CN223401003U

CN223401003U - FPC circuit board detects positioning die

Info

Publication number: CN223401003U
Application number: CN202422591452.3U
Authority: CN
Inventors: 王军
Original assignee: Jiangsu Xinglianda Precision Industrial Equipment Co ltd
Current assignee: Jiangsu Xinglianda Precision Industrial Equipment Co ltd
Priority date: 2024-10-25
Filing date: 2024-10-25
Publication date: 2025-09-30
Anticipated expiration: 2034-10-25

Abstract

The utility model discloses an FPC circuit board detection and positioning mold, which relates to the field of FPC circuit board detection technology and solves the problem of low FPC circuit board detection efficiency and inability to meet large-scale detection needs. The mold includes a first needle template and a second needle template, both of which are formed with positioning grooves that are compatible with the shape of the circuit board to be detected; a first connection module and a second connection module, each having a plurality of first probes for contacting the pins of electronic components on the circuit board to be detected; a needle mold fixing block having a second probe for electrically contacting the circuit board to be detected; and a magnet. The mold can quickly complete the positioning of the FPC circuit board, and at the same time, the probes at the corresponding positions will electrically contact the FPC circuit board and the corresponding electronic components. The first connection module and the second connection module can then be connected to the detection instrument to quickly complete the detection of the FPC circuit board, and the detection efficiency is significantly improved.

Description

FPC circuit board detects positioning die

Technical Field

The utility model relates to the technical field of FPC circuit board detection, in particular to a FPC circuit board detection positioning die.

Background

A flexible printed circuit board (FPC board for short) is a flexible printed circuit board having high reliability and excellent in flexibility, which is made of polyimide or polyester film as a base material. The wiring density is high, the weight is light, the thickness is thin, the flexibility is good. The electronic device is widely used in various electronic devices, such as mobile phones, electronic watches, flat panels and the like.

After the FPC circuit board is produced, the performances of resistance, capacitance, voltage and the like of the FPC circuit board need to be tested, and whether the FPC circuit board meets the design requirements or not is detected. Because the FPC circuit board has different shapes, is usually in an irregular shape and has good flexibility, the FPC circuit board is inconvenient to fix during detection, and a detection instrument is required to be connected with each connection part and each electronic component on the FPC circuit board through leads respectively and then is electrified for testing. This mode is complicated, and the detection instrument needs to be electrically connected with the FPC circuit board repeatedly all the time, so that the operation is complicated. Meanwhile, because the number of the connection ports is relatively large, local contact failure is easy to occur, and repeated debugging is needed. Therefore, the detection requirements of a large batch cannot be met, and the efficiency is lower.

Disclosure of utility model

The utility model aims to solve the problems, designs the FPC circuit board detection positioning die, and solves the problems that the FPC circuit board detection efficiency is low and the requirement of mass detection cannot be met.

The technical scheme of the utility model for realizing the purpose is that the FPC circuit board detection positioning die comprises:

The positioning grooves are formed in the first pin template and the second pin template, and are matched with the shape of the circuit board to be detected, and a plurality of positioning holes which are convenient for positioning the pins on the electronic component are formed in the positioning grooves;

The first connecting module and the second connecting module are respectively positioned at the bottoms of the first pin template and the second pin template, and the first pin template and the second pin template are respectively provided with a plurality of first probes which are used for contacting with pins of the electronic components on the circuit board to be detected, and the positions of the first probes correspond to the positions of the positioning holes;

The pin die fixing block is positioned at the bottom of the first pin die plate, a second probe used for being in electrical contact with the circuit board to be detected is arranged on the pin die fixing plate, and the second probe is electrically connected with the first connecting module;

And the magnet is positioned at the bottom of the first needle template and at one side of the needle module fixing block and is used for providing a magnetic field environment for electronic components on the circuit board to be detected.

Preferably, the first needle template is provided with a mounting groove, a positioning block is arranged in the mounting groove, the positioning block is provided with a positioning groove, the positioning groove is a part of the positioning groove, the positioning groove is internally provided with a plurality of positioning holes, and the first connecting module is positioned below the positioning block.

Preferably, the first connection module comprises a base, a ox horn connector fixed at the bottom of the base, a fixed block fixed at the top of the base, and a plurality of first probes fixed on the fixed block in a penetrating manner, wherein the first probes are electrically connected with the ox horn connector.

Preferably, the fixing block is provided with a positioning part in an upward protruding mode, the bottom of the positioning block is provided with a groove used for being clamped with the positioning part, the fixing block is provided with a positioning pin, and the positioning pin is spliced with the positioning block.

