CN223348561U - Inverter main board heat radiation structure and inverter - Google Patents
Inverter main board heat radiation structure and inverterInfo
- Publication number
- CN223348561U CN223348561U CN202422385780.8U CN202422385780U CN223348561U CN 223348561 U CN223348561 U CN 223348561U CN 202422385780 U CN202422385780 U CN 202422385780U CN 223348561 U CN223348561 U CN 223348561U
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- Prior art keywords
- inverter
- heat dissipation
- main board
- radiating
- mainboard
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Abstract
The utility model discloses an inverter main board radiating structure and an inverter, wherein the inverter comprises an inverter main board, two semiconductor device modules and a transformer inverter main board radiating structure, the inverter comprises a plurality of radiating fins and radiating fans, the first radiating fins are arranged on one end of the inverter main board in parallel, the first radiating fans are arranged on one side of the inverter main board and the blowing direction of the first radiating fins is parallel to the plane where the first radiating fins and the inverter main board are located, the second radiating fins are arranged on the other end of the inverter main board in parallel, the second radiating fans are arranged on the other side of the inverter main board and the blowing direction of the second radiating fins is parallel to the plane where the first radiating fins and the inverter main board are located, and the second radiating fins are perpendicular to the first radiating fins. The utility model can obtain larger air contact area, the copper sheet can be used as a heat dissipation circuit and a conductive circuit, the insulation requirement of the original aluminum heat dissipation strip structure can be omitted, a large number of insulation heat conduction silica gel pads and screw insulation pads are saved, and the heat conduction efficiency is improved.
Description
Technical Field
The utility model relates to an inverter main board heat dissipation structure and an inverter.
Background
An inverter is a power electronic device that converts Direct Current (DC) into Alternating Current (AC). It is widely applied to the fields of solar power generation, wind power generation, electric vehicles and the like. The main functions of the inverter include converting direct current generated by the solar panel into alternating current which can be directly used by household and industrial equipment, the inverter can adjust output voltage to meet the requirements of the equipment, the high-quality inverter can provide stable sine wave current, damage to electric appliances is reduced, the running efficiency of the equipment is improved, and many modern inverters are provided with monitoring systems which can monitor parameters such as power generation efficiency, current and voltage in real time.
There are many kinds of inverters, including photovoltaic inverters, vehicle-mounted inverters, centralized and distributed inverters for power systems, and the like.
In the prior art, an inverter generally adopts aluminum cooling fins, the aluminum cooling fins are generally drilled after being cut by using a stretched aluminum profile, the aluminum cooling fins cannot be randomly processed in production, and a large circuit board space is required to be occupied.
Disclosure of utility model
The utility model aims to overcome the defects that the radiating structure of the inverter cannot be processed and adjusted at will and occupies a larger circuit board space in the production of the radiating structure of the inverter in the prior art, and provides the radiating structure of the main board of the inverter and the inverter, which provide a larger air contact area, are convenient to produce and improve the heat conduction efficiency.
The utility model solves the technical problems by the following technical scheme:
An inverter main board heat dissipation structure is used for an inverter, the inverter comprises an inverter main board, two semiconductor device modules and a transformer, and is characterized in that the inverter main board heat dissipation structure comprises a plurality of heat dissipation fins and a plurality of heat dissipation fans,
The semiconductor devices in the first semiconductor device module are evenly distributed on the first radiating fins, the first radiating fins are arranged on one end of the inverter main board in parallel, the first radiating fan is arranged on one side of the inverter main board, and the blowing direction of the first radiating fan is parallel to the planes of the first radiating fins and the inverter main board;
the semiconductor devices in the second semiconductor device module are evenly distributed on the second radiating fins, the second radiating fins are arranged on the other end of the inverter main board in parallel, the second radiating fan is arranged on the other side of the inverter main board, the blowing direction of the second radiating fan is parallel to the planes of the first radiating fins and the inverter main board, and the second radiating fins are perpendicular to the first radiating fins.
Preferably, the transformer is disposed between two semiconductor device modules.
Preferably, the number of the radiating copper sheets is 4, the 4 radiating copper sheets are installed on one end of the main board of the inverter in parallel, the two radiating copper sheets on the outer side are aligned, the two radiating copper sheets on the inner side are aligned, and 3 or 4 semiconductor devices are arranged on each radiating copper sheet.
Preferably, copper sheet connecting bridges are connected between the 2 inner radiating copper sheets, and three capacitance devices are arranged between the 2 inner radiating copper sheets.
Preferably, the semiconductor device of the low-voltage region is an IGBT tube, and the semiconductor device of the high-voltage region is a mos tube.
Preferably, the second cooling fins are aluminum alloy cooling fins, 2 third cooling fans are arranged at the tops of the 2 second cooling fins, and the blowing direction of the third cooling fans is perpendicular to the plane where the inverter main board is located.
Preferably, the second cooling fins are aluminum alloy cooling fins, one side of the 2 second cooling fins is provided with 1 third cooling fan, and the blowing direction of the third cooling fan is parallel to the plane of the main board of the inverter.
Preferably, the third cooling fan is disposed at a side close to the edge of the main board of the inverter.
