CN223362582U

CN223362582U - 2U internal circulation air-liquid cooling hybrid heat dissipation server

Info

Publication number: CN223362582U
Application number: CN202422681511.6U
Authority: CN
Inventors: 李斌; 蒋杰; 周善祥; 杜永花; 肖兰江; 熊湘泉
Original assignee: Hunan Guoke Chaocai Technology Co ltd
Current assignee: Hunan Guoke Chaocai Technology Co ltd
Priority date: 2024-11-05
Filing date: 2024-11-05
Publication date: 2025-09-19
Anticipated expiration: 2034-11-05

Abstract

The utility model relates to the technical field of server heat dissipation, and particularly discloses a 2U internal circulating air-liquid cooling hybrid heat dissipation server which comprises a server case component, a liquid cooling component, a fan and a first circuit board, wherein the server case component comprises a base, a front window, a rear window and an upper cover, the front window and the rear window are respectively arranged at the front end and the rear end of the base, the upper cover covers the upper part of the base, the first circuit board is fixedly connected to the base, the fan is arranged between the front window and the first circuit board, the liquid cooling component comprises a heat exchanger, a micro water pump and a liquid cooling plate, the heat exchanger is arranged between the front window and the fan, the liquid cooling plate is arranged on the surface of a chip on the first circuit board, a water outlet of the heat exchanger is communicated with the micro water pump, and a water inlet of the heat exchanger is respectively communicated with the liquid cooling plate through a hose. High-efficient, the accurate high-power consumption chip to the inside server of liquid cooling board dispels the heat through the forced air cooling to the interior low-power consumption component heat dissipation of server, and liquid cooling and forced air cooling mode combine to realize the independent heat dissipation of server.

Description

2U internal circulation air-liquid cooling hybrid heat dissipation server

Technical Field

The utility model relates to the technical field of server heat dissipation, in particular to a 2U internal circulation air-liquid cooling hybrid heat dissipation server.

Background

The existing rack-mounted server cooling technology mainly comprises two types, one type is forced convection heat dissipation through air cooling, the other type is liquid cooling heat dissipation, and the liquid cooling heat dissipation comprises direct liquid cooling heat dissipation (immersed liquid cooling) and indirect liquid cooling heat dissipation (cold plate type liquid cooling). The traditional forced convection heat dissipation of air cooling is when the heat flux density of a server single chip is great, needs to select the axial fan of high-power consumption, designs complicated radiator simultaneously, satisfies the chip heat dissipation demand, and this scheme has more shortcoming, mainly shows in that the fan consumption is high, and the noise is big, and radiating efficiency is low, and the server energy consumption is high etc.. When the power consumption of the server chip exceeds 350W and even reaches 500W, the traditional air cooling heat dissipation can not meet the heat dissipation requirement of the chip in normal, the heat dissipation of the server needs to adopt liquid cooling heat dissipation, the liquid cooling heat dissipation of the main stream on the market at present all needs to be externally supplied with cooling liquid, and an external liquid cold source (a cold water machine) is arranged outside the server and used for providing cooling liquid for a liquid cooling plate of the server. The liquid cooling heat dissipation server of the type has the same defects, and is mainly characterized in that a single liquid cooling heat dissipation server cannot be independently used after being separated from a liquid cooling source, when a client uses only one server device, the single liquid cooling source is required to be configured for guaranteeing the stable operation of the device, the liquid cooling source is large in size and inconvenient to deploy, and large noise still exists when the liquid cooling source operates, and meanwhile, the external liquid cooling source is matched with one machine, so that the energy consumption of the whole system is still high. Therefore, it is necessary to design and develop a server heat dissipation scheme that can be operated independently and has high cooling efficiency, so as to meet the cooling requirements in different server setting scenarios.

It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present application and is presented for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background of the application section.

Disclosure of utility model

The utility model aims to overcome the defects of the prior art, and provides a 2U internal circulation air-liquid cooling mixed heat dissipation server, wherein a liquid cooling heat dissipation circulation system is designed in the server, the server can be independently used under the condition of not externally connecting a liquid cooling source, meanwhile, liquid cooling cold plate type heat dissipation of a high-power consumption chip is supported, other low-power consumption devices in the server still use forced air cooling heat dissipation, and the whole machine heat dissipation mode is internal circulation air-liquid cooling mixed heat dissipation.

