CN223284589U - A durable computer motherboard heat sink - Google Patents

Abstract

The utility model discloses a durable computer motherboard heat sink in the technical field of computer motherboards, comprising a heat sink, multiple groups of U-shaped copper heat pipes are fixedly installed on both sides of the heat sink, the interior of the copper heat pipes is sealed and filled with coolant, the surface of the copper heat pipes is plated with a nickel layer, aluminum heat conducting sheets are evenly and fixedly installed on the surface of the copper heat pipes, multiple groups of aluminum heat conducting sheets are vertically arranged, a heat dissipation through-hole is fixedly opened in the middle of the surface of the connecting plate, a heat dissipation fan is fixedly installed on the inner side of the heat dissipation through-hole, the nickel layer is provided, the service life of the copper heat pipes is increased, and a corrosion-resistant effect can be played, the surface of the aluminum heat conducting sheet is provided with multiple groups of heat dissipation sheets, and the heat dissipation air duct formed by cooperation is thereby increased in density, thereby increasing the contact surface with the air and improving the heat dissipation efficiency.

Description

Durable computer motherboard fin

Technical Field

The utility model belongs to the technical field of computer mainboards, and particularly relates to a durable computer mainboard radiating fin.

Background

The radiating fin is a device for radiating the heat-generating electronic element in the power supply, which is mostly made of aluminum alloy, brass or bronze into plate, sheet, multi-sheet and the like, for example, a CPU central processing unit in a computer needs to use a quite large radiating fin, a power tube and a row tube in a television, a power amplifier tube in the power amplifier needs to use the radiating fin, and the main materials of the radiating fin of a computer main board comprise silver, copper, aluminum and steel.

In the prior art, only one cooling fan is usually installed on a computer motherboard to cool the computer motherboard, so that heat generated during the operation of a computer cannot be completely dissipated, and the computer motherboard still circulates around the computer motherboard, so that the heat dissipation of the computer motherboard is poor.

Disclosure of utility model

The utility model aims to provide a durable computer motherboard cooling fin, which solves the problem that the prior computer motherboard is provided with only one cooling fan to cool the computer motherboard in the prior art, and the effect is poor.

In order to achieve the above purpose, the technical scheme is that the durable computer motherboard radiating fin comprises a radiating base, copper heat conduction pipes are arranged on two sides of the radiating base, cooling liquid is arranged in the copper heat conduction pipes, aluminum heat conduction fins are arranged on the surfaces of the copper heat conduction pipes, a connecting plate is arranged on one side of the aluminum heat conduction fins, radiating through holes are formed in the surfaces of the connecting plate, a radiating fan is arranged on the inner side of each radiating through hole, fixing holes are formed in the surfaces of the connecting plate, radiating thin pieces are arranged on the surfaces of the aluminum heat conduction fins, radiating air channels are formed between the radiating thin pieces, and heat conduction silicone grease is arranged at the bottom of the radiating base.

Preferably, a plurality of groups of U-shaped copper heat conduction pipes are fixedly arranged on two sides of the heat dissipation base in a penetrating mode, cooling liquid is filled in the copper heat conduction pipes in a sealing mode, and a nickel layer is plated on the surface of the copper heat conduction pipes.

Preferably, the surface of the copper heat pipe is uniformly and fixedly penetrated with aluminum heat conducting fins, and a plurality of groups of aluminum heat conducting fins are vertically arranged in a row.

Preferably, a heat dissipation through hole is fixedly formed in the middle of the surface of the connecting plate, and a heat dissipation fan is fixedly arranged on the inner side of the heat dissipation through hole.

Preferably, fixing holes are formed in four corners of the surface of the connecting plate in a penetrating mode, and a plurality of groups of radiating sheets are uniformly arranged on the surface of the aluminum heat conducting sheet.

Preferably, a heat dissipation air duct is formed between the heat dissipation sheets, and heat conduction silicone grease is uniformly smeared on the bottom surface of the heat dissipation base.

Compared with the prior art, the utility model has the beneficial effects that:

The bottom of heat dissipation base carries out contact welding with the surface of CPU, the inside coolant liquid of heat copper heat pipe that CPU produced, make inside liquid evaporate into gas, gas changes back liquid after releasing heat to copper heat pipe's top condensation end, through copper heat pipe inside so cyclic reciprocating's evaporation and condensation, and then reach the effect of heat transfer, through the nickel layer of setting, copper heat pipe's life has been increased, can play anticorrosive effect, aluminium system heat conducting fin's surface is through setting up multiunit radiating fin, the radiating wind channel that the cooperation constitutes, thereby increased density, and then increase the contact surface with the air, and the radiating efficiency is improved.

Drawings

FIG. 1 is a schematic diagram of the front structure of the present utility model;

FIG. 2 is a schematic side view of the present utility model;

Fig. 3 is a schematic structural view of an aluminum heat conductive sheet according to the present utility model.

