CN223274415U - Efficient space heat radiation module - Google Patents

Abstract

The present utility model provides a high-efficiency spatial heat dissipation module, comprising a plurality of switch heat dissipation units and a capacitor heat dissipation unit; the switch heat dissipation unit is vertically arranged on the main circuit structure, each of the switch heat dissipation units is arranged corresponding to the switch interval, and the capacitor heat dissipation unit is attached above the capacitor and is located between the plurality of switch heat dissipation units. The high-efficiency spatial heat dissipation module provided by the present utility model improves the heat dissipation efficiency of the main circuit structure through a reasonable arrangement of heat dissipation units and a compact structural design, helps to avoid failures of the switches and capacitors due to overheating, thereby extending the service life of the equipment and improving stability and reliability. The present utility model also includes an inverter with the high-efficiency spatial heat dissipation module, which can dissipate heat from the main circuit structure having switches and capacitors.

Description

Efficient space heat radiation module

Technical Field

The utility model relates to the field of electronic equipment, in particular to a high-efficiency space heat dissipation module.

Background

The inverter is widely applied to a power system, and in the working process, components such as a switch, a capacitor and the like generate a large amount of heat. The switching components (e.g., IGBTs, MOSFETs) and capacitors are the primary sources of heat in the inverter, and if the heat dissipation is not timely or adequate, the operating efficiency of the system and the service life of the device will be severely impacted. In order to ensure stable operation of the inverter, it is necessary to design efficient heat dissipation modules for these heating elements to ensure that they operate in a safe temperature range.

In the prior art, a heat dissipation module is generally used in an inverter to dissipate heat. Most of the heat dissipation modules are combined with air flow through the heat dissipation fins, so that the heat dissipation area is increased, and the cooling effect is realized. However, because the space in the inverter is limited, especially the distance between key elements such as a switch and a capacitor is small, the existing heat dissipation module design is difficult to fully utilize the space while guaranteeing the heat dissipation effect, so that the heat dissipation of part of the elements is uneven, the local temperature is too high, and the performance of the inverter is possibly affected.

Therefore, a high-efficiency heat dissipation module adaptable to compact layout of an inverter is needed, not only can independently dissipate heat for a switch and a capacitor, but also can improve the overall heat dissipation efficiency in a limited space, ensure stable operation of the inverter, and prolong the service life of the inverter. The novel heat radiation module should be capable of optimizing the arrangement mode of the heat radiation units, so that the heat radiation path is more reasonable and the heat radiation effect is more uniform.

Disclosure of utility model

The utility model aims to provide a high-efficiency space heat radiation module, which solves the problem of uneven heat radiation in an inverter and realizes high-efficiency heat radiation of a switch and a capacitor.

The utility model provides a high-efficiency space heat radiation module which is arranged in an inverter and used for radiating heat of a main circuit structure with a switch and a capacitor, and comprises a plurality of switch heat radiation units and a capacitor heat radiation unit, wherein the switch heat radiation units are vertically arranged on the main circuit structure, each switch heat radiation unit is arranged corresponding to a switch at intervals, and the capacitor heat radiation unit is attached above the capacitor and is positioned among the switch heat radiation units.

The utility model further provides an inverter, which comprises a main circuit structure and a high-efficiency space heat dissipation module, wherein the main circuit structure is provided with a plurality of switches and capacitors, the main circuit structure comprises a plurality of switch heat dissipation units and capacitor heat dissipation units, the switch heat dissipation units and the capacitor heat dissipation units are respectively arranged corresponding to the switches and the capacitors, the switch heat dissipation units are vertically arranged on the main circuit structure, the switch heat dissipation units are arranged corresponding to the switches at intervals, and the capacitor heat dissipation units are attached to the upper parts of the capacitors and are positioned among the switch heat dissipation units.

Compared with the prior art, the efficient space heat dissipation module provided by the utility model solves the heat dissipation problem under the limitation of the internal space of the inverter through reasonable heat dissipation unit layout, and can ensure the stable work of the switch and the capacitor in a narrow space. The inverter adopting the high-efficiency space heat dissipation module not only improves the heat dissipation effect, but also improves the space utilization rate of the system through compact design, thereby prolonging the service life of equipment and improving the working reliability of the inverter.

