CN223356126U - Automatic silicon wafer unpacking and loading machine - Google Patents
Automatic silicon wafer unpacking and loading machineInfo
- Publication number
- CN223356126U CN223356126U CN202422648592.XU CN202422648592U CN223356126U CN 223356126 U CN223356126 U CN 223356126U CN 202422648592 U CN202422648592 U CN 202422648592U CN 223356126 U CN223356126 U CN 223356126U
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- storage box
- action
- taking
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本实用新型公开了一种硅片自动拆盒上料机，其包括机架、机器人上下料机构、开盒机构、取盖机构、取硅片机构、吸纸板机构、硅片夹爪机构、泡沫纸板输送线、硅片输送线和硅片堆叠视觉检测机构。本实用新型能够解决人工取存放盒，拆存放盒操作不当，划伤存放盒或者硅片等问题，避免因刀片锋利而划伤人员等情况的发生，提高了生产效率，减少了产品不良率，节约了生产成本。
The utility model discloses an automatic silicon wafer unpacking and loading machine, which includes a frame, a robotic loading and unloading mechanism, a box opening mechanism, a lid removal mechanism, a silicon wafer removal mechanism, a paperboard suction mechanism, a silicon wafer clamping mechanism, a foam paperboard conveyor line, a silicon wafer conveyor line, and a silicon wafer stacking visual inspection mechanism. The utility model can solve problems such as manual unpacking and unpacking of storage boxes, scratching of storage boxes or silicon wafers, and avoids injuries to personnel caused by sharp blades, thereby improving production efficiency, reducing product defect rates, and saving production costs.
Description
Technical Field
The utility model relates to the technical field of new photovoltaic materials, in particular to an automatic box-disassembling and feeding machine for silicon wafers.
Background
At present, in the photovoltaic industry, a silicon wafer storage box is detached and silicon wafer loading is performed in a manual operation or semi-automatic mode, namely, the silicon wafer foam storage box is manually scratched, the silicon wafer is taken out and put into a designated position for detection, then an empty storage box is put into a designated storage position, and then the silicon wafer which is qualified in detection is manually put into a wafer dispenser.
Meanwhile, the silicon wafers are relatively more, fragile, high in labor intensity of manual grabbing, easy to break, easy to hurt personnel by the blade, and the like, so that great loss is caused, and in addition, the manual operation efficiency is low and the cost is high.
Therefore, whether an automatic silicon wafer box-disassembling and feeding machine can be provided becomes a technical problem to be solved in the field.
Disclosure of utility model
The utility model aims to overcome the defects in the prior art and provides an automatic silicon wafer box-disassembling and feeding machine.
The utility model solves the technical problems by the following technical scheme:
An automatic box-disassembling and feeding machine for silicon wafers, comprises a frame, a robot feeding and discharging mechanism arranged on the frame a box opening mechanism, a cover taking mechanism, a silicon wafer taking mechanism the device comprises a paper suction plate mechanism, a foam paper plate conveying line, a silicon wafer clamping jaw mechanism and a silicon wafer stacking visual detection mechanism;
The robot loading and unloading mechanism is used for completing loading actions, namely grabbing the storage box to be disassembled from the storage area to the box opening area;
The box opening mechanism is used for completing the separation action, namely separating the upper cover and the lower storage box of the storage box to be disassembled, which are positioned in the box opening area, after the feeding action of the robot feeding and discharging mechanism is completed;
The cover taking mechanism is used for completing cover taking action, namely, after the box opening mechanism completes separation action, the upper cover of the storage box is taken down from the lower storage box;
The silicon chip taking mechanism is used for completing the taking action, namely taking out and conveying the silicon chip in the lower storage box, the upper foam paperboard on the upper surface of the silicon chip and the lower foam paperboard on the lower surface of the silicon chip to the foam paperboard conveying line together after the cover taking mechanism completes the cover taking action;
the cover taking mechanism is also used for completing the cover closing action, namely, after the silicon wafer taking mechanism completes the material taking action, the upper cover of the storage box is put back onto the lower storage box to be closed;
The robot feeding and discharging mechanism is also used for completing the discharging action, namely after the cover taking mechanism completes the cover closing action, the upper cover of the storage box and the lower storage box are conveyed to the storage area;
The paper sucking mechanism is used for completing the action of taking the upper paper plate, namely, after the silicon wafer taking mechanism completes the action of taking the material, the upper foam paper plate is taken down from the silicon wafer and conveyed to the foam paper plate conveying line;
the silicon chip taking mechanism is also used for completing the overturning action, namely after the paper board sucking mechanism completes the action of taking the paper board, the silicon chip and the lower foam paper board are overturned until the lower foam paper board faces upwards;
The paper sucking mechanism is also used for completing the paper sucking action, namely, after the silicon wafer taking mechanism completes the overturning action, the lower foam paper board is taken down from the silicon wafer and conveyed to the foam paper board conveying line;
The silicon wafer clamping jaw mechanism is used for completing the action of loading silicon wafers, namely, after the paperboard sucking mechanism completes the action of taking off the paperboard, the silicon wafers are conveyed from the foam paperboard conveying line to the silicon wafer conveying line;
The silicon wafer stacking visual detection mechanism is used for completing visual detection actions, namely detecting the effects around the stacked silicon wafers after the silicon wafer clamping jaw mechanism completes the actions of loading the silicon wafers, and judging whether the silicon wafers are qualified or not;
The silicon wafer clamping jaw mechanism is also used for completing the silicon wafer unloading action, namely, after the silicon wafer stacking visual detection mechanism completes the visual detection action, the qualified silicon wafer is conveyed to the next procedure.
