CN223235979U - Polishing device for semiconductor processing capable of preventing polishing solution from splashing - Google Patents
Polishing device for semiconductor processing capable of preventing polishing solution from splashingInfo
- Publication number
- CN223235979U CN223235979U CN202422426857.1U CN202422426857U CN223235979U CN 223235979 U CN223235979 U CN 223235979U CN 202422426857 U CN202422426857 U CN 202422426857U CN 223235979 U CN223235979 U CN 223235979U
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- China
- Prior art keywords
- polishing
- workbench
- storage tank
- semiconductor processing
- liquid
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
本实用新型公开了一种防止抛光液飞溅的半导体加工用抛光装置，包括工作台、工作台的下端固定连接有起到储物作用的储液箱及工作台的上端左右对称的螺栓连接有电动伸缩杆；所述储液箱的内部以及上侧分别设置有收集结构和限位结构，其中收集结构包括有支撑板、过滤网、密封板和进液孔，限位结构包括有连接板、限位槽、连接口、腔体、抽气管和抽气泵；所述电动伸缩杆的上端分别固定连接在第二防护框的左右两端，且第二防护框的内部呈等间距的转动连接有连接轴。该防止抛光液飞溅的半导体加工用抛光装置，防止抛光液飞溅，便于收集抛光液循环利用，而且方便对半导体进行限位，同时便于批量抛光半导体。
The utility model discloses a semiconductor processing polishing device that prevents polishing liquid from splashing. The device comprises a workbench, a liquid storage tank fixedly connected to the lower end of the workbench to serve as a storage tank, and an electric telescopic rod symmetrically bolted to the upper end of the workbench. The interior and upper side of the liquid storage tank are respectively provided with a collection structure and a limiting structure, wherein the collection structure includes a support plate, a filter screen, a sealing plate, and a liquid inlet hole, and the limiting structure includes a connecting plate, a limiting groove, a connecting port, a cavity, an exhaust pipe, and an exhaust pump. The upper end of the electric telescopic rod is respectively fixedly connected to the left and right ends of a second protective frame, and the interior of the second protective frame is rotatably connected to a connecting shaft at equal intervals. The semiconductor processing polishing device that prevents polishing liquid from splashing prevents polishing liquid from splashing, facilitates the collection and recycling of polishing liquid, and facilitates the limiting of semiconductors, while also facilitating batch polishing of semiconductors.
Description
Technical Field
The utility model relates to the technical field related to semiconductor processing, in particular to a polishing device for semiconductor processing, which is used for preventing polishing liquid from splashing.
Background
The semiconductor has wide application in radio, television and temperature measurement, a polishing device is used when the semiconductor is processed, and the surface of the semiconductor is smoothed by the polishing device, so that the surface quality of the semiconductor reaches a higher level;
However, the utility model discloses a polishing device for semiconductor processing, which comprises a base, wherein a side plate is fixedly arranged on the left side and the right side of the upper end of the base, a top plate is fixedly arranged on the upper end of the side plate, a sliding groove is formed in the top plate, a sliding block slides in the sliding groove, one end of the sliding block, which is close to the side plate, is rotationally connected with one end of a transmission rod through a rotating shaft, the other end of the transmission rod is rotationally connected with a driven shaft through the rotating shaft, the driven shaft slides in a sliding rail, the sliding rail is arranged in a rotating ring, the rotating ring is rotationally connected with a driving shaft, the driving shaft is rotationally connected with a first rotating gear, the polishing head is driven to rotate around the driving shaft by the first rotating gear, so that the sliding block is driven to move left and right in the sliding groove periodically, the polishing head is comprehensively polished, the polishing efficiency is improved, and in addition, the sliding column is stretched through the connection of a screw rod and a thread groove, so that a clamping block is driven to clamp and loosen a semiconductor.
The prior art scheme has the following defects that the batch polishing of semiconductors is inconvenient, only one group of semiconductors can be polished, the lifting structure of the polishing head is complicated, the spacing structure of the semiconductors is complicated, the spacing of the semiconductors is inconvenient and rapid, polishing liquid is easy to splash, and the collection and the recycling of the polishing liquid are inconvenient.
