slide bar 5 to move downwards, the slide bar 5 drives the upper die 7 to move downwards through the feeding shell 6 to close the lower die 4 corresponding to the lower part, the upper die 7 can push the lower die 4 and the rotating frame 3 to slide downwards along the supporting shaft 2, the upper surface of the frame 1 is contacted with the rotating frame 3 and provides support, the middle part of the slide bar 5 is provided with a small electric push rod 12, the telescopic end of the small electric push rod 12 is fixedly connected with the upper surface of the supporting frame 11, the input end of the small electric push rod 12 is electrically connected with the output end of the PLC 19, the telescopic end of the small electric push rod 12 stretches out to drive the supporting frame 11 to slide downwards along the slide bar 5, the middle part of the frame 1 is provided with an electric heating sheet I20, the electric heating sheet I20 is positioned below the lower die 4 at the rear side, the lower die 4 is contacted with the electric heating sheet I20 to conduct heat, the front end of the first electric heating sheet 20 is provided with a second temperature sensor 21, the input end of the first electric heating sheet 20 is electrically connected with the output end of the PLC controller 19, the output end of the second temperature sensor 21 is electrically connected with the input end of the PLC controller 19, the first electric heating sheet 20 works to generate heat to heat the lower die 4, the heating temperature is 80-120 ℃, the curing speed is accelerated by heating, the second temperature sensor 21 converts temperature information into an electric signal to be transmitted to the PLC controller 19, when the temperature reaches a specified value, the PLC controller 19 controls the first electric heating sheet 20 to stop working, the left side and the right side of the upper surface of the additive shell 6 are provided with the second electric heating sheet 9, the middle part of the upper surface of the additive shell 6 is provided with a first temperature sensor 10, the input end of the second electric heating sheet 9 is electrically connected with the output end of the PLC controller 19, the output end of the first temperature sensor 10 is electrically connected with the input end of the PLC controller 19, the second electric heating sheet 9 works, the second electric heating sheet 9 heats the additive shell 6, the heating temperature is 40-50 ℃, the epoxy resin can be reduced, and the temperature of the same as the first electric heating sheet 9 can be used for detecting the fluidity of the additive shell 6.

The working principle of the plastic packaging equipment for producing the semiconductor chip provided by the utility model is as follows: when in use, a semiconductor chip is placed in a groove of the lower die 4 at the front side, a PLC (programmable logic controller) 19 is regulated and controlled, a motor 16 runs, an output shaft of the motor 16 drives a worm 14 to rotate, the worm 14 drives a supporting shaft 2 to rotate through a worm wheel 15, the supporting shaft 2 drives a rotating frame 3 and the lower die 4 to rotate through a pin shaft 17, the motor 16 controls the supporting shaft 2 to rotate for one hundred eighty degrees, the motor 16 stops running, the reduction ratio of the worm 14 and the worm wheel 15 is fixed, the motor 16 uses a servo motor, the PLC 19 controls the motor 16 to rotate for a designated number of turns through outputting pulse signals, the supporting shaft 2 is ensured to stop rotating for one hundred eighty degrees, the lower die 4 filled at the front side is further moved to the rear side, then a large electric push rod 13 runs, and a telescopic end of the large electric push rod 13 contracts to drive a slide bar 5 to move downwards, the slide bar 5 drives the upper die 7 to move downwards through the material adding shell 6 to be closed with the lower die 4 corresponding to the lower part, meanwhile, the upper die 7 can push the lower die 4 and the rotating frame 3 to slide downwards along the supporting shaft 2, the upper surface of the frame 1 is contacted with the rotating frame 3 and provides support, the lower die 4 is contacted with the first electric heating piece 20 to conduct heat conduction, a feed inlet at the upper end of the material adding shell 6 is connected with an external material injection pump, external epoxy resin is injected into the material adding shell 6, then enters between the upper die 7 and the lower die 4 through a discharge hole at the upper surface of the upper die 7 to encapsulate a semiconductor chip, after filling, the telescopic end of the small electric push rod 12 stretches out to drive the supporting frame 11 to slide downwards along the slide bar 5, the supporting frame 11 drives the round shaft 8 to move downwards, the lower end of the round shaft 8 is conical, the lower end of the round shaft 8 is spliced with the discharge hole at the upper surface of the upper die 7 to be plugged, the epoxy resin in the upper die 7 and the lower die 4 is separated from the resin in the material adding shell 6, then the first electric heating sheet 20 works to generate heat to heat the lower die 4, the heating temperature is 80-120 ℃, the second temperature sensor 21 converts temperature information into electric signals to be transmitted to the PLC controller 19, when the temperature reaches a specified value, the PLC controller 19 controls the first electric heating sheet 20 to stop working, the second electric heating sheet 9 works during plastic packaging, the second electric heating sheet 9 heats the material adding shell 6, the heating temperature is 40-50 ℃, the viscosity of the epoxy resin can be reduced, the fluidity is improved, the first electric heating sheet 10 detects the temperature of the material adding shell 6, after a period of solidification, the expansion end of the large electric push rod 13 stretches out to drive the upper die 7 to be separated from the lower die 4 at the lower side, meanwhile, the spring 18 in a compressed state pushes the rotating frame 3 to be separated from the frame 1, the motor 16 continues to drive the supporting shaft 2 to rotate by one hundred eighty degrees, the two lower dies 4 can be alternately closed with the upper die 7, the lower die 4 can be subjected to plastic packaging operation, the lower die 4 can be subjected to material discharging operation after the lower die 4 is finished, and the material discharging time is further shortened.

