CN223515209U - Air-cooling and water-cooling combined radiator - Google Patents
Air-cooling and water-cooling combined radiatorInfo
- Publication number
- CN223515209U CN223515209U CN202422918722.7U CN202422918722U CN223515209U CN 223515209 U CN223515209 U CN 223515209U CN 202422918722 U CN202422918722 U CN 202422918722U CN 223515209 U CN223515209 U CN 223515209U
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- China
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- water
- cooling
- cooled
- housing
- fixedly connected
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Abstract
The utility model discloses an air-cooling and water-cooling combined radiator, which comprises a shell, wherein a ventilation hood is arranged in the shell, the left end and the right end of the ventilation hood penetrate through the shell and extend to the inside of the shell, the bottom surface of the ventilation hood is fixedly communicated with an air inlet hood, the bottom end of the air inlet hood penetrates through the shell and extends to the lower part of the shell, the inner wall of the shell is fixedly inlaid with a semiconductor refrigerating sheet, the back surface of the semiconductor refrigerating sheet is fixedly connected with a plurality of radiating sheets, the front surface of the shell is fixedly inlaid with a water-cooling guide plate, the outer surface of the ventilation hood is fixedly inlaid with two support hoods, the inner walls of the two support hoods are fixedly connected with support plates, one side surfaces, close to each other, of the two support plates are fixedly provided with a heat radiation fan, and the two heat radiation fans are respectively positioned in the two support hoods. The utility model has the characteristic of combining air cooling and water cooling for heat dissipation, can meet the heat dissipation requirement of a heating object, and improves the heat dissipation speed of the heating object.
Description
Technical Field
The application relates to the technical field of radiators, in particular to an air-cooling and water-cooling combined radiator.
Background
The heat radiator is a device for transferring heat from one object to another or radiating heat to the surrounding environment, the heat radiator is a series of devices for transferring and releasing heat by utilizing three heat transfer modes of heat conduction, heat convection and heat radiation, when a heating object is in direct contact with the heat radiator, heat can be transferred from the object with high temperature to the heat radiator with low temperature through heat movement of molecules, and the heat radiator is a generic name of a series of devices for transferring and releasing heat.
The existing radiator is usually air-cooled radiating and water-cooled radiating, the air-cooled radiating radiates the product by utilizing flowing air, the water-cooled radiating radiates the product by utilizing a refrigerant medium, but the existing air-cooled radiating and the water-cooled radiating are difficult to combine and use, and the independent air-cooled radiating or the water-cooled radiating cannot meet the radiating requirement of a heating object, so that the radiating speed of the heating object is reduced, and therefore, in order to solve the problems, the air-cooled and water-cooled combined radiator is provided.
Disclosure of utility model
The utility model aims to provide an air-cooling and water-cooling combined radiator so as to solve the problems in the background art.
The embodiment of the application adopts the following technical scheme:
the utility model provides an forced air cooling combines radiator with water-cooling, includes the casing, the inside of casing is equipped with the ventilation hood, both ends all run through the casing and extend to the inside of casing about the ventilation hood, the fixed intercommunication in bottom surface of ventilation hood has the air inlet cover, the bottom of air inlet cover runs through the casing and extends to the below of casing, the fixed semiconductor cooling piece that inlays of inner wall of casing, the back fixedly connected with of semiconductor cooling piece has a plurality of fin, the front of casing is fixed to inlay has the water-cooling baffle, the fixed surface of ventilation hood is inlayed and is had two supporting hoods, two the equal fixedly connected with extension board of inner wall of supporting hoods, two equal fixed mounting in a side that the extension board is close to each other has the air heater, two the air heater is located the inside of two supporting hoods respectively.
Preferably, the below of air inlet cover is equipped with the filter screen plate, the bottom surface fixedly connected with of casing two fixing screw rods, two the bottom of fixing screw rod all runs through the filter screen plate and extends to the below of filter screen plate, two the equal threaded connection of surface of fixing screw rod has lock nut, two lock nut's top all contacts with the bottom surface of filter screen plate.