Therefore, we propose a polishing apparatus for semiconductor processing that prevents the polishing liquid from splashing so as to solve the problems set forth in the above.
Disclosure of utility model
The utility model aims to provide a polishing device for semiconductor processing, which is used for preventing polishing liquid from splashing, so as to solve the problems that the polishing liquid is easy to splash, is inconvenient to collect and recycle, is inconvenient to limit semiconductors and is inconvenient to polish semiconductors in batches in the actual use process.
The polishing device for semiconductor processing for preventing polishing liquid from splashing comprises a workbench, a liquid storage tank fixedly connected with the lower end of the workbench and electric telescopic rods connected with the upper end of the workbench in a bilateral symmetry manner;
Further comprises:
The inside and the upside of the liquid storage tank are respectively provided with a collecting structure and a limiting structure, wherein the collecting structure comprises a supporting plate, a filter screen, a sealing plate and a liquid inlet, and the limiting structure comprises a connecting plate, a limiting groove, a connecting port, a cavity, an exhaust pipe and an exhaust pump;
The upper end of electric telescopic handle is fixed connection respectively in the left and right sides both ends of second protection frame, and the inside of second protection frame is equidistant rotation and is connected with the connecting axle to the upper end fixedly connected with worm wheel of connecting axle.
Preferably, the upper end of the workbench is embedded and connected with a first protection frame, the inner wall of the first protection frame is fixedly connected with a connecting plate, and the connecting plate is provided with limiting grooves at equal intervals, and the diameter of each limiting groove is equal to that of the semiconductor.
Preferably, the positions of the limit grooves are in one-to-one correspondence with the positions of the connecting ports, the connecting ports are arranged at the upper end of the workbench, and the connecting ports are of porous structures;
Wherein, the cavity has been seted up to the inside of workstation intermediate position, and the exhaust tube is installed to the front end of cavity to the front end bolted connection of exhaust tube has the aspiration pump, and the connector is linked together with the exhaust tube through the cavity moreover.
Preferably, the lower end bolt of connecting axle is connected with the polishing dish, and the rear end meshing of the worm wheel of connecting axle upside is connected with the worm to the worm rotates the upper end in the back of second protection frame.
Preferably, the motor is installed to the right-hand member of worm, and the polishing dish is revolution mechanic through worm and worm wheel in the inside of second protection frame, and wherein the cross sectional area of second protection frame equals with the cross sectional area of first protection frame.
Preferably, the workbench is uniformly provided with liquid inlet holes, the upper end of the inner part of the liquid storage tank at the lower side of the liquid inlet holes is symmetrically embedded and connected with a supporting plate, and the upper end of the supporting plate is provided with a filter screen;
The right end of the liquid storage tank is connected with a sealing plate with a positive-section longitudinal section in a convex structure in a clamping mode, the rear end of the liquid storage tank is fixedly connected with a first connecting pipe, and the rear end of the first connecting pipe is connected with a water pump through a bolt.
Preferably, the upper end of the water pump is connected with a second connecting pipe through a bolt, the upper end of the second connecting pipe is fixedly connected with the lower end of the transverse pipe, and the transverse pipe is connected with the rear end of the workbench through a bolt;
The front end of the transverse pipe is connected with the spray heads in an equidistant threaded mode, the spray heads and the positions of the limiting grooves are in front-back one-to-one correspondence, and the liquid storage tank and the spray heads form a communication structure through the first connecting pipe and the transverse pipe.