1, A heat dissipation base; 2, copper heat conduction pipes, 3, aluminum heat conduction sheets, 4, a connecting plate, 5, a heat dissipation through hole, 6, a heat dissipation fan, 7, a fixing hole, 8, a heat dissipation sheet, 9, a heat dissipation air duct and 10, and heat conduction silicone grease.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the utility model provides a technical scheme that a durable computer motherboard cooling fin comprises a cooling base 1, copper heat conduction pipes 2 are arranged on two sides of the cooling base 1, cooling liquid is arranged inside the copper heat conduction pipes 2, aluminum heat conduction fins 3 are arranged on the surfaces of the copper heat conduction pipes 2, a connecting plate 4 is arranged on one side of the aluminum heat conduction fins 3, cooling through holes 5 are arranged on the surfaces of the connecting plate 4, cooling fans 6 are arranged on the inner sides of the cooling through holes 5, fixing holes 7 are arranged on the surfaces of the connecting plate 4, cooling thin sheets 8 are arranged on the surfaces of the aluminum heat conduction fins 3, cooling air channels 9 are arranged between the cooling thin sheets 8, and heat conduction silicone grease 10 is arranged at the bottom of the cooling base 1.

Specifically, the both sides of heat dissipation base 1 are fixed wears to establish and install multiunit U type copper heat pipe 2, copper heat pipe 2's inside is sealed to be filled with the coolant liquid, copper heat pipe 2's surface has plated the nickel layer, copper heat pipe 2's surface evenly fixed wears to establish and installs aluminium system conducting strip 3, aluminium system conducting strip 3 vertical branch is arranged in a row and is installed multiunit, the fixed through-hole 5 that has offered in surface middle part of connecting plate 4, the inboard fixed mounting of through-hole 5 has radiator fan 6, fixed orifices 7 have been offered in the surface four corners position of connecting plate 4, multiunit radiating fin 8 are evenly installed on aluminium system conducting strip 3's surface, constitute between the radiating fin 8 and have heat dissipation wind channel 9, heat conduction silicone grease 10 has evenly been paintd on the bottom surface of heat dissipation base 1.

In this embodiment, in specific use, the bottom of the heat dissipation base 1 is welded in contact with the surface of the CPU, the heat transfer efficiency between the CPU and the heat dissipation base 1 is increased by the set heat conduction silicone grease 10, the heat generated by the CPU is absorbed by the heat dissipation base 1, and then transferred to the copper heat conduction pipe 2, the heat is absorbed by the copper heat conduction pipe 2 contacting with the heat source, so that the internal liquid is evaporated into gas, the gas is converted back into liquid after releasing the heat from the upper condensation end of the copper heat conduction pipe 2, the heat is circularly evaporated and condensed in this way through the copper heat conduction pipe 2, and then the effect of heat transfer is achieved, the service life of the copper heat conduction pipe 2 is prolonged by the set nickel layer, the anti-corrosion effect can be achieved, the surface of the aluminum heat conduction sheet 3 is provided with a plurality of heat dissipation sheets 8, the heat dissipation air duct 9 formed by matching is increased, the density is increased, the contact surface with the air is increased, the heat dissipation efficiency is improved, and the heat dissipation efficiency is improved, after the heat of the copper heat conduction sheet 3 absorbs the heat of the copper heat conduction pipe 2, the device is discharged through the rotating heat dissipation fan 6, and the heat dissipation efficiency is convenient for long-time use.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A durable computer motherboard heat sink, comprising a heat sink base (1), characterized in that: copper heat pipes (2) are provided on both sides of the heat sink base (1), a coolant is provided inside the copper heat pipes (2), an aluminum heat sink (3) is provided on the surface of the copper heat pipes (2), a connecting plate (4) is provided on one side of the aluminum heat sink (3), a heat dissipation through hole (5) is provided on the surface of the connecting plate (4), a heat dissipation fan (6) is provided on the inner side of the heat dissipation through hole (5), a fixing hole (7) is provided on the surface of the connecting plate (4), a heat dissipation fin (8) is provided on the surface of the aluminum heat sink (3), a heat dissipation air duct (9) is provided between the heat dissipation fins (8), and a thermal grease (10) is provided on the bottom of the heat sink base (1). 2. A durable computer motherboard heat sink according to claim 1, characterized in that: multiple groups of U-shaped copper heat pipes (2) are fixedly installed on both sides of the heat dissipation base (1), the interior of the copper heat pipes (2) are sealed and filled with coolant, and the surface of the copper heat pipes (2) is plated with a nickel layer. 3. A durable computer motherboard heat sink according to claim 1, characterized in that: aluminum heat conducting plates (3) are evenly and fixedly installed on the surface of the copper heat conducting pipe (2), and the aluminum heat conducting plates (3) are installed in multiple groups vertically. 4. A durable computer motherboard heat sink according to claim 1, characterized in that a heat dissipation through hole (5) is fixedly opened in the middle of the surface of the connecting plate (4), and a heat dissipation fan (6) is fixedly installed on the inner side of the heat dissipation through hole (5). 5. A durable computer motherboard heat sink according to claim 1, characterized in that: fixing holes (7) are provided through the four corners of the surface of the connecting plate (4), and multiple groups of heat dissipation fins (8) are evenly installed on the surface of the aluminum heat conducting plate (3). 6. A durable computer motherboard heat sink according to claim 1, characterized in that: a heat dissipation duct (9) is formed between the heat dissipation fins (8), and the bottom surface of the heat dissipation base (1) is evenly coated with thermal grease (10).