Preferably, the upper surface of casing has seted up annotates the liquid mouth, annotate the top of liquid mouth and be equipped with the screw thread sealing plug, the surface of screw thread sealing plug and the inner wall looks adaptation of annotating the liquid mouth.
Preferably, the outer surface of the shell is fixedly connected with two groups of mounting pieces, and the outer surfaces of the two groups of mounting pieces are provided with mounting holes.
Preferably, the left and right sides of casing all has seted up fixed mouthful, two the inner wall of fixed mouthful all with the surface fixed connection of ventilation hood.
Preferably, the outer surface of the ventilation hood is fixedly connected with two groups of reinforcing blocks, and the back surfaces of the two groups of reinforcing blocks are fixedly connected with the front surface of the shell.
The above at least one technical scheme adopted by the embodiment of the application can achieve the following beneficial effects:
This forced air cooling combines radiator with water-cooling, through the setting of casing, can pour into the coolant liquid, utilize the setting of semiconductor refrigeration piece simultaneously, can carry out conduction cooling to the inside water-liquid refrigeration processing of casing, through the setting of water-cooling baffle, can be through the coolant liquid to the object surface that generates heat, play the preliminary water-cooling radiating effect to the object that generates heat, through the setting of ventilation hood and air inlet cover, and utilize the suction that two cooling fans produced, can make the outside air circulate in ventilation hood and air inlet cover, and can utilize the coolant liquid to cool down ventilation hood and the inside gas that circulates of air inlet cover, then through the emission of radiator fan with low temperature gas, reach the effect of blowing cooling to the object surface air-cooling that generates heat, can possess forced air cooling and water-cooling and combine radiating characteristics, can satisfy the heat dissipation demand of the object that generates heat, improve the radiating rate to the object that generates heat.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
FIG. 1 is a schematic diagram of a front view of an air-cooled and water-cooled radiator in a three-dimensional structure;
FIG. 2 is a cross-sectional view of a front view of an air-cooled and water-cooled combined radiator of the present utility model;
FIG. 3 is a schematic perspective view of a back view of an air-cooled and water-cooled radiator according to the present utility model;
FIG. 4 is a cross-sectional view of a top view of the air-cooled and water-cooled combined heat sink of the present utility model.
The air inlet cover, the filter screen plate, the locking nut, the fixing screw rod, the fixing hole, the supporting cover, the supporting plate, the cooling fan, the reinforcing block, the water cooling guide plate, the liquid injection hole, the threaded sealing plug, the mounting piece, the mounting hole, the semiconductor refrigerating piece and the cooling fin are respectively arranged in the drawing, wherein the air inlet cover, the filter screen plate, the locking nut, the fixing screw rod, the fixing hole, the supporting cover, the supporting plate, the cooling fan, the cooling block, the reinforcing block, the cooling guide plate, the liquid injection hole, the threaded sealing plug, the mounting piece and the mounting hole are respectively arranged in the drawing.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to specific embodiments of the present application and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The following describes in detail the technical solutions provided by the embodiments of the present application with reference to the accompanying drawings.
Referring to fig. 1-4, the present utility model provides a technical solution for an air-cooling and water-cooling combined radiator:
The utility model provides an forced air cooling combines radiator with water-cooling, including casing 1, the inside of casing 1 is equipped with ventilation hood 2, ventilation hood 2's both ends all run through casing 1 and extend to the inside of casing 1, ventilation hood 2's the fixed intercommunication of bottom surface has air inlet cover 3, air inlet cover 3's bottom runs through casing 1 and extends to the below of casing 1, casing 1's the fixed semiconductor refrigeration piece 17 that inlays of inner wall, semiconductor refrigeration piece 17 is the refrigeration plant of current know, the back fixedly connected with of semiconductor refrigeration piece 17 a plurality of fin 18, the front fixed water-cooling baffle 12 that inlays of casing 1, ventilation hood 2's the fixed two support hoods 8 that inlay of surface, the equal fixedly connected with extension board 9 of inner wall of two support hoods 8, a side that two extension boards 9 are close to each other is all fixedly mounted with radiator fan 10, two radiator fan 10 are located the inside of two support hoods 8 respectively, through the setting of casing 1 and semiconductor refrigeration piece 17, can be to the inside liquid refrigeration processing of casing 1, through the setting of water-cooling baffle 12, can be to the object surface that generates heat, the preliminary heat and the object cooling is conducted to the effect of generating heat.
