CN223391584U

CN223391584U - Radiator and power conversion equipment

Info

Publication number: CN223391584U
Application number: CN202422797775.8U
Authority: CN
Inventors: 李伟; 于任斌; 周杰; 王鹏
Original assignee: Sungrow Power Supply Co Ltd
Current assignee: Sungrow Power Supply Co Ltd
Priority date: 2024-11-15
Filing date: 2024-11-15
Publication date: 2025-09-26
Anticipated expiration: 2034-11-15

Abstract

The utility model discloses a radiator and a power conversion device, wherein the radiator includes a heat-conducting substrate and a heat exchange module; the heat exchange module is installed on the first surface of the heat-conducting substrate, and the heat-conducting substrate is used to receive heat; the airflow blown to the heat exchange module is divided into at least two flow paths in different directions. When it is necessary to dissipate heat from the heating device of the electrical equipment, the radiator is installed on the electrical equipment, the heat-conducting substrate performs heat exchange with the device in the chassis, and the heat of the heat-conducting substrate is heat exchanged with the heat exchange module. Under the action of the airflow, cold air blows to the heat exchange module, and the airflow is divided into at least two flow paths in different directions to exchange with the heat exchange module. In the radiator provided in the present application, the airflow blown to the heat exchange module is divided into at least two flow paths in different directions, which shortens the flow distance of the airflow in the heat exchange module, thereby reducing heat accumulation.

Description

Radiator and power conversion equipment

Technical Field

The utility model relates to the technical field of equipment heat dissipation, in particular to a heat radiator and power conversion equipment.

Background

During operation, power modules such as inverter/power devices and the like, the conversion/power modules used therein may continuously generate heat. In order to improve the use installability, heat dissipation is required to be performed on the module of the electrical equipment to avoid heat accumulation of the electrical equipment. The traditional radiator is air-cooled heat dissipation, and specifically, the module is attached to a heat dissipation air duct for air-cooled heat dissipation, forced convection is adopted by a fan for heat dissipation, specifically, cold air entering is realized by taking one side of the heat dissipation air duct as an air inlet, and hot air discharging is realized by taking the other side of the heat dissipation air duct as an air outlet.

However, as the capacity of heating devices such as a power module or other heating modules is continuously increased, and the heat flux density in the electrical equipment is also increased, the air cooling has not been able to meet the heat dissipation requirement of the electrical equipment gradually, and meanwhile, as the radiator continuously works, the heat accumulation at the air outlet of the radiator is increased seriously.

Therefore, how to reduce the heat accumulation of the heat sink is a technical problem to be solved by those skilled in the art.

Disclosure of utility model

The utility model aims to provide a radiator, electrical equipment and a photovoltaic system, so as to reduce heat accumulation of the radiator.

The radiator comprises a heat conducting substrate and a heat exchange module, wherein the heat exchange module is arranged on the first surface of the heat conducting substrate and is used for receiving heat, and air flow blown to the heat exchange module is at least divided into two flow paths in different directions.

Optionally, in the radiator, the heat-conducting substrate is filled with a phase-change working medium to form an evaporator by an inner cavity, the heat exchange module is used as a condenser to be connected with the evaporator, the evaporator is used for bearing the power module and absorbing heat of the power module, the top end of the condenser is higher than the top end of the evaporator along the height direction, and the projection parts of the condenser and the evaporator along the horizontal direction are overlapped or arranged at intervals up and down.

Optionally, in the above radiator, an inner cavity of the evaporator is provided with first turbulence structures arranged at intervals;

The evaporator is characterized in that a wall surface close to a heating area in the case is a heat exchange wall, the inner wall surface of the heat exchange wall comprises a first wall surface opposite to the heating area in the case and a second wall surface opposite to a non-heating area in the case, the first density of a first turbulence structure arranged at the position of the first wall surface is larger than the second density of the first turbulence structure arranged at the position of the second wall surface, the first density is the occupied area of the first turbulence structure on the first wall surface divided by the total area of the first wall surface, and the second density is the occupied area of the first turbulence structure on the second wall surface divided by the total area of the second wall surface.

Optionally, in the radiator, the inner cavity of the evaporator is divided into at least two working medium accommodating chambers, each working medium accommodating chamber is filled with the phase-change working medium, at least one condenser is communicated with one or more working medium accommodating chambers, or at least one working medium accommodating chamber is communicated with one or more condensers.

Optionally, in the radiator, the working medium accommodating chambers arranged in the evaporator are arranged along a horizontal direction, or the working medium accommodating chambers arranged in the evaporator are arranged along a vertical direction perpendicular to the horizontal direction.

Optionally, in the foregoing radiator, the condenser includes a plurality of first heat dissipation fins arranged at intervals, one end of each first heat dissipation fin is connected with the heat conduction substrate, and has a certain height in a direction away from the heat conduction substrate, and each first heat dissipation fin is a solid fin or a hollow fin.

Optionally, in the radiator, one end of the first radiating fin, which faces away from the heat conducting substrate, is bent towards one end of the heat conducting substrate.

Optionally, in the radiator, the condenser comprises a heat exchange channel and a second radiating fin, wherein the heat exchange channel has a height in a direction away from the evaporator;

One end of the heat exchange channel is connected to the heat conducting substrate, and the inner cavity of the heat exchange channel is communicated with the inner cavity of the heat conducting substrate, or the inner cavity of the heat exchange channel is communicated with the inner cavity of the heat conducting substrate through the middle channel.

