CN223515209U - Air-cooling and water-cooling combined radiator - Google Patents

Air-cooling and water-cooling combined radiator

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Publication number
CN223515209U
CN223515209U CN202422918722.7U CN202422918722U CN223515209U CN 223515209 U CN223515209 U CN 223515209U CN 202422918722 U CN202422918722 U CN 202422918722U CN 223515209 U CN223515209 U CN 223515209U
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China
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water
cooling
cooled
housing
fixedly connected
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CN202422918722.7U
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Chinese (zh)
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别武华
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Xinyang Tongyu Electronic Technology Co ltd
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Xinyang Tongyu Electronic Technology Co ltd
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Priority to CN202422918722.7U priority Critical patent/CN223515209U/en
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Abstract

The utility model discloses an air-cooling and water-cooling combined radiator, which comprises a shell, wherein a ventilation hood is arranged in the shell, the left end and the right end of the ventilation hood penetrate through the shell and extend to the inside of the shell, the bottom surface of the ventilation hood is fixedly communicated with an air inlet hood, the bottom end of the air inlet hood penetrates through the shell and extends to the lower part of the shell, the inner wall of the shell is fixedly inlaid with a semiconductor refrigerating sheet, the back surface of the semiconductor refrigerating sheet is fixedly connected with a plurality of radiating sheets, the front surface of the shell is fixedly inlaid with a water-cooling guide plate, the outer surface of the ventilation hood is fixedly inlaid with two support hoods, the inner walls of the two support hoods are fixedly connected with support plates, one side surfaces, close to each other, of the two support plates are fixedly provided with a heat radiation fan, and the two heat radiation fans are respectively positioned in the two support hoods. The utility model has the characteristic of combining air cooling and water cooling for heat dissipation, can meet the heat dissipation requirement of a heating object, and improves the heat dissipation speed of the heating object.