In order to achieve the aim, the utility model provides a 2U internal circulation air-liquid cooling mixed heat dissipation server, which comprises a server case component, a liquid cooling component, a fan and a first circuit board, wherein the server case component comprises a base, a front window, a rear window and an upper cover, the front window and the rear window are respectively arranged at the front end and the rear end of the base, the upper cover covers the base to seal the base, the first circuit board is fixedly connected onto the base, the fan is arranged between the front window and the first circuit board, the liquid cooling component comprises a heat exchanger, a micro water pump and a liquid cooling plate, the heat exchanger is arranged between the front window and the fan, the liquid cooling plate is arranged on the surface of a chip on the first circuit board, a water outlet of the heat exchanger is communicated with the micro water pump, and a water inlet of the micro water pump is respectively communicated with the liquid cooling plate through a hose.

Further, the air inlet side of the heat exchanger is abutted with the front window, and the air outlet side of the heat exchanger is abutted with the air inlet side of the fan.

Further, foam is filled in gaps around the contact end face of the air outlet side of the heat exchanger and the air inlet side of the fan.

Further, the base is internally and fixedly connected with a fan bracket, and the fan is arranged in the fan bracket.

Further, the upper cover includes a first upper cover provided above the front window to the fan and a second upper cover provided above the fan to the rear window.

Further, a second circuit board and a third circuit board are further installed in the base, and the second circuit board and the third circuit board are located below the second upper cover.

Further, the outer side of the base is fixedly connected with a right chassis hanging lug and a left chassis hanging lug.

Further, the aperture ratio of the front window is larger than 60%, and the air inlet holes of the front window are regular hexagonal honeycomb holes.

Further, a power supply bin is further arranged in the base, and a power supply is arranged in the power supply bin.

The scheme of the utility model has the following beneficial effects:

The 2U internal circulation air-liquid cooling mixed heat dissipation server provided by the utility model integrates a liquid cooling heat dissipation circulation system in the server, adopts air cooling to simultaneously dissipate heat of a liquid cooling circulation medium and the inside of a server case, simultaneously can accurately and efficiently dissipate heat of components such as high-power consumption chips in the server through a liquid cooling plate of the liquid cooling system, and simultaneously, other low-power consumption devices in the server still use forced air cooling for heat dissipation, and the whole machine heat dissipation mode is internal circulation air cooling and liquid cooling mixed heat dissipation, and adopts different cooling modes according to different cooling requirements of different electronic components in the server, so that the server can be singly used without external liquid cooling sources.

Other advantageous effects of the present utility model will be described in detail in the detailed description section which follows.

Drawings

FIG. 1 is a schematic view of the overall internal structure of the present utility model;

FIG. 2 is a schematic diagram of the overall structure of a server chassis assembly according to the present utility model;

FIG. 3 is a schematic diagram of the overall structure of the liquid cooling assembly of the present utility model;

fig. 4 is a schematic diagram illustrating the installation of the liquid cooling assembly and the first circuit board according to the present utility model.

[ Reference numerals description ]

1-Server case components, 11-bases, 12-front windows, 13-case right lugs, 14-case left lugs, 15-fan brackets, 16-first upper covers, 17-second upper covers, 18-power supply bins, 19-rear windows, 2-liquid cooling components, 21-heat exchangers, 22-micro water pumps, 23-hoses, 24-liquid cooling plates, 3-fans, 4-first circuit boards, 41-chips, 5-second circuit boards, 6-third circuit boards and 7-power supplies.

Detailed Description

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model. The various features and embodiments described in the detailed description may be combined in any suitable manner, for example, different embodiments may be formed by different combinations of features/embodiments, where not contradictory, and various possible combinations of features/embodiments in the present utility model are not described further in order to avoid unnecessary repetition.

It should be noted that the terms "disposed" and "connected" should be construed broadly, and may be, for example, directly disposed, mounted, connected, or indirectly disposed, connected through a central element or central structure. In addition, the directions or positional relationships indicated by "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. in the present utility model are directions or positional relationships based on the drawings or the conventional placement state or use state, are merely for convenience of description of the present utility model and for simplification of description, and do not indicate or imply that the structures, features, devices or elements to be referred to must have specific directions, be configured and operated in specific directions, and thus are not to be construed as limiting the present utility model.