Optionally, in the radiator, the heat exchange channel is provided with a plate-shaped inner cavity, the second radiating fins and the heat exchange channel are arranged at intervals or are connected with the outer wall of the heat exchange channel, or the heat exchange channel is provided with a columnar inner cavity, and the outer wall of the heat exchange channel is penetrated with the second radiating fins.

Optionally, in the above heat radiator, the inner cavity of the heat exchange channel is provided with second turbulence structures arranged at intervals, and the second turbulence structures are connected with the inner wall of the heat exchange channel.

Optionally, in the above radiator, a first fan accommodating space for accommodating a fan is concavely formed at an end of the condenser away from the evaporator toward the evaporator.

Optionally, in the radiator, an air inlet channel is formed in the condenser, an inlet of the air inlet channel is used for entering air flow blowing to the heat exchange module, an outlet of the air inlet channel is arranged close to the heat conducting base plate, and the air inlet channel is communicated with gaps between adjacent first radiating fins in the condenser or gaps between adjacent first radiating fins.

Optionally, the radiator further comprises an air duct shell, wherein the air duct shell is covered outside the heat exchange module, and the air duct shell is provided with an air inlet and an air outlet.

Optionally, in the above radiator, the air outlets are at least two, and the at least two air outlets are respectively located at two opposite sides of the air duct housing, which are opposite to each other.

The power conversion equipment comprises a machine case, a fan, a power module and a radiator arranged on the outer wall of the back of the machine case, wherein the power module is borne by a heat conducting substrate of the radiator, the radiator is any one of the radiator, and the fan blows air flow to the heat exchange module along the air flow direction.

Optionally, in the power conversion apparatus, the power conversion apparatus further includes a first heat generating device, and the air flow sequentially passes through the fan, the heat exchange module, and the first heat generating device.

In the technical scheme, the radiator comprises the heat conducting substrate and the heat exchange module, wherein the heat exchange module is arranged on the first surface of the heat conducting substrate, the heat conducting substrate is used for receiving heat, and air flow blown to the heat exchange module is at least divided into two flow paths in different directions. When the heat of the heating device of the electrical equipment is required to be dissipated, the radiator is arranged on the electrical equipment, the heat conducting substrate exchanges heat with the device in the case, and the heat of the heat conducting substrate exchanges heat with the heat exchange module. Under the action of the air flow, cold air is blown to the heat exchange module, and the air flow is at least divided into two flow paths in different directions to exchange with the heat exchange module.

As can be seen from the above description, in the radiator provided by the present application, the air flow blown to the heat exchange module is at least divided into two flow paths in different directions, so that the flowing distance of the air flow in the heat exchange module is shortened, and further, the heat accumulation is reduced.

Drawings

In order to more clearly illustrate the present disclosure or the prior art solutions, the drawings that are required for the detailed description of the present utility model or the prior art will be briefly described below, it being apparent that the drawings in the following description are only specific embodiments of the present utility model and that other drawings may be obtained according to the provided drawings without inventive effort for a person skilled in the art.

Fig. 1 is a layout diagram of a first power conversion apparatus provided by the present disclosure;

FIG. 2 is a layout of a working fluid receiving chamber provided by the present disclosure;

fig. 3 is a front view of a first power conversion apparatus provided by the present disclosure;

fig. 4 is a side view of a first power conversion apparatus provided by the present disclosure;

FIG. 5 is a schematic diagram of the power conversion apparatus shown in FIG. 4 along the direction A-A;

Fig. 6 is a top view of a first power conversion apparatus provided by the present disclosure;

FIG. 7 is a schematic diagram of the power conversion apparatus shown in FIG. 6 along the B-B direction;

Fig. 8 is a layout diagram of a second power conversion apparatus provided by the present disclosure;

Fig. 9 is a front view of a second power conversion apparatus provided by the present disclosure;

fig. 10 is a side view of a second power conversion apparatus provided by the present disclosure;

FIG. 11 is a schematic diagram of the power conversion apparatus of FIG. 10 along the direction C-C;

fig. 12 is a top view of a second power conversion apparatus provided by the present disclosure;

FIG. 13 is a schematic diagram of the power conversion apparatus of FIG. 12 along the direction D-D;

fig. 14 is a layout diagram of a third power conversion apparatus provided by the present disclosure;

fig. 15 is a front view of a third power conversion apparatus provided by the present disclosure;

fig. 16 is a top view of a third power conversion apparatus provided by the present disclosure;

fig. 17 is a side view of a third power conversion apparatus provided by the present disclosure;

FIG. 18 is a schematic diagram of the power conversion apparatus of FIG. 17 along the E-E direction;

Fig. 19 is a front view of a layout of a fourth power conversion apparatus provided by the present disclosure;

fig. 20 is a layout side view of a fourth power conversion device provided by the present disclosure;

fig. 21 is a front view of a fourth power conversion apparatus provided by the present disclosure;

Fig. 22 is a top view of a fourth power conversion apparatus provided by the present disclosure;

Fig. 23 is a side view of a fourth power conversion apparatus provided by the present disclosure;