Drawings

Fig. 1 is a schematic diagram of a three-dimensional structure of an inverter according to the present utility model;

Fig. 2 is an exploded view of an inverter according to the present utility model;

FIG. 3 is a top view of the capacitive heat dissipating unit shown in FIG. 2;

FIG. 4 is a side view of the capacitive heat dissipating unit shown in FIG. 2;

FIG. 5 is a perspective view of the switch heat dissipation unit shown in FIG. 2, and

Fig. 6 is a schematic perspective view of another embodiment of an inverter according to the present utility model.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1 and 2, fig. 1 is a schematic perspective view of an inverter according to the present utility model, and fig. 2 is an exploded perspective view of the inverter according to the present utility model. The inverter 100 includes a main circuit structure 1 and a high-efficiency space heat dissipation module 7, wherein the main circuit structure 1 is provided with a plurality of switches 11 and capacitors 13. The main circuit structure 1 is a common arrangement in the prior art, and includes an input end and an output end of DC and AC, and a boost/buck module, a DC/AC conversion module and a circuit board structure for displaying the modules. Wherein, a plurality of switches 11 are arranged in the module controlled by the bridge circuit and used for realizing the functions inside the module. The switch 11 is mainly a switching tube, such as an IGBT, a MOSfet, etc., and is not limited herein.

The capacitor 13 is a key component in the main circuit structure 1, and is mainly used for smoothing current fluctuation, storing and releasing electric energy. A plurality of capacitors 13 are arranged in parallel or in series on the main circuit structure 1, and are distributed close to the switch 11 or among the DC/AC conversion modules to optimize the energy storage and conversion efficiency. The selection and layout of the capacitive elements are designed according to the voltage and current requirements of different modules, so that the power balance and stable output of the modules during the operation of the high-frequency switch are ensured. In the module controlled by the bridge circuit, the capacitor 13 is particularly disposed between the DC input terminal and the AC output terminal, for filtering the DC voltage and smoothing the AC waveform, and preventing the switching tube (such as IGBT, MOSFET, etc.) from being damaged by the transient voltage.

The efficient space heat dissipation module 7 is disposed in the inverter 100 and dissipates heat of the main circuit structure 1 having the switch 11 and the capacitor 13, the efficient space heat dissipation module 7 includes a plurality of switch heat dissipation units 71 and a capacitor heat dissipation unit 73, the switch heat dissipation units 71 are vertically disposed on the main circuit structure 1, and the switch heat dissipation units 71 are disposed at intervals corresponding to the switch 11 so as to effectively dissipate heat generated by the switch 11.

The capacitor heat dissipation unit 73 is attached above the capacitor 13 and is located between the switch heat dissipation units 71, so that heat dissipation of the capacitor 13 is accelerated and space inside the inverter 100 is saved by a heat conduction mode of a solid medium. Unlike the prior art, the efficient space heat dissipation module 7 is additionally provided with the capacitor heat dissipation unit 73, so that the capacitor 13 can also dissipate heat effectively. Because the switch 11 and the capacitor 13 generate heat during the operation, the temperature at the bottom of the main circuit structure 1 is higher, and the switch heat dissipation unit 71 can effectively transfer the heat of the switch 11, but the capacitor 13 can only cool down through air flow, so that the efficiency is lower. By providing the capacitor heat dissipation unit 73, the heat dissipation problem of the capacitor 13 is effectively solved, and the heat dissipation effect of the bottom of the main circuit structure 1 is ensured.

With continued reference to fig. 3 and fig. 4, in the present embodiment, the capacitive heat dissipation unit 73 includes a heat-conducting substrate 731 and a plurality of heat dissipation fins 733. The heat conducting substrate 731 is attached to the upper portion of the capacitor 13, so as to fully contact the surface of the capacitor 13, and timely conduct out heat generated during operation of the capacitor 13. The heat dissipation fins 733 are vertically disposed at the bottom of the heat conducting substrate 731, the heat dissipation fins 733 are arranged in a square matrix, and each heat dissipation fin 733 is uniformly spaced apart, and at least two heat dissipation channels perpendicular to each other are formed. Therefore, the heat dissipation surface area can be effectively increased, so that air can flow from multiple directions to take away heat.

It should be noted that the capacitive heat dissipation unit 73 may be formed by combining a plurality of different heat dissipation devices, such as a diversion trench, a heat pipe, a fan, a heat conductive paste, etc. In this embodiment, the heat dissipation unit 73 is bonded to the heat-conducting substrate 731 by using a heat-conducting paste, and the heat-conducting substrate and the capacitor 13 are thermally connected to each other, so that the heat dissipation is ensured, and the heat dissipation unit 73 is fixed to the heat-conducting substrate 731, and the heat dissipation fins 733 extend outwards from the heat-conducting substrate 731, so that the temperature near the bottom of the main circuit structure 1 is transferred outwards, and the heat dissipation is facilitated by transferring the temperature to a similar height as much as possible to the switch heat dissipation unit 71.

