CN223414077U - Power module packaging structure and electronic equipment - Google Patents
Power module packaging structure and electronic equipmentInfo
- Publication number
- CN223414077U CN223414077U CN202422910075.5U CN202422910075U CN223414077U CN 223414077 U CN223414077 U CN 223414077U CN 202422910075 U CN202422910075 U CN 202422910075U CN 223414077 U CN223414077 U CN 223414077U
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- heat dissipation
- power module
- frame
- packaging
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Abstract
本实用新型实施例公开了一种功率模组封装结构及电子设备。该功率模组封装结构包括：散热封装框架，包括相对设置的第一表面和第二表面；第一表面设置有凹槽；功率芯片设置于凹槽内；散热盖板；散热盖板设置于凹槽内且位于功率芯片远离散热封装框架的一侧。本实用新型实施例的技术方案，通过设置散热封装框架，以及在散热封装框架的第一表面设置凹槽，将功率芯片设置于凹槽内，为功率芯片提供机械保护、电气连接以及散热通道，且将散热盖板设置于凹槽内位于功率芯片远离散热封装框架的一侧，实现对功率芯片的多面散热，增强封装散热的效果，且封装结构简单，简化了封装流程。
The embodiment of the present utility model discloses a power module packaging structure and an electronic device. The power module packaging structure includes: a heat dissipation packaging frame, including a first surface and a second surface arranged opposite to each other; a groove is provided on the first surface; a power chip is arranged in the groove; a heat dissipation cover plate; the heat dissipation cover plate is arranged in the groove and is located on the side of the power chip away from the heat dissipation packaging frame. The technical solution of the embodiment of the present utility model is to provide mechanical protection, electrical connection and heat dissipation channel for the power chip by providing a heat dissipation packaging frame and providing a groove on the first surface of the heat dissipation packaging frame, and to provide the power chip with mechanical protection, electrical connection and heat dissipation channel, and to provide the heat dissipation cover plate in the groove on the side of the power chip away from the heat dissipation packaging frame, thereby realizing multi-sided heat dissipation of the power chip and enhancing the heat dissipation effect of the package. The packaging structure is simple, and the packaging process is simplified.
Description
Technical Field
The present disclosure relates to semiconductor technology, and more particularly, to a power module package structure and an electronic device.
Background
With the continuous increase of chip integration and continuous improvement of chip performance, a high-power-consumption chip can generate a large amount of heat during operation, so as to avoid burning of the chip due to high temperature, ensure long-term stable operation of the chip, and ensure heat dissipation of the chip when forming a packaging structure.
The existing chip package mainly comprises a Quad Flat No-LEADS PACKAGE (QFN) technology or a Dual Flat No-LEADS PACKAGE (DFN) technology, wherein the main structure of the QFN technology comprises a frame, a chip and a plastic package material, an exposed bonding pad is arranged at the bottom of the frame and used for conducting heat and bonding the chip, an electric connector is arranged between the chip and the frame, and internal pins are arranged around the frame and used for electrically connecting the chip, the frame and a circuit board.
However, in the existing packaging structure, the front surface of the frame is attached with the chip, the bonding pad on the surface of the chip is connected with the frame pin, the packaging is completed through the plastic packaging material, the heat dissipation path of the chip is conducted to the frame through the bottom of the chip and then dissipated, the heat dissipation capacity is poor, and the packaging process is complex through bonding and plastic packaging.
Disclosure of utility model
The utility model provides a power module packaging structure and electronic equipment, which are used for solving the problems of poor packaging heat dissipation capacity and complex packaging flow.
According to an aspect of the present utility model, there is provided a power module package structure including:
The heat dissipation packaging frame comprises a first surface and a second surface which are oppositely arranged, wherein the first surface is provided with a groove;
the heat dissipation cover plate is arranged in the groove and is positioned at one side of the power chip far away from the heat dissipation packaging frame.
Optionally, the groove comprises a first concave part and a second concave part, wherein the first concave part is communicated with the second concave part;
The projection area of the first concave part on the heat dissipation packaging frame is smaller than that of the second concave part on the heat dissipation packaging frame.
Optionally, a heat conducting adhesive layer is arranged in the first concave part;
the power chip is fixed in the heat dissipation packaging frame through the heat conduction bonding layer.