Description

Air-cooling and water-cooling combined radiator
Technical Field
The application relates to the technical field of radiators, in particular to an air-cooling and water-cooling combined radiator.
Background
The heat radiator is a device for transferring heat from one object to another or radiating heat to the surrounding environment, the heat radiator is a series of devices for transferring and releasing heat by utilizing three heat transfer modes of heat conduction, heat convection and heat radiation, when a heating object is in direct contact with the heat radiator, heat can be transferred from the object with high temperature to the heat radiator with low temperature through heat movement of molecules, and the heat radiator is a generic name of a series of devices for transferring and releasing heat.
The existing radiator is usually air-cooled radiating and water-cooled radiating, the air-cooled radiating radiates the product by utilizing flowing air, the water-cooled radiating radiates the product by utilizing a refrigerant medium, but the existing air-cooled radiating and the water-cooled radiating are difficult to combine and use, and the independent air-cooled radiating or the water-cooled radiating cannot meet the radiating requirement of a heating object, so that the radiating speed of the heating object is reduced, and therefore, in order to solve the problems, the air-cooled and water-cooled combined radiator is provided.
Disclosure of utility model
The utility model aims to provide an air-cooling and water-cooling combined radiator so as to solve the problems in the background art.
The embodiment of the application adopts the following technical scheme:
the utility model provides an forced air cooling combines radiator with water-cooling, includes the casing, the inside of casing is equipped with the ventilation hood, both ends all run through the casing and extend to the inside of casing about the ventilation hood, the fixed intercommunication in bottom surface of ventilation hood has the air inlet cover, the bottom of air inlet cover runs through the casing and extends to the below of casing, the fixed semiconductor cooling piece that inlays of inner wall of casing, the back fixedly connected with of semiconductor cooling piece has a plurality of fin, the front of casing is fixed to inlay has the water-cooling baffle, the fixed surface of ventilation hood is inlayed and is had two supporting hoods, two the equal fixedly connected with extension board of inner wall of supporting hoods, two equal fixed mounting in a side that the extension board is close to each other has the air heater, two the air heater is located the inside of two supporting hoods respectively.
Preferably, the below of air inlet cover is equipped with the filter screen plate, the bottom surface fixedly connected with of casing two fixing screw rods, two the bottom of fixing screw rod all runs through the filter screen plate and extends to the below of filter screen plate, two the equal threaded connection of surface of fixing screw rod has lock nut, two lock nut's top all contacts with the bottom surface of filter screen plate.
Preferably, the upper surface of casing has seted up annotates the liquid mouth, annotate the top of liquid mouth and be equipped with the screw thread sealing plug, the surface of screw thread sealing plug and the inner wall looks adaptation of annotating the liquid mouth.
Preferably, the outer surface of the shell is fixedly connected with two groups of mounting pieces, and the outer surfaces of the two groups of mounting pieces are provided with mounting holes.
Preferably, the left and right sides of casing all has seted up fixed mouthful, two the inner wall of fixed mouthful all with the surface fixed connection of ventilation hood.
Preferably, the outer surface of the ventilation hood is fixedly connected with two groups of reinforcing blocks, and the back surfaces of the two groups of reinforcing blocks are fixedly connected with the front surface of the shell.
The above at least one technical scheme adopted by the embodiment of the application can achieve the following beneficial effects:
This forced air cooling combines radiator with water-cooling, through the setting of casing, can pour into the coolant liquid, utilize the setting of semiconductor refrigeration piece simultaneously, can carry out conduction cooling to the inside water-liquid refrigeration processing of casing, through the setting of water-cooling baffle, can be through the coolant liquid to the object surface that generates heat, play the preliminary water-cooling radiating effect to the object that generates heat, through the setting of ventilation hood and air inlet cover, and utilize the suction that two cooling fans produced, can make the outside air circulate in ventilation hood and air inlet cover, and can utilize the coolant liquid to cool down ventilation hood and the inside gas that circulates of air inlet cover, then through the emission of radiator fan with low temperature gas, reach the effect of blowing cooling to the object surface air-cooling that generates heat, can possess forced air cooling and water-cooling and combine radiating characteristics, can satisfy the heat dissipation demand of the object that generates heat, improve the radiating rate to the object that generates heat.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
FIG. 1 is a schematic diagram of a front view of an air-cooled and water-cooled radiator in a three-dimensional structure;
FIG. 2 is a cross-sectional view of a front view of an air-cooled and water-cooled combined radiator of the present utility model;
FIG. 3 is a schematic perspective view of a back view of an air-cooled and water-cooled radiator according to the present utility model;
FIG. 4 is a cross-sectional view of a top view of the air-cooled and water-cooled combined heat sink of the present utility model.
The air inlet cover, the filter screen plate, the locking nut, the fixing screw rod, the fixing hole, the supporting cover, the supporting plate, the cooling fan, the reinforcing block, the water cooling guide plate, the liquid injection hole, the threaded sealing plug, the mounting piece, the mounting hole, the semiconductor refrigerating piece and the cooling fin are respectively arranged in the drawing, wherein the air inlet cover, the filter screen plate, the locking nut, the fixing screw rod, the fixing hole, the supporting cover, the supporting plate, the cooling fan, the cooling block, the reinforcing block, the cooling guide plate, the liquid injection hole, the threaded sealing plug, the mounting piece and the mounting hole are respectively arranged in the drawing.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to specific embodiments of the present application and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The following describes in detail the technical solutions provided by the embodiments of the present application with reference to the accompanying drawings.
Referring to fig. 1-4, the present utility model provides a technical solution for an air-cooling and water-cooling combined radiator:
The utility model provides an forced air cooling combines radiator with water-cooling, including casing 1, the inside of casing 1 is equipped with ventilation hood 2, ventilation hood 2's both ends all run through casing 1 and extend to the inside of casing 1, ventilation hood 2's the fixed intercommunication of bottom surface has air inlet cover 3, air inlet cover 3's bottom runs through casing 1 and extends to the below of casing 1, casing 1's the fixed semiconductor refrigeration piece 17 that inlays of inner wall, semiconductor refrigeration piece 17 is the refrigeration plant of current know, the back fixedly connected with of semiconductor refrigeration piece 17 a plurality of fin 18, the front fixed water-cooling baffle 12 that inlays of casing 1, ventilation hood 2's the fixed two support hoods 8 that inlay of surface, the equal fixedly connected with extension board 9 of inner wall of two support hoods 8, a side that two extension boards 9 are close to each other is all fixedly mounted with radiator fan 10, two radiator fan 10 are located the inside of two support hoods 8 respectively, through the setting of casing 1 and semiconductor refrigeration piece 17, can be to the inside liquid refrigeration processing of casing 1, through the setting of water-cooling baffle 12, can be to the object surface that generates heat, the preliminary heat and the object cooling is conducted to the effect of generating heat.
In the embodiment, the filter screen plate 4 is arranged below the air inlet cover 3, two fixing screws 6 are fixedly connected to the bottom surface of the shell 1, the bottom ends of the two fixing screws 6 penetrate through the filter screen plate 4 and extend to the lower side of the filter screen plate 4, locking nuts 5 are connected to the outer surfaces of the two fixing screws 6 in a threaded mode, the top ends of the two locking nuts 5 are in contact with the bottom surface of the filter screen plate 4, a liquid injection port 13 is formed in the upper surface of the shell 1, a threaded sealing plug 14 is arranged above the liquid injection port 13, the outer surface of the threaded sealing plug 14 is matched with the inner wall of the liquid injection port 13, specifically, the filter screen plate 4 can be installed below the air inlet cover 3 through the fixing screws 6 and the locking nuts 5, the installation of the filter screen plate 4 is utilized, the effect of filtering dust during ventilation is achieved, cooling liquid can be injected through the arrangement of the liquid injection port 13, the liquid injection port 13 can be sealed through the threaded sealing plug 14, and the phenomenon that the cooling liquid is prevented from leaking is caused.
In this embodiment, two groups of mounting pieces 15 are fixedly connected to the outer surface of the casing 1, mounting holes 16 are formed in the outer surfaces of the two groups of mounting pieces 15, fixing openings 7 are formed in the left side surface and the right side surface of the casing 1, the inner walls of the two fixing openings 7 are fixedly connected with the outer surface of the ventilation hood 2, two groups of reinforcing blocks 11 are fixedly connected to the outer surface of the ventilation hood 2, the back surfaces of the two groups of reinforcing blocks 11 are fixedly connected with the front surface of the casing 1, and specifically, the casing 1 can be mounted and fixed through the mounting pieces 15 and the mounting holes 16, the ventilation hood 2 can be conveniently mounted through the fixing openings 7, the fixing of the ventilation hood 2 can be deepened by the arrangement of the two groups of reinforcing blocks 11, and the ventilation hood 2 can be more stable in the heat dissipation process.
The working principle is that firstly, the shell 1 is installed and fixed through the installation piece 15 and the installation hole 16, then the threaded sealing plug 14 is removed, cooling liquid is injected into the shell 1 through the liquid injection hole 13, then the semiconductor refrigerating piece 17 is started to operate, so that water liquid in the shell 1 can be refrigerated, meanwhile, the water cooling guide plate 12 is utilized, the surface of a heating object can be conducted and cooled through cooling liquid, and the two heat dissipation fans 10 operate, so that the inside of the ventilation hood 2 is in a negative pressure state, external air flows into the shell 1 through the air inlet hood 3 and flows in the ventilation hood 2, the cooling liquid in the shell 1 can be utilized for cooling the air flowing in the ventilation hood 2 and the air inlet hood 3, low-temperature air can be formed, and the heat dissipation fans 10 can blow the low-temperature air to the surface of the heating object better.
The foregoing is merely exemplary of the present utility model and is not intended to limit the present utility model. Various modifications and variations of the present utility model will be apparent to those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present utility model should be included in the scope of the claims of the present utility model, and it should be apparent to those skilled in the art that the present utility model is not limited to the details of the above-described exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.

Claims (6)

1.一种风冷与水冷结合散热器,包括壳体(1),其特征在于:所述壳体(1)的内部设有通风罩(2),所述通风罩(2)的左右两端均贯穿壳体(1)并延伸至壳体(1)的内部,所述通风罩(2)的底面固定连通有进风罩(3),所述进风罩(3)的底端贯穿壳体(1)并延伸至壳体(1)的下方,所述壳体(1)的内壁固定镶嵌有半导体制冷片(17),所述半导体制冷片(17)的背面固定连接有多个散热片(18),所述壳体(1)的正面固定镶嵌有水冷导板(12),所述通风罩(2)的外表面固定镶嵌有两个支撑罩(8),两个所述支撑罩(8)的内壁均固定连接有支板(9),两个所述支板(9)相互靠近的一侧面均固定安装有散热风机(10),两个所述散热风机(10)分别位于两个支撑罩(8)的内部。1. A combined air-cooled and water-cooled radiator, comprising a housing (1), characterized in that: a ventilation hood (2) is provided inside the housing (1), both ends of the ventilation hood (2) penetrate the housing (1) and extend into the interior of the housing (1), an air inlet hood (3) is fixedly connected to the bottom surface of the ventilation hood (2), the bottom end of the air inlet hood (3) penetrates the housing (1) and extends to the bottom of the housing (1), a semiconductor cooling chip (17) is fixedly embedded in the inner wall of the housing (1), a plurality of heat sinks (18) are fixedly connected to the back of the semiconductor cooling chip (17), a water-cooled guide plate (12) is fixedly embedded in the front of the housing (1), two support covers (8) are fixedly embedded in the outer surface of the ventilation hood (2), a support plate (9) is fixedly connected to the inner wall of the two support covers (8), a cooling fan (10) is fixedly installed on the side of the two support plates (9) that are close to each other, and the two cooling fans (10) are respectively located inside the two support covers (8). 2.根据权利要求1所述的一种风冷与水冷结合散热器,其特征在于:所述进风罩(3)的下方设有过滤网板(4),所述壳体(1)的底面固定连接有两个固定螺杆(6),两个所述固定螺杆(6)的底端均贯穿过滤网板(4)并延伸至过滤网板(4)的下方,两个所述固定螺杆(6)的外表面均螺纹连接有锁紧螺母(5),两个所述锁紧螺母(5)的顶端均与过滤网板(4)的底面相接触。2. A combined air-cooled and water-cooled radiator according to claim 1, characterized in that: a filter screen plate (4) is provided below the air inlet shroud (3), two fixing screws (6) are fixedly connected to the bottom surface of the housing (1), the bottom ends of the two fixing screws (6) penetrate through the filter screen plate (4) and extend to the bottom of the filter screen plate (4), the outer surfaces of the two fixing screws (6) are threaded with locking nuts (5), and the top ends of the two locking nuts (5) are in contact with the bottom surface of the filter screen plate (4). 3.根据权利要求1所述的一种风冷与水冷结合散热器,其特征在于:所述壳体(1)的上表面开设有注液口(13),所述注液口(13)的上方设有螺纹密封塞(14),所述螺纹密封塞(14)的外表面与注液口(13)的内壁相适配。3. A combined air-cooled and water-cooled radiator according to claim 1, characterized in that: a liquid injection port (13) is provided on the upper surface of the housing (1), and a threaded sealing plug (14) is provided above the liquid injection port (13), the outer surface of the threaded sealing plug (14) being adapted to the inner wall of the liquid injection port (13). 4.根据权利要求1所述的一种风冷与水冷结合散热器,其特征在于:所述壳体(1)的外表面固定连接有两组安装件(15),两组所述安装件(15)的外表面均开设有安装孔(16)。4. A combined air-cooled and water-cooled radiator according to claim 1, characterized in that: two sets of mounting parts (15) are fixedly connected to the outer surface of the housing (1), and mounting holes (16) are opened on the outer surface of both sets of mounting parts (15). 5.根据权利要求1所述的一种风冷与水冷结合散热器,其特征在于:所述壳体(1)的左右两侧面均开设有固定口(7),两个所述固定口(7)的内壁均与通风罩(2)的外表面固定连接。5. A combined air-cooled and water-cooled radiator according to claim 1, characterized in that: a fixing port (7) is provided on both the left and right sides of the housing (1), and the inner walls of the two fixing ports (7) are fixedly connected to the outer surface of the ventilation cover (2). 6.根据权利要求1所述的一种风冷与水冷结合散热器,其特征在于:所述通风罩(2)的外表面固定连接有两组加固块(11),两组所述加固块(11)的背面均与壳体(1)的正面固定连接。6. A combined air-cooled and water-cooled radiator according to claim 1, characterized in that: two sets of reinforcing blocks (11) are fixedly connected to the outer surface of the ventilation cover (2), and the back sides of the two sets of reinforcing blocks (11) are fixedly connected to the front side of the shell (1).
CN202422918722.7U 2024-11-28 2024-11-28 Air-cooling and water-cooling combined radiator Active CN223515209U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202422918722.7U CN223515209U (en) 2024-11-28 2024-11-28 Air-cooling and water-cooling combined radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202422918722.7U CN223515209U (en) 2024-11-28 2024-11-28 Air-cooling and water-cooling combined radiator

Publications (1)

Publication Number Publication Date
CN223515209U true CN223515209U (en) 2025-11-04

Family

ID=97512902

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202422918722.7U Active CN223515209U (en) 2024-11-28 2024-11-28 Air-cooling and water-cooling combined radiator

Country Status (1)

Country Link
CN (1) CN223515209U (en)

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