In order to further optimize the heat dissipation path, the capacitive heat dissipation unit 73 further includes a cross flow baffle 735, where the cross flow baffle 735 is vertically disposed at the bottom of the heat conducting substrate 731 and is located between two adjacent rows of the heat dissipation fins 733, as shown in fig. 3. The height of the cross flow baffle 735 is slightly smaller than that of the heat dissipation fins 733, so that the cross flow baffle and the heat dissipation fins 733 cooperate to form a plurality of first heat dissipation channels 7339, so that the temperature of the surface of the capacitor 13 can be transferred outwards along the first heat dissipation channels 7339 and cannot be mixed with the temperature of the surface of the switch 11. The cross flow baffle 735 not only guides air to flow to a specific channel by dividing the heat dissipation channel, improves the efficiency of air flow, further improves the heat dissipation capacity, but also plays a certain role in protecting the capacitor 13.

It should be noted that, the heat dissipation fins 733 may take different shapes and structures, such as flat plates, tubes, micro-channels, etc., to adapt to different heat dissipation requirements.

In this embodiment, the heat dissipation fins 733 are configured as a cuboid structure, and are uniformly spaced and vertically disposed on the heat conducting substrate 731, so that heat can be uniformly distributed in all directions, heat dissipation area is maximized in a limited volume, and the heat dissipation fins are easier to integrate with other components, so that the heat dissipation device is suitable for a compact space, and the cuboid structure is easier to manufacture and lower in cost compared with other complex shapes. In this other embodiment, the heat dissipation fins 733 are configured as a cylinder structure, and are uniformly spaced and vertically disposed on the heat conducting substrate 731, so that the heat dissipation effect of the heat dissipation channel can be optimized in this arrangement mode, and each surface of the cylinder is uniformly contacted with air, so that the overall heat dissipation efficiency is uniform, and partial position damage is not easy to occur.

In this embodiment, the heat dissipation fins 733 include a first heat dissipation surface 7331 and a second heat dissipation surface 7333, the heat dissipation fins 733 arranged in the same row are arranged on the same plane, the first heat dissipation surface 7331 and the second heat dissipation surface 7333 are arranged vertically, the heat dissipation fins arranged in the same row are arranged on the same plane, and the first heat dissipation surface 7331 and the second heat dissipation surface 7333 respectively correspond to different arrangement directions of the heat dissipation fins 733. This arrangement ensures that the heat dissipation air flow smoothly passes through and brings away the temperature on the heat dissipation fins 733 without causing turbulence.

A second heat dissipation channel 7335 is formed by an adjacent row of the heat dissipation fins 733, a third heat dissipation channel 7337 is formed by an adjacent row of the heat dissipation fins 733, the second heat dissipation channel 7335 is perpendicular to the third heat dissipation channel 7337, the width of the second heat dissipation surface 7333 is smaller than the width of the first heat dissipation surface 7331, the arrangement of the second heat dissipation channel 7335 and the third heat dissipation channel 7337 is related to the arrangement of the switch heat dissipation unit 71, and the width of the second heat dissipation surface 7333 is smaller than the width of the first heat dissipation surface 7331 in order to make the air flow mainly take away heat along the second heat dissipation channel 7335. Therefore, the second heat dissipation channel 7335 and the heat dissipation channel on the switch heat dissipation unit 71 need to be the same flow channel.

Referring to fig. 5 and 6, the switch heat dissipation unit 71 includes a first heat dissipation fin 711 and a plurality of second heat dissipation fins 713. The first heat dissipation fins 711 are closely attached to one side of the switch 11, so that heat generated when the switch 11 works can be effectively conducted. The second heat dissipation fins 713 are vertically disposed on two sides of the first heat dissipation fin 711 and are perpendicular to the first heat dissipation fin 711, so as to increase the heat dissipation area and accelerate heat dissipation. In this embodiment, the first heat dissipation fins 711 are disposed parallel to the main circuit structure 1, the switch 11 is sandwiched between the main circuit structure 1 and the first heat dissipation fins 711, and the second heat dissipation fins 713 are disposed at a side far away from the switch 11, so as to provide flexible structural design to adapt to different heat dissipation requirements. This setting mode is favorable to first radiating fin 711 with dismouting between the switch 11 can be fixed through the heat conduction glue between the two, need not to fix through other fixed modes, and the heat conduction effect is better moreover.

In another embodiment, the first heat dissipation fins 711 are disposed perpendicular to the main circuit structure 1, the switch 11 is attached to one side of the first heat dissipation fins 711, and the second heat dissipation fins 713 are disposed at two sides of the first heat dissipation fins 711 at uniform intervals, so as to further enhance the heat dissipation effect.