Optionally, the thermally conductive bonding layer comprises a tin thermally conductive bonding layer or a sintered silver paste thermally conductive bonding layer.
Optionally, the size of the power chip is smaller than the size of the first recess;
The size of the heat dissipation cover plate is smaller than that of the second concave part.
Optionally, a first connection pad and a second connection pad are arranged on one side of the power chip far away from the heat dissipation packaging frame;
The heat dissipation cover plate consists of a substrate and a conductive layer, wherein the substrate is provided with a first through hole and a second through hole which are distributed at intervals;
the first conductive portion is electrically connected to the first connection pad, and the second conductive portion is electrically connected to the second connection pad.
Optionally, a surface of the first conductive portion facing the first connection pad is provided with a first conductive post, and the first conductive portion and the first connection pad are electrically connected by solder;
the surface of the second conductive part facing the second connection pad is provided with a second conductive post, and the second conductive post and the second connection pad are electrically connected by solder.
Optionally, the power module packaging structure further comprises a filling adhesive;
the filling glue is arranged between the heat dissipation cover plate and the power chip and between the heat dissipation cover plate and the heat dissipation packaging frame.
Optionally, the second surface is provided with a grating structure.
Optionally, the projection area of the grid structure on the heat dissipation packaging frame is larger than or equal to the projection area of the power chip on the heat dissipation packaging frame.
Optionally, the heat dissipation package frame is a metal copper heat dissipation frame.
According to another aspect of the present utility model, there is provided an electronic apparatus including a support substrate, one side of which is provided with a conductive line;
The power chip in the power module packaging structure is electrically connected with the conductive circuit through the heat dissipation cover plate, and the power module packaging structure is the power module packaging structure.
Optionally, the support substrate is a printed circuit board.
According to the technical scheme, the heat dissipation packaging frame is arranged, the groove is arranged on the first surface of the heat dissipation packaging frame, the power chip is arranged in the groove to provide mechanical protection, electrical connection and a heat dissipation channel for the power chip, the heat dissipation cover plate is arranged in the groove and is positioned on one side of the power chip far away from the heat dissipation packaging frame, so that multi-face heat dissipation of the power chip is realized, the packaging heat dissipation effect is enhanced, the packaging structure is simple, and the packaging flow is simplified.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the utility model or to delineate the scope of the utility model. Other features of the present utility model will become apparent from the description that follows.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional structure of a power module package according to an embodiment of the utility model;
Fig. 2 is a schematic front view of a power module package structure according to an embodiment of the utility model;
fig. 3 is a schematic back view of a power module package structure according to an embodiment of the utility model;
Fig. 4 is a schematic cross-sectional structure of a heat dissipation package frame according to an embodiment of the present utility model;
fig. 5 is a schematic cross-sectional structure of a power chip according to an embodiment of the present utility model;
fig. 6 is a schematic cross-sectional view of a heat dissipating cover according to an embodiment of the present utility model;
Fig. 7 is a schematic cross-sectional structure of a power chip disposed in a recess according to an embodiment of the present utility model;
Fig. 8 is a schematic cross-sectional structure of another power module package structure according to an embodiment of the utility model;
FIG. 9 is a schematic back view of another power module package structure according to an embodiment of the present utility model;
fig. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present utility model.
Detailed Description
In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the utility model described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements that are expressly listed or inherent to such process, method, article, or apparatus.
Aiming at the problems of poor packaging heat dissipation capability and complex packaging flow, the embodiment of the utility model provides the following technical scheme that fig. 1 is a schematic cross-sectional structure diagram of a power module packaging structure provided by the embodiment of the utility model. Fig. 2 is a schematic front view of a power module package structure according to an embodiment of the utility model. Fig. 3 is a schematic back view of a power module package structure according to an embodiment of the utility model. As shown in fig. 1, 2 and 3, the power module package structure comprises a heat dissipation package frame 10, a power chip 20, a heat dissipation cover plate 30 and a heat dissipation cover plate 30, wherein the heat dissipation package frame 10 comprises a first surface 101 and a second surface 102 which are oppositely arranged, the first surface 101 is provided with a groove 103, the power chip 20 is arranged in the groove 103, and the heat dissipation cover plate 30 is arranged in the groove 103 and is positioned on one side, far away from the heat dissipation package frame 10, of the power chip 20.