FIG. 24 is a schematic view of the power conversion apparatus of FIG. 23 in the F-F direction;

fig. 25 is a schematic structural diagram of a heat sink provided by the present disclosure;

FIG. 26 is a schematic view of a separate evaporator and condenser arrangement provided by the present disclosure;

FIG. 27 is an isometric view of a heat sink fin provided by the present disclosure;

FIG. 28 is a schematic view of a heat dissipating fin according to the present disclosure;

fig. 29 is a schematic structural view of a heat exchange module provided by the present disclosure;

FIG. 30 is a schematic view of a first airflow direction provided by the present disclosure;

FIG. 31 is a schematic view of a second airflow direction provided by the present disclosure;

FIG. 32 is a schematic view of a third airflow direction provided by the present disclosure;

fig. 33 is a schematic structural diagram of a fifth power conversion device provided by the present disclosure;

fig. 34 is a schematic structural diagram of a sixth power conversion device provided by the present disclosure;

Fig. 35 is a schematic structural diagram of a seventh power conversion apparatus provided by the present disclosure.

In the figures 1-35, a 1-chassis, a 2-air duct housing, a 21-air inlet, a 22-air outlet, a 3-first heating device, a 4-radiator, a 41-evaporator, a 411-heat conduction substrate, a 4111-working medium accommodating chamber, a 4112-heat conduction mounting plate, a 4113-first turbulence structure, a 4114-first wall surface, a 4115-second wall surface, a 4116-first surface, a 4117-second surface, a 42-heat exchange module, a 42A-condenser, a 421-heat exchange channel, a 422-second turbulence structure, a 423-first heat radiating fin, a 424-second heat radiating fin, a 43-first fan accommodating space, a 44-air inlet channel, a 45-middle channel, a 5-fan, a 6-power module, a 7-PCB board and an 8-second heating device are arranged.

Detailed Description

The utility model provides a radiator, electrical equipment and a photovoltaic system, which are used for reducing heat accumulation of the radiator. The present utility model will be described in further detail below with reference to the drawings and embodiments, so that those skilled in the art can better understand the technical solutions of the present utility model.

For ease of understanding, the present disclosure will be described taking the case where the heat conductive substrate 411 is disposed in the vertical direction. In practical applications, the heat conductive substrate 411 may also be disposed horizontally, and the specific structure is similar to the disclosure, except for the change of the posture. As shown in fig. 1, the heat sink 4 provided in the embodiment of the utility model includes a heat conducting substrate 411 and a heat exchange module 42, wherein the heat exchange module 42 is mounted on a first surface of the heat conducting substrate 411, and the heat conducting substrate 411 is used for receiving heat. The air flow directed to the heat exchange module 42 is divided into at least two flow paths of different directions. When heat dissipation is required to the heating device of the electrical equipment, the radiator 4 is installed on the electrical equipment, the heat conducting substrate 411 exchanges heat with the device in the case 1, and the heat of the heat conducting substrate 411 exchanges heat with the heat exchange module 42.

Under the action of the air flow, the cold air blows to the heat exchange module 42, and the air flow is at least divided into two flow paths in different directions to exchange with the heat exchange module 42.

In the radiator 4 according to the embodiment of the present application, by dividing the air flow blown to the heat exchange module 42 into at least two flow paths in different directions, the flow distance of the air flow in the heat exchange module 42 is shortened, thereby reducing heat accumulation.

Meanwhile, the air flow blown to the heat exchange module 42 is at least divided into two flow paths in different directions, so that the flowing distance of the air flow in the heat exchange module 42 is shortened, the temperature of the air flow exchanging heat with the heat exchange module 42 is further reduced, and the heat dissipation efficiency of the radiator 4 is further improved.

In a specific embodiment, the heat exchange module 42 includes heat dissipation fins arranged in sequence, and two adjacent heat dissipation fins are used for passing air flow, and one end of each heat dissipation fin is connected with the heat conduction substrate 411. The heat dissipation fin may be a solid structure.

In the specific implementation shown in fig. 1 to 24, in order to further improve the heat dissipation efficiency, in one specific implementation, the heat conducting substrate 411 is filled with a phase change working medium from an inner cavity to form the evaporator 41, the heat exchange module 42 is connected with the evaporator 41 as a condenser 42A, and the evaporator 41 is used for carrying the power module 6 and absorbing heat of the power module 6. Specifically, the phase change working medium becomes a gas state after being heated, and the cooled phase change working medium becomes a liquid state.

The evaporator 41 is generally rectangular, has a plate-like structure having a certain thickness, and may be a circular plate-like structure or a plate-like structure having another shape. As shown in fig. 10, the outer surface of the evaporator 41 has two large-area faces (a first face 4116 and a second face 4117) disposed opposite to each other, wherein the first face 4116 is used for mounting the power module 6 and the second face 4117 is used for mounting the condenser 42A. Specifically, the first surface 4116 is disposed on the heat-conductive mounting board 4112 with heat-conductive function.