It should be noted that, since a plurality of the switch heat dissipating units 71 may be simultaneously provided in the inverter 100, different arrangements of the first heat dissipating fins 711 and the second heat dissipating fins 713 may coexist in the inverter 100, that is, two embodiments may be simultaneously provided for the switch heat dissipating units 71, and as shown in fig. 1 and 6, various examples of the switch heat dissipating units 71 may be selected, and the present invention is not limited thereto.

Through the design, the efficient space heat dissipation module 7 can effectively provide sufficient heat dissipation for the switch 11 and the capacitor 13 assembly in the main circuit structure 1, and equipment performance degradation or damage caused by overheating is avoided. The switch heat dissipation unit 71 adopts the first heat dissipation fins 711 or the second heat dissipation fins 713 which are vertically arranged, so that the heat dissipation area is greatly increased, and the capacitor heat dissipation unit 73 achieves uniform and efficient heat dissipation of the capacitor 13 through the heat conduction substrate 731 and the heat dissipation fins 733 which are arranged in a matrix. The design of the cross flow baffle 735 further optimizes the air flow path of the capacitive heat sink unit 73, enhancing overall heat dissipation.

In addition, the utility model has simple and reasonable structural design and convenient installation, can adapt to inverters with different specifications, can flexibly expand the application range through modularized design, and is suitable for wide application in various industries and consumer electronic equipment.

It is apparent that the present utility model is not limited to the above-described embodiments, and any changes or modifications made by those skilled in the art on the basis of the present utility model should be included in the scope of the present utility model.

Claims (10)

1. The utility model provides a high-efficient space heat dissipation module, locates in the dc-to-ac converter, dispels the heat to main body circuit structure that has switch and electric capacity, its characterized in that includes:

A plurality of switch heat dissipation units vertically arranged on the main circuit structure, each switch heat dissipation unit being arranged at intervals corresponding to the switch, and

And the capacitor radiating units are attached to the upper parts of the capacitors and are positioned among the switch radiating units.

2. The efficient space heat dissipation module of claim 1, wherein the capacitive heat dissipation unit comprises:

A heat conducting substrate which is attached to the capacitor, and

The heat dissipation fins are vertically arranged at the bottom of the heat conduction substrate, are arranged in a square matrix, are arranged at intervals, and form at least two mutually perpendicular heat dissipation channels.

3. The efficient space heat dissipating module of claim 2, wherein the capacitive heat dissipating unit further comprises a cross flow baffle vertically disposed at the bottom of the heat conducting substrate and between two adjacent rows of the heat dissipating fins.

4. A high efficiency spatial heat sink module in accordance with claim 3 wherein said cross flow baffle has a height less than said heat fins, said cross flow baffle and said heat fins cooperating to form a plurality of first heat dissipation channels.

5. The efficient spatial heat sink module as set forth in claim 2, wherein the heat sink fins are of a cylindrical structure and are arranged at uniform intervals.

6. The efficient spatial heat sink module as set forth in claim 2, wherein the heat sink fins are of a rectangular parallelepiped structure, comprising:

A first heat dissipation surface, the heat dissipation fins arranged in the same row and the corresponding first heat dissipation surfaces are arranged in the same plane, and

The second radiating surfaces are perpendicular to the first radiating surfaces, the radiating fins arranged in the same row are arranged on the same plane, and the corresponding second radiating surfaces are arranged on the same plane.

7. The efficient space heat dissipation module according to claim 6, wherein the heat dissipation fins arranged in adjacent rows form a second heat dissipation channel, the heat dissipation fins arranged in adjacent rows form a third heat dissipation channel, the second heat dissipation channel and the third heat dissipation channel are perpendicular to each other, and the width of the second heat dissipation surface is smaller than the width of the first heat dissipation surface.

8. The efficient space heat sink module as recited in claim 1, wherein the switch heat sink unit comprises:

A first heat dissipation fin attached to the switch, and

The second radiating fins are uniformly arranged on the first radiating fins at intervals and are perpendicular to the first radiating fins.

9. The efficient space heat dissipation module as recited in claim 8, wherein said first heat dissipation fins are arranged perpendicular to said main circuit structure, said switch is attached to one side of said first heat dissipation fins, and said second heat dissipation fins are arranged on both sides of said first heat dissipation fins, or

The first radiating fins are arranged parallel to the main circuit structure, the switch is clamped between the main circuit structure and the first radiating fins, and the second radiating fins are arranged on one side, far away from the switch, of the first radiating fins.

10. An inverter is provided, which comprises a first inverter and a second inverter, characterized by comprising the following steps:

A main circuit structure provided with a plurality of switches and capacitors, and

The efficient space heat dissipation module as defined in any one of claims 1 to 9, wherein the switch heat dissipation unit and the capacitor heat dissipation unit are disposed corresponding to the switch and the capacitor, respectively.