CN223419943U - Molds for preparing plastic carriers - Google Patents

Abstract

The utility model discloses a mold for preparing a plastic carrier tray, comprising a mold base, a lower template, a lower module, an upper module, an upper template and an injection molding plate, and an ejector pin assembly built into the mold base, perpendicular to the lower template and perforated to cooperate, and also comprising several groups of heat preservation components and temperature adjustment components built into the upper surface of the upper template cavity, the lower end face of the upper module is provided with an upper cavity surface of a product to be molded, and a heat preservation component is provided in affixed relation to a large-area planar bracket portion of the product to be molded, and a temperature adjustment component is provided in affixed relation to the center of the bracket, the mold covers and fits the large-area planar bracket portion through the cooperation of multiple groups of heat preservation components and temperature adjustment components, maintains a suitable temperature of the hot cavity, fully cooperates with the high-temperature plastic infusion to fill the inside of the bracket portion cavity, and then cooperates with the temperature adjustment component to temperature-adjust and shape the bracket portion from the center outward to prevent tearing during the molding and shaping process, thereby ensuring good molding quality and improving the yield rate.

Description

Mould for preparing plastic carrier disc

Technical Field

The utility model relates to the technical field of mold equipment, in particular to a mold for preparing a plastic carrier disc.

Background

The injection molding product is visible everywhere in people's life, it is also very extensive to use in industrial production, current PCB board that has welded the chip needs the bearing to transplant, the conversion transmission between the different processes of being convenient for, because the PCB board that has welded the chip can not buckle and warp, the quality requirement to the bearing carrier plate is higher, traditional practical's plastic uptake tray production technology is simple and practical, but to the PCB board that has welded the chip of this product can not take place the problem of bending and center sagging, need other ideal methods, use other production technologies to make the structure of bearing carrier plate more firm, see fig. 5, require bearing carrier plate central part to possess firm plane support, can not take place to buckle and warp and center sagging.

Therefore, the special design and manufacture of a mold are necessary for the needs of customers, under the technical requirement of ensuring mass and low-cost production of the bearing carrier plate, the bracket at the center of the bearing carrier plate can keep plastic fully flowing into each runner cavity in the molding process, and the bracket and shaping bracket structure can be rapidly molded in a heat-preserving and temperature-regulating mode, so that the molding mold for the large-area bracket product needs to be specially designed with an effective heat-preserving and temperature-regulating component in the cavity so as to ensure the molding quality and yield of the product.

Disclosure of utility model

The utility model aims at: the mold for preparing the plastic carrying tray is designed according to the technical requirements that the plastic carrying tray is required to be quickly and completely poured into a cavity for molding the large-area planar supporting groove and quickly shaped after molding, the mold covers and attaches a large-area planar supporting groove part through a plurality of groups of heat-insulating components, the temperature of the heat-insulating cavity is kept to be proper, the inside of the cavity of the supporting groove part is fully matched with high-temperature plastic pouring and filling, and the temperature adjusting component is matched with the temperature adjusting and shaping of the supporting groove part from the center outwards so as to prevent molding tearing, and the mold is good in molding quality and high in yield.

The technical scheme adopted for solving the problems is as follows:

A mould for preparing plastic carrier plate comprises a mould base, a lower mould plate, an upper mould plate, an injection moulding plate, a thimble assembly which is arranged in the mould base, is vertical to the lower mould plate and is matched with the perforation, a plurality of groups of heat-preserving components and temperature-regulating components which are arranged on the upper surface of a mould cavity of the upper mould plate,

The die holder, the lower die plate, the upper die plate and the injection molding plate are sequentially stacked, and the lifting linear sliding motion is realized by the penetrating fit of the guide post and guide sleeve components at four corners, the lower die plate is matched above the lower die plate, the upper die plate is matched below the upper die plate, a plurality of cooling pipelines and heat preservation pipelines which are spaced from the cavity surface of the molded product at a certain distance are arranged in the lower die plate and the upper die plate,

The utility model provides a thermal insulation device for plastic injection molding, including last module, temperature adjusting block, temperature adjusting pipe, plastic circulation packing everywhere in the control die cavity, and control to wait for injection molding's product shaping design, prevent that the dispersion from leading to the finished product tearing to take place, the lower terminal surface of last module sets up the last die cavity face of waiting to take shape product, and just to the laminating of the large tracts of land support groove position of waiting to shape product is provided with the heat preservation subassembly to the laminating of last module, just to the large tracts of land support groove position of waiting to shape product, is provided with temperature adjusting assembly to the laminating of support groove center, just is provided with temperature adjusting assembly to support groove center, and the plastic circulation packing everywhere in the control die cavity is realized the temperature adjusting pipe is passed through to temperature preserving fluid or cooling fluid to the temperature adjusting pipe.

