CN223333766U - An adaptive wafer ingot transfer robot - Google Patents

Abstract

The utility model relates to the technical field of semiconductor material processing equipment, in particular to a self-adaptive wafer ingot transferring manipulator which comprises a base and a bracket, wherein the base and the bracket are used for integrally and fixedly supporting, the bracket is of a C-shaped structure and is fixedly arranged on the base, a plurality of groups of vacuum chucks are uniformly arranged at the bottom of the base and are connected with external vacuum equipment through pipelines, rotatable guide rods are arranged in the base, close to four corners, in a penetrating manner through shaft seats, and the lower ends of the guide rods are fixedly provided with rotary handles of a horizontal structure. According to the utility model, the load capacity of the manipulator is improved through the plurality of groups of vacuum chucks, wafers with different diameter sizes can be adsorbed and transported, the application range is improved, and meanwhile, the guide rods can be adjusted in an up-and-down movement manner, so that the manipulator can adapt to the transportation requirements of crystal ingots with different thickness, and can cope with wafers or crystal ingots with various sizes without replacement, and the flexibility and convenience of use are greatly improved.

Description

Self-adaptive wafer ingot transferring manipulator

Technical Field

The utility model relates to the technical field of semiconductor material processing equipment, in particular to a self-adaptive wafer ingot transferring manipulator which is used for automatically, accurately and safely transferring wafers or ingots with different sizes and weights in the semiconductor production process.

Background

A wafer refers to a substrate (also called a base) from which semiconductor transistors or integrated circuits are fabricated. Being crystalline material, it is also commonly referred to as a wafer because of its generally circular shape. Structures fabricated as various circuit elements can be fabricated on wafers (e.g., silicon wafers) to form integrated circuit products having specific electrical functions. During wafer processing, a transfer robot is required to move the wafer into the processing tool.

There are a number of limitations to the wafer transfer robots currently available in the market. First, they are generally only suitable for one custom sized wafer and have a small load carrying capacity. When the size of the wafer to be transferred or grasped changes, the corresponding manipulator often needs to be replaced, which greatly limits the flexibility and convenience of use. Second, existing manipulators are not capable of efficiently transporting or gripping larger size ingots, and are not adaptable for larger size ingots because the ingots are typically heavy (typically on the order of 1-10 kg) and thick, while the loading capacity of existing manipulators in the market is generally no more than 1kg (except for special customization). In addition, the existing manipulator is lack of a wafer falling protection device, and if the sucker fails in the transferring process, serious loss is caused by wafer falling.

Disclosure of utility model

Aiming at the defects in the prior art, the utility model provides a self-adaptive wafer ingot transferring manipulator which solves the problems in the background art.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

The utility model provides a self-adaptation formula wafer ingot transportation manipulator, includes base and the support that is used for whole fixed stay, the support is for C shape structure and sets firmly on the base, multiunit vacuum chuck is evenly installed to the base bottom, just vacuum chuck is connected with outside vacuum equipment through the pipeline, inside four corners that are close to of base all run through the axle bed and install rotatable guide arm, the rotatory hand that holds in the palm of horizontal structure has been set firmly to the guide arm lower extreme, be equipped with rotatable worm wheel through the bearing on the guide arm, the worm wheel upside is equipped with the second band pulley with it an organic whole, the second band pulley upside is equipped with first band pulley, multiunit connect through first belt drive between the first band pulley, multiunit connect through second belt drive between the second band pulley, the base rear side is equipped with servo motor, install the worm on the servo motor output, just worm and one of them a set of meshing drive connection, servo motor jar output installation fixed block, fixed block and first band pulley fixed connection.

Further, the upper side of the bracket is covered with a shell, and the shell is detachably connected with the bracket through a screw.

Further, an external flange for connecting with external equipment is arranged at the top of the shell.

Further, external threads are carved on the ring surface of the guide rod, and the second belt wheel and the worm wheel are rotationally connected with the guide rod through threads.

Further, a clamping block is fixedly arranged in the first belt wheel, a limiting chute matched with the clamping block is formed in the guide rod, and the clamping block is clamped into the limiting chute and is in sliding connection with the limiting chute.