In some embodiments, the box opening mechanism comprises a first rotary cylinder, a first servo module, a sliding table cylinder fixing frame, a sliding table cylinder, a blade, a guide piece, a storage box placing plate, a second rotary cylinder, a rotary shaft, a support, a second servo module and a camera, wherein the blade is installed on the sliding table cylinder, the sliding table cylinder is installed on the first servo module through the sliding table cylinder fixing frame, the first servo module is installed on the frame, the guide piece is connected with the storage box placing plate, the storage box placing plate is connected with the second rotary cylinder, the rotary shaft is connected with the storage box placing plate and the support is installed on the second servo module, the first rotary cylinder is connected with the storage box placing plate, and the camera is configured to be capable of detecting a gap between an upper storage box cover and a lower storage box of a storage box to be detached in a box opening area.
In some embodiments, the cover taking mechanism comprises a sucker fixing piece, a vacuum adsorption assembly, a linear bearing, a guide shaft, a support and a hydraulic cylinder, wherein the vacuum adsorption assembly is installed on the sucker fixing piece, the sucker fixing piece is connected to the support through the guide shaft and the linear bearing, the hydraulic cylinder is installed on the support, and the support is installed on the frame.
In some embodiments, the silicon wafer taking mechanism comprises a gear rack, a motor fixing plate, a module connecting plate, a motor, a third servo module, a first module fixing plate, a guide rail, a clamping jaw, a third rotary cylinder and a first air cylinder, wherein the clamping jaw is connected with the guide rail and fixed on the guide rail fixing plate, the guide rail fixing plate is connected with the first module fixing plate, the first module fixing plate is fixed on the third servo module, the third servo module is fixed on the module connecting plate, the motor and the third servo module are fixed on the motor fixing plate, the motor fixing plate is connected with the gear rack, and the gear rack is fixed on the rack.
In some embodiments, the paper sucking plate mechanism comprises a second cylinder, a fixing plate, a floating head, a third cylinder, a sucking disc assembly, a sucking disc fixing piece, a cylinder fixing piece and a guide rail sliding block, wherein the sucking disc assembly is connected with the sucking disc fixing piece, the sucking disc fixing piece is fixed on the third cylinder, the third cylinder is fixed on the cylinder fixing piece, the cylinder fixing piece is connected with the guide rail sliding block, the third cylinder is connected with the floating head and the second cylinder, the second cylinder is fixed on the fixing plate, and the fixing plate is fixed on the silicon wafer taking mechanism.
In some embodiments, the foam board conveyor line includes a first positioning bracket for receiving the silicon chip and the foam board from the silicon chip taking mechanism;
And/or the silicon wafer conveying line comprises a second positioning bracket, and the second positioning bracket is used for receiving the silicon wafer.
In some embodiments, the silicon wafer clamping jaw mechanism comprises an upper silicon wafer clamping jaw mechanism for conveying the silicon wafer to the second positioning support to perform visual inspection of the silicon wafer stacking, and a silicon wafer unloading clamping jaw mechanism for grabbing the silicon wafer qualified in visual inspection into a wafer sending machine and entering the next procedure.
In some embodiments, the silicon wafer stacking vision detection mechanism comprises a rotation mechanism, a silicon wafer chamfer detection camera, a camera support and a silicon wafer side detection camera, wherein the rotation mechanism drives a stacked silicon wafer product to rotate on a workbench surface, the silicon wafer chamfer detection camera is mounted on the camera support and is used for detecting whether a chamfer of a silicon wafer has defects, the silicon wafer side detection camera is mounted on the camera support and is used for detecting whether the side surface of the silicon wafer has defects.
In some embodiments, the silicon wafer chamfer detection cameras are two sets in total and symmetrically mounted to the camera support;
And/or the two sets of silicon wafer side face detection cameras and the two sets of camera supports are symmetrically arranged above the silicon wafer conveying line.
In some embodiments, the rotation angle of the rotation mechanism is 0-90 degrees.
On the basis of conforming to the common knowledge in the field, the above preferred conditions can be arbitrarily combined to obtain the preferred examples of the utility model.
The utility model has the advantages that the problems of improper operation of manually taking the storage box, improper disassembly of the storage box, scratching of the storage box or silicon wafers and the like can be solved, the occurrence of the conditions of scratching personnel and the like due to sharp blades is avoided, the production efficiency is improved, the reject ratio of products is reduced, and the production cost is saved.
Drawings
Fig. 1 is a schematic structural view of an automatic silicon wafer disassembling and loading machine according to a preferred embodiment of the utility model.
