CN223414949U - Switch and communication system - Google Patents

Abstract

The utility model provides a switch and a communication system, which relate to the field of communication equipment manufacturing. The switch includes a switch housing, a mainboard, and a first power supply module. The switch housing includes an air inlet surface, and the air inlet surface includes a first air inlet window and a second air inlet window. A first air duct partition is fixed on the mainboard. The mainboard is installed and fixed in the switch housing, dividing the internal space of the switch housing into a first layer and a second layer, wherein the first layer corresponds to the first surface of the mainboard. The first air duct partition is fixed on the first surface, dividing the space of the first layer into a first air inlet area and a second air inlet area. The first air inlet window corresponds to the first air inlet area, and the second air inlet window corresponds to the second air inlet area. The first power supply module is arranged in the second air inlet area of the first layer, opposite to the second air inlet window, and the first power supply module is pluggably electrically connected to the mainboard through a connector. The utility model can prevent crosstalk in the internal air duct of the switch, thereby avoiding overheating of the power supply module and the main chip.

Description

Switch and communication system

Technical Field

The present utility model relates to the field of manufacturing of communication devices, and in particular, to a switch and a communication system.

Background

As the market demand for network switching capacity increases, the demand for switch performance increases, and correspondingly, the power consumption of the switch increases gradually. The conventional natural heat dissipation mode by using the heat dissipation fins cannot meet the heat dissipation requirement of the existing switch system. Air cooling heat dissipation is an indispensable heat dissipation mode in the current switch system.

The existing air-cooled heat dissipation switch is generally arranged as an air channel shared by a fan and a power supply. However, under the condition of high power consumption, the common air duct can cause air duct crosstalk, and further cause the conditions of power supply, main chip overtemperature and the like.

Disclosure of utility model

The present utility model aims to provide a switch and a communication system, which can at least partially solve the above technical problems.

In a first aspect, the utility model provides a switch, which comprises a switch shell, a main board and a first power module, wherein the switch shell comprises an air inlet surface, the air inlet surface comprises a first air inlet window and a second air inlet window, and a first air channel baffle is fixed on the main board;

The main board is arranged and fixed in the switch shell, and the internal space of the switch shell is divided into a first layer and a second layer, wherein the first layer corresponds to the first surface of the main board;

The first air duct partition plate is fixed on the first surface and divides the space of the first layer into a first air inlet area and a second air inlet area;

The first air inlet window corresponds to the first air inlet area, and the second air inlet window corresponds to the second air inlet area;

the first power module is arranged in the second air inlet area of the first layer and opposite to the second air inlet window, and is connected with the main board in an pluggable manner through a connecting piece.

Optionally, the switch further comprises a second power module and a second air duct partition;

The second air duct partition plate is fixed on a second surface of the main board and corresponds to the first air duct partition plate, and the space of the second layer is divided into a third air inlet area and a fourth air inlet area, wherein the second surface is a surface of the main board corresponding to the second layer, and the first surface is opposite to the second surface;

the second power module is arranged in the third air inlet area of the second layer and is opposite to the second air inlet window, and the second power module is connected with the main board in an pluggable manner through a connecting piece.

Optionally, the switch further comprises a panel connector, and the air inlet surface further comprises a third air inlet window;

The third air inlet window is arranged opposite to the first air inlet window and corresponds to the first air inlet area;

The panel connector is arranged on the air inlet surface and is positioned among the first air inlet window, the second air inlet window and the third air inlet window.

Optionally, the switch further comprises a main chip radiator, a third air duct partition plate and a fourth air duct partition plate, and the switch shell further comprises a first cover plate;

the main chip radiator is fixed on the main board and is positioned in the second air inlet area of the first layer;

the first cover plate is arranged opposite to the first surface and far away from the second surface;

The third air duct partition plate and the fourth air duct partition plate are fixed on the first cover plate and are respectively arranged at a first preset angle and a second preset angle with the first cover plate;

The third air duct partition plate and the fourth air duct partition plate are located in the first air inlet area and are arranged opposite to the main chip radiator, so that air entering from the first air inlet window passes through the third air duct partition plate and the fourth air duct partition plate to be guided to the main chip radiator.