Further, a thickness measuring sensor for measuring the thickness of the ingot is embedded on the right side surface of the bracket.

Further, a layer of buffer protection pad is stuck on the upper surface of the rotary support.

Compared with the prior art, the utility model has the following beneficial effects:

1. According to the utility model, the load capacity of the manipulator is improved through the plurality of groups of vacuum chucks, wafers with different diameter sizes can be adsorbed and transported, the application range is improved, and meanwhile, the guide rods can be adjusted in an up-and-down movement manner, so that the manipulator can adapt to the transportation requirements of crystal ingots with different thickness, and can cope with wafers or crystal ingots with various sizes without replacement, and the flexibility and convenience of use are greatly improved.

2. According to the utility model, the thickness of the ingot can be measured in real time through the thickness measuring sensor, accurate thickness data are provided for the mechanical arm, so that the mechanical arm can adjust the telescopic moving distance of the guide rod according to the thickness of the ingot, and the stability and safety of the ingot in the transferring process are ensured.

3. According to the utility model, the rotatable guide rod and the rotary handle can support the wafer or the crystal ingot from the bottom, so that the anti-falling protection of the wafer or the crystal ingot is realized, the buffer protection pad stuck on the upper surface of the rotary handle can absorb and disperse impact force, the wafer or the crystal ingot is prevented from being damaged in the transferring process, scratches and damages caused by collision or friction of the wafer or the crystal ingot are prevented, meanwhile, the buffer protection pad can increase the friction force between the rotary handle and the wafer or the crystal ingot, and the wafer or the crystal ingot is prevented from sliding or falling in the transferring process, so that the transferring stability is improved.

Drawings

Fig. 1 is a schematic diagram of the overall structure of the present utility model.

Fig. 2 is a schematic view of the bottom structure of the present utility model.

Fig. 3 is a schematic view of the internal structure of the housing according to the present utility model.

Fig. 4 is a schematic view of another angle structure of the inside of the housing according to the present utility model.

Fig. 5 is a schematic view of a partial structure of the present utility model.

Fig. 6 is a partially disassembled structure of the present utility model.

Fig. 7 is a schematic view of the usage state of the present utility model.

In the figure, 1, an external flange; 2, a shell, 3, a guide rod, 31, a limiting chute, 4, a rotary hand holder, 5, a vacuum chuck, 6, a shaft seat, 7, a bracket, 8, a first belt, 9, a second belt, 10, a worm wheel, 11, a thickness measuring sensor, 12, a worm, 13, a servo motor, 14, a fixed block, 15, a servo cylinder, 16, a base, 17, a first belt wheel, 171, a clamping block, 18, a second belt wheel, 19 and external threads.

Detailed Description

The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples:

As shown in fig. 1 to 7, an adaptive wafer ingot transferring manipulator comprises a base 16 and a bracket 7 for integrally fixing and supporting, wherein the bracket 7 is of a C-shaped structure and is fixedly arranged on the base 16, the stable combination of the base 16 and the C-shaped bracket 7 provides integral support for the manipulator, the stability in the transferring process is ensured, a plurality of groups of vacuum chucks 5 are uniformly arranged at the bottom of the base 16, the vacuum chucks 5 are connected with external vacuum equipment through pipelines, the vacuum chucks 5 are controlled by the external vacuum equipment, a wafer or an ingot can be firmly adsorbed, rotatable guide rods 3 are arranged in the base 16 near four corners in a penetrating way through shaft seats 6, a rotary supporting hand 4 of a horizontal structure is fixedly arranged at the lower end of the guide rods 3, the wafer or the ingot can be supported from the bottom through the rotatable guide rods 3 and the rotary supporting hand 4, the anti-drop protection of a wafer or an ingot is realized, a rotatable worm wheel 10 is assembled on a guide rod 3 through a bearing, a second belt wheel 18 integrated with the worm wheel 10 is arranged on the upper side of the worm wheel 10, a first belt wheel 17 is arranged on the upper side of the second belt wheel 18, a plurality of groups of first belt wheels 17 are in transmission connection through a first belt 8, a plurality of groups of second belt wheels 18 are in transmission connection through a second belt 9, a servo motor 13 is assembled on the rear side of a base 16, a worm 12 is installed at the output end of the servo motor 13, the worm 12 is in meshed transmission connection with one group of worm wheels 10, a servo cylinder 15 is fixedly arranged at the left side inside a bracket 7, a fixed block 14 is fixedly connected with the first belt wheel 17, the worm wheel 10, the worm 12, the second belt wheel 18 and a belt transmission system are combined, so that the servo motor 13 can drive a plurality of guide rods 3 to synchronously move up and down, thereby adapting to ingots with different thicknesses.