In the specific arrangement, as shown in fig. 26, the condenser 42A may also be in communication with the evaporator 41 through the intermediate passage 45, or the end of the condenser 42A may be directly connected to the evaporator 41 and arranged in communication. At this time, the condenser 42A and the evaporator 41 may be disposed at an upper and lower interval in the horizontal direction projection, and at this time, the condenser 42A and the evaporator 41 are communicated through a pipe. Heat dissipation is performed through thermosiphon, specifically, when heat exchange is performed, liquid phase-change working medium positioned in the evaporator 41 absorbs heat to form gas phase to volatilize to the position of the condenser 42A, the gas phase-change working medium exchanges heat with cooler air flow flowing through the periphery of the condenser 42A, and the condensed phase-change working medium forms liquid phase to flow back to the evaporator 41 under the action of self gravity, so that heat exchange operation is completed.

In one embodiment, the projected portions of the condenser 42A and the evaporator 41 in the horizontal direction overlap, and at this time, the condenser 42A and the evaporator 41 are directly connected and disposed in communication.

The present disclosure is illustrated with the vertical arrangement of the evaporator 41 as an example, and as shown in fig. 1, the power modules 6 may be distributed in the vertical direction on the first face 4116. Or the power modules 6 may be distributed in an array at the first face 4116.

As shown in fig. 2, the evaporator 41 may be disposed in a horizontal direction, that is, the first face 4116 and the second face 4117 of the evaporator 41 extend in the horizontal direction, where the condenser 42A is located directly above the evaporator 41, so that the gasified gaseous phase-change working medium angle flows to the condenser 42A sufficiently for heat exchange. In particular use, the heat sink 4 may be mounted on top of the chassis 1.

As shown in fig. 4, the evaporator 41 may be disposed in a vertical direction, that is, the first face 4116 and the second face 4117 of the evaporator 41 extend in a vertical direction, wherein the vertical direction and the horizontal direction are disposed vertically. At this time, the condenser 42A is located at the left side of the evaporator 41, so that the radiator 4 can be directly installed at the back of the chassis 1, so that the overall height of the power conversion device after the radiator 4 is installed is reduced, and considering that the power module 6 is usually installed at the back of the chassis 1, the radiator 4 is directly installed inside the chassis 1, specifically, the first face 4116 of the evaporator 41 is used as the back plate of the chassis 1, and the power module 6 is directly installed on the first face 4116, so that the heat dissipation efficiency is further improved.

Of course, in practical applications, as shown in fig. 25, the evaporator 41 may also be inclined at an angle away from the vertical, for example, the first face 4116 and the second face 4117 of the evaporator 41 are disposed at acute angles to the horizontal and the vertical. The radiator is arranged in such a way, is suitable for special installation environments, and improves the universality of the radiator 4.

In view of the rising of the hot gas, in order to facilitate the sufficient flow of the vaporized gaseous phase-change working medium to the condenser 42A for heat exchange, it is preferable that the top end of the condenser 42A is higher than the top end of the evaporator 41 in the height direction, which is a direction perpendicular to the horizontal plane.

As shown in fig. 5, 11, 18 and 24, the inner cavity of the evaporator 41 is provided with first turbulence structures 4113 arranged at intervals. Specifically, the end portion of the first spoiler 4113 may be connected to the first surface 4116 or the second surface 4117, or opposite ends of the first spoiler 4113 are respectively connected to the first surface 4116 and the second surface 4117. By arranging the first turbulence structures 4113, the liquid phase change working medium flowing through the position can exchange heat with the corresponding position sufficiently, and the first turbulence structures 4113 can be heat conducting members, for example, the first turbulence structures 4113 can be metal members, so as to achieve a heat transfer effect.

The first turbulence structures 4113 may be columnar structures, such as cylinders or rectangular parallelepiped structures. Opposite ends of the columnar structure are connected with the first face 4116 and the second face 4117, respectively.

The first turbulence structures 4113 are preferably metal pieces. The first turbulence structures 4113 may be arranged in an array, and the cross-sectional dimensions of the first turbulence structures 4113 along the direction perpendicular to the connecting line of the first surface 4116 and the second surface 4117 may be the same or different. The first turbulence structures 4113 serve to separate flow passages and to strengthen heat exchange and support pressure resistance of the evaporator 41.

As shown in fig. 5, 11, 18 and 24, in one embodiment, the wall surface of the evaporator 41 close to the heat generating region in the chassis 1 is a heat exchange wall, the inner wall surface of the heat exchange wall includes a first wall surface 4114 and a second wall surface 4115 opposite to the heat generating region in the chassis 1, and the second wall surface 4155 is an area opposite to the chassis 1 except the heat generating region. In practical applications, devices with relatively high heat productivity or relatively high heat dissipation requirements, such as IGBTs and MOS transistors, are usually mounted in the heat generating region of the chassis 1, and devices with relatively low heat productivity or no devices are usually mounted in the region corresponding to the second wall 4155 of the chassis 1. The first wall 4114 is a wall surface projected in a direction in which the evaporator 41 extends toward the casing 1, and the heat exchange wall is overlapped with the heat generation region projection. The second wall 4115 is a wall surface projected in a direction in which the evaporator 41 extends toward the casing 1, and the heat exchange wall is overlapped with the projection of the non-heat-generating region.

In order to improve the heat dissipation efficiency, it is preferable that the first density of the first turbulence structures 4113 disposed at the position of the first wall 4114 is greater than the second density of the first turbulence structures 4113 disposed at the position of the second wall 4115. Specifically, the first density is an area of the projection of the first turbulence structures 4113 on the first wall 4114 divided by a total area of the first wall 4114. The second density is a projection of the first turbulence structure 4113 on the second wall 4115 on the first wall 4114 divided by a total area of the second wall 4115. Specifically, the first density may be two or more times the second density.