Optionally, the switch further comprises a fifth air duct partition;

The fifth air duct partition plate is fixed on the first surface of the main board, one side edge of the fifth air duct partition plate is tightly attached to the main chip radiator, and the other side edge of the fifth air duct partition plate is tightly attached to the edge of the first air inlet area;

And one side of the main chip radiator, which is far away from the fifth air duct partition board, is tightly attached to the first air duct partition board.

Optionally, the switch further comprises a sixth air duct partition;

The sixth air duct partition plate is fixed on one surface of the first air inlet window close to the first air inlet area;

The sixth air duct partition plate and the first air inlet window are arranged at a third preset angle.

Optionally, the switch housing further includes an air outlet face, the air outlet face includes a first preset number of first air outlets and a second preset number of second air outlets, a fan module is correspondingly disposed in each of the first air outlets, and the first power module and the second power module are disposed in the second air outlets;

The first air outlet corresponds to the first air inlet window and the third air inlet window and is used for discharging heat of the first air inlet area and the fourth air inlet area from the inside of the switch;

The second air outlet corresponds to the second air inlet window and is used for discharging heat of the second air inlet area and the third air inlet area from the inside of the switch.

Optionally, the switch further comprises a fan power supply board;

The fan power supply board is arranged between the main board and the first air outlet and is positioned on the same plane with the main board;

Each fan module is connected with the fan power supply board in a pluggable manner.

Optionally, the switch further comprises a CPU and a CPU heat sink;

the CPU is arranged on the first surface and is close to the fan power supply board;

the CPU radiator is fixed on one surface of the CPU, which is far away from the main board.

In a second aspect, the present utility model provides a communication system comprising a switch as claimed in any one of the preceding claims.

The exchanger and the communication system provided by the utility model have the beneficial effects that:

Through setting up first wind channel baffle, divide into first air inlet region and second air inlet region with the first layer that the mainboard kept apart, set up first power module in the second air inlet region. The power supply is enabled to use one air duct alone, air duct crosstalk can not occur between the power supply and the first air inlet area, and the occurrence of the over-temperature condition of the power supply and the main chip is effectively avoided.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of an existing switch according to an embodiment of the present utility model;

Fig. 2 is a schematic structural diagram of a switch according to an embodiment of the present utility model;

FIG. 3 is a schematic view of a second air duct spacer and a panel connector according to an embodiment of the present utility model;

fig. 4 is a schematic diagram illustrating the positions of a first cover plate and a main chip heat sink according to an embodiment of the present utility model;

FIG. 5 is a schematic view illustrating a position of a fifth air duct partition according to an embodiment of the present utility model;

FIG. 6 is a schematic view illustrating a position of a sixth air duct partition according to an embodiment of the present utility model;

FIG. 7 is a schematic diagram of an air outlet surface according to an embodiment of the present utility model;

FIG. 8 is a schematic diagram of a fan power board and a CPU according to an embodiment of the present utility model;

Fig. 9 is a schematic diagram of a fan module and a power module according to an embodiment of the utility model.

The icons are 01-switch, 10-switch housing, 101-air inlet face, 1011-first air inlet window, 1012-second air inlet window, 1013-third air inlet window, 102-first cover plate, 103-air outlet face, 1031-first air outlet, 1032-second air outlet, 11-motherboard, 111-first face, 112-second face, 12-first power module, 13-second power module, 14-panel connector, 15-main chip radiator, 16-fan module, 17-fan power panel, 18-CPU, 19-CPU radiator, 21-first air duct partition, 22-second air duct partition, 23-third air duct partition, 24-fourth air duct partition, 25-fifth air duct partition, 26-sixth air duct partition.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present utility model, it should be understood that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like indicate orientations or positional relationships based on those shown in the drawings, or those conventionally put in place when the inventive product is used, or those conventionally understood by those skilled in the art, merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediary, or in communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

The switch generally comprises a main board, a fan module, a power module and a CPU module, and the specific module position can be designed according to the system requirement.

The plug power supply is generally placed at the rear end of the case, self-heat dissipation is carried out by a fan provided with the plug power supply, and heat dissipation of the system is completed by the fan at the rear end of the case. At present, fans of common low-power-consumption air-cooled switch equipment are fixed on the inner wall of the switch through screws, and if the fans are abnormally required to be replaced in the operation process, the upper cover is opened for maintenance after power failure, so that the scene that the switch is required to be continuously used without power failure is very influenced, and at the moment, the fans are required to be supported to be quickly hot-plugged to complete replacement when damaged like a plug power supply.