Fig. 2 is a schematic structural view of a box opening mechanism according to a preferred embodiment of the present utility model.
Fig. 3 is a schematic structural view of a cap removing mechanism according to a preferred embodiment of the present utility model.
Fig. 4 is a schematic structural view of a silicon wafer taking mechanism according to a preferred embodiment of the present utility model.
Fig. 5 is a schematic structural view of a paper sucking plate mechanism according to a preferred embodiment of the present utility model.
Fig. 6 is a schematic structural view of a stacked visual inspection mechanism according to a preferred embodiment of the present utility model.
Reference numerals illustrate:
The device comprises a frame 1, a robot feeding and discharging mechanism 2, a box opening mechanism 3, a cover taking mechanism 4, a silicon wafer taking mechanism 5, a paper sucking plate mechanism 6, a silicon wafer clamping jaw mechanism 7, a foam paper plate conveying line 8, a silicon wafer conveying line 9, a silicon wafer stacking vision detecting mechanism 10, a first rotary cylinder 11, a first servo module 12, a sliding table cylinder fixing frame 13, a sliding table cylinder 14, a blade 15, a guide piece 16, a storage box placing plate 17, a second rotary cylinder 18, a rotary shaft 19, a support 20, a second servo module 21, a camera 22, a sucker fixing piece 23, a vacuum adsorption component 24, a linear bearing 25, a guide shaft 26, a support 27, a hydraulic cylinder 28, a gear rack 31, a motor fixing plate 32, a module connecting plate 33, a motor 34, a third servo module 35, a first module fixing plate 36, a guide rail fixing plate 37, a guide rail 38, a clamping jaw 39, a third rotary cylinder 40, a first cylinder 41, a second cylinder 42, a fixing plate 43, a floating head 44, a third cylinder 45, a sucker component 46, a sucker fixing piece 47, a cylinder fixing piece 48, a guide rail slider 49, a rotary mechanism 50, a chamfer detecting camera 51, a silicon wafer detecting support 53 and a camera side surface 53.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the utility model, its application, or uses. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that in the claims and the description of this patent, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
As shown in fig. 1-6, the embodiment discloses a novel automatic silicon wafer box-disassembling and loading machine, which comprises a frame 1, a robot loading and unloading mechanism 2, a box opening mechanism 3, a cover taking mechanism 4, a silicon wafer taking mechanism 5, a paper sucking plate mechanism 6, a silicon wafer clamping jaw mechanism 7, a foam paper plate conveying line 8, a silicon wafer conveying line 9 and a silicon wafer stacking visual detection mechanism 10, wherein the robot loading and unloading mechanism 2 is arranged on the frame.
The robot loading and unloading mechanism 2 is used for completing loading actions, namely grabbing the storage box to be disassembled from the storage area to the box opening area.
The box opening mechanism 3 is used for completing the separation action, namely separating the upper cover and the lower storage box of the storage box to be disassembled, which are positioned in the box opening area, after the feeding action of the robot feeding and discharging mechanism 2 is completed.
The cover taking mechanism 4 is used for completing the cover taking action, namely, after the box opening mechanism 3 completes the separating action, the upper cover of the storage box is taken down from the lower storage box.
The silicon wafer taking mechanism 5 is used for completing the material taking action, namely taking out and conveying the silicon wafer in the lower storage box, the upper foam paperboard on the upper surface of the silicon wafer and the lower foam paperboard on the lower surface of the silicon wafer to the foam paperboard conveying line 8 after the cover taking mechanism 4 completes the cover taking action.
The cover taking mechanism 4 is also used for completing the cover closing action, namely, after the silicon wafer taking mechanism 5 completes the material taking action, the upper cover of the storage box is put back onto the lower storage box to be closed.
The robot loading and unloading mechanism 2 is also used for completing the unloading action, namely, after the cover taking mechanism 4 completes the cover closing action, the upper cover and the lower storage box of the storage box are conveyed to the storage area.
The paper sucking mechanism 6 is used for completing the paper sucking action, namely, after the silicon wafer taking mechanism 5 completes the material sucking action, the upper foamed paper board is taken down from the silicon wafer and conveyed to the foamed paper board conveying line 8.
The silicon chip taking mechanism 5 is also used for completing the overturning action, namely, after the paper sucking mechanism 6 completes the action of taking the paper board, the silicon chip and the lower foam paper board are overturned until the lower foam paper board faces upwards.
The paper sucking mechanism 6 is also used for completing the paper taking-off action, namely, after the silicon chip taking-off mechanism 5 completes the overturning action, the lower foamed paper board is taken off from the silicon chip and conveyed to the foamed paper board conveying line 8.
The silicon wafer clamping jaw mechanism 7 is used for completing the action of loading silicon wafers, namely, after the paperboard sucking mechanism 6 completes the action of taking off the paperboard, the silicon wafers are conveyed from the foam paperboard conveying line 8 to the silicon wafer conveying line 9.
The silicon wafer stacking visual detection mechanism 10 is used for completing visual detection actions, namely detecting the effect on the periphery of the stacked silicon wafers after the silicon wafer clamping jaw mechanism 7 completes the actions of loading the silicon wafers, and judging whether the silicon wafers are qualified or not.