The inner cavity of the evaporator 41 is divided into at least two working substance accommodating chambers 4111, and each working substance accommodating chamber 4111 is filled with a phase change working substance. As shown in fig. 2, in one embodiment, the working substance accommodating chambers 4111 provided in the evaporator 41 are arranged in the horizontal direction.

As shown in fig. 13, in another embodiment, the working substance accommodating chambers 4111 provided in the evaporator 41 are arranged in a vertical direction perpendicular to the horizontal direction. The working medium accommodating chambers 4111 may also be arranged in an array on a vertical plane, and at this time, the working medium accommodating chambers 4111 are preferably arranged in a plurality of rows. Preferably, by providing a plurality of working medium accommodating chambers 4111, the phase change working medium in the inner cavity of the evaporator 41 is prevented from being concentrated at a certain position, and the heat dissipation uniformity is improved.

At least one condenser 42A communicates with one or more working substance receiving chambers 4111, or at least one working substance receiving chamber 4111 communicates with one or more condensers 42A. For example, one condenser 42A may be in one-to-one communication with one working substance receiving chamber 4111. The plurality of working substance accommodating chambers 4111 may be sequentially arranged in the vertical direction, or sequentially arranged left and right in the horizontal direction, or the plurality of working substance accommodating chambers 4111 may be respectively distributed in an array in the vertical direction and the horizontal direction. The extending direction and the size of part of the working medium accommodating chambers can be the same as or different from those of other working medium accommodating chambers. In order to reduce the processing difficulty, the overall shape of the working medium accommodating chamber 4111 is rectangular. Of course, in order to enhance the temperature equalizing effect, two or more working medium accommodating chambers 4111 may be simultaneously communicated with one condenser 42A, and in order to enhance the heat dissipating effect, one working medium accommodating chamber 4111 may be simultaneously communicated with two or more condensers 42A.

In one embodiment, the condenser 42A includes a plurality of first heat dissipation fins 423 arranged at intervals, and preferably, adjacent first heat dissipation fins 423 are distributed at equal intervals. One end of the first radiating fin 423 is connected with the heat conducting base plate 411, and has a certain height in the direction far away from the heat conducting base plate 411, and the first radiating fin 423 is a solid fin or a hollow fin, so that the radiating effect is further improved by arranging the first radiating fin 423.

As shown in fig. 2 and 15, in one embodiment, the first heat dissipation fins 423 are bent toward one end of the heat conductive substrate 411 away from one end of the heat conductive substrate 411. The first heat radiating fin 423 may also be a straight plate structure. Along the direction of arranging the first heat radiating fins 423 perpendicularly, the length of the first heat radiating fins 423 arranged in a bending manner is reduced relative to the first heat radiating fins 423 arranged in a straight plate structure.

In one embodiment, as shown in fig. 3, the condenser 42A includes a heat exchanging channel 421 and a second heat dissipating fin 424, the heat exchanging channel 421 has a height in a direction away from the evaporator 41, and has a hollow inner cavity, the second heat dissipating fin 424 is disposed between two adjacent heat exchanging channels 421, and the second heat dissipating fin 424 is connected to an outer wall of the heat exchanging channel 421. One end of the heat exchanging channel 421 is connected to the heat conducting substrate 411, and the inner cavity of the heat exchanging channel 421 is directly communicated with the inner cavity of the heat conducting substrate 411, and the two are integrally arranged. Or as shown in fig. 26, the inner cavity of the heat exchange channel 421 is communicated with the inner cavity of the heat conducting substrate 411 through the middle channel 45, and at this time, the heat exchange channel 421 and the heat conducting substrate 411 are separately arranged. When the heat exchange device is specifically used, the gasified phase change working medium can enter the heat exchange channel 421, and as the second radiating fins 424 are connected with the outer wall of the heat exchange channel 421, heat generated by liquefying the phase change working medium in the heat exchange channel 421 can be conducted to the second radiating fins 424 and then dissipated into air flow, so that the heat dissipation effect is further improved.

In one embodiment, as shown in fig. 27 and 28, the heat exchanging channel 421 has a cylindrical inner cavity, and the outer wall of the heat exchanging channel 421 is provided with a second heat dissipating fin 424.

In a specific embodiment, as shown in fig. 29, the heat exchange channel 421 has a plate-shaped inner cavity, and in particular, the heat exchange channel 421 may be a cavity with a uniform cavity thickness. When specifically arranged, the second heat dissipation fins 424 and the heat exchange channels 421 are arranged at intervals. The second heat radiating fin 424 may be connected to the outer wall of the heat exchanging channel 421. In order to improve the assembly efficiency, the second heat dissipation fins 424 are integrally formed with the heat exchange channels 421.

As shown in fig. 27 and 28, in a specific embodiment, the inner cavity of the heat exchange channel 421 is provided with second turbulence structures 422 arranged at intervals, and the second turbulence structures 422 are connected with the inner wall of the heat exchange channel 421. Specifically, the second turbulence structure 422 is disposed in a column shape, and when the second turbulence structure 422 is disposed specifically, two ends of the second turbulence structure 422 are connected to two opposite surfaces of the heat exchange channel 421 in the thickness direction.