In the layout design of a high-power-consumption switch device, the air channels of a power supply module and a plug fan module need to be completely isolated, mainly because 1, when the device is an air draft design, the temperature of the air inlet position of the power supply module is always higher than the temperature of the air inlet of the device, and mainly because the light module and a radiator of a main chip cause a certain temperature rise of air, the temperature possibly exceeds the limit use temperature of the power supply module. 2. For the heat design of a large-power-consumption heat exchanger, the general fans are high static pressure fans, if the fans are not isolated from the power module by air channels, the back pressure of the fans of the power module is high, the efficiency of plugging the power fans is greatly reduced, so that the heat dissipation of the plugged power module is affected, and in severe cases, the heat dissipation of a system is greatly affected due to the fact that the air channels are in backflow, air channels are in disorder and the like.

Fig. 1 is a schematic diagram of a conventional switch chassis configured with pluggable fans and power supplies. The fan is generally used for relatively smaller power exchanger equipment, when the fan is fixed on the back, the pluggable fan and the power supply are all shared air channels (can be used for selectively exhausting or blowing air at the same time), the fan static pressure and the fan static pressure of the power supply module are relatively balanced, the heat dissipation inside the system is relatively uniform, and the heat dissipation requirement in most environments can be met.

However, the structure can only meet the heat dissipation requirement of small-power-consumption equipment, and when the power consumption reaches a certain degree, the power module and the fan share the system air channel to cause the problems of air channel disorder, over-temperature of the power module, abnormal back pressure of the power module with the fan and over-temperature of the main chip of the system.

Based on the above circumstances, the embodiments of the present disclosure provide a switch 01 and a communication system, which can effectively alleviate the above technical problems.

In the embodiment provided in the present utility model, when the switch 01 is an air draft design, an air inlet surface 101, an air inlet window, an air outlet surface 103, an air outlet, and the like described below may be used. If the switch 01 is configured for blowing, the principle is similar, and the technical effect of the scheme of the utility model is not affected. The following description of the principle of the solution of the present utility model will be made only with the solution of the air draft design.

Referring to fig. 2, the embodiment provides a switch 01, the switch 01 includes a switch housing 10, a main board 11 and a first power module 12, the switch housing 10 includes an air inlet surface 101, the air inlet surface 101 includes a first air inlet window 1011 and a second air inlet window 1012, and a first air channel partition 21 is fixed on the main board 11.

The main board 11 is installed and fixed in the switch housing 10, and divides the internal space of the switch housing 10 into a first layer and a second layer, wherein the first layer corresponds to the first face 111 of the main board 11.

The first air duct partition 21 is fixed to the first face 111, and divides the space of the first layer into a first air inlet area and a second air inlet area.

The first air inlet window 1011 corresponds to the first air inlet region, and the second air inlet window 1012 corresponds to the second air inlet region.

The first power module 12 is disposed in the second air inlet area of the first layer, opposite to the second air inlet window 1012, and the first power module 12 is electrically connected to the motherboard 11 through a connector in a pluggable manner.

In fig. 2, a main board 11 is provided at an intermediate position of the switch case 10, dividing a space inside the switch case 10 into upper and lower parts, respectively a first layer and a second layer. The first duct partition 21 subdivides the first layer of the internal space of the switch housing 10 corresponding to the first face 111 of the main board 11 into a first air intake area and a second air intake area. A first air inlet window 1011 is provided at a position corresponding to the first air inlet region on the air inlet surface 101, and a second air inlet window 1012 is provided at a position corresponding to the second air inlet region. And the first power module 12 is disposed at a position opposite to the second air intake window 1012 in the second air intake region.

When the heat dissipation system of the switch 01 starts to work, the air entering through the first air inlet window 1011 only passes through the first air inlet area, and the air entering through the second air inlet window 1012 only passes through the second air inlet area and reaches the first power module 12, so that the heat generated by the first power module 12 is taken away, and the problem of air duct crosstalk is avoided.

Optionally, the switch 01 further includes a second power module 13 and a second air duct partition 22.

The second air duct partition 22 is fixed on the second surface 112 of the main board 11, and corresponds to the first air duct partition 21, and divides the space of the second layer into a third air inlet area and a fourth air inlet area, wherein the second surface 112 is a surface of the main board 11 corresponding to the second layer, and the first surface 111 is opposite to the second surface 112.

