CN223348171U - High-efficient radiating laser emitter - Google Patents

Abstract

The utility model discloses a laser emitter with high heat dissipation efficiency, comprising a laser emitter body and a PCB board. Components are mounted on one side of the PCB board, and a water-cooled heat pipe is provided on the other side of the PCB board. The water-cooled heat pipe is provided with a plurality of U-shaped bends. The PCB board is provided with a plurality of heat dissipation holes, and metal heat dissipation columns are provided on the heat dissipation holes. The U-shaped bends of the water-cooled heat pipe are wound around the metal heat dissipation columns. This heat dissipation device can dissipate heat in a timely manner, improve the heat dissipation effect of the laser emitter, and effectively extend the service life of the laser.

Description

High-efficient radiating laser emitter

Technical Field

The utility model relates to the technical field of heat dissipation, in particular to a laser emitter capable of efficiently dissipating heat.

Background

With the continuous improvement of the performance of electronic devices, the heat productivity of the electronic devices is increased, and the heat dissipation problem becomes one of the key factors affecting the stability and the service life of the electronic devices.

In practical application, the laser has a smaller overall mechanism volume, so that a traditional radiator cannot be normally installed. Therefore, in practical application, the laser cannot normally and rapidly dissipate heat, so that the application power of the laser is very low, if the laser with high power is practically used, the laser can be limited to be used for a long time, the working state cannot be maintained for a long time, and if the laser cannot be used for a long time, the service life of the laser can be greatly reduced.

Disclosure of utility model

Aiming at the defects of the prior art, the utility model provides the laser transmitter with high-efficiency heat dissipation, which not only can timely dissipate heat, but also has good heat dissipation effect.

In order to solve the technical problems, the technical scheme of the utility model is as follows:

The utility model provides a high-efficient radiating laser emitter, includes laser emission main part and PCB board, components and parts are installed to one side of PCB board, the opposite side of PCB board is provided with the water cooling tube, be provided with a plurality of U type bend on the water cooling tube, be provided with a plurality of louvres on the PCB board, be provided with the metal heat dissipation post on the louvre, the U type bend round joint of water cooling tube is on the metal heat dissipation post.

According to the technical scheme, the metal heat radiation columns arranged on the heat radiation holes are in contact with the water-cooling heat radiation pipes, so that heat generated by the electric element can be quickly conducted to the surface of the heat radiator, and the heat is radiated in a water flow circulation and air convection or radiation mode.

Preferably, the water-cooling radiating pipe has a flat structure.

Among the above-mentioned technical scheme, the water-cooling tube is a U-shaped tubular profile that forms after flattening by the tubular metal resonator (inside has rivers to pass through), and wherein the setting of platykurtic structure not only is convenient for install on the PCB board to the area of contact with the PCB board is bigger, can effectively improve radiating efficiency.

Preferably, the U-shaped curve has a smooth arc structure.

In the above technical scheme, the inside of the water-cooling radiating pipe is provided with a plurality of bends, so that the radiating structure extends transversely and forms a plurality of radiating surfaces. The curve is preferably a smooth transition to reduce water flow resistance and improve heat dissipation efficiency.

Preferably, the thickness of the water-cooling radiating pipe is 1mm. Can be effectively arranged on the equipment with smaller volume of the PCB.

Preferably, a heat conducting layer is arranged between the bottom side of the water-cooling radiating pipe and the PCB.

In the above technical scheme, the bottom of the water-cooling radiating pipe is provided with the heat conducting layer so as to improve the heat transfer efficiency between the radiating structure and the heating element of the electronic equipment.

Preferably, the water-cooled radiating pipe is made of copper.

In the technical scheme, the copper sheet is used as the main body material of the radiator, and because the copper has excellent heat conduction performance, the heat generated by the electric element can be quickly conducted to the surface of the radiator and emitted in a water flow circulation and air convection or radiation mode.

Preferably, the heat conducting layer is any one of heat conducting silicone grease and heat conducting adhesive tape.

Preferably, the U-shaped bend on the water-cooling radiating pipe is configured according to the pin layout of the electric elements on the PCB.

In the technical scheme, the number of the curves on the two side arms of the U-shaped curve can be adjusted according to actual demands, and the heat dissipation area can be increased by winding N curves, so that the heat dissipation efficiency is improved. Meanwhile, the size and the shape of the curve can be optimally designed to adapt to the heat dissipation requirements of different electronic devices.

The utility model has the following characteristics and beneficial effects:

By adopting the technical scheme, the laser can be suitable for the PCB of the laser, heat dissipation can be timely completed, the laser can be kept in a working state for a long time, and the laser can be in a high-power state for a long time, so that the service life of the laser is effectively prolonged while the actual application requirements are met.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.

Fig. 1 is a schematic perspective view of an embodiment of the present utility model.

Fig. 2 is a schematic perspective view of an embodiment of the present utility model.

Fig. 3 is a schematic perspective view of a second embodiment of the present utility model.

In the figure, a 1-PCB board, a 2-water cooling radiating pipe and a 3-metal radiating column.

Detailed Description

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.