In the embodiment of the present utility model, the heat dissipation package frame 10 is an important component for heat dissipation and protection of the chip or the electronic component, performs physical support and electrical connection to the chip or the electronic component, and provides an effective heat dissipation path. The heat dissipation package frame 10 is generally made of metal or a material having high thermal conductivity, and surrounds the electronic component to form a relatively airtight space to ensure that the electronic component operates and stably operates within a proper temperature range, and to avoid damage due to excessive temperature.
The first surface 101 of the heat dissipation package frame 10 is provided with a groove 103, the power chip 20 is disposed in the groove 103, and mechanical protection, electrical connection and heat dissipation channels are provided for the power chip 20 through the heat dissipation package frame 10. Heat generated by the power chip 20 is conducted out in time through the heat dissipation packaging frame 10, so that the power chip 20 is prevented from being reduced in performance and shortened in service life or even damaged due to overheating. The heat dissipation package frame 10 and the grooves 103 provide physical support and protection for the power chip 20, so that the power chip 20 is protected from external mechanical impact, vibration, dust or moisture and other environmental factors.
The power chip 20 is an integrated circuit chip capable of processing high voltage and high current signals, and is mainly used for converting, controlling and driving electric energy so as to meet the power requirements of various electronic devices. The types of power chips 20 mainly include metal oxide semiconductor field effect transistor power chips, insulated gate bipolar transistor power chips, and bipolar transistor power chips.
The power module packaging structure further comprises a heat dissipation cover plate 30, wherein the heat dissipation cover plate 30 is arranged in the groove 103 and is positioned on one side, far away from the heat dissipation packaging frame 10, of the power chip 20, electric connection and mechanical support are provided for heat dissipation of the power chip 20, and through the arrangement of the heat dissipation packaging frame 10 and the heat dissipation cover plate 30, multi-face heat dissipation of the power chip 20 is achieved, and the heat dissipation effect of packaging is enhanced. In the packaging process of the power chip 20, bonding and plastic packaging are not needed, so that the packaging flow is simplified, and the formed power module packaging structure is simpler.
According to the technical scheme, the heat dissipation packaging frame is arranged, the groove is arranged on the first surface of the heat dissipation packaging frame, the power chip is arranged in the groove to provide mechanical protection, electrical connection and a heat dissipation channel for the power chip, the heat dissipation cover plate is arranged in the groove and is positioned on one side of the power chip far away from the heat dissipation packaging frame, so that multi-face heat dissipation of the power chip is realized, the packaging heat dissipation effect is enhanced, the packaging structure is simple, and the packaging flow is simplified.
Fig. 4 is a schematic cross-sectional structure of a heat dissipation package frame according to an embodiment of the present utility model. Referring to fig. 1 and 4, the recess 103 may optionally include a first recess 1031 and a second recess 1032, where the first recess 1031 and the second recess 1032 are in communication, and a projected area of the first recess 1031 on the heat dissipation package frame 10 is smaller than a projected area of the second recess 1032 on the heat dissipation package frame 10.
In the embodiment of the present utility model, the first recess 1031 is used for placing the power chip 20, the second recess 1032 is used for placing the heat dissipation cover plate 30, and the first recess 1031 and the second recess 1032 are communicated, so as to connect the heat dissipation cover plate 30 and the power chip 20, and dissipate heat and electrically connect the power chip 20 through the heat dissipation cover plate 30. The projection area of the first concave portion 1031 on the heat dissipation package frame 10 is smaller than the projection area of the second concave portion 1032 on the heat dissipation package frame 10, so that the heat dissipation cover plate 30 completely covers the power chip 20, and the overall heat dissipation of the power chip 20 is realized through the heat dissipation package frame 10, and the heat dissipation effect of the power module package structure is improved. The first recess 1031 and the second recess 1032 may be formed by performing an etching process or a punching process on the heat dissipation package frame 10.
On the basis of the technical solution of the above embodiment of the utility model, referring to fig. 1 and 4, optionally, a heat-conducting adhesive layer 104 is disposed in the first recess 1031, and the power chip 20 is fixed in the heat dissipation package frame 10 by the heat-conducting adhesive layer 104.