The second power module 13 is disposed in the third air inlet area of the second layer, opposite to the second air inlet window 1012, and the second power module 13 is electrically connected to the motherboard 11 through a connector in a pluggable manner.

As shown in fig. 3, a second air duct partition 22 is disposed on the second side 112 of the main board 11 corresponding to the first air duct partition 21, and a second power module 13 is disposed corresponding to the first power module 12. The second air duct partition 22 is arranged to divide the space of the second layer corresponding to the second surface 112 into a third air inlet area and a fourth air inlet area, so that the air entering the third air inlet area through the second air inlet window 1012 can be ensured not to cross-talk with the air entering the fourth air inlet area, and the working stability of the second power module 13 is ensured.

Optionally, the switch 01 further comprises a panel connector 14, and the air inlet face 101 further comprises a third air inlet window 1013. The third air intake 1013 is disposed opposite to the first air intake 1011 and corresponds to the first air intake area.

The panel connector 14 is disposed on the air inlet surface 101 and located between the first air inlet window 1011, the second air inlet window 1012 and the third air inlet window 1013.

Still referring to fig. 3, the panel connector 14 of the switch 01 may be disposed on the air inlet surface 101 and located between the first air inlet window 1011, the second air inlet window 1012 and the third air inlet window 1013, so that the space resources of the air inlet surface 101 may be well utilized. The third air intake window 1013 corresponds to the fourth air intake region, so that all the air in the fourth air intake region comes from the third air intake window 1013, and the air in other air intake windows is prevented from entering the fourth air intake region to generate interference.

Optionally, the switch 01 further includes a main chip radiator 15, a third air duct partition 23, and a fourth air duct partition 24, and the switch case 10 further includes a first cover plate 102.

The main chip radiator 15 is fixed on the main board 11 and is located in the second air inlet area of the first layer. The first cover 102 is disposed opposite to the first surface 111 and away from the second surface 112.

The third air duct partition 23 and the fourth air duct partition 24 are fixed on the first cover plate 102 and are disposed at a first preset angle and a second preset angle with the first cover plate 102 respectively.

The third air duct partition 23 and the fourth air duct partition 24 are located in the first air intake area, and are disposed opposite to the main chip radiator 15 such that the air entering from the first air intake window 1011 is guided to the main chip radiator 15 through the third air duct partition 23 and the fourth air duct partition 24.

As shown in fig. 4, the first cover plate 102 may be an upper cover plate of the switch housing 10 covered on the first layer, and the third air duct partition plate 23 and the fourth air duct partition plate 24 are installed and fixed on the first cover plate 102, so that the air quantity entering through the first air inlet window 1011 can be better guided to the main chip radiator 15, thereby achieving a better heat dissipation effect.

Optionally, the switch 01 further comprises a fifth air duct partition 25. The fifth air duct partition 25 is fixed on the first surface 111 of the main board 11, and one side edge of the fifth air duct partition 25 is closely attached to the main chip radiator 15, and the other side edge is closely attached to the edge of the first air inlet area.

The side of the main chip radiator 15 away from the fifth air duct partition 25 is disposed in close contact with the first air duct partition 21.

As shown in fig. 5, since the left side of the main chip radiator 15 is tightly attached to the fifth air duct partition 25 and the right side is tightly attached to the first air duct partition 21, when wind enters the first air inlet area from the first air inlet window 1011, the wind can only pass through the position where the main chip is located, and then reaches the position where the wind is discharged from the rear end of the switch 01, thereby further improving the heat dissipation effect of the main chip radiator 15.

Optionally, the switch 01 further includes a sixth air duct partition 26. The sixth air duct partition 26 is fixed to one side of the first air inlet window 1011 near the first air inlet region. The sixth air duct partition 26 is disposed at a third predetermined angle with respect to the first air inlet window 1011.

Referring to fig. 6, a sixth air duct partition 26 is installed on a surface of the first air inlet window 1011 near the first air inlet region, when air enters the first air inlet region from the first air inlet window 1011, the air will firstly dissipate heat from the port optical module corresponding to the panel connector 14 due to the effect of the sixth air duct partition 26, and then the main chip radiator 15 is continuously cooled.