Compared with the prior art, the polishing device for semiconductor processing, which prevents the polishing solution from splashing, is convenient for collecting the polishing solution for recycling, is convenient for limiting the semiconductors, and is convenient for polishing the semiconductors in batches;
1. The polishing device comprises a first protection frame and a liquid inlet, wherein the cross section area of a second protection frame is equal to that of the first protection frame, the second protection frame is downwards covered on the first protection frame, liquid inlet holes are uniformly formed in a workbench, polishing liquid in the first protection frame falls on a filter screen through the liquid inlet to be filtered, the filtered polishing liquid enters the lower end of the interior of a liquid storage tank to be collected, so that the polishing liquid is prevented from splashing, and the polishing liquid can be conveniently collected and recycled;
2. The semiconductor clamping device is provided with a limiting groove and a connecting port, wherein the connecting port is communicated with the exhaust pipe through a cavity, so that after the semiconductor is clamped in the limiting groove, gas between the semiconductor and the workbench enters the cavity through the connecting port with a porous structure and is exhausted through the exhaust pipe, the semiconductor is tightly adsorbed at the upper end of the workbench, and the semiconductor is conveniently limited;
3. Be provided with connecting axle and worm wheel, the polishing dish is at the inside structural design of second protection frame for worm wheel meshing with equidistant setting when worm rotates lets worm wheel and connecting axle drive the polishing dish and rotates, polishes the semiconductor in the spacing inslot when equidistant setting's polishing dish rotates, thereby is convenient for polish the semiconductor in batches.
Drawings
FIG. 1 is a schematic diagram of a front cross-sectional structure of the present utility model;
FIG. 2 is a schematic view of a right side cross-sectional structure of a cavity and an exhaust pipe connection of the present utility model;
FIG. 3 is a schematic top view of a cross-section of a cross-pipe and nozzle connection of the present utility model;
FIG. 4 is a schematic top view of a cross-sectional structure of a connection port and a workbench according to the utility model;
FIG. 5 is a schematic top view of a cross-sectional structure of a worm gear and worm connection of the present utility model.
The device comprises a workbench, a liquid storage tank, a first protection frame, a connecting plate, a limiting groove, a connecting port, a 7, a cavity, an 8, an exhaust pipe, a 9, an exhaust pump, a 10, a second protection frame, an 11, an electric telescopic rod, a 12, a connecting shaft, a 13, a polishing disc, a 14, a worm wheel, a 15, a worm, a 16, a motor, a 17, a supporting plate, a 18, a filter screen, a 19, a sealing plate, a 20, a liquid inlet, a 21, a first connecting pipe, a 22, a water pump, a 23, a second connecting pipe, a 24, a transverse pipe, a 25 and a nozzle.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described with reference to the drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, the utility model provides a polishing device for semiconductor processing, which comprises a workbench 1, a liquid storage tank 2, a first protective frame 3, a connecting plate 4, a limit groove 5, a connecting port 6, a cavity 7, an exhaust pipe 8, an exhaust pump 9, a second protective frame 10, an electric telescopic rod 11, a connecting shaft 12, a polishing disk 13, a worm wheel 14, a worm 15, a motor 16, a supporting plate 17, a filter screen 18, a sealing plate 19, a liquid inlet 20, a first connecting pipe 21, a water pump 22, a second connecting pipe 23, a transverse pipe 24 and a spray nozzle 25, wherein when the polishing device for semiconductor processing, which prevents the polishing liquid from splashing, is used, the limit structure comprises the connecting plate 4, the limit groove 5, the connecting port 6, the cavity 7, the exhaust pipe 8 and the pump 9, and the limit groove 5 are arranged on the connecting plate 4 at equal intervals, the diameter of the limit groove 5 is equal to the diameter of a semiconductor, the position of the limit groove 5 corresponds to the position of the connecting port 6 up and down, the limit groove 6 is in a one-to-one correspondence, and the exhaust pipe 8 is communicated with the exhaust pipe 8 through the connecting port 6;
Therefore, the semiconductors are respectively clamped and connected in the limiting grooves 5 which are arranged at equal intervals, the lower ends of the semiconductors are attached to the upper end of the workbench 1, the air in the cavity 7 is pumped out through the air pumping pipe 8 when the air pumping pump 9 works, the air between the semiconductors and the upper end of the workbench 1 enters the cavity 7 through the connecting ports 6 which are arranged in a porous structure and is discharged through the air pumping pipe 8 and the air pumping pump 9, and the semiconductors are adsorbed on the upper end face of the workbench 1, so that the semiconductors are conveniently limited;
As shown in fig. 1, 2, 3 and 5, since the inside of the second protection frame 10 is connected with the connecting shaft 12 in an equidistant rotating manner, the rear end of the worm wheel 14 is connected with the worm 15 in a meshed manner, the polishing disk 13 is in a rotating structure inside the second protection frame 10 through the worm 15 and the worm wheel 14, and the cross section area of the second protection frame 10 is equal to the cross section area of the first protection frame 3;
Therefore, when the electric telescopic rod 11 symmetrically arranged left and right works, the second protective frame 10 is driven to descend, the lower end of the second protective frame 10 is attached to the upper end of the first protective frame 3, the second protective frame 10 and the first protective frame 3 surround the semiconductor and the polishing disc 13, the lower end of the polishing disc 13 which is arranged at equal intervals is abutted against the upper end of the semiconductor at the corresponding position, the water pump 22 conveys polishing liquid in the liquid storage tank 2 to the inside of the transverse tube 24 through the first connecting tube 21 during working, the polishing liquid in the transverse tube 24 is sprayed on the semiconductor at the corresponding position through the spray heads 25 which are arranged at equal intervals, the motor 16 drives the worm 15 to rotate during working, the worm wheel 14 drives the connecting shaft 12 to rotate when the worm 15 rotates, and the polishing disc 13 is driven by the connecting shaft 12 to rotate, so that the semiconductor is polished when the polishing disc 13 which is arranged at equal intervals rotates, and the semiconductor is convenient to polish in batches;
As shown in fig. 1, 2 and 4, the collecting structure comprises a supporting plate 17, a filter screen 18, a sealing plate 19 and liquid inlet holes 20, and as the liquid inlet holes 20 are uniformly formed on the workbench 1, the positions of the spray heads 25 and the limiting grooves 5 are in front-back one-to-one correspondence, and the liquid storage tank 2 and the spray heads 25 form a communicating structure through a first connecting pipe 21 and a transverse pipe 24;
The redundant polishing solution at the upper end of the workbench 1 enters the interior of the liquid storage tank 2 through uniformly arranged liquid inlet holes 20 and falls on the filter screen 18, the polishing solution is filtered through the filter screen 18, impurities are left at the upper end of the filter screen 18, the filtered polishing solution falls on the lower end of the interior of the liquid storage tank 2 through the filter screen 18 to be collected, the polishing solution collected in the liquid storage tank 2 is sprayed on a semiconductor again through the first connecting pipe 21, the second connecting pipe 23, the transverse pipe 24 and the spray head 25, and the sealing plate 19 is pulled rightward to be separated from the interior of the upper right end of the workbench 1;
the filter screen 18 is pulled rightward to take out the filter screen 18 from the interior of the liquid storage tank 2, impurities on the filter screen 18 are treated, the filter screen 18 is placed into the interior of the upper end of the liquid storage tank 2 again after the impurities are treated, the support plates 17 which are symmetrically arranged left and right support the filter screen 18, and the sealing plates 19 with the vertical sections being in the convex structures are connected into the interior of the right upper end of the liquid storage tank 2 in a clamping manner, so that polishing liquid can be collected conveniently for recycling, and the electrical elements are all of the prior art and are not described in detail herein.
The details not described in detail in the specification belong to the prior art known to those skilled in the art, standard parts used in the utility model can be purchased from market, special-shaped parts can be customized according to the description of the specification and the drawings, the specific connection modes of all parts adopt conventional means such as mature bolts, rivets and welding in the prior art, the machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection modes in the prior art, so that the description is omitted.
Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.
Claims (7)
1. A polishing device for semiconductor processing for preventing polishing liquid from splashing comprises a workbench (1), a liquid storage tank (2) which plays a role in storing is connected to the lower end of the workbench (1), and an electric telescopic rod (11) is connected to the upper end of the workbench (1) through bilateral symmetry bolts;
characterized by further comprising:
The inside and the upside of the liquid storage tank (2) are respectively provided with a collecting structure and a limiting structure, wherein the collecting structure comprises a supporting plate (17), a filter screen (18), a sealing plate (19) and a liquid inlet hole (20), and the limiting structure comprises a connecting plate (4), a limiting groove (5), a connecting port (6), a cavity (7), an exhaust pipe (8) and an exhaust pump (9);
the upper ends of the electric telescopic rods (11) are respectively and fixedly connected with the left end and the right end of the second protection frame (10), the inside of the second protection frame (10) is provided with connecting shafts (12) in an equidistant rotating mode, and the upper ends of the connecting shafts (12) are fixedly connected with worm wheels (14).