In the embodiment of the present utility model, a high heat conductive adhesive is coated in the first recess 1031 of the groove 103 of the heat dissipation package frame 10 to form the heat conductive adhesive layer 104. The power chip 20 is fixed in the heat dissipation package frame 10 through the heat conduction bonding layer 104, so that the fixing and heat conduction of the power chip 20 are realized.
Based on the technical solution of the above embodiment of the utility model, referring to fig. 1, optionally, the heat conductive adhesive layer 104 includes a tin heat conductive adhesive layer or a sintered silver adhesive heat conductive adhesive layer.
In the embodiment of the present utility model, the heat-conducting adhesive layer 104 may be a high heat-conducting adhesive material such as solder paste or sintered silver paste. When the heat-conducting adhesive layer 104 is provided, a high heat-conducting adhesive material needs to be selected according to the requirements of adhesive strength, heat conductivity coefficient, temperature resistance, corrosion resistance, construction process, cost and the like.
On the basis of the technical solution of the above embodiment of the utility model, referring to fig. 1 and 4, optionally, the size of the power chip 20 is smaller than the size of the first recess 1031, and the size of the heat dissipation cover 30 is smaller than the size of the second recess 1032.
In the embodiment of the present utility model, the size of the power chip 20 is set smaller than the size of the first recess 1031, so that the power chip 20 is completely embedded in the heat dissipation package frame 10. The size of the heat dissipation cover plate 30 is smaller than that of the second recess 1032, so that the heat dissipation cover plate 30 is embedded into the heat dissipation package frame 10 and covers the power chip 20, and the overall heat dissipation of the power chip 20 is achieved.
Fig. 5 is a schematic cross-sectional structure of a power chip according to an embodiment of the present utility model. Fig. 6 is a schematic cross-sectional structure of a heat dissipating cover according to an embodiment of the present utility model. Referring to fig. 1, 5 and 6, alternatively, a side of the power chip 20 away from the heat dissipation package frame 10 is provided with a first connection pad 201 and a second connection pad 202, the heat dissipation cover plate 30 is composed of a substrate 301 and a conductive layer 302, the substrate 301 is provided with a first through hole 3011 and a second through hole 3012 which are distributed at intervals, the conductive layer 302 comprises a first conductive part 3021 and a second conductive part 3022, the first conductive part 3021 is located in the first through hole 3011, the second conductive part 3022 is located in the second through hole 3012, the first conductive part 3021 is electrically connected with the first connection pad 201, and the second conductive part 3022 is electrically connected with the second connection pad 202.
In an embodiment of the present utility model, the first connection pad 201 may be connected to the drain of the power chip 20, and the second connection pad 202 may be connected to the gate of the power chip 20. The power chip 20 is thinned so that the power chip 20 can be placed in the first recess 1031. Fig. 7 is a schematic cross-sectional structure of a power chip disposed in a recess according to an embodiment of the present utility model. As shown in fig. 7, after the power chip 20 provided with the first connection pad 201 and the second connection pad 202 is thinned, the power chip 20 is placed in the first recess 1031 of the heat dissipation package frame 10 provided with the heat conductive adhesive layer 104, and the heat dissipation package frame 10 is connected to the plurality of surfaces of the power chip 20 through the heat conductive adhesive layer 104, so as to dissipate heat from the plurality of surfaces of the power chip 20.
The heat sink cover 30 is composed of a substrate 301 and a conductive layer 302, and the substrate 301 may be a ceramic substrate having high heat conductive properties. The conductive layer 302 includes a first conductive portion 3021 and a second conductive portion 3022, each of which is a metallic conductive layer, including but not limited to copper. Illustratively, the first conductive portion 3021 is electrically connected to the drain of the power chip 20 through the first connection pad 201, and the second conductive portion 3022 is electrically connected to the gate of the power chip 20 through the second connection pad 202. First and second through holes 3011 and 3012 are provided on the substrate 301 at intervals for injecting metal to form first and second conductive portions 3021 and 3022.
On the basis of the technical solution of the above embodiment of the utility model, referring to fig. 1 and 6, optionally, a surface of the first conductive portion 3021 facing the first connection pad 201 is provided with a first conductive post 303, the first conductive portion 3021 and the first connection pad 201 are electrically connected by solder 305, and a surface of the second conductive portion 3022 facing the second connection pad 202 is provided with a second conductive post 304, and the second conductive post 304 and the second connection pad 202 are electrically connected by solder 305.