The silicon wafer clamping jaw mechanism 7 is also used for completing the silicon wafer unloading action, namely, after the silicon wafer stacking visual detection mechanism completes the visual detection action, the qualified silicon wafer is conveyed to the next procedure.
The silicon wafer automatic box-disassembling and feeding machine of the embodiment adopts the structural form, can solve the problems that the storage box is manually taken, the storage box is improperly disassembled, the storage box or the silicon wafer is scratched, and the like, and the blade is sharp, and the personnel are scratched to perform dangerous operations, so that the production efficiency is improved, the reject ratio of products is reduced, and the production cost is saved.
In the present embodiment, the box opening mechanism 3 and the cover taking mechanism 4 are used in cooperation. The box opening mechanism 3 includes a first rotary cylinder 11, a first servo module 12, a slide cylinder holder 13, a slide cylinder 14, a blade 15, a guide 16, a storage box placement plate 17, a second rotary cylinder 18, a rotary shaft 19, a support 20, a second servo module 21, and a camera 22. The blade 15 of the box opening mechanism 3 is fixed on the slipway cylinder 14, the slipway cylinder 14 is fixed on the first servo module 12 through the slipway cylinder fixing frame 13, the first servo module 12 is fixed on the frame 1, the guide piece 16 is connected with the storage box placing plate 17, the storage box placing plate 17 is fixedly connected with the second rotary cylinder 18, and the rotary shaft 19 is fixed on the second servo module 21 by connecting the storage box placing plate 17 with the support 20. The first rotary cylinder 11 is connected to the storage box placement plate 17, and the camera 22 is configured to be able to detect a gap between the upper and lower storage boxes of the storage box to be disassembled located in the box opening area.
The cover taking mechanism 4 comprises a sucker fixing piece 23, a vacuum adsorption assembly 24, a linear bearing 25, a guide shaft 26, a bracket 27 and a hydraulic cylinder 28. The vacuum adsorption component 24 of the cover taking mechanism 4 is fixed on the sucker fixing piece 23, the sucker fixing piece 23 is connected with the linear bearing 25 through the guide shaft 26 on the bracket 27, the hydraulic cylinder 28 is also connected on the bracket 27, and the bracket 27 is fixed on the frame 1.
The box opening mechanism 3 and the cover taking mechanism 4 work in principle and the cooperation actions among all the components are as follows:
the robot loading and unloading mechanism 2 grabs the storage box to be disassembled from the storage area to the box opening area.
The second servo module 21 of the box opening mechanism 3 moves the storage box to be disassembled and other parts fixed on the second servo module 21 placed in the box opening area to a specified position, a camera 22 performs visual detection on a gap between the upper storage box cover and the lower storage box of the storage box to be disassembled, then the first servo module 12 drives a sliding table cylinder 14 and a blade 15 to move upwards to a position of the gap between the upper storage box cover and the lower storage box, the sliding table cylinder 14 drives the blade to puncture the adhesive tape, the adhesive tape enters the gap between the upper storage box cover and the lower storage box, and the second rotary cylinder 18 rotates 180 degrees, so that the adhesive tape is scratched by the two blades 15.
The cover taking mechanism 4 drives the guide shaft 26, the sucker fixing piece 23 and the vacuum adsorption component 24 to move downwards through the hydraulic cylinder 28, the vacuum adsorption component 24 adsorbs the upper cover of the storage box, and the hydraulic cylinder 28 retracts to drive the guide shaft 26, the sucker fixing piece 23 and the vacuum adsorption component 24 to move upwards. The first rotary cylinder 11 of the box opening mechanism 3 rotates 90 degrees clockwise to drive the lower storage box and the silicon wafers to rotate 90 degrees clockwise together. After the silicon wafer taking mechanism 5 picks up the silicon wafer, the first rotary cylinder 11 rotates anticlockwise for 90 degrees again to drive the storage box to rotate back. The cover taking mechanism 4 repeats the above actions to put the upper cover of the storage box back to the lower storage box to be folded. When the first rotary cylinder 11 of the box opening mechanism 3 rotates 90 degrees anticlockwise, the second servo module 21 brings the box opening mechanism back to the initial position, and the storage box (the whole formed by folding the upper cover and the lower storage box) is sucked to the storage area by the robot feeding and discharging mechanism 2.
In this embodiment, through the box opening mechanism 3 and the cover taking mechanism 4 of the above structural form, the problems of manual storage box taking, improper storage box disassembly and storage box or silicon wafer scratch and the like can be solved, the occurrence of the conditions of scratching personnel and the like due to sharp blades 15 is avoided, the production efficiency is improved, the defective rate of products is reduced, and the production cost is saved.