It should be noted that, in the above embodiment, the small electric putter 12, the large electric putter 13, the motor 16, the PC controller 19, the first electric heater 20, the second temperature sensor 21, the second electric heater 9 and the first temperature sensor 10 may be configured freely according to the practical application scenario, the small electric putter 12 may be an electric putter with the model ANT-26, the large electric putter 13 may be an electric putter with the model ANT-52, the motor 16 may be A servo motor with the model ECMA-C20604RS, the PC controller 19 may be A PC controller with the model FX3U-48MT/ES-A, the first electric heater 20 and the second electric heater 9 may be polyimide film electric heating films, the second temperature sensor 21 and the first temperature sensor 10 may be temperature sensors with the model MS39/BS-803, and the PC controller 19 may control the small electric putter 12, the large electric putter 13, the motor 16, the first electric heater 20, the second temperature sensor 21, the second electric heater 9 and the first temperature sensor 803 by using the conventional methods in the prior art.

The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.

Claims (8)

1. A molding compound for semiconductor chip production, characterized in that it includes a frame (1); The frame (1) is rotatably connected to a support shaft (2) at its front end. A rotating frame (3) is slidably connected to the middle of the outer arc surface of the support shaft (2). The interior of both the front and rear ends of the rotating frame (3) is provided with a lower mold (4). A slide bar (5) is slidably connected to the interior of the upper end of the frame (1). The lower end of the slide bar (5) is fixedly connected to the upper surface of the filling shell (6). An upper mold (7) is provided at the lower end of the filling shell (6). Both lower molds (4) are matched with the upper mold (7). A support frame (11) is slidably connected to the outside of the slide bar (5). The lower surface of the support frame (11) is provided with evenly distributed round shafts (8). Multiple round shafts (8) penetrate the filling shell (6) and are matched with the discharge holes on the upper surface of the upper mold (7). 2. The molding equipment for semiconductor chip production according to claim 1, characterized in that: a PLC controller (19) is provided inside the front end of the frame (1), and the input terminal of the PLC controller (19) is electrically connected to an external power supply. 3. A molding compound for semiconductor chip production according to claim 2, characterized in that: a worm gear (15) is provided at the lower end of the support shaft (2), a worm (14) is rotatably connected to the lower end inside the frame (1), a motor (16) is provided at the lower end inside the frame (1), the output shaft of the motor (16) is fixedly connected to the rear end of the worm (14), and the input end of the motor (16) is electrically connected to the output end of the PLC controller (19). 4. A molding compound for semiconductor chip production according to claim 1, characterized in that: a pin (17) is provided in the middle of the outer arc surface of the support shaft (2), the pin (17) is slidably connected to the long sliding hole in the middle of the rotating frame (3), and a spring (18) is movably sleeved in the middle of the outer arc surface of the support shaft (2), the spring (18) is located between the upper surface of the front end of the frame (1) and the rotating frame (3). 5. A molding compound for semiconductor chip production according to claim 2, characterized in that: the upper end of the slide bar (5) is provided with a large electric push rod (13), the telescopic end of the large electric push rod (13) is fixedly connected to the upper surface of the frame (1), and the input end of the large electric push rod (13) is electrically connected to the output end of the PLC controller (19). 6. A molding compound for semiconductor chip production according to claim 2, characterized in that: a small electric push rod (12) is provided in the middle of the slide bar (5), the telescopic end of the small electric push rod (12) is fixedly connected to the upper surface of the support frame (11), and the input end of the small electric push rod (12) is electrically connected to the output end of the PLC controller (19). 7. A molding compound for semiconductor chip production according to claim 2, characterized in that: an electric heating element (20) is provided in the middle of the frame (1), the electric heating element (20) is located below the lower mold (4) on the rear side, a temperature sensor (21) is provided at the front end of the electric heating element (20), the input end of the electric heating element (20) is electrically connected to the output end of the PLC controller (19), and the output end of the temperature sensor (21) is electrically connected to the input end of the PLC controller (19). 8. A molding compound for semiconductor chip production according to claim 2, characterized in that: electric heating elements 2 (9) are provided on the left and right sides of the upper surface of the filling shell (6), and a temperature sensor 1 (10) is provided in the middle of the upper surface of the filling shell (6), the input end of the electric heating element 2 (9) is electrically connected to the output end of the PLC controller (19), and the output end of the temperature sensor 1 (10) is electrically connected to the input end of the PLC controller (19).