In an embodiment of the present utility model, the first conductive pillars 303 may be copper pillars. Solder 305 may be tin. The heat dissipation cover 30 is electrically connected with the power chip 20 through the first conductive column 303 and the solder 305 of the first conductive part 3021 facing the first connection pad 201 and the second conductive column 304 and the solder 305 of the second conductive part 3022 facing the second connection pad 202, so that the heat dissipation cover 30 not only dissipates heat of the power chip 20, but also can realize transmission of electrical signals.
On the basis of the technical solution of the above embodiment of the utility model, referring to fig. 1, optionally, the power module packaging structure further includes a filling adhesive 50, where the filling adhesive 50 is disposed between the heat dissipation cover 30 and the power chip 20, and between the heat dissipation cover 30 and the heat dissipation packaging frame 10.
In the embodiment of the present utility model, the filling glue 50 is used for fixing the heat dissipation cover 30 and the power chip 20, and plays a role of insulating space.
Fig. 8 is a schematic cross-sectional structure of another power module package structure according to an embodiment of the utility model. Fig. 9 is a schematic back view of another power module package structure according to an embodiment of the utility model. Referring to fig. 8 and 9, the second surface 102 is optionally provided with a grating structure 1021.
In the embodiment of the present utility model, the power module package structure shown in fig. 8 is different from the power module package structure shown in fig. 1 in that the second surface 102 of the power module package structure shown in fig. 8 is provided with a grid structure 1021. The second surface 102 is provided with the grille structure 1021, so that the surface area of the power module packaging structure can be increased, and a better heat dissipation effect can be obtained. The power module package structure shown in fig. 8 does not need a peripheral radiator, and the heat dissipation device is integrated in the package structure by arranging the grille structure 1021 on the second surface 102, so that the package size is reduced, and a better heat dissipation effect is achieved.
Based on the technical solution of the above embodiment of the present utility model, referring to fig. 8, optionally, the projection area of the grid structure 1021 on the heat dissipation package frame 10 is greater than or equal to the projection area of the power chip 20 on the heat dissipation package frame 10.
In the embodiment of the utility model, the projection area of the grille structure 1021 on the heat dissipation packaging frame 10 is larger than or equal to the projection area of the power chip 20 on the heat dissipation packaging frame 10, so that the heat dissipation area is increased, the heat dissipation of the power chip 20 is facilitated, and the overall packaging size of the power module packaging structure is not affected.
On the basis of the technical solution of the above embodiment of the utility model, referring to fig. 1, optionally, the heat dissipation package frame 10 is a metal copper heat dissipation frame.
In the embodiment of the utility model, the metal copper heat dissipation frame has the characteristics of high heat conductivity, good heat stability and uniform heat dissipation, and the application of the metal copper heat dissipation frame has high strength and hardness, so that the power chip 20 is protected, and the power chip 20 is prevented from being impacted by external force. The metallic copper heat dissipation frame also has oxidation resistance and corrosion resistance.
Fig. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present utility model, as shown in fig. 10, where the electronic device includes a support substrate 100, a conductive circuit is disposed on one side of the support substrate 100, and a power module package structure 200, in which a power chip 20 in the power module package structure 200 is electrically connected to the conductive circuit through a heat dissipation cover plate 30, and the power module package structure 200 is the power module package structure 200 according to any embodiment of the present utility model.
In an embodiment of the present utility model, the supporting substrate 100 is used for supporting and fixing the power module package structure 200. The formed power module packaging structure 200 is attached to the supporting substrate 100, a conductive circuit is arranged on one side of the supporting substrate 100, the power chip 20 in the power module packaging structure 200 is electrically connected with the conductive circuit through the heat dissipation cover plate 30, a part of heat generated by the power chip 20 is transferred to the supporting substrate 100 through a copper column and is emitted through a copper through hole on the supporting substrate 100, and the other part of heat is emitted through a metal copper heat dissipation frame contacted with the power chip 20, so that six sides of the power chip 20 are dissipated, and a better heat dissipation effect is achieved.