In this embodiment, the cover of support 7 upside is equipped with casing 2, and casing 2 can shelter from inside transmission system and the key parts of manipulator through screw and support 7 detachable connection, and outside dust, impurity etc. are prevented to get into inside the manipulator, cause interference or damage to the normal operating of manipulator, and in the manipulator work process, casing 2 can also play certain safety protection effect, prevent that operating personnel from touching the inside moving part of manipulator by mistake to avoid the emergence of incident.

In this embodiment, the casing 2 top is equipped with and is used for the external flange 1 of being connected with external equipment, and external flange 1 is as the bridge between manipulator and the external equipment for the manipulator can be easily connected with external equipment such as automated production line, transfer robot, etc. thereby realizes more efficient material transportation and flow automation.

In this embodiment, the ring surface of the guide rod 3 is carved with external threads 19, the second belt pulley 18 and the worm wheel 10 are rotationally connected with the guide rod 3 through threads, and the rotational movement of the second belt pulley 18 can be converted into the linear movement of the guide rod 3 through the threaded connection, so that the guide rod 3 is controlled to move up and down to adapt to ingots with different thicknesses.

In this embodiment, the fixture block 171 is fixed inside the first belt wheel 17, the limit chute 31 adapted to the fixture block 171 is provided inside the guide rod 3, the fixture block 171 is clamped into the limit chute 31 and is in sliding connection with the limit chute 31, the connection between the first belt wheel 17 and the guide rod 3 is realized through the fixture block 171 and the limit chute 31, when the first belt wheel 17 rotates, the guide rod 3 is driven to rotate through the fixture block 171, and then the angle position of the rotary supporting hand 4 at the bottom of the guide rod 3 is adjusted, so that the support to the wafer ingot is realized, and the guide rod 3 can keep relatively stable with the first belt wheel 17 and can move up and down simultaneously, so that flexible transmission and adjustment are realized.

In this embodiment, the thickness measuring sensor 11 for measuring the thickness of the ingot is embedded on the right side surface of the bracket 7, and the thickness of the ingot can be measured in real time by the manipulator when the ingot is grabbed and transported by the thickness measuring sensor 11, so that the telescopic moving distance of the guide rod 3 can be adjusted according to the thickness of the ingot, and the stability and the safety of the ingot in the transportation process can be ensured.

In this embodiment, a layer of buffer protection pad is stuck on the upper surface of the rotary handle 4, and the buffer protection pad has the main function of protecting the wafer or the ingot from being damaged in the transferring process, and can absorb and disperse impact force when the manipulator grabs and places the wafer or the ingot, so as to prevent the wafer or the ingot from generating the problems of scratch, breakage and the like due to collision or friction, and meanwhile, the buffer protection pad can increase the friction force between the rotary handle 4 and the wafer or the ingot, so as to prevent the wafer or the ingot from sliding or falling in the transferring process, thereby improving the transferring stability.

The working principle of the self-adaptive wafer ingot transferring manipulator is that the manipulator is connected to external transferring equipment through an external flange 1 in actual use, when a wafer is grabbed, the manipulator moves to the upper side of the wafer through the external transferring equipment, the vacuum chuck 5 is enabled to be in contact with the wafer, the wafer is adsorbed through the vacuum chuck 5, then the manipulator is controlled to move upwards to grab the wafer, at the moment, a servo cylinder 15 is driven to move a fixed block 14, the fixed block 14 drives a first belt pulley 17 to move a certain distance, the first belt pulley 17 is driven to rotate by a certain angle, a guide rod 3 and a rotary supporting hand 4 on the guide rod 3 are driven to rotate through rotation of the first belt pulley 17, the rotary supporting hand 4 is supported from the bottom of the wafer, when the ingot is grabbed, feedback is provided for a control system through real-time measurement of the thickness of the ingot through a thickness measuring sensor 11, and a servo motor 13 is started to drive the guide rod 3 to move up and down through a worm 12, a worm 10, a second belt pulley 18 and the like, so that the thickness of the ingot is adapted to the worm wheel.