The second spoiler structure 422 is preferably a metal member. The second spoiler structure 422 may be specifically arranged in an array. The second turbulence structure 422 serves to separate the flow channels and also serves to strengthen the heat exchange and support the pressure resistance of the heat exchange channel 421.

As shown in fig. 10, in a specific embodiment, one end of the condenser 42A away from the evaporator 41 is concaved inwards towards the evaporator 41 to form a first fan accommodating space 43 for accommodating the fans 5, where the number of the first fan accommodating spaces 43 is the same as the number of the fans 5, and the fans 5 are in one-to-one correspondence during installation, or all the fans 5 may be installed in the same first fan accommodating space 43. In a specific assembly, the fan 5 may be mounted to the first fan housing space 43, and the overall assembly may reduce the size of the radiator 4 in a direction from the condenser 42A to the evaporator 41, so that the overall layout is more compact. Of course, the first fan accommodating space 43 may be formed by two or at least three of the end faces of the annularly arranged condensers 42A being recessed together.

In another embodiment, as shown in fig. 4, all of the condensers 42A are disposed flush with the end face of the end remote from the evaporator 41. So configured, it is convenient for the cool air to enter all of the condensers 42A relatively uniformly.

In one embodiment, as shown in fig. 7, the condenser 42A has an air inlet channel 44 therein, the inlet of the air inlet channel 44 being for entering the air flow blowing toward the heat exchange module 42, and the outlet of the air inlet channel 44 being disposed adjacent to the heat conductive substrate 411. In particular, the blower 5 may be mounted in the air intake channel 44, or in the direction of the air flow, the blower 5 may be mounted upstream of the air intake channel 44. When a plurality of fans 5 are provided, the fans 5 may be arranged in the air intake passage 44 in the horizontal direction in order.

When specifically provided, the air intake passage 44 communicates with the gaps between the adjacent first heat radiating fins 423 in the condenser 42A, or the gaps between the adjacent first heat radiating fins 423. When the radiator 4 works, cold air enters gaps between the condenser 42A and/or the first radiating fins 423 through the air inlet channels 44, and the uniformity of the air inlet of the gaps between the condenser 42A and/or the first radiating fins 423 is improved by arranging the air inlet channels 44.

In a specific embodiment, at least two condensers 42A are mounted on the same evaporator 41, and two adjacent condensers 42A are arranged at intervals to form an air inlet channel 44, and air flow paths in the two condensers 42A are divided into different directions by the air inlet channel 44. For example, the condensers 42A on opposite sides of the intake passage 44 are arranged in the horizontal direction or in the vertical direction.

As shown in fig. 1, 8, 14 and 19, in one embodiment, the radiator 4 further includes a duct housing 2, and the duct housing 2 is covered on the outside of the heat exchange module 42 so as to form a duct at the position of the heat exchange module 42. As shown in fig. 30 to 32, the duct housing 2 is provided with an air inlet 21 and an air outlet 22, and at least two air inlets 21 and air outlets 22 may be provided. Alternatively, one air inlet 21 is provided, at least two air outlets 22 are provided, and at least two air outlets 22 are respectively located at two opposite sides of the air duct housing 2, which are arranged back to each other. For example, two air outlets 22 are arranged at opposite ends of the air duct housing 2 in the vertical direction, or two air outlets 22 are arranged at opposite ends of the air duct housing 2 in the horizontal direction.

In a specific embodiment, in order to improve the heat dissipation effect, the number of the air outlets 22 may be the same as the number of the heat exchange modules 42, and each heat exchange module 42 corresponds to one air outlet 22, and the air flow in each heat exchange module 42 is discharged through the air outlet 22 at the corresponding position after heat exchange. Specifically, the air outlet 22 is preferably disposed on a wall surface of the air duct housing 2 adjacent to the chassis 1. The air inlet 21 is positioned on the wall surface of the air duct housing 2, which is opposite to the back surface of the case 1. Meanwhile, the back air inlet mode is the same as that of the existing case 1, so that the application change of subsequent products is less, and the overall layout is compact. The shape and size of the air outlet 22 are determined according to actual needs. The positions of the air outlet 22 and the air inlet 21 are formed by a plurality of hole structures which are arranged in an array, so that impurities are prevented from entering the air channel shell 2 through the air inlet 21 and the air outlet 22.

When the heat dissipation of the heating device of the power conversion equipment is needed, the radiator 4 is installed on the back of the case 1, wherein the back of the case 1 is one side far away from the operation end of a worker, air is taken in from the back of the case 1 under the action of the fan 5, cold air enters the radiator 4, and after the exchange, the cold air is discharged through two air outlets 22 which are oppositely arranged.

The power conversion equipment provided by the application comprises a case 1, a fan 5, a power module 6 and a radiator arranged on the outer wall of the back of the case 1, wherein the radiator is any radiator 4, the specific structure of the radiator 4 is described, and the power conversion equipment comprises the radiator 4 and has the same technical effects.