In this embodiment, the silicon wafer taking mechanism 5 and the paper sucking plate mechanism 6 are used in cooperation, and the silicon wafer taking mechanism 5 includes a rack and pinion 31, a motor fixing plate 32, a module connecting plate 33, a motor 34, a third servo module 35, a first module fixing plate 36, a guide rail fixing plate 37, a guide rail 38, a clamping jaw 39, a third rotary cylinder 40, and a first cylinder 41. Clamping jaw 39 of silicon wafer taking mechanism 5 is connected with guide rail 38 and fixed on guide rail fixing plate 37, guide rail fixing plate 37 is connected with first module fixing plate 36 and fixed on third servo module 35, third servo module 35 is fixed on module connecting plate 33, motor 34 and third servo module 35 are both fixed on motor fixing plate 32, and motor fixing plate 32 is connected with rack and pinion 31. A gear rack 31 is fixed on the frame 1, and the gear rack is used for driving the silicon wafer taking mechanism 5 and the paper sucking plate mechanism 6 to move.
The suction plate mechanism 6 includes a second air cylinder 42, a fixed plate 43, a floating head 44, a third air cylinder 45, a suction cup assembly 46, a suction cup fixing member 47, an air cylinder fixing member 48, and a rail slider 49. The sucking disc assembly 46 in the sucking disc mechanism 6 is connected with the sucking disc fixing piece 47, the sucking disc fixing piece 47 is fixed on the third air cylinder 45, the third air cylinder 45 is fixed on the air cylinder fixing piece 48, the air cylinder fixing piece 48 is connected with the guide rail sliding block 49, the third air cylinder 45 is simultaneously connected with the floating head 44 and the second air cylinder 42, the second air cylinder 42 is fixed on the fixing plate 43, and the fixing plate 43 is fixed on the silicon wafer taking mechanism 5.
The foam paperboard conveying line 8 comprises a first positioning bracket, wherein the first positioning bracket is used for receiving a silicon wafer from the silicon wafer taking mechanism 5, an upper foam paperboard on the upper surface of the silicon wafer and a lower foam paperboard on the lower surface of the silicon wafer.
The silicon wafer conveyor line 9 comprises a second positioning bracket for receiving a silicon wafer.
The silicon wafer clamping jaw mechanism 7 comprises an upper silicon wafer clamping jaw mechanism for conveying the silicon wafer to the second positioning bracket to perform visual inspection of the silicon wafer stack and a silicon wafer unloading clamping jaw mechanism for grabbing the silicon wafer qualified in visual inspection into a wafer sending machine and entering the next procedure.
The silicon wafer stacking vision detecting mechanism 10 judges whether or not it is acceptable by detecting the effect around the stacked silicon wafer.
In the embodiment, the working principle of the silicon wafer taking mechanism 5 and the paper sucking mechanism 6 is that a first air cylinder 41 stretches out to drive a clamping jaw 39 to open, a motor 34 rotates to drive the clamping jaw 39 to move to the box opening mechanism 3, a third servo module 35 drives the clamping jaw 39 to descend, the first air cylinder 41 retracts to clamp the silicon wafer, the upper foam paper board on the upper surface of the silicon wafer and the lower foam paper board on the lower surface of the silicon wafer together from the box opening mechanism 3, the third servo module 35 drives the clamping jaw 39 and the silicon wafer to ascend, the motor 34 rotates to drive the clamping jaw 39, the silicon wafer, the upper foam paper board and the lower foam paper board to move to the foam paper board conveying line 8 together, the clamping jaw is loosened through the first air cylinder 41, and the silicon wafer, the upper foam paper board and the lower foam paper board are placed on a first positioning bracket on the foam paper board conveying line 8.
The third cylinder 45 of the paper sucking plate mechanism 6 stretches out to drive the sucking disc assembly 46 to suck the upper foam paper plate, the third cylinder 45 retracts to drive the upper foam paper plate to move upwards, the second cylinder 42 stretches out to drive the third cylinder 45 and the upper foam paper plate to move leftwards, the third cylinder 45 descends again, the upper foam paper plate is put down on the foam paper plate conveying line 8, the foam paper plate conveying line 8 conveys the upper foam paper plate to a manual station, and the upper foam paper plate is manually taken away. The third rotary cylinder 40 turns the silicon chip and the lower foam paperboard up by 180 degrees, and acts in the same way as the upper part, the lower foam paperboard is placed on the foam paperboard conveying line 8, after the lower foam paperboard is conveyed and taken out, the silicon chip is moved to a second positioning bracket of the silicon chip conveying line 9 by the silicon chip taking mechanism 5, and the second positioning bracket is used for receiving the silicon chip and positioning the position of the silicon chip, so that convenience is provided for subsequent stacking and detection. The actions of the silicon wafer taking mechanism 5 and the paper sucking plate mechanism 6 are completed.
In the embodiment, the silicon wafer taking mechanism 5 and the paper sucking plate mechanism 6 with the structural forms are adopted, and through the automatic design of the silicon wafer taking mechanism 5, the silicon wafers are automatically taken out from the storage box, and the efficiency and the accuracy of silicon wafer taking are improved. Through the cooperation of components such as rack and pinion 31, motor fixed plate 32, module connecting plate 33, motor 34, third servo module 35, the accurate positioning and the removal of silicon chip in taking out process have been ensured. The automatic silicon wafer taking mechanism 5 reduces the requirement of manual operation and reduces the labor intensity and operation risk of operators. The process of automatically taking the silicon wafers reduces the time for taking and placing the silicon wafers, thereby further improving the overall production efficiency.