It should be noted that, the first preset angle, the second preset angle and the third preset angle may be the same angle or may be different angles, and the user may specifically set the angle according to the requirement in the actual setting, which is not specifically limited in the present utility model.

Optionally, the switch housing 10 further includes an air outlet surface 103, where the air outlet surface 103 includes a first preset number of first air outlets 1031 and a second preset number of second air outlets 1032, and one fan module 16 is correspondingly disposed in each first air outlet 1031, and the first power module 12 and the second power module 13 are disposed in the second air outlets 1032.

The first outlet 1031 corresponds to the first inlet 1011 and the third inlet 1013, and is configured to discharge heat in the first inlet area and the fourth inlet area from the inside of the exchange 01.

The second air outlet 1032 corresponds to the second air inlet window 1012, and is used for discharging heat of the second air inlet area and the third air inlet area from the inside of the exchanger 01.

Taking fig. 7 as an example, corresponding to the air inlet surface 101, the air outlet surface 103 of the switch 01 may be provided with a plurality of first air outlets 1031, where each first air outlet 1031 is provided with a pluggable fan module 16 as shown in fig. 9. Similarly, the first power module 12 and the second power module 13 may be provided with the second air outlet 1032. When the switch 01 is in operation, cold air enters the switch 01 from the air inlet surface 101, and is discharged from the switch 01 under the action of fans of the fan module 16, the first power module 12 and the second power module 13 after radiating heat from the main chip radiator 15, the first power module 12 and the second power module 13 respectively. Since the fan module 16, the first power module 12 and the second power module 13 are all pluggable, the replacement can be performed more conveniently and quickly.

In practical applications, the number of the first air outlets 1031, the number of the fan modules 16, and the number of the first power modules 12 and the second power modules 13 may be set according to requirements, which is not particularly limited in the present utility model.

Optionally, the switch 01 further comprises a fan power board 17. The fan power supply board 17 is disposed between the main board 11 and the first air outlet 1031, and is located on the same plane as the main board 11. Each fan module 16 is removably and electrically connected to a fan power supply board 17.

Referring to fig. 8, the fan power supply board 17 is disposed between the main board 11 and the first air outlet 1031, so as to provide a condition for plugging and unplugging the fan module 16, and the fan power supply board and the main board 11 are disposed on the same plane, so that the internal space of the main board 11 is reasonably utilized.

Optionally, the switch 01 further comprises a CPU18 and a CPU heat sink 19. The CPU18 is mounted on the first face 111 at a position close to the fan power supply panel 17. The CPU heat sink 19 is fixed to a side of the CPU18 remote from the motherboard 11.

Still taking fig. 8 as an example, the CPU radiator 19 is disposed close to the fan module 16, so that when the fan is running, heat on the CPU radiator 19 can be quickly taken away, and heat dissipation of the CPU18 is well performed.

Based on the same inventive concept, the present utility model provides a communication system comprising a switch 01 of any of the above.

With respect to the above-mentioned communication system, the specific functions and structures of the respective parts have been described in detail in the embodiment of the switch 01 provided in the present specification, and will not be described in detail herein.

By adopting the scheme in the embodiment of the utility model, the following steps are realized:

1. Through setting up first wind channel baffle, divide into first air inlet region and second air inlet region with the first layer that the mainboard kept apart, set up first power module in the second air inlet region. The power supply is enabled to use one air duct alone, air duct crosstalk can not occur between the power supply and the first air inlet area, and the occurrence of the over-temperature condition of the power supply and the main chip is effectively avoided.

2. The first power supply module, the second power supply module and each fan module are all arranged to be pluggable, so that the fan modules or the power supply modules can be replaced more conveniently.

The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (10)

1. The switch is characterized in that the switch (01) comprises a switch shell (10), a main board (11) and a first power module (12), the switch shell (10) comprises an air inlet surface (101), the air inlet surface (101) comprises a first air inlet window (1011) and a second air inlet window (1012), and a first air channel baffle plate (21) is fixed on the main board (11);

the main board (11) is fixedly arranged in the switch shell (10) and divides the internal space of the switch shell (10) into a first layer and a second layer, wherein the first layer corresponds to a first surface (111) of the main board (11);

The first air duct partition plate (21) is fixed on the first surface (111) and divides the space of the first layer into a first air inlet area and a second air inlet area;

The first air inlet window (1011) corresponds to the first air inlet region, and the second air inlet window (1012) corresponds to the second air inlet region;

The first power module (12) is arranged in the second air inlet area of the first layer and is opposite to the second air inlet window (1012), and the first power module (12) is electrically connected with the main board (11) in a pluggable manner through a connecting piece.