The utility model provides a laser emitter capable of efficiently radiating, which comprises a laser emitting main body and a PCB (printed circuit board) 1, wherein components are arranged on one side of the PCB 1, a water cooling radiating pipe 2 is arranged on the other side of the PCB, and a plurality of U-shaped curved channels are arranged on the water cooling radiating pipe 2, wherein the U-shaped curved channels are of smooth arc structures. So that the heat dissipation structure extends in the lateral direction and forms a plurality of heat dissipation surfaces. The curve is preferably a smooth transition to reduce water flow resistance and improve heat dissipation efficiency.

Further setting of this embodiment, be provided with a plurality of louvres on the PCB board 1, be provided with metal heat dissipation post 3 on the louvre, the U type bend wiring of water-cooling tube is on metal heat dissipation post 3.

It can be understood that the metal heat dissipation post 3 is in direct contact with the water-cooling heat dissipation tube 2, and the metal heat dissipation post 3 is welded in the heat dissipation hole on the PCB board, so that heat collection can be timely and rapidly carried out, and heat generated by the electric element can be rapidly conducted to the surface of the heat radiator and dissipated in a water flow circulation and air convection or radiation mode.

Further, the water-cooling radiating pipe 2 is a U-shaped tubular outline formed by flattening a metal pipe (water flows through the inside), and the arrangement of the flat structure is convenient to install on the PCB, and the contact area with the PCB is larger, so that the radiating efficiency can be effectively improved.

Wherein, the water cooling tube is made of copper. The copper sheet is used as the main material of the radiator, and because the copper has excellent heat conducting property, the heat generated by the electric element can be quickly conducted to the surface of the radiator and is emitted in a water flow circulation and air convection or radiation mode.

It can be understood that the surface of the PCB board is smooth, so that the installation is more convenient through the arrangement of the flat structure, the contact area between the water cooling radiating pipe 2 and the PCB board is larger, and the radiating efficiency can be effectively improved.

Further, in this embodiment, the thickness of the water-cooled radiating pipe is 1mm. Can effectually install on this kind of less equipment of volume of PCB board to do not influence the structure of PCB board on the whole, consequently also can not influence the encapsulation of PCB board.

Further, a heat conducting layer is arranged between the bottom side of the water-cooling radiating pipe and the PCB. The heat conduction layer adopts any one of heat conduction silicone grease and heat conduction adhesive tape.

It can be understood that the heat conduction silicone grease and the heat conduction adhesive tape can be used for installing the water cooling radiating pipe 2 as a heat conduction layer, and can also play an insulating effect, so that the water cooling radiating pipe 2 made of metal materials is prevented from being contacted with pins of components and parts, and the normal operation of the PCB is ensured.

Further, a heat conducting layer is arranged at the bottom of the water-cooling radiating pipe so as to improve the heat transfer efficiency between the radiating structure and the heating element of the electronic equipment.

In a further arrangement of this embodiment, the U-shaped bend on the water-cooled radiating pipe is configured according to a pin layout of the electrical components on the PCB board.

In the technical scheme, the number of the curves on the two side arms of the U-shaped curve can be adjusted according to actual demands, and the heat dissipation area can be increased by winding N curves, so that the heat dissipation efficiency is improved. Meanwhile, the size and the shape of the curve can be optimally designed to adapt to the heat dissipation requirements of different electronic devices.

It can be understood that when the U-shaped bend is configured, in order to avoid the contact between the water cooling tube and the pins of the components and parts and influence the normal operation of the PCB, the U-shaped bend needs to be configured according to actual conditions.

The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings, but the present utility model is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments, including the components, without departing from the principles and spirit of the utility model, yet fall within the scope of the utility model.

Claims (8)

1. A laser emitter with high heat dissipation efficiency, comprising a laser emitting body and a PCB board, wherein components are mounted on one side of the PCB board. The invention is characterized in that a water-cooled heat pipe is provided on the other side of the PCB board, the water-cooled heat pipe is provided with a plurality of U-shaped bends, the PCB board is provided with a plurality of heat dissipation holes, the heat dissipation holes are provided with metal heat dissipation columns, and the U-shaped bends of the water-cooled heat pipe are wrapped around the metal heat dissipation columns. 2. The laser transmitter with high heat dissipation efficiency according to claim 1, wherein the water-cooled heat dissipation pipe has a flat structure. 3. The laser emitter with high heat dissipation efficiency according to claim 1, wherein the U-shaped bend is a smooth arc structure. 4. The laser transmitter with high heat dissipation efficiency according to claim 2, wherein the thickness of the water-cooled heat dissipation pipe is 1 mm. 5. The laser transmitter with high heat dissipation efficiency according to claim 1, wherein a heat conducting layer is provided between the bottom side of the water-cooled heat pipe and the PCB board. 6. The laser transmitter with high heat dissipation efficiency according to claim 1, wherein the water-cooled heat pipe is made of copper. 7. The laser emitter with high heat dissipation efficiency according to claim 5, wherein the heat-conducting layer is made of any one of thermal grease and thermal tape. 8. A laser transmitter with high heat dissipation efficiency according to any one of claims 1 to 7, characterized in that the U-shaped bend on the water-cooled heat pipe is configured according to the pin layout of the electrical components on the PCB board.