Through inhaling cardboard mechanism 6 can realize that the automation of cardboard absorbs and places, reduced manual operation, further improves production efficiency, through the action of accurate control sucking disc subassembly 46 and cylinder, can ensure that the cardboard of foam can accurately take out and place the assigned position in the case to absorb and place the process automatically and reduced the damage that the cardboard of foam probably takes place in the manual operation in-process.
In this embodiment, through foam cardboard transfer chain 8 and silicon chip transfer chain 9 and the automatic transport of silicon chip clamping jaw mechanism 7 of silicon chip and foam cardboard, further reduced manual operation, improved production efficiency to can ensure the accurate positioning of silicon chip in the transportation process through first locating support and second locating support, provide convenience for subsequent stacking and detection. By the silicon wafer stacking visual detection mechanism 10, the rotation mechanism 50, the silicon wafer chamfering detection camera 51 and the silicon wafer side detection camera 53, automatic detection of the silicon wafer stacking quality is realized, the product quality is ensured, the requirement of manual inspection is reduced by automatic visual detection, and the labor intensity and the possibility of human errors are reduced.
Further, the silicon wafer stack vision inspection mechanism 10 of the present embodiment further includes a rotation mechanism 50, a silicon wafer chamfer inspection camera 51, a camera bracket 52, and a silicon wafer side inspection camera 53. The rotating mechanism 50 can drive the stacked silicon wafer products to rotate on the workbench surface, the silicon wafer chamfering detection camera 51 is installed on the camera support 52 and used for detecting whether defects exist in the chamfering of the silicon wafer, the silicon wafer side detection camera 53 is installed on the camera support 52, and the silicon wafer side detection camera 53 is used for detecting whether defects exist in the side face of the silicon wafer.
The working principle of the silicon wafer stack vision inspection mechanism 10/the cooperation actions among the components are as follows:
After the stacked silicon wafers are transported to a designated position through the silicon wafer conveying line 9, a silicon wafer chamfer detecting camera 51 and a silicon wafer side detecting camera 53 respectively detect whether defects exist on two side surfaces and two chamfer surfaces of the silicon wafers, then a rotating mechanism 50 drives the stacked silicon wafers to rotate, then the other two side surfaces and the two chamfer surfaces are detected, then the unqualified silicon wafers are manually taken out if the silicon wafers are judged to be unqualified, and the silicon wafer is grasped by a silicon wafer unloading clamping jaw mechanism into a wafer sending machine to enter the next working procedure if the silicon wafers are judged to be qualified.
The silicon wafer stacking vision detection mechanism 10 of the embodiment enables the silicon wafer to rotate on the workbench surface through the rotation mechanism 50, combines the silicon wafer chamfering detection camera 51 and the silicon wafer side detection camera 53, can detect multiple surfaces of the silicon wafer, ensures the comprehensiveness of detection, uses a special camera and a bracket for chamfering and side detection, can more accurately identify defects of the silicon wafer such as cracks, impurities or other defects, automatically performs vision detection, reduces the requirement of manual detection, and reduces the labor intensity and the possibility of human errors.
Further, in the present embodiment, the silicon wafer bevel inspection cameras 51 are provided in total in two sets and symmetrically mounted to the camera mount 52.
In this embodiment, by two sets of symmetrically installed chamfer detection cameras 51, the reliability of detection can be improved, the chamfer of the silicon wafer can be ensured to be detected from different angles, the symmetrical camera layout is helpful to reduce the blind area in the detection process, and all the chamfer areas of the silicon wafer can be ensured to be effectively detected.
Further, in the present embodiment, the silicon wafer side surface detecting cameras 53 and the camera holders 52 are each provided in two sets and are symmetrically installed above the silicon wafer transport line 9.
Further, in this embodiment, by symmetrically installing two sets of cameras above the silicon wafer conveying line 9, it is possible to ensure comprehensive detection of both side surfaces of the silicon wafer and reduce omission. The symmetrical camera layout allows for simultaneous detection of both sides of the silicon wafer, thereby improving the efficiency of the detection process. The two sets of cameras can capture images from different angles, and are beneficial to improving the detection precision of the side defects of the silicon wafer.
Further, in the present embodiment, the rotation angle of the rotation mechanism 50 is 0 to 90 degrees. The rotation mechanism 50 can precisely control the rotation angle within the range of 0-90 degrees, and ensure the correct positioning and rotation of the silicon wafer in the detection process.
The automatic box-disassembling and feeding machine for the silicon wafers solves the problems that the storage box is manually taken, the storage box is improperly disassembled, the storage box is scratched or the silicon wafers are scratched, the blades are sharp, and personnel are scratched and the like in dangerous operation, so that the production efficiency is improved, the reject ratio of products is reduced, and the production cost is saved.
