CN223362580U - Be used for supplementary heat abstractor of cloud computer all-in-one - Google Patents

Abstract

The utility model discloses an auxiliary heat dissipation device for a cloud computer all-in-one machine, comprising: a machine body, a circuit board installed inside the back of the machine body, a heat sink provided on one side of the circuit board, the machine body is located on one side of the circuit board and is fixedly connected to a heat dissipation back cover by screws, a heat dissipation seat is located at one end of the heat dissipation back cover and a heat conducting plate is provided, thermally conductive silicone is adhered to the same side of the heat dissipation seat as the heat conducting plate, the thermally conductive silicone is adhered to the inner side of the heat dissipation back cover on the opposite side of the heat dissipation seat, and an air guide baffle is provided on the inner side of the heat dissipation seat. The utility model has the following advantages: the utility cloud computer all-in-one machine adopts the heat dissipation seat to be adhered to the heat dissipation back cover through thermally conductive silicone, so that when the exhaust fan on the heat dissipation seat is dissipating heat, dust in the external environment will not enter the interior of the all-in-one machine and fall on the circuit board, thereby further ensuring cleanliness, and heat can be transferred to the heat dissipation back cover to dissipate outwards through the heat dissipation seat, the heat conducting plate and the thermally conductive silicone. The heat dissipation area can be effectively increased through the heat dissipation back cover, thereby further ensuring the speed of heat dissipation.

Description

Be used for supplementary heat abstractor of cloud computer all-in-one

Technical Field

The utility model relates to the technical field of integrated machine radiating devices, in particular to an auxiliary radiating device for a cloud computer integrated machine.

Background

The cloud computer all-in-one machine is novel computer equipment combining cloud computing technology and all-in-one machine hardware design. Typically consisting of one display and one mouse, all computing resources are concentrated in the cloud. The user logs in the server of the account connection high in the cloud through starting the display, obtains required computing power, and can be in charge of various office creation and entertainment activities.

However, because the big data cloud computing all-in-one machine has higher requirements on running speed, data processing capability and the like, the big data cloud computing all-in-one machine has higher requirements on hardware configuration of the big data cloud computing all-in-one machine, and the existing radiating mode of the big data cloud computing all-in-one machine generally only adopts a radiator to radiate heat of a CPU inside the all-in-one machine in combination with a radiating fan, so that the mode is limited in radiating, and when the radiating fan on the radiator exchanges heat with the outside, dust in the outside air easily enters the inside of the all-in-one machine and is attached to a circuit board. Therefore, the auxiliary heat dissipation device for the cloud computer all-in-one machine is provided, so that the problems are solved.

Disclosure of utility model

In order to solve the problems in the background technology, the technical scheme adopted by the utility model is that the auxiliary heat dissipation device for the cloud computer all-in-one machine comprises a machine body, a circuit board is arranged in the back of the machine body, a heat dissipation seat is arranged on one side of the circuit board, the machine body is fixedly connected with a heat dissipation rear cover through screws, a heat conduction plate is arranged at one end of the heat dissipation rear cover, heat conduction silica gel is attached to the same side of the heat dissipation seat as the heat conduction plate, heat conduction silica gel is attached to the inner side of the heat dissipation rear cover at the opposite side of the heat dissipation seat, and an air guide baffle is arranged on the inner side of the heat dissipation seat.

As a preferable technical scheme of the utility model, two air guide baffles are arranged in number, a fan seat is arranged between the two air guide baffles, exhaust fans are arranged in the fan seat, and two exhaust fans are arranged in number.

As a preferable technical scheme of the utility model, a plurality of radiating fins are arranged in the radiating seat and opposite to one side of the air guide partition plate, and the radiating fins are provided with through holes.

As a preferable technical scheme of the utility model, a space is reserved between the radiating fin and the air guide partition plate, and an air inlet is reserved between the air guide partition plate and the inner side of the radiating seat.

As an optimized technical scheme of the utility model, a fixing seat is arranged on one side, close to the circuit board, of the heat dissipation seat, the fixing seat is fixedly connected to the circuit board through screws, and CPU heat dissipation silica gel is attached to the outer side, located at one end of the circuit board, of the heat dissipation seat.