As shown in fig. 1-4, this embodiment provides a 2U internal circulation air-liquid cooling hybrid heat dissipation server, including a server chassis assembly 1, a liquid cooling assembly 2, a fan 3 and a first circuit board 4, where the server chassis assembly 1 includes a base 11, a front window 12, a rear window 19 and an upper cover, the front window 12 and the rear window 19 are respectively disposed at front and rear ends of the base 11, the aperture ratio of the front window 12 is greater than 60%, the air inlet hole of the front window 12 is a regular hexagonal honeycomb hole, and the air inlet amount of the front window 12 can be ensured to meet the cooling requirement as much as possible. The upper cover covers the upper part of the base 11 to seal the base 11, so that external cold air is ensured to flow through the inside of the server component 1 and finally flow out of the rear window 19 after entering from the front window 12. The base 11 is fixedly connected with the first circuit board 4, and the first circuit board 4 is provided with a chip 41 with high power consumption. In this embodiment, the base 11 is provided with a fixing nut for fixing the first circuit board 4 by riveting M3, and other conventional fixing methods may be adopted in other embodiments. The outer side of the base 11 is also fixedly connected with a right chassis hanger 13 and a left chassis hanger 14, which are used for installing the server into the cabinet.

In this embodiment, the fan 3 is disposed between the front window 12 and the first circuit board 4, specifically, the fan bracket 15 is fixedly connected in the base 11, the fan 3 is installed and fixed in the fan bracket 15, the number of installed fans 3 in this embodiment is preferably 4 axial fans with 8038 specification, which provides powerful power, and in other embodiments, fans with different numbers and types can be selected according to the heat dissipation requirement. The liquid cooling assembly 2 comprises a heat exchanger 21, a micro water pump 22 and a liquid cooling plate 24, wherein the heat exchanger 21 is arranged between the front window 12 and the fan 3, cold air entering from the front window 12 firstly cools and cools the circulating cooling medium through the heat exchanger 21, and the heat exchanger 21 is preferably a fin tube made of pure copper in the implementation, so that the heat exchange efficiency is high. The liquid cooling plate 24 is disposed on the surface of the chip 41 to perform liquid cooling heat dissipation on the chip 41 with high power consumption and high heat generation. Further, the water outlet of the heat exchanger 21 is communicated with the micro water pump 22, the water outlet of the micro water pump 22 and the water inlet of the heat exchanger 21 are respectively communicated with the liquid cooling plate 24 through the hose 23, the micro water pump 22 conveys the cooling medium (such as water) cooled by the heat exchanger 21 to the water inlet of the liquid cooling plate 24 through the hose 23, and the cooling medium in the liquid cooling plate 24 exchanges heat with the chip 41 and then is conveyed back to the water inlet of the heat exchanger 21 through the hose 23, so that the internal circulation of the cooling medium is realized. Specifically, the number of liquid cooling plates 24 corresponds to the number of chips 41 on the first circuit board 4. In this embodiment, the number of the chips 41 and the number of the liquid cooling plates 24 are two, the two liquid cooling plates 24 are respectively and correspondingly arranged on the two different chips 41, and the two liquid cooling plates 24 are also connected in series by adopting the hose 23. The hose 23 is preferably a rubber hose, which facilitates the bending arrangement of the hose 23 according to the internal structural features of the server.

Further, the upper cover includes a first upper cover 16 and a second upper cover 17, the first upper cover 16 is disposed above the front window 12 to the fan 3, the second upper cover 17 is disposed above the fan 3 to the rear window 19, so as to realize partition, and when the cooling unit or the circuit unit needs to be maintained, the different upper covers can be detached correspondingly. The air inlet side of the heat exchanger 21 is abutted with the front window 12, the air outlet side of the heat exchanger 21 is abutted with the air inlet side of the fan 3, foam is filled in gaps around the contact end face of the air outlet side of the heat exchanger 21 and the air inlet side of the fan 3, and all cold air sucked by the fan 3 through the front window 12 can be directly subjected to heat exchange through the heat exchanger 21 by sealing around.