As shown in fig. 1, in the horizontal direction, the heat sink 4, the heat conductive substrate 411 and the power module 6 are sequentially disposed from left to right, and the heat sink 4 and the power module 6 are disposed on two outer sides of the heat conductive substrate 411, however, the heat sink 4 and the power module 6 may be disposed on the same outer side of the heat conductive substrate 411, and the installation positions and the number of the power modules 6 are determined according to actual needs. The side wall of the case 1 is provided with an opening, the heat conducting base plate 411 is embedded in the opening of the side wall and serves as a part of the case body, or the heat conducting base plate 411 is attached to the outer surface of the side wall of the case 1, and further, the opening of the side wall of the case 1 is used for the power module 6 arranged on the heat conducting base plate 411 to penetrate through the opening and extend into the case to protect the power module 6. In addition, the heat conductive substrate 411 may be located entirely inside the chassis 1, and open holes are formed in the chassis 1 for the heat sink 4 to protrude outside the chassis 1. In practical applications, when the heat conducting substrate 411 is the evaporator 41, the positional relationship between the heat sink 4, the power module 6, the chassis 1 and the evaporator 41 may be the same as that described above, except that the heat conducting substrate 411 is replaced with the evaporator 41.

In the air flow direction, the fan 5 blows air flow towards the heat exchange module 42, i.e. in the air flow direction, the fan 5 is located upstream of the heat exchange module 42, and then the air flow is re-branched and blown upwards and downwards respectively towards the upper and lower arranged radiators 4. Of course, if two or more heat sinks 4 are disposed laterally on both left and right sides of the fan 5, the air flow is branched and then blown to the left and right, respectively, of the heat sinks 4 disposed laterally. The case 1 serves as a shell of the electrical equipment, plays a role in protecting internal devices of the case 1, and simultaneously carries the installation of internal/external devices of the electrical equipment and the installation of the complete machine. Specifically, the power conversion device may be an inverter, a wind power converter, an energy storage converter, or the like.

As shown in fig. 35, the evaporator 41 may be located inside the cabinet 1, and the condenser 42A may be disposed through the cabinet or both connected through the intermediate passage 45, in which case the evaporator 41 may absorb heat in the air inside the cabinet 1. In the specific assembly, a heating device such as a capacitor, a resistor, or a reactor may be provided on the evaporator 41. In particular, one or at least two fans 5 may be provided, and in order to improve heat exchange efficiency, it is preferable that at least two fans 5 be provided. As shown in fig. 19, preferably, all fans 5 are arranged in sequence in a direction perpendicular to the air flow.

As shown in fig. 1, 8, 14 and 19, in a specific embodiment, the power conversion apparatus further includes a first heat generating device 3, and the air flow sequentially passes through the fan 5, the heat exchange module 42 and the first heat generating device 3. As shown in the above figures, the first heat generating device 3 is disposed outside the cabinet 1, but within the duct housing 2, at which time the first heat generating device 3 exchanges heat with the air flow passing through the heat exchanging module 42. The first heating device 3 is arranged outside the cabinet 1, and the first heating device 3 does not occupy the internal space of the cabinet 1, so that the internal structural layout of the cabinet 1 is facilitated. Meanwhile, the first heating device 3 may be protected by the air duct housing 2. Specifically, the first heat generating device 3 may be a heat-resistant device with low heat dissipation requirement or a heat-resistant device such as a reactor, so that the waste of the space downstream of the heat exchange module 42 is avoided, and the overall structure of the power conversion device is compact while the heat dissipation requirement is ensured.

As shown in fig. 33, the first heat generating device 3 may be disposed outside the chassis 1 and located outside the air duct housing 2, at this time, the first heat generating device 3 radiates heat through external air, and the layout of the first heat generating device 3 is not affected by the internal structures of the chassis 1 and the air duct housing 2, and the arrangement position of the first heat generating device 3 is more flexible.

As shown in fig. 34, the first heating device 3 may be disposed in the cabinet 1, and at this time, the first heating device 3 is located outside the duct housing 2, and at this time, the first heating device 3 is protected by the cabinet 1 and radiates heat through the radiator 4.

In a specific embodiment, the power conversion device further comprises a PCB 7, and the PCB 7 is located in the inner cavity of the chassis 1 and is isolated from the wall surface of the chassis 1. Specifically, a second heating device 8 is arranged on the PCB 7 according to the requirement. Or other non-heat generating devices may also be mounted on the PCB board 7. Specifically, when the two air outlets 22 are arranged left and right, the first heaters are arranged on the left and right sides of the thermosiphon heat exchanger, and when a plurality of first heaters are arranged on each side, the thermosiphon heat exchanger is arranged in an array manner with the first heaters on the same side, and specifically, the first heaters are arranged in a row from top to bottom.

In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described by a difference from other embodiments, and identical and similar parts between the embodiments are referred to each other. The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat sink, characterized by comprising a heat-conducting substrate (411) and a heat exchange module (42);

The heat exchange module (42) is mounted on a first surface of the heat-conducting substrate (411), and the heat-conducting substrate (411) is used to receive heat;

The airflow blowing toward the heat exchange module (42) is divided into at least two flow paths in different directions.

2. The heat sink according to claim 1, characterized in that the heat-conducting substrate (411) has an inner cavity filled with a phase-change working medium to form an evaporator (41), the heat exchange module (42) is connected to the evaporator (41) as a condenser (42A), and the evaporator (41) is used to carry the power module (6) and absorb heat from the power module (6);

In the height direction, the top of the condenser (42A) is higher than the top of the evaporator (41); and the projections of the condenser (42A) and the evaporator (41) in the horizontal direction overlap or are spaced apart.