Claims (10)
1. An automatic silicon wafer box-disassembling and feeding machine is characterized in that, comprises a frame, a robot feeding and discharging mechanism arranged on the frame a box opening mechanism, a cover taking mechanism, a silicon wafer taking mechanism the device comprises a paper suction plate mechanism, a foam paper plate conveying line, a silicon wafer clamping jaw mechanism and a silicon wafer stacking visual detection mechanism;
The robot loading and unloading mechanism is used for completing loading actions, namely grabbing the storage box to be disassembled from the storage area to the box opening area;
The box opening mechanism is used for completing the separation action, namely separating the upper cover and the lower storage box of the storage box to be disassembled, which are positioned in the box opening area, after the feeding action of the robot feeding and discharging mechanism is completed;
The cover taking mechanism is used for completing cover taking action, namely, after the box opening mechanism completes separation action, the upper cover of the storage box is taken down from the lower storage box;
The silicon chip taking mechanism is used for completing the taking action, namely taking out and conveying the silicon chip in the lower storage box, the upper foam paperboard on the upper surface of the silicon chip and the lower foam paperboard on the lower surface of the silicon chip to the foam paperboard conveying line together after the cover taking mechanism completes the cover taking action;
the cover taking mechanism is also used for completing the cover closing action, namely, after the silicon wafer taking mechanism completes the material taking action, the upper cover of the storage box is put back onto the lower storage box to be closed;
The robot feeding and discharging mechanism is also used for completing the discharging action, namely after the cover taking mechanism completes the cover closing action, the upper cover of the storage box and the lower storage box are conveyed to the storage area;
The paper sucking mechanism is used for completing the action of taking the upper paper plate, namely, after the silicon wafer taking mechanism completes the action of taking the material, the upper foam paper plate is taken down from the silicon wafer and conveyed to the foam paper plate conveying line;
the silicon chip taking mechanism is also used for completing the overturning action, namely after the paper board sucking mechanism completes the action of taking the paper board, the silicon chip and the lower foam paper board are overturned until the lower foam paper board faces upwards;
The paper sucking mechanism is also used for completing the paper sucking action, namely, after the silicon wafer taking mechanism completes the overturning action, the lower foam paper board is taken down from the silicon wafer and conveyed to the foam paper board conveying line;
The silicon wafer clamping jaw mechanism is used for completing the action of loading silicon wafers, namely, after the paperboard sucking mechanism completes the action of taking off the paperboard, the silicon wafers are conveyed from the foam paperboard conveying line to the silicon wafer conveying line;
The silicon wafer stacking visual detection mechanism is used for completing visual detection actions, namely detecting the effects around the stacked silicon wafers after the silicon wafer clamping jaw mechanism completes the actions of loading the silicon wafers, and judging whether the silicon wafers are qualified or not;
The silicon wafer clamping jaw mechanism is also used for completing the silicon wafer unloading action, namely, after the silicon wafer stacking visual detection mechanism completes the visual detection action, the qualified silicon wafer is conveyed to the next procedure.
2. The automatic silicon wafer disassembly and loading machine according to claim 1, wherein the box opening mechanism comprises a first rotary cylinder, a first servo module, a sliding cylinder fixing frame, a sliding cylinder, a blade, a guide piece, a storage box placement plate, a second rotary cylinder, a rotary shaft, a support, a second servo module and a camera, wherein the blade is installed on the sliding cylinder, the sliding cylinder is installed on the first servo module through the sliding cylinder fixing frame, the first servo module is installed on the frame, the guide piece is connected with the storage box placement plate, the storage box placement plate is connected with the second rotary cylinder, the rotary shaft is connected with the storage box placement plate and the support is installed on the second servo module, the first rotary cylinder is connected with the storage box placement plate, and the camera is configured to be capable of detecting a gap between an upper storage box cover and a lower storage box of a storage box to be disassembled, which are located in a box opening area.
3. The automatic silicon wafer disassembly and loading machine according to claim 1, wherein the cover taking mechanism comprises a sucker fixing piece, a vacuum adsorption assembly, a linear bearing, a guide shaft, a support and a hydraulic cylinder, wherein the vacuum adsorption assembly is mounted on the sucker fixing piece, the sucker fixing piece is connected with the linear bearing on the support through the guide shaft, the hydraulic cylinder is mounted on the support, and the support is mounted on the frame.
4. The automatic silicon wafer disassembling and feeding machine according to claim 1, wherein the silicon wafer taking mechanism comprises a gear rack, a motor fixing plate, a module connecting plate, a motor, a third servo module, a first module fixing plate, a guide rail, a clamping jaw, a third rotary cylinder and a first cylinder, wherein the clamping jaw is connected with the guide rail and fixed on the guide rail fixing plate, the guide rail fixing plate is connected with the first module fixing plate, the first module fixing plate is fixed on the third servo module, the third servo module is fixed on the module connecting plate, the motor and the third servo module are fixed on the motor fixing plate, the motor fixing plate is connected with the gear rack, and the gear rack is fixed on the rack.