In this embodiment, the second circuit board 6 and the third circuit board 7 are further installed in the base 11, the second circuit board 6 and the third circuit board 7 are located below the second upper cover 17, the second circuit board 6 and the third circuit board 7 are common circuit boards without high power consumption chips, and in other embodiments, a person skilled in the art can set different numbers of common circuit boards as required. The base 11 is also provided with a power supply bin 18, and a power supply 7 is arranged in the power supply bin 18 and used for supplying power to the server.

When the 2U internal circulation air-liquid cooling mixed heat dissipation server provided by the utility model is particularly used, the fan 3 is started, cold air is sucked from the front window 12 and firstly passes through the heat exchanger 21 so as to cool the cooling circulation medium in the heat exchange 21, the cold air is blown to low-power-consumption electronic components in the server case assembly 1 through the fan 3 to cool in an air-cooling way, and finally the cold air is discharged from the rear window 19. Meanwhile, the cooling medium subjected to heat exchange and temperature reduction in the heat exchanger 21 is conveyed to the water inlet of the liquid cooling plate 24 by the micro water pump 22, the liquid cooling plate 24 is in direct contact with the surface of the chip 41 for heat exchange, and the cooling medium subjected to heat exchange flows back to the water inlet of the heat exchanger 21 through the water outlet of the liquid cooling plate 24, so that internal circulation is realized. According to the utility model, the high-power-consumption chip in the server is efficiently and accurately radiated through the liquid cooling plate 24, the low-power-consumption element in the server is radiated through air cooling, and the independent radiation of the server is realized through the combination of liquid cooling and air cooling modes.

While the foregoing is directed to the preferred embodiments of the present utility model, it will be appreciated by those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present utility model, and such modifications and adaptations are intended to be comprehended within the scope of the present utility model.

Claims

1. The utility model provides a 2U internal circulation wind liquid cooling mixes heat dissipation server, its characterized in that includes server machine case subassembly (1), liquid cooling subassembly (2), fan (3) and first circuit board (4), server machine case subassembly (1) include base (11), front window (12), rear window (19) and upper cover, front window (12) and rear window (19) set up respectively both ends around base (11), the upper cover covers base (11) top to seal base (11), fixed connection on base (11) first circuit board (4), fan (3) set up front window (12) with between first circuit board (4), liquid cooling subassembly (2) include heat exchanger (21), miniature water pump (22) and liquid cooling board (24), heat exchanger (21) set up front window (12) with between fan (3), liquid cooling board (24) set up be located on first circuit board (4) chip surface (21) heat exchanger (22) and miniature water pump (24) water inlet (21) through miniature water pump (24).

2. The 2U internal circulation air-liquid cooling hybrid heat radiation server according to claim 1, wherein an air inlet side of the heat exchanger (21) is abutted with the front window (12), and an air outlet side of the heat exchanger (21) is abutted with an air inlet side of the fan (3).

3. The 2U internal circulation air-liquid cooling mixed radiating server according to claim 2, wherein foam is filled in gaps around the contact end face of the air outlet side of the heat exchanger (21) and the air inlet side of the fan (3).

4. The 2U internal circulation air-liquid cooling hybrid heat radiation server according to claim 1, wherein a fan bracket (15) is fixedly connected in the base (11), and the fan (3) is installed in the fan bracket (15).

5. The 2U internal circulation air-liquid cooling hybrid heat dissipation server according to claim 1, wherein the upper cover comprises a first upper cover (16) and a second upper cover (17), the first upper cover (16) is disposed above the front window (12) to the fan (3), and the second upper cover (17) is disposed above the fan (3) to the rear window (19).

6. The 2U internal circulation air-liquid cooling hybrid heat dissipation server according to claim 5, wherein a second circuit board (5) and a third circuit board (6) are further installed in the base (11), and the second circuit board (5) and the third circuit board (6) are located below the second upper cover (17).

7. The 2U internal circulation air-liquid cooling mixed heat radiation server according to claim 1, wherein the outer side of the base (11) is fixedly connected with a case right hanging lug (13) and a case left hanging lug (14).

8. The 2U internal circulation air-liquid cooling hybrid heat radiation server according to claim 1, wherein the aperture ratio of the front window (12) is greater than 60%, and the air inlet hole of the front window (12) is a regular hexagonal honeycomb hole.

9. The 2U internal circulating air and liquid cooling mixed heat dissipation server according to claim 1, wherein a power supply bin (18) is further arranged in the base (11), and a power supply (7) is arranged in the power supply bin (18).