3. The radiator according to claim 2, characterized in that the inner cavity of the evaporator (41) is provided with first flow-turbulating structures (4113) arranged at intervals;

The wall of the evaporator (41) close to the heating area in the chassis (1) is a heat exchange wall, and the inner wall of the heat exchange wall includes a first wall (4114) directly opposite to the heating area in the chassis (1) and a second wall (4115) directly opposite to the non-heating area in the chassis (1); the first density of the first spoiler structure (4113) arranged at the position of the first wall (4114) is greater than the second density of the first spoiler structure (4113) arranged at the position of the second wall (4115), the first density being the area occupied by the first spoiler structure (4113) on the first wall (4114) divided by the total area of the first wall (4114), and the second density being the area occupied by the first spoiler structure (4113) on the second wall (4115) divided by the total area of the second wall (4115).

4. The radiator according to claim 2, characterized in that the inner cavity of the evaporator (41) is divided into at least two working medium accommodating chambers (4111), and each of the working medium accommodating chambers (4111) is filled with the phase-change working medium;

At least one of the condensers (42A) is in communication with one or more working medium accommodating chambers (4111), or at least one working medium accommodating chamber (4111) is in communication with one or more of the condensers (42A).

5. The radiator according to claim 4, characterized in that:

The working medium accommodating chamber (4111) provided in the evaporator (41) is arranged in a horizontal direction;

Or the working medium accommodating chamber (4111) provided in the evaporator (41) is arranged in a vertical direction perpendicular to the horizontal direction.

6. The radiator according to claim 2 is characterized in that the condenser (42A) includes a plurality of first heat dissipation fins (423) arranged at intervals, one end of the first heat dissipation fin (423) is connected to the heat conductive substrate (411), and has a certain height in a direction away from the heat conductive substrate (411), and the first heat dissipation fin (423) is a solid fin or a hollow fin.

7. The radiator according to claim 6, characterized in that:

One end of the first heat dissipation fin (423) facing away from the heat-conducting substrate (411) is bent toward one end of the heat-conducting substrate (411).

8. The radiator according to claim 2, characterized in that the condenser (42A) comprises a heat exchange channel (421) and a second heat dissipation fin (424), the heat exchange channel (421) has a height in a direction away from the evaporator (41); the second heat dissipation fin (424) is connected to an outer wall of the heat exchange channel (421);

One end of the heat exchange channel (421) is connected to the heat conductive substrate (411), and the inner cavity of the heat exchange channel (421) is communicated with the inner cavity of the heat conductive substrate (411); or the inner cavity of the heat exchange channel (421) is communicated with the inner cavity of the heat conductive substrate (411) through an intermediate channel (45).

9. The radiator according to claim 8, characterized in that:

The heat exchange channel (421) has a plate-shaped inner cavity, and the second heat dissipation fins (424) and the heat exchange channel (421) are arranged at intervals or the second heat dissipation fins (424) are connected to the outer wall of the heat exchange channel (421);

Alternatively, the heat exchange channel (421) has a columnar inner cavity, and the second heat dissipation fins (424) are provided through the outer wall of the heat exchange channel (421).

10. The radiator according to claim 8, characterized in that the inner cavity of the heat exchange channel (421) is provided with second spoiler structures (422) arranged at intervals, and the second spoiler structures (422) are connected to the inner wall of the heat exchange channel (421).

11. The radiator according to claim 2, characterized in that one end of the condenser (42A) away from the evaporator (41) is concave toward the evaporator (41) to form a first fan accommodating space (43) for accommodating the fan (5).

12. The radiator according to any one of claims 6 to 10, characterized in that the condenser (42A) has an air inlet channel (44);

The inlet of the air inlet channel (44) is used for the air flow to enter and blow toward the heat exchange module (42); the outlet of the air inlet channel (44) is arranged close to the heat conductive substrate (411);

The air inlet channel (44) is communicated with the gaps between adjacent first heat dissipation fins (423) in the condenser (42A), or the gaps between adjacent first heat dissipation fins (423) are communicated with.

13. The radiator according to any one of claims 2 to 11, characterized in that it further comprises an air duct housing (2), wherein the air duct housing (2) is arranged to cover the outside of the heat exchange module (42); the air duct housing (2) is provided with an air inlet (21) and an air outlet (22).

14. The radiator according to claim 13, characterized in that at least two air outlets (22) are provided, and the at least two air outlets (22) are respectively located on two opposite sides of the air duct housing (2) that are arranged in a reverse direction.

15. A power conversion device, characterized in that it comprises a chassis (1), a fan (5), a power module (6) and a radiator installed on the back outer wall of the chassis (1); the power module (6) is supported by a heat-conducting substrate (411) of the radiator; the radiator is the radiator (4) according to any one of claims 1 to 14; along the direction of airflow, the fan (5) blows the airflow toward the heat exchange module (42).

16. The power conversion device according to claim 15, characterized in that it further comprises a first heating device (3), and the air flow passes through the fan (5), the heat exchange module (42), and the first heating device (3) in sequence.