In summary, this self-adaptation formula wafer crystal ingot transport manipulator has improved the load capacity of manipulator through the multiunit vacuum chuck 5 that set up, can adsorb the wafer of transporting different diameter sizes, has improved application scope, and the guide arm 3 that sets up simultaneously can carry out the reciprocates and adjust, can adapt to the transportation demand of different thickness crystal ingots for the manipulator need not to change and can handle wafer or the crystal ingot of multiple size, has improved flexibility and the convenience of use greatly, has realized the nimble high-efficient transportation to wafer or the crystal ingot of different sizes and thickness.

It should be understood that the foregoing examples of the present utility model are merely illustrative of the present utility model and not limiting of the embodiments of the present utility model, and that various other changes and modifications can be made by those skilled in the art based on the above description, and it is not intended to be exhaustive of all of the embodiments, and all obvious changes and modifications that come within the scope of the utility model are defined by the following claims.

Claims (7)

1. An adaptive wafer ingot transfer robot, characterized in that: it includes a base (16) and a bracket (7) for overall fixed support, the bracket (7) is set as a C-shaped structure and is fixed on the base (16), a plurality of groups of vacuum suction cups (5) are evenly installed on the bottom of the base (16), and the vacuum suction cups (5) are connected to external vacuum equipment through pipelines, a rotatable guide rod (3) is installed through the shaft seat (6) near the four corners of the base (16), the lower end of the guide rod (3) is fixed with a rotating support (4) of a horizontal structure, a rotatable worm gear (10) is assembled on the guide rod (3) through a bearing, and the upper side of the worm gear (10) is provided with an integral A second pulley (18) is provided on the upper side of the second pulley (18), a first pulley (17) is provided on the upper side of the second pulley (18), multiple groups of the first pulleys (17) are connected to each other through a first belt (8), and multiple groups of the second pulleys (18) are connected to each other through a second belt (9), a servo motor (13) is assembled on the rear side of the base (16), a worm (12) is mounted on the output end of the servo motor (13), and the worm (12) is meshed and connected to one group of worm wheels (10), a servo electric cylinder (15) is fixed on the left side inside the bracket (7), a fixed block (14) is mounted on the output end of the servo electric cylinder (15), and the fixed block (14) is fixedly connected to the first pulley (17). 2. The adaptive wafer ingot transfer robot according to claim 1 is characterized in that a shell (2) is provided on the upper side cover of the bracket (7), and the shell (2) is detachably connected to the bracket (7) by screws. 3. The adaptive wafer and ingot transfer robot according to claim 2 is characterized in that an external flange (1) for connecting to external equipment is provided on the top of the shell (2). 4. The adaptive wafer ingot transfer robot according to claim 1 is characterized in that an external thread (19) is engraved on the annular surface of the guide rod (3), and the second pulley (18) and the worm gear (10) are rotatably connected to the guide rod (3) through the thread. 5. The adaptive wafer ingot transfer robot according to claim 1 is characterized in that: a clamping block (171) is fixedly provided inside the first pulley (17), and a limiting slide groove (31) adapted to the clamping block (171) is opened inside the guide rod (3), and the clamping block (171) is clamped into the limiting slide groove (31) and slidably connected thereto. 6. The adaptive wafer ingot transfer robot according to claim 1, characterized in that a thickness sensor (11) for measuring the thickness of the ingot is embedded on the right side surface of the bracket (7). 7. The adaptive wafer and ingot transfer robot according to claim 1 is characterized in that a layer of buffer pad is pasted on the upper surface of the rotating support (4).