Further, the upper end face of the lower module is provided with a lower cavity face of a product to be formed, and an overflow slag ladle cavity is arranged along the periphery of a parting face of the cavity.

Further, the pouring gate of the heat conducting block is communicated with the heat-preserving pouring gate pipe, the heat-preserving pouring gate pipe maintains the plastic flow of the internal flow pipeline smooth in an electric heating mode, and all the heat-preserving pouring gate pipes are converged at the injection molding opening.

Further, the peripheral interval of the upper end face of the temperature regulating block is uniformly provided with air release sheets so as to match with the air pressure balance in the die cavity.

The beneficial effects of the utility model are as follows:

This a mould for preparing plastics carrier plate is through multiunit heat preservation subassembly and temperature regulating assembly mutually support, carries out the laminating with the plane bracket position of large tracts of land, keeps hot die cavity temperature suitable to inside fully cooperation high temperature plastic fills bracket position die cavity, and the subassembly that adjusts the temperature again is to supporting the bracket position and outwards adjusts the design from the center, in order to prevent tearing in the shaping design process, can ensure that shaping quality is good, improves the yields height.

Drawings

FIG. 1 is a side plan view of an embodiment of a mold for making a plastic tray;

FIG. 2 is a side plan view of a mold-removed upper platen, upper mold block, lower mold block for preparing a plastic tray of an embodiment;

FIG. 3 is a side plan view of a thermal insulation assembly and a temperature regulation assembly according to an embodiment;

FIG. 4 is an enlarged view of a portion of FIG. 3 at A;

FIG. 5 is a side plan view of a product to be molded according to an embodiment;

The device comprises a 1-lower die plate, a 2-lower die plate, a 3-upper die plate, a 4-upper die plate, a 5-injection die plate, a 6-injection molding port, a 7-lower cooling pipeline, an 8-heat conducting block, a 9-heat insulation pouring gate pipe, a 10-upper sealing cover, a 11-horizontal pouring gate pipe, a 12-upper cooling pipeline, a 13-product to be molded, a 14-guide pillar and guide sleeve component, a 15-ejector pin component, a 16-temperature regulating block, a 17-product reinforcing rib, a 18-plug, a 19-air release sheet, a 20-liquid inlet, a 21-screw hole, a 22-liquid outlet, a 23-heating pipe, a 24-pouring gate, a 25-transverse frame, a 26-longitudinal frame and a 27-bracket.

Detailed Description

The technical solution of the present utility model will be clearly and completely described by way of example with reference to the accompanying drawings.

Referring to fig. 1 and 3, the present embodiment provides a mold for preparing a plastic carrier, which includes a mold base, a lower mold plate 1, a lower mold plate 2, an upper mold plate 3, an upper mold plate 4, an injection molding plate 5, a thimble assembly 15 disposed in the mold base and perpendicular to the lower mold plate 1 and in perforation fit, and four sets of heat preservation assemblies and temperature adjustment assemblies disposed in the upper surface of the cavity of the upper mold plate 4.

Referring to the arrangement rule of traditional mould equipment, stack in proper order between die holder, lower bolster 1, lower module 2, last module 3, cope match-plate pattern 4 and the injection molding board 5 to wear the cooperation by the guide pillar guide pin bushing subassembly 14 of four corners and realize the straight line slip action that goes up and down, lower module 2 cooperation is in lower bolster 1 top, go up the cooperation of module 3 below cope match-plate pattern 4, cooling pipeline and the heat preservation pipeline of a plurality of distances shaping product's die cavity face certain interval have all been seted up to lower module 2, go up in the module 3, wherein the cooling fluid of circulation in the cooling pipeline for after the die cavity intussuseption is filled, the acceleration of gradual cooling design process, the heat preservation fluid of circulation in the heat preservation pipeline for the die cavity keeps the fluid form to gradually to fill up whole die cavity space in the plastic in-filling process.