As an optimized technical scheme of the utility model, the heat radiating seat and the heat conducting plate are made of copper, the heat radiating rear cover is made of aluminum, the heat radiating fins are arranged on the outer side of the heat radiating rear cover, and the dust screen is fixedly connected to the outer side of one end of the heat radiating rear cover, which is opposite to the heat radiating seat, through screws.

The cloud computer integrated machine has the advantages that the heat dissipation seat is attached to the heat dissipation rear cover through the heat conduction silica gel, so that dust in the external environment cannot enter the integrated machine and fall on the circuit board when the exhaust fan on the heat dissipation seat dissipates heat, and cleanliness is further guaranteed;

the heat can be transferred to the heat dissipation rear cover for outward heat dissipation through the heat dissipation seat, the heat conduction plate and the heat conduction silica gel, and the heat dissipation area can be effectively increased through the heat dissipation rear cover, so that the heat dissipation speed is further ensured.

Drawings

FIG. 1 is a schematic view of a cloud computing all-in-one machine according to a preferred embodiment of the present utility model;

FIG. 2 is a schematic diagram showing a structure of a heat dissipation back cover separated from a body according to a preferred embodiment of the present utility model;

FIG. 3 is a schematic view of a heat sink base in partial cross-section according to a preferred embodiment of the present utility model;

fig. 4 is a schematic side view of the heat sink of fig. 3 according to a preferred embodiment of the present utility model.

The reference numerals indicate that 1, a machine body, 2, a circuit board, 3, a heat dissipation rear cover, 4, a heat dissipation seat, 5, an air guide baffle, 6, a fan seat, 7, an exhaust fan, 8, a heat conduction plate, 9, heat conduction silica gel, 10, heat dissipation fins, 11, through holes, 12, a fixing seat, 13, heat dissipation fins, 14, a dust screen, 15 and CPU heat dissipation silica gel.

Detailed Description

The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying positive importance.

In the description of the present utility model, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

The utility model is further described below with reference to the accompanying drawings.

Referring to fig. 1-4, the auxiliary heat dissipating device for a cloud computer integrated machine of the present utility model includes a machine body 1, a circuit board 2 is mounted inside the back of the machine body 1, a heat dissipating seat 4 is disposed on one side of the circuit board 2, a heat dissipating back cover 3 is fixedly connected to one side of the machine body 1 on the circuit board 2 through screws, a heat conducting plate 8 is disposed at one end of the heat dissipating back cover 3 on the heat dissipating seat 4, heat conducting silica gel 9 is attached to the same side of the heat dissipating seat 4 as the heat conducting plate 8, the heat conducting silica gel 9 is attached to the inner side of the heat dissipating back cover 3 on the opposite side of the heat dissipating seat 4, and an air guiding partition 5 is disposed on the inner side of the heat dissipating seat 4.

The combination is shown in fig. 3 and 4, wherein the number of the air guide baffles 5 is two, a fan seat 6 is installed between the two air guide baffles 5, then take away the heat in the heat dissipation seat 4 and then outwards discharge from the exhaust fan 7, the fan seat 6 is internally provided with the exhaust fan 7, the number of the exhaust fan 7 is two, the inside of the heat dissipation seat 4 is just provided with cooling fins 10 on one side of the air guide baffles 5, the number of the cooling fins 10 is provided with a plurality of, the cooling fins 10 are provided with through holes 11, a gap is reserved between the cooling fins 10 and the air guide baffles 5, the air is conveniently circulated and taken away easily in circulation through the cooling fins 10 and the through holes 11, an air inlet is reserved between the air guide baffles 5 and the inner side of the heat dissipation seat 4, and the outside air is conveniently caused to enter from the upper end and the lower end of the heat dissipation seat 4 through the air guide baffles 5.

Wherein, the heat dissipation seat 4 is close to circuit board 2 one side and is provided with fixing base 12, fixing base 12 passes through screw fixed connection on circuit board 2, heat dissipation seat 4 is located the laminating of circuit board 2 one end outside and has CPU heat dissipation silica gel 15, and then avoid heat dissipation seat 4 direct contact CPU to cause wearing and tearing to the CPU, heat dissipation seat 4 and heat-conducting plate 8 are the copper material, combine the figure 2 to show, lid 3 is the aluminium material after the heat dissipation, the lid 3 outside is provided with heat dissipation fin 13 after the heat dissipation, and then can promote the heat dissipation area of lid 3 after the heat dissipation, lid 3 just is connected with dust screen 14 through screw fixed connection outside heat dissipation seat 4 one end.