Preferably, the number of the second heat dissipation fans is two, the blowing direction of the first heat dissipation fan is the direction from the outside to the inside of the inverter main board, and the blowing direction of the second heat dissipation fan is the direction from the inside to the outside of the inverter main board.
The utility model also provides an inverter which is characterized by comprising the inverter main board heat dissipation structure.
On the basis of conforming to the common knowledge in the field, the above preferred conditions can be arbitrarily combined to obtain the preferred examples of the utility model.
The utility model has the positive progress effects that:
The copper sheet is used as a heat conduction and radiation main body, and is welded with a bonding pad on the circuit board, so that the copper sheet is used as an IGBT and circuit board radiating fin and also used as a part of a circuit system to participate in electric conduction. And the copper sheet has a large thickness and a current carrying capacity stronger than that of the copper foil on the circuit board.
The structure is different from the traditional aluminum radiating fin, and the aluminum radiating fin is generally drilled after being cut by using a stretched aluminum profile, so that the aluminum radiating fin has the advantage of obtaining a relatively large air contact area. However, aluminum has a lower heat conductivity than copper, and at the same time, the shape cannot be processed at will, and a larger circuit board space is required.
After the copper sheet is used as a heat dissipation circuit and a conductive circuit, the insulation requirement of the original aluminum heat dissipation strip structure can be omitted, a large number of insulation heat conduction silica gel pads and screw insulation pads are saved, and the heat conduction efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation structure of an inverter motherboard according to embodiment 1 of the present utility model.
Fig. 2 is a schematic diagram illustrating the effect of the heat dissipation structure of the main board of the inverter according to embodiment 1 of the present utility model.
Detailed Description
The utility model is further illustrated by means of the following examples, which are not intended to limit the scope of the utility model.
Example 1
In the present embodiment, the positional or positional relationship indicated by the terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Referring to fig. 1 to 2, the present embodiment provides a heat dissipation structure of an inverter motherboard for a high-power inverter, the inverter including an inverter motherboard 11, two semiconductor device modules 12, and a transformer 13.
The inverter main board heat dissipation structure comprises a plurality of radiating fins and a plurality of radiating fans.
The semiconductor devices 121 in the first semiconductor device module are evenly distributed on the first heat sink.
The first cooling fins 14 are arranged on one end of the inverter main board in parallel, the first cooling fan 16 is arranged on one side of the inverter main board, and the blowing direction is parallel to the planes of the first cooling fins and the inverter main board;
The semiconductor devices 121 in the second semiconductor device module are evenly distributed on the second cooling fins, the second cooling fins 15 are installed on the other end of the inverter main board in parallel, the second cooling fan 17 is installed on the other side of the inverter main board, and the blowing direction is parallel to the planes of the first cooling fins and the inverter main board.
The second heat sink is perpendicular to the first heat sink.
The first radiating fins and the second radiating fins are T-shaped, so that air can circulate, and the using space of the main board of the inverter can be saved, referring to the red arrow direction of fig. 2.
The transformer 13 is provided between two semiconductor device modules.
The number of the radiating copper sheets is 4, and the 4 radiating copper sheets are parallelly arranged at one end of the main board of the inverter.
The two heat dissipation copper sheets on the outer side are aligned, the two heat dissipation copper sheets on the inner side are aligned, and each heat dissipation copper sheet is provided with 3 or 4 semiconductor devices, and the number of the heat dissipation copper sheets is 4 in the embodiment.
And three capacitance devices 19 are arranged between the 2 inner radiating copper sheets and the connecting bridge 18 of the copper sheets.
The semiconductor device of the low voltage region is an IGBT tube, and the semiconductor device of the high voltage region is a mos tube.
The second cooling fins are aluminum alloy cooling fins, 2 third cooling fans 20 are arranged at the tops of the 2 second cooling fins, and the blowing direction of each third cooling fan 20 is perpendicular to the plane of the main board of the inverter.
The number of the second cooling fans is two, the blowing direction of the first cooling fan is the direction from the outside to the inside of the main board of the inverter, and the blowing direction of the second cooling fan is the direction from the inside to the outside of the main board of the inverter.
Example 2
This embodiment is substantially the same as embodiment 1, except that:
The second radiating fins are aluminum alloy radiating fins, 1 third radiating fan is arranged on one side of the 2 second radiating fins, and the blowing direction of the third radiating fan is parallel to the plane where the inverter main board is located.
The third cooling fan is arranged on one side close to the edge of the main board of the inverter.
While specific embodiments of the utility model have been described above, it will be appreciated by those skilled in the art that these are by way of example only, and the scope of the utility model is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the principles and spirit of the utility model, but such changes and modifications fall within the scope of the utility model.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422385780.8U CN223348561U (en) | 2024-09-29 | 2024-09-29 | Inverter main board heat radiation structure and inverter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422385780.8U CN223348561U (en) | 2024-09-29 | 2024-09-29 | Inverter main board heat radiation structure and inverter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223348561U true CN223348561U (en) | 2025-09-16 |
Family
ID=97023845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202422385780.8U Active CN223348561U (en) | 2024-09-29 | 2024-09-29 | Inverter main board heat radiation structure and inverter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223348561U (en) |
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2024
- 2024-09-29 CN CN202422385780.8U patent/CN223348561U/en active Active
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