In the embodiment, the filter screen plate 4 is arranged below the air inlet cover 3, two fixing screws 6 are fixedly connected to the bottom surface of the shell 1, the bottom ends of the two fixing screws 6 penetrate through the filter screen plate 4 and extend to the lower side of the filter screen plate 4, locking nuts 5 are connected to the outer surfaces of the two fixing screws 6 in a threaded mode, the top ends of the two locking nuts 5 are in contact with the bottom surface of the filter screen plate 4, a liquid injection port 13 is formed in the upper surface of the shell 1, a threaded sealing plug 14 is arranged above the liquid injection port 13, the outer surface of the threaded sealing plug 14 is matched with the inner wall of the liquid injection port 13, specifically, the filter screen plate 4 can be installed below the air inlet cover 3 through the fixing screws 6 and the locking nuts 5, the installation of the filter screen plate 4 is utilized, the effect of filtering dust during ventilation is achieved, cooling liquid can be injected through the arrangement of the liquid injection port 13, the liquid injection port 13 can be sealed through the threaded sealing plug 14, and the phenomenon that the cooling liquid is prevented from leaking is caused.
In this embodiment, two groups of mounting pieces 15 are fixedly connected to the outer surface of the casing 1, mounting holes 16 are formed in the outer surfaces of the two groups of mounting pieces 15, fixing openings 7 are formed in the left side surface and the right side surface of the casing 1, the inner walls of the two fixing openings 7 are fixedly connected with the outer surface of the ventilation hood 2, two groups of reinforcing blocks 11 are fixedly connected to the outer surface of the ventilation hood 2, the back surfaces of the two groups of reinforcing blocks 11 are fixedly connected with the front surface of the casing 1, and specifically, the casing 1 can be mounted and fixed through the mounting pieces 15 and the mounting holes 16, the ventilation hood 2 can be conveniently mounted through the fixing openings 7, the fixing of the ventilation hood 2 can be deepened by the arrangement of the two groups of reinforcing blocks 11, and the ventilation hood 2 can be more stable in the heat dissipation process.
The working principle is that firstly, the shell 1 is installed and fixed through the installation piece 15 and the installation hole 16, then the threaded sealing plug 14 is removed, cooling liquid is injected into the shell 1 through the liquid injection hole 13, then the semiconductor refrigerating piece 17 is started to operate, so that water liquid in the shell 1 can be refrigerated, meanwhile, the water cooling guide plate 12 is utilized, the surface of a heating object can be conducted and cooled through cooling liquid, and the two heat dissipation fans 10 operate, so that the inside of the ventilation hood 2 is in a negative pressure state, external air flows into the shell 1 through the air inlet hood 3 and flows in the ventilation hood 2, the cooling liquid in the shell 1 can be utilized for cooling the air flowing in the ventilation hood 2 and the air inlet hood 3, low-temperature air can be formed, and the heat dissipation fans 10 can blow the low-temperature air to the surface of the heating object better.
The foregoing is merely exemplary of the present utility model and is not intended to limit the present utility model. Various modifications and variations of the present utility model will be apparent to those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present utility model should be included in the scope of the claims of the present utility model, and it should be apparent to those skilled in the art that the present utility model is not limited to the details of the above-described exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422918722.7U CN223515209U (en) | 2024-11-28 | 2024-11-28 | Air-cooling and water-cooling combined radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422918722.7U CN223515209U (en) | 2024-11-28 | 2024-11-28 | Air-cooling and water-cooling combined radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223515209U true CN223515209U (en) | 2025-11-04 |
Family
ID=97512902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202422918722.7U Active CN223515209U (en) | 2024-11-28 | 2024-11-28 | Air-cooling and water-cooling combined radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223515209U (en) |
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2024
- 2024-11-28 CN CN202422918722.7U patent/CN223515209U/en active Active
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