Specifically, when the heat dissipation device is used, heat generated by the CUP on the circuit board 2 is transferred to the heat dissipation seat 4 through the CPU heat dissipation silica gel 15, the heat dissipation seat 4 transfers the heat to the heat conduction plate 8 and the heat dissipation fins 10, the heat conduction plate 8 transfers the heat to the heat conduction silica gel 9, the heat is transferred to the heat dissipation rear cover 3 through the heat conduction silica gel 9 to further conduct outward heat dissipation, meanwhile, the exhaust fan 7 is operated to exhaust the air outwards from the inside of the heat dissipation seat 4, and then the outside air enters from the air inlet between the air guide partition plate 5 and the inner side of the heat dissipation seat 4, and the entering fresh air takes away the heat at the heat dissipation fins 10 inside the heat dissipation seat 4 and then is discharged outwards from the exhaust fan 7, so that the heat dissipation of the CPU can be realized.

The foregoing is merely a preferred embodiment of the present utility model and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present utility model, which are intended to be comprehended within the scope of the present utility model.

Other parts of the present utility model not described in detail are all of the prior art, and are not described in detail herein.

It should be noted that the above embodiments are merely for illustrating the technical solution of the present utility model and not for limiting the same, and although the present utility model has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that the technical solution described in the above embodiments may be modified or some or all of the technical features may be equivalently replaced, and these modifications or substitutions do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the present utility model.

Claims (6)

1. The auxiliary heat dissipation device for the cloud computer all-in-one machine comprises a machine body (1) and is characterized in that a circuit board (2) is mounted in the back of the machine body (1), a heat dissipation seat (4) is arranged on one side of the circuit board (2), a heat dissipation rear cover (3) is fixedly connected to one side of the circuit board (2) through screws, a heat conduction plate (8) is arranged at one end of the heat dissipation rear cover (3) of the heat dissipation seat (4), heat conduction silica gel (9) is attached to the same side of the heat conduction plate (8), heat conduction silica gel (9) is attached to the inner side of the heat dissipation rear cover (3) on the opposite side of the heat dissipation seat (4), and an air guide partition plate (5) is arranged on the inner side of the heat dissipation seat (4).

2. The auxiliary heat dissipation device for the cloud computer all-in-one machine according to claim 1, wherein two air guide baffles (5) are arranged in number, a fan seat (6) is arranged between the two air guide baffles (5), exhaust fans (7) are arranged in the fan seat (6), and two exhaust fans (7) are arranged in number.

3. The auxiliary heat dissipation device for the cloud computer all-in-one machine according to claim 1, wherein heat dissipation fins (10) are arranged on one side, facing the air guide partition plate (5), inside the heat dissipation seat (4), a plurality of heat dissipation fins (10) are arranged, and through holes (11) are formed in the heat dissipation fins (10).

4. The auxiliary heat dissipation device for the cloud computer integrated machine according to claim 3, wherein a space is reserved between the heat dissipation plate (10) and the air guide partition plate (5), and an air inlet is reserved between the air guide partition plate (5) and the inner side of the heat dissipation seat (4).

5. The auxiliary heat dissipation device for the cloud computer all-in-one machine according to claim 1, wherein a fixing seat (12) is arranged on one side, close to the circuit board (2), of the heat dissipation seat (4), the fixing seat (12) is fixedly connected to the circuit board (2) through screws, and CPU heat dissipation silica gel (15) is attached to the outer side, located at one end of the circuit board (2), of the heat dissipation seat (4).

6. The auxiliary heat dissipation device for the cloud computer integrated machine according to claim 1, wherein the heat dissipation base (4) and the heat conduction plate (8) are made of copper, the heat dissipation rear cover (3) is made of aluminum, heat dissipation fins (13) are arranged on the outer side of the heat dissipation rear cover (3), and a dustproof net (14) is fixedly connected to the outer side, opposite to one end of the heat dissipation base (4), of the heat dissipation rear cover (3) through screws.