On the basis of the technical solution of the above embodiment of the utility model, referring to fig. 10, optionally, the supporting substrate 100 is a printed circuit board.
In an embodiment of the present utility model, the support substrate 100 is a printed circuit board (Printed Circuit Board, PCB). The PCB is formed by forming printed boards of point-to-point connection wires and printed elements on an insulating substrate according to a predetermined design. The PCB provides electrical connection and mechanical support for the power chip 20 in the power module package structure 200, which is a key carrier for implementing the functions of the power chip 20, ensuring accurate transmission of signals and stable supply of power.
It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps described in the present utility model may be performed in parallel, sequentially, or in a different order, so long as the desired results of the technical solution of the present utility model are achieved, and the present utility model is not limited herein.
The above embodiments do not limit the scope of the present utility model. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included in the scope of the present utility model.
Claims (13)
1. The utility model provides a power module packaging structure which characterized in that includes:
The heat dissipation packaging frame comprises a first surface and a second surface which are oppositely arranged, wherein the first surface is provided with a groove;
The heat dissipation cover plate is arranged in the groove and is positioned at one side of the power chip far away from the heat dissipation packaging frame.
2. The power module packaging structure according to claim 1, wherein the groove comprises a first concave part and a second concave part, wherein the first concave part is communicated with the second concave part;
The projection area of the first concave part on the heat dissipation packaging frame is smaller than the projection area of the second concave part on the heat dissipation packaging frame.
3. The power module package structure of claim 2, wherein a thermally conductive adhesive layer is disposed within the first recess;
the power chip is fixed in the heat dissipation packaging frame through the heat conduction bonding layer.
4. The power module package structure of claim 3, wherein the thermally conductive adhesive layer comprises a tin thermally conductive adhesive layer or a sintered silver paste thermally conductive adhesive layer.
5. The power module package structure of claim 2, wherein the power chip has a size smaller than the size of the first recess;
the size of the heat dissipation cover plate is smaller than that of the second concave part.
6. The power module packaging structure according to claim 1, wherein a first connection pad and a second connection pad are arranged on one side of the power chip away from the heat dissipation packaging frame;
The heat dissipation cover plate consists of a substrate and a conductive layer, wherein the substrate is provided with a first through hole and a second through hole which are distributed at intervals;
The first conductive part is electrically connected with the first connection pad, and the second conductive part is electrically connected with the second connection pad.
7. The power module package structure according to claim 6, wherein a surface of the first conductive portion facing the first connection pad is provided with a first conductive post, the first conductive portion and the first connection pad being electrically connected by solder;
The surface of the second conductive part facing the second connection pad is provided with a second conductive column, and the second conductive column and the second connection pad are electrically connected through solder.
8. The power module package structure of claim 1, further comprising a filler paste;
The filling glue is arranged between the heat dissipation cover plate and the power chip and between the heat dissipation cover plate and the heat dissipation packaging frame.
9. The power module package structure of claim 1, wherein the second surface is provided with a grid structure.
10. The power module package structure of claim 9, wherein a projected area of the grid structure on the heat dissipation package frame is greater than or equal to a projected area of the power chip on the heat dissipation package frame.
11. The power module package structure of claim 1, wherein the heat dissipation package frame is a metallic copper heat dissipation frame.
12. An electronic device, comprising:
a supporting substrate, one side of which is provided with a conductive circuit;
The power module packaging structure, wherein the power chip in the power module packaging structure is electrically connected with the conductive circuit through the heat dissipation cover plate, and the power module packaging structure is the power module packaging structure according to any one of claims 1-11.
13. The electronic device of claim 12, wherein the support substrate is a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422910075.5U CN223414077U (en) | 2024-11-27 | 2024-11-27 | Power module packaging structure and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202422910075.5U CN223414077U (en) | 2024-11-27 | 2024-11-27 | Power module packaging structure and electronic equipment |
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| CN223414077U true CN223414077U (en) | 2025-10-03 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121191993A (en) * | 2025-11-24 | 2025-12-23 | 珠海越亚半导体股份有限公司 | Power device embedded structure and its fabrication method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121191993A (en) * | 2025-11-24 | 2025-12-23 | 珠海越亚半导体股份有限公司 | Power device embedded structure and its fabrication method |
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