Preferably, a detection mechanism for sensing the circuit board to be detected is arranged at the bottom of the first needle template, an avoidance hole is formed in the positioning groove, and the detection mechanism is located below the avoidance hole.

Preferably, the bottoms of the first needle template and the second needle template are respectively provided with a negative pressure joint, and the positioning groove is internally provided with a through hole communicated with the negative pressure joint.

Preferably, a pin die fixing plate is arranged at the bottom of the second pin die plate, a pin die insert is arranged on the pin die fixing plate, a plurality of limiting holes corresponding to the positions of the positioning holes are formed in the pin die insert, and a plurality of first probes sequentially penetrate through the limiting holes and the positioning holes.

Preferably, the second connection module comprises a pin clamping block connected with the bottom of the pin die fixing plate through a connecting rod, a connector fixed at the bottom of the pin clamping block, and a plurality of first probes connected with the connector.

Preferably, the bottoms of the first needle template and the second needle template are provided with guide posts and buffer springs.

Preferably, a shifting cylinder is arranged below the first needle template, the shifting cylinder is horizontally arranged, the output end of the shifting cylinder is connected with a supporting block, and the top of the supporting block is provided with a containing groove for preventing a magnet.

Compared with the prior art, the beneficial effects are that:

According to the utility model, the FPC circuit board is positioned and fixed in the positioning grooves on the first pin template and the second pin template, meanwhile, probes at corresponding positions are in electrical contact with the FPC circuit board and corresponding electronic components, then the first connecting module and the second connecting module can be connected with a detection instrument, after the power is on, the numerical value changes of capacitance, voltage, current, resistance and the like of the FPC circuit board can be detected through the detection instrument, meanwhile, a magnetic field environment is provided for a chip by a magnet, the working state of the chip in the magnetic field environment is detected, the situation of poor contact can not occur, the detection of the FPC circuit board can be rapidly completed, and the detection efficiency is obviously improved.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a FPC board inspection positioning mold in the present utility model;

FIG. 2 is a schematic structural view of the FPC board when the FPC board is placed on the FPC board inspection positioning mold;

FIG. 3 is a schematic view of the structure when the first pin template and the displacement cylinder are mated;

FIG. 4 is a schematic view of the structure of FIG. 3 from another perspective;

FIG. 5 is a schematic view of the bottom structure of the first pin template;

FIG. 6 is a schematic structural view of a first connection module;

FIG. 7 is a schematic view of the mounting structure of the shift cylinder and the support block;

FIG. 8 is a schematic view of the structure of the first pin template;

FIG. 9 is a schematic structural view of the positioning block;

FIG. 10 is a schematic view of the bottom structure of the positioning block;

FIG. 11 is a schematic view of the mounting structure of the second pin die plate and pin die fixing plate;

FIG. 12 is a schematic view of the structure of FIG. 11 from another perspective;

fig. 13 is a schematic structural view of a second needle template.

In the figure, 1, a first pin template, 2, a second pin template, 3, a first connecting module, 31, a base, 32, a ox horn connector, 33, a fixing block, 4, a pin template fixing plate, 5, a locating block, 501, a locating groove, 502, a groove, 6, a shifting cylinder, 7, a second connecting module, 71, a pin clamping block, 72, a connector, 8, an FPC circuit board, 9, a guide pillar, 10, a buffer spring, 11, a negative pressure connector, 12, a detecting mechanism, 13, a supporting block, 14, a pin template fixing block, 15, a magnet, 101, a locating groove, 1011, a locating hole, 102, a first probe, 103 and a second probe.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1-5 and fig. 11-12, a preferred embodiment of the present utility model proposes an FPC board inspection positioning mold, which is used as a mold for positioning an FPC board 8, and mainly includes a first pin template 1, a second pin template 2, a pin module fixing block 14, a first connection module 3, a second connection module 7, and the like.

The first needle template 1 and the second needle template 2 are arranged side by side, and the second needle template 2 is fixedly arranged on the needle template fixing plate 4. A positioning groove 101 is formed in the first needle pattern plate 1 and the second needle pattern plate 2, and the positioning groove 101 is divided into two parts, one part is on the first needle pattern plate 1 and the other part is on the second needle pattern plate 2. The overall shape of the positioning groove 101 is matched with the shape of the FPC circuit board 8, so that the FPC circuit board 8 and various electronic components positioned on the FPC circuit board 8 can be positioned.

Referring to fig. 3, 8-10, a mounting groove is formed in the first pin template 1, a positioning block 5 is fixedly mounted in the mounting groove through a screw, a positioning groove 501 is formed in the positioning block 5, and the positioning groove 501 is a part of the positioning groove 101 and is used for positioning an electronic component. The positioning groove 501 is provided with a plurality of positioning holes 1011, and since the electronic component is provided with a plurality of pins, the pins can be positioned through the positioning holes 1011, and the probes (i.e. the first probes 102) can be in electrical contact with the pins.

Referring to fig. 6, the first connection module 3 is mainly composed of a base 31, a header connector 32, a fixing block 33 and a plurality of first probes 102, wherein the fixing block 33 is fixed on the base 31 by screws, and the header connector 32 is fixed at the bottom of the base 31. The fixed block 33 is upwards protruded to form a positioning part, and meanwhile, two positioning pins which are diagonally distributed are arranged on the fixed block 33, so that the positioning part can be spliced with the groove 502 at the bottom of the positioning block 5 above during assembly, and meanwhile, the positioning pins can be spliced with the positioning block 5, thereby ensuring accurate positioning.

The positioning part is provided with a plurality of small holes which are penetrated up and down, and each small hole is internally provided with a first probe 102. The first probe 102 passes through the positioning hole 1011 on the positioning block 5 upwards and contacts with the electronic component on the FPC circuit board 8, and can detect the circuit board after being electrified.

Referring to fig. 5, the pin die fixing blocks 14 are provided in two, adjacent two sides of the bottom of the first pin die plate 1, corresponding to two portions of the FPC board, respectively. There are two probes, i.e., second probes 103, on each of the pin die holding blocks 14. The two second probes 103 penetrate through the first pin template 1 and are inserted into the positioning grooves 101, and are contacted with electronic components on two parts of the FPC circuit board 8.

All of the second probes 103 are electrically connected to the header connector 32 by wires. The header connector 32 is a 10PIN quick connector that can be quickly plugged into the connector of the test instrument.

Referring to fig. 3, 4 and 7, a displacement cylinder 6 is provided below the first needle template 1, and a slide cylinder is used as the displacement cylinder 6. The output end of the shifting cylinder 6 is fixedly connected with a supporting block 13, the top of the supporting block 13 is provided with an accommodating groove, and a magnet 15 is placed in the accommodating groove. The magnet 15 can be controlled to move below the first needle template 1 and close to the position of the needle template fixing block 14 by the displacement cylinder 6. Two second probes 103 on one of the pin die fixing blocks 14 can be contacted with a chip on the FPC circuit board 8, the magnet 15 can provide a safe magnetic field environment for the chip, and the performance change of the chip under a specific magnetic field environment can be detected after the chip is electrified. The support block 13 can be controlled to move by the displacement cylinder 6 so as to bring the magnet under the chip. While the magnet 15 can be quickly replaced according to the need.

The second needle template 2 is located on one side of the first needle template 1. A pin die insert (not shown) is provided between the pin die fixing plate 4 and the second pin die plate 2. The pin die insert is used to secure the probe pin on the second connection module 7.

As shown in fig. 12, the second connection module 7 is composed of a card pin block 71, a connector 72 and a plurality of first probes 102. The connector 72 is fixed at the bottom of the needle clamping block 71 through a screw, and two ends of the needle clamping block 71 are fixedly connected with the upper needle mould fixing plate 4 through a connecting rod. There are a number of limiting holes on the pin die insert to limit the first probe 102.

The connector 72 is a 34PIN common connector 72 which can be quickly connected with a joint of a detection instrument.

As shown in fig. 12 and 13, the lower ends of the first probes 102 are electrically connected to the connector 72, the upper ends of the first probes 102 sequentially pass through the pin die fixing plate 4, the pin die insert and the second pin die plate 2, and the first probes 102 pass through the limiting holes and the positioning holes 1011 and penetrate into the positioning slots 101 to electrically contact with the electronic components on the FPC board 8.

As shown in fig. 12, in order to ensure that the FPV circuit board is firmly adsorbed in the positioning groove 101, a negative pressure connector 11 is further arranged below the first needle template 1 and the second needle template 2, the lower end of the negative pressure connector 11 is externally connected with an air extraction mechanism, a through hole is formed in the positioning groove 101, and the upper end of the negative pressure connector 11 is communicated with the through hole. After the FPC board 8 is placed in the positioning groove 101, the negative pressure connector 11 will suck air outwards to generate negative pressure, and the FPC board 8 is adsorbed in the positioning groove 101.

The bottom of the first needle template 1 is also provided with a detection mechanism 12, an optical fiber sensor is adopted by the detection mechanism 12, and the upper end of the optical fiber sensor can penetrate through an avoidance hole on the first needle template 1 for detecting whether the positioning groove 101 is provided with the FPC circuit board 8. The automatic detection device can work together when working.

The bottoms of the first needle template 1 and the second needle template 2 are also provided with a guide rod and a buffer spring 10, the guide rod plays a role in guiding up and down, and the buffer spring 10 plays a role in buffering. The pin die of the connector 72 works together with the pressing plate, and the pressing plate is pressed down to press the FPC circuit board 8, so that the FPC circuit board 8 is firmly attached to the pin die plate. At this time, the buffer spring 10 is stressed and compressed to play a role of buffering and prevent crushing.

The above technical solution only represents the preferred technical solution of the present utility model, and some changes that may be made by those skilled in the art to some parts of the technical solution represent the principles of the present utility model, and the technical solution falls within the scope of the present utility model.

Claims

1. The utility model provides a FPC circuit board detects positioning die which characterized in that includes:

The electronic component comprises a first pin template (1) and a second pin template (2), wherein positioning grooves (101) matched with the shape of a circuit board to be detected are formed in the first pin template (1) and the second pin template (2), and a plurality of positioning holes (1011) which are convenient for positioning pins on the electronic component are formed in the positioning grooves (101);

The first connecting module (3) and the second connecting module (7), the first connecting module (3) and the second connecting module (7) are respectively positioned at the bottoms of the first pin template (1) and the second pin template (2), the first pin template (1) and the second pin template (2) are respectively provided with a plurality of first probes (102) which are used for being contacted with pins of electronic components on a circuit board to be detected, and the positions of the first probes (102) correspond to the positions of the positioning holes (1011);

the pin die fixing block (14), the pin die fixing block (14) is positioned at the bottom of the first pin die plate (1), the pin die fixing plate (4) is provided with a second probe (103) which is used for being in electrical contact with a circuit board to be detected, and the second probe (103) is electrically connected with the first connecting module (3);

The magnet (15) is positioned at the bottom of the first needle template (1) and at one side of the needle template fixing block (14) and is used for providing a magnetic field environment for electronic components on a circuit board to be detected.

2. The FPC board detection positioning die according to claim 1, wherein a mounting groove is formed in the first pin die plate (1), a positioning block (5) is configured in the mounting groove, a positioning groove (501) is formed in the positioning block (5), the positioning groove (501) is a part of the positioning groove (101), a plurality of positioning holes (1011) are formed in the positioning groove (501), and the first connection module (3) is located below the positioning block (5).

3. The FPC board detection positioning die according to claim 2, wherein the first connection module (3) comprises a base (31), a header connector (32) fixed at the bottom of the base (31), a fixing block (33) fixed at the top of the base (31), and a plurality of first probes (102) penetrating and fixed on the fixing block (33), and the first probes (102) are electrically connected with the header connector (32).

4. The FPC board detection positioning die according to claim 3, wherein a positioning portion is formed on the fixing block (33) in an upward protruding manner, a groove (502) for being clamped with the positioning portion is formed in the bottom of the positioning block (5), and a positioning pin is arranged on the fixing block (33) and is spliced with the positioning block (5).

5. The FPC circuit board detection positioning die according to claim 1, wherein a detection mechanism (12) for sensing a circuit board to be detected is arranged at the bottom of the first pin template (1), an avoidance hole is formed in the positioning groove (101), and the detection mechanism (12) is located below the avoidance hole.

6. The FPC circuit board detection positioning die according to claim 1, wherein the bottoms of the first needle template (1) and the second needle template (2) are respectively provided with a negative pressure joint (11), and the positioning groove (101) is internally provided with a through hole communicated with the negative pressure joint (11).

7. The FPC circuit board detection positioning die according to claim 1, wherein a needle die fixing plate (4) is arranged at the bottom of the second needle die plate (2), a needle die insert is arranged on the needle die fixing plate (4), a plurality of limiting holes corresponding to the positions of the positioning holes (1011) are formed in the needle die insert, and a plurality of first probes (102) sequentially penetrate through the limiting holes and the positioning holes (1011).

8. The FPC board detection positioning die according to claim 7, wherein the second connection module (7) comprises a pin block (71) connected with the bottom of the pin die fixing plate (4) through a connecting rod, a connector (72) fixed at the bottom of the pin block (71), and a plurality of first probes (102) connected with the connector (72).

9. The FPC circuit board detection positioning mold according to claim 1, wherein the bottoms of the first needle template (1) and the second needle template (2) are provided with guide posts (9) and buffer springs (10).

10. The FPC circuit board detection positioning die according to claim 1, wherein a shifting cylinder (6) is arranged below the first pin template (1), the shifting cylinder (6) is horizontally arranged, the output end of the shifting cylinder (6) is connected with a supporting block (13), and the top of the supporting block (13) is provided with a containing groove for preventing a magnet (15).