2. The exchange according to claim 1, wherein the exchange (01) further comprises a second power module (13) and a second air duct partition (22);

The second air duct partition board (22) is fixed on a second surface (112) of the main board (11), corresponds to the first air duct partition board (21), and divides the space of the second layer into a third air inlet area and a fourth air inlet area, wherein the second surface (112) is a surface of the main board (11) corresponding to the second layer, and the first surface (111) is opposite to the second surface (112);

The second power module (13) is arranged in the third air inlet area of the second layer and is opposite to the second air inlet window (1012), and the second power module (13) is electrically connected with the main board (11) in a pluggable manner through a connecting piece.

3. The exchange of claim 2 wherein the exchange (01) further comprises a panel connector (14), the air inlet face (101) further comprising a third air inlet window (1013);

the third air inlet window (1013) is arranged opposite to the first air inlet window (1011) and corresponds to the first air inlet area;

The panel connector (14) is disposed on the air inlet surface (101) and is located between the first air inlet window (1011), the second air inlet window (1012), and the third air inlet window (1013).

4. The switch of claim 2, wherein the switch (01) further comprises a main chip heat sink (15), a third air duct partition (23) and a fourth air duct partition (24), the switch housing (10) further comprising a first cover plate (102);

the main chip radiator (15) is fixed on the main board (11) and is positioned in the second air inlet area of the first layer;

The first cover plate (102) is arranged opposite to the first surface (111) and away from the second surface (112);

The third air duct partition plate (23) and the fourth air duct partition plate (24) are fixed on the first cover plate (102) and are respectively arranged at a first preset angle and a second preset angle with the first cover plate (102);

The third air duct partition plate (23) and the fourth air duct partition plate (24) are located in the first air inlet area and are arranged opposite to the main chip radiator (15), so that air entering from the first air inlet window (1011) is guided to the main chip radiator (15) through the third air duct partition plate (23) and the fourth air duct partition plate (24).

5. The exchange according to claim 4, wherein the exchange (01) further comprises a fifth air duct partition (25);

The fifth air duct partition plate (25) is fixed on the first surface (111) of the main board (11), one side edge of the fifth air duct partition plate (25) is tightly attached to the main chip radiator (15), and the other side edge is tightly attached to the edge of the first air inlet area;

One side of the main chip radiator (15) far away from the fifth air duct partition plate (25) is tightly attached to the first air duct partition plate (21).

6. The exchange according to claim 1, wherein the exchange (01) further comprises a sixth air duct partition (26);

The sixth air duct partition plate (26) is fixed on one surface of the first air inlet window (1011) close to the first air inlet area;

the sixth air duct partition plate (26) and the first air inlet window (1011) are arranged at a third preset angle.

7. A switch according to claim 3, wherein the switch housing (10) further comprises an air outlet surface (103), the air outlet surface (103) comprises a first preset number of first air outlets (1031) and a second preset number of second air outlets (1032), one fan module (16) is correspondingly arranged in each first air outlet (1031), and the first power module (12) and the second power module (13) are arranged in the second air outlets (1032);

The first air outlet (1031) corresponds to the first air inlet window (1011) and the third air inlet window (1013) and is used for discharging heat of the first air inlet area and the fourth air inlet area from the inside of the exchanger (01);

The second air outlet (1032) corresponds to the second air inlet window (1012) and is used for discharging heat of the second air inlet area and the third air inlet area from the inside of the switch (01).

8. The exchange according to claim 7, wherein said exchange (01) further comprises a fan power board (17);

The fan power supply board (17) is arranged between the main board (11) and the first air outlet (1031) and is positioned on the same plane with the main board (11);

Each fan module (16) is connected with the fan power supply board (17) in a pluggable manner.

9. The switch according to claim 8, characterized in that the switch (01) further comprises a CPU (18) and a CPU heat sink (19);

The CPU (18) is arranged on the first surface (111) at a position close to the fan power supply board (17);

the CPU radiator (19) is fixed on one surface of the CPU (18) which is far away from the main board (11).

10. A communication system, characterized in that it comprises a switch (01) according to any one of claims 1-9.