2. The polishing device for semiconductor processing capable of preventing polishing liquid from splashing according to claim 1, wherein the upper end of the workbench (1) is connected with a first protection frame (3) in an embedded mode, a connecting plate (4) is fixedly connected to the inner wall of the first protection frame (3), limit grooves (5) are formed in the connecting plate (4) at equal intervals, and the diameter of the limit grooves (5) is equal to that of a semiconductor.
3. The polishing apparatus for semiconductor processing capable of preventing splashing of a polishing liquid according to claim 1, wherein the position of the limit groove (5) corresponds to the position of the connection port (6) one by one vertically, the connection port (6) is arranged at the upper end of the workbench (1), and the connection port (6) has a porous structure;
Wherein, cavity (7) have been seted up to the inside of workstation (1) intermediate position, and exhaust tube (8) are installed to the front end of cavity (7) to the front end bolted connection of exhaust tube (8) has aspiration pump (9), and connector (6) are linked together with exhaust tube (8) through cavity (7) moreover.
4. The polishing apparatus for semiconductor processing capable of preventing splashing of polishing liquid according to claim 1, wherein a polishing disk (13) is bolted to the lower end of the connecting shaft (12), a worm (15) is engaged and connected to the rear end of a worm wheel (14) on the upper side of the connecting shaft (12), and the worm (15) is rotatably connected to the rear upper end of the second protection frame (10).
5. The polishing apparatus for semiconductor processing capable of preventing splashing of polishing liquid according to claim 4, wherein a motor (16) is mounted at the right end of the worm (15), and the polishing disk (13) is in a rotating structure inside the second protective frame (10) through the worm (15) and the worm wheel (14), wherein the cross-sectional area of the second protective frame (10) is equal to the cross-sectional area of the first protective frame (3).
6. The polishing device for semiconductor processing for preventing splashing of polishing liquid according to claim 1, wherein liquid inlet holes (20) are uniformly formed in the workbench (1), a supporting plate (17) is connected to the upper end of the inner part of the liquid storage tank (2) at the lower side of the liquid inlet holes (20) in a laterally symmetrical embedded manner, and a filter screen (18) is arranged at the upper end of the supporting plate (17);
The right end of the liquid storage tank (2) is connected with a sealing plate (19) with a positive-section longitudinal section in a convex structure in a clamping mode, the rear end of the liquid storage tank (2) is fixedly connected with a first connecting pipe (21), and the rear end of the first connecting pipe (21) is connected with a water pump (22) through bolts.
7. The polishing apparatus for semiconductor processing capable of preventing splashing of polishing liquid according to claim 6, wherein a second connecting pipe (23) is connected to an upper end of the water pump (22) by a bolt, an upper end of the second connecting pipe (23) is fixedly connected to a lower end of a horizontal pipe (24), and the horizontal pipe (24) is connected to a rear end of the table (1) by a bolt;
The front end of the transverse pipe (24) is in equidistant threaded connection with a spray head (25), the spray heads (25) and the positions of the limiting grooves (5) are in front-back one-to-one correspondence, and the liquid storage tank (2) and the spray heads (25) form a communication structure through the first connecting pipe (21) and the transverse pipe (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422426857.1U CN223235979U (en) | 2024-10-09 | 2024-10-09 | Polishing device for semiconductor processing capable of preventing polishing solution from splashing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422426857.1U CN223235979U (en) | 2024-10-09 | 2024-10-09 | Polishing device for semiconductor processing capable of preventing polishing solution from splashing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223235979U true CN223235979U (en) | 2025-08-19 |
Family
ID=96729961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202422426857.1U Active CN223235979U (en) | 2024-10-09 | 2024-10-09 | Polishing device for semiconductor processing capable of preventing polishing solution from splashing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223235979U (en) |
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2024
- 2024-10-09 CN CN202422426857.1U patent/CN223235979U/en active Active
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