Referring to fig. 3 and 4, the lower end surface of the upper module 3 is provided with an upper cavity surface of the product 13 to be molded, a heat-insulating component is attached to a large-area planar bracket 27 of the product 13 to be molded, a temperature-regulating component 16 is attached to the center of the bracket 27, the heat-insulating component comprises a heat-conducting block 8 attached to the upper cavity surface, a heating pipe 23 and an energizing wire (not shown in the figure), the center of the heat-conducting block 8 is provided with a sprue 24 communicated with the cavity, the heating pipe 23 is attached to the upper end surface of the heat-conducting block in an O-shape and energized to obtain a heating and heat-insulating effect, the heat-conducting block 8 is connected with the lower end surface of the upper module 3 through a screw in a threaded manner, the temperature-regulating component is arranged in the center of the bracket 27 and comprises a temperature-regulating block 16 and a temperature-regulating pipe, the temperature-regulating pipe is internally provided with a temperature-regulating pipeline, the temperature-regulating pipeline is connected with the temperature-regulating pipe, the temperature-regulating pipe is internally communicated with a heat-insulating fluid or a cooling fluid to regulate the temperature of the temperature-regulating block, the temperature-insulating filling in the cavity is further controlled, the molding and the plastic product to be molded is prevented from tearing and shrinking due to the product to be molded,

In a further embodiment, the upper end surface of the lower module 2 is provided with a lower cavity surface of the product 13 to be formed, and an overflow ladle cavity is arranged along the periphery of the parting surface of the cavity.

Referring to fig. 4, the runner port 24 of the heat conducting block 8 is communicated with the heat insulating runner pipe 9, the heat insulating runner pipe 9 maintains the plastic flow of the internal flow pipeline smooth by an electric heating mode, and all heat insulating runner pipes 9 are converged at the injection port 6.

Referring to fig. 4, in order to remove the gaps between the plurality of heat conducting blocks and the temperature adjusting blocks in the cavity and the upper cavity surface, the peripheral space of the upper end surface of the temperature adjusting block 16 is uniformly provided with air release pieces 19 to match with the air pressure balance in the mold cavity.

The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the embodiments described above, and various changes, modifications, substitutions and alterations can be made therein by those having ordinary skill in the art without departing from the spirit of the present utility model, the scope of which is defined by the appended claims and their equivalents.

Claims (5)

1. A mould for preparing a plastic carrying disc comprises a mould base, a lower mould plate (1), a lower mould plate (2), an upper mould plate (3), an upper mould plate (4) and an injection moulding plate (5), and a thimble assembly (15) which is arranged in the mould base, is vertical to the lower mould plate (1) and is matched with a perforation, and is characterized by also comprising a plurality of groups of heat preservation assemblies and temperature regulation assemblies which are arranged on the upper surface of a mould cavity of the upper mould plate (4),

The utility model provides a lower terminal surface of last module (3) sets up the last die cavity face of waiting to form product (13), and just is to the laminating of the large tracts of land of last module (13) face support groove (27) position and be provided with heat preservation subassembly, just is to support groove (27) center laminating and be provided with the attemperator, the attemperator is including heat conduction piece (8), heating pipe (23) and the circular telegram wire of laminating last die cavity face, heat conduction piece (8) center is provided with the sprue gate (24) of intercommunication die cavity, heating pipe (23) are O shape laminating at heat conduction piece (8) up end to the circular telegram obtains heating insulation effect, heat conduction piece (8) are connected with last module (3) lower terminal surface spiro union through the screw, attemperator sets up the center at support groove (27) position, including attemperator (16) and attemperator, attemperator (16) are inside to be seted up attemperator, attemperator and union coupling, are realized attemperator (16) temperature by attemperator inside intercommunication fluid or attemperator cooling fluid, control filling each place and control the plastic of thermal insulation shaping that treats the shaping of moulding.

2. The mold for preparing plastic carrier plates according to claim 1, wherein the mold base, the lower mold plate (1), the lower mold plate (2), the upper mold plate (3), the upper mold plate (4) and the injection molding plate (5) are sequentially stacked, lifting linear sliding motion is realized by penetrating and matching of guide post and guide sleeve assemblies (14) at four corners, the lower mold plate (2) is matched above the lower mold plate (1), the upper mold plate (3) is matched below the upper mold plate (4), and a plurality of cooling pipelines and heat preservation pipelines which are spaced from the cavity surface of a molded product at certain intervals are arranged in the lower mold plate (2) and the upper mold plate (3).

3. The mold for preparing plastic carrier plates according to claim 1, wherein the pouring gate (24) of the heat conducting block (8) is communicated with a heat-preserving pouring gate pipe (9), the heat-preserving pouring gate pipe (9) maintains the plastic flow of the internal flow pipeline smooth in an electric heating mode, and all heat-preserving pouring gate pipes (9) are converged at the injection molding opening (6).

4. The mold for preparing plastic trays according to claim 1, wherein the temperature adjusting block (16) is provided with air release pieces (19) uniformly at intervals on the periphery of the upper end surface.

5. The mold for producing plastic carrier trays according to claim 1, wherein the upper end surface of the lower mold block (2) is provided with a lower cavity surface of a product (13) to be molded, and an overflow ladle cavity is provided along the periphery of the cavity parting surface.