5. The automatic silicon wafer disassembling and feeding machine according to claim 1, wherein the paper sucking plate mechanism comprises a second air cylinder, a fixing plate, a floating head, a third air cylinder, a sucking disc assembly, a sucking disc fixing piece, an air cylinder fixing piece and a guide rail sliding block, wherein the sucking disc assembly is connected with the sucking disc fixing piece, the sucking disc fixing piece is fixed on the third air cylinder, the third air cylinder is fixed on the air cylinder fixing piece, the air cylinder fixing piece is connected with the guide rail sliding block, the third air cylinder is connected with the floating head and the second air cylinder, the second air cylinder is fixed on the fixing plate, and the fixing plate is fixed on the silicon wafer taking mechanism.
6. The automatic silicon wafer disassembly and loading machine according to claim 1, wherein the foam paperboard conveying line comprises a first positioning bracket, wherein the first positioning bracket is used for receiving silicon wafers and foam paperboards from a silicon wafer taking mechanism;
And/or the silicon wafer conveying line comprises a second positioning bracket, and the second positioning bracket is used for receiving the silicon wafer.
7. The automatic silicon wafer disassembly and loading machine according to claim 6, wherein the silicon wafer clamping jaw mechanism comprises an upper silicon wafer clamping jaw mechanism for conveying the silicon wafer to the second positioning bracket for visual inspection of the silicon wafer stack and a silicon wafer unloading clamping jaw mechanism for grabbing the silicon wafer qualified in visual inspection into the wafer dispenser and entering the next procedure.
8. The automatic silicon wafer disassembly and loading machine according to claim 1, wherein the silicon wafer stacking visual detection mechanism comprises a rotation mechanism, a silicon wafer chamfering detection camera, a camera support and a silicon wafer side detection camera, wherein the rotation mechanism drives a stacked silicon wafer product to rotate on a workbench surface, the silicon wafer chamfering detection camera is mounted on the camera support, the silicon wafer chamfering detection camera is used for detecting whether a chamfer of a silicon wafer has a defect, the silicon wafer side detection camera is mounted on the camera support, and the silicon wafer side detection camera is used for detecting whether a side of the silicon wafer has the defect.
9. The automatic silicon wafer disassembly and loading machine according to claim 8, wherein the silicon wafer chamfer angle detection cameras are arranged on the camera support symmetrically and comprise two sets;
And/or the two sets of silicon wafer side face detection cameras and the two sets of camera supports are symmetrically arranged above the silicon wafer conveying line.
10. The automatic silicon wafer disassembling and loading machine according to claim 8, wherein the rotation angle of the rotation mechanism is 0-90 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422648592.XU CN223356126U (en) | 2024-10-31 | 2024-10-31 | Automatic silicon wafer unpacking and loading machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422648592.XU CN223356126U (en) | 2024-10-31 | 2024-10-31 | Automatic silicon wafer unpacking and loading machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223356126U true CN223356126U (en) | 2025-09-19 |
Family
ID=97034857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202422648592.XU Active CN223356126U (en) | 2024-10-31 | 2024-10-31 | Automatic silicon wafer unpacking and loading machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223356126U (en) |
-
2024
- 2024-10-31 CN CN202422648592.XU patent/CN223356126U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108820408B (en) | Film tearing machine | |
| CN111139523A (en) | Intelligent single-polycrystalline silicon rod inspection, preparation and adhesion system | |
| CN117393835B (en) | Battery cover plate assembly production line and working method thereof | |
| CN113314445B (en) | COB automatic assembly equipment | |
| CN115157702A (en) | A kit assembly equipment | |
| CN118083289B (en) | Automatic packaging machine for battery piece | |
| CN111302064B (en) | Precision feeding device for laser scribing machine | |
| CN115890928A (en) | An automated production process for stably cutting and breaking glass on both sides | |
| CN115401325A (en) | A multi-threaded airflow sensor automatic welding equipment | |
| CN117564005B (en) | Full-automatic RING cleaning machine and working method | |
| CN118952005A (en) | A dual-axis grinding wheel dicing machine with automatic loading and unloading | |
| CN223356126U (en) | Automatic silicon wafer unpacking and loading machine | |
| CN114178628B (en) | A kind of quick modification method of automatic dicing machine | |
| CN113414122B (en) | Flexible screen double-sided 3D inspection equipment | |
| CN116315319A (en) | Automatic packaging machine compatible with cylindrical battery cell and square battery cell | |
| CN120991774A (en) | Six-sided coplanar inspection integrated tape and reel machine and its inspection method | |
| CN120716166A (en) | An automatic film laminating machine for LCD screen IC | |
| CN119408818A (en) | Automatic wafer unpacking and loading machine | |
| CN114043796A (en) | Full-automatic laminating machine | |
| CN209634811U (en) | A kind of mounted box equipment of unpacking automatically | |
| CN115172889B (en) | Lithium battery dispensing packaging equipment capable of realizing single-folded edge or double-folded edge | |
| CN107403946A (en) | A kind of method and system of the storage battery pole piece auto plate separation based on robot | |
| CN215940682U (en) | Automatic microscopic examination system for chip electrolytic capacitor | |
| CN116441637A (en) | Aluminum strip cutting and testing equipment | |
| CN116038152A (en) | A laser cutting system for flexible screens |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |