CN223222688U - A new type of high temperature resistant laser engraving dust bonding mechanism - Google Patents
A new type of high temperature resistant laser engraving dust bonding mechanismInfo
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- CN223222688U CN223222688U CN202422309301.4U CN202422309301U CN223222688U CN 223222688 U CN223222688 U CN 223222688U CN 202422309301 U CN202422309301 U CN 202422309301U CN 223222688 U CN223222688 U CN 223222688U
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Abstract
本实用新型公开了一种新型防高温镭雕粉尘粘结机构，属于金属件镭雕粉尘清洁技术领域，包括基座，所述基座的上端设置有密封壳，基座的上端中间设置有产品放置台，密封壳的中间设置有产品定位板，产品定位板的中间设置有密封板，产品放置台的中间设置有水冷散热组件，本实用新型设置水冷散热组件，产品底部与散热片的上端接触，散热片导热，将产品热量传导，通过水冷槽内冷却液吸收，避免积热，半导体制冷片制冷，使水冷槽内冷却液温度降低，保证散热片持续对产品降温，半导体制冷片产生的热量通过散热管散热，然后从散热口排出，隔热涂层避免散热管内热量传到产品，避免因镭雕温度过热使得产品粘接粉尘。
The utility model discloses a novel high-temperature resistant laser engraving dust bonding mechanism, which belongs to the technical field of laser engraving dust cleaning for metal parts, and comprises a base, a sealing shell is provided at the upper end of the base, a product placement platform is provided in the middle of the upper end of the base, a product positioning plate is provided in the middle of the sealing shell, a sealing plate is provided in the middle of the product positioning plate, and a water-cooled heat dissipation component is provided in the middle of the product placement platform. The utility model is provided with a water-cooled heat dissipation component, the bottom of the product contacts the upper end of the heat sink, the heat sink conducts heat, and conducts the heat of the product, which is absorbed by the coolant in the water-cooling tank to avoid heat accumulation, and the semiconductor refrigeration piece cools down to reduce the temperature of the coolant in the water-cooling tank, ensuring that the heat sink continuously cools the product, and the heat generated by the semiconductor refrigeration piece is dissipated through the heat dissipation pipe and then discharged from the heat dissipation port, and the heat insulation coating prevents the heat in the heat dissipation pipe from being transferred to the product, thereby preventing the product from adhering to dust due to overheating of the laser engraving temperature.
Description
Technical Field
The utility model belongs to the technical field of cleaning of laser carving dust of metal pieces, and particularly relates to a novel high Wen Leidiao dust bonding prevention mechanism.
Background
The precise metal structural parts are widely applied to intelligent terminal products, and in general, two-dimensional codes, LOGO, conductive potential and the like are required to be laser carved on the inner surfaces of the metal structural parts.
Chinese patent application number 202221417527.0 discloses a prevent high Wen Leidiao dust bonding device, including sealed box, the side and the negative pressure intake pipe intercommunication of sealed box, the inside of sealed box is equipped with the product and places the platform, and the up end of sealed box just is located the product and places the platform and be equipped with radium carving processing mouth directly over. The product is placed the platform and is set up in the inside of the sealed box that feeds through negative pressure intake pipe, when the product carries out radium carving processing, utilize normal atmospheric temperature air to cool off the product fast, avoid making radium carving dust bond on the product surface because of radium carving temperature is overheated, utilize the negative pressure to adsorb the dust in the air and not bond the dust on the product surface simultaneously to clear away the dust that radium carving produced, improve production efficiency, improve radium carving yields, alleviate workman intensity of labour.
The patent disclosed above has the advantages that the radiating structure is single, the radiating effect is poor, the laser carving effect is affected, meanwhile, the fixing and mounting between the sealing plate and the product positioning plate are troublesome, the time and the labor are wasted, and the use is affected.
Disclosure of utility model
To solve the problems set forth in the background art. The utility model provides a novel high Wen Leidiao dust-proof bonding mechanism, which has the characteristics of good heat dissipation effect and disassembly and assembly of a sealing plate and a product positioning plate.
In order to achieve the above purpose, the novel anti-high Wen Leidiao dust bonding mechanism comprises a base, wherein a sealing shell is arranged at the upper end of the base, a product placing table is arranged in the middle of the upper end of the base, a product positioning plate is arranged in the middle of the sealing shell, a sealing plate is arranged in the middle of the product positioning plate, a water cooling and heat radiating component is arranged in the middle of the product placing table, product placing pads are arranged around the upper end of the product placing table, heat radiating openings are arranged on two sides of the sealing shell, fixing components are arranged on two sides of the sealing plate, pin holes are formed on two sides of a middle groove of the product positioning plate, and negative pressure air inlet pipes are arranged on the sides of the base and the sealing shell.
Preferably, the water cooling heat dissipation assembly comprises a water cooling groove, cooling fins and cooling holes, wherein the water cooling groove is formed in the product placement table, the cooling fins are arranged at the upper end of the water cooling groove, a plurality of cooling holes are formed in the surface of the cooling fins, and the upper ends of the cooling fins are flush with the product placement pad.
Preferably, the water cooling assembly further comprises a mounting groove, a radiating pipe and a semiconductor refrigerating piece, wherein the bottom of the product placement table is provided with the mounting groove, the semiconductor refrigerating piece is arranged in the middle of the mounting groove, and the radiating pipes are arranged on two sides of the mounting groove.
Preferably, a heat-insulating coating is arranged on the surface of the radiating tube, and the side edge of the radiating tube is clung to the radiating opening.
Preferably, the fixed subassembly includes movable groove, handle, fixed pin and reset spring, and wherein, the both sides of closing plate are provided with movable groove, and the inside of movable groove is provided with reset spring, and reset spring's side is connected with the fixed pin, and the upper end of fixed pin is close to reset spring one side and is provided with the handle.
Preferably, the fixing pin is always inserted into the pin hole under the elastic force of the return spring.
Compared with the prior art, the utility model has the beneficial effects that:
1. The utility model sets up the water-cooling assembly, the bottom of the product contacts with upper end of the fin, the fin conducts heat, transfer the heat of the product, absorb through the coolant in the water-cooling tank, avoid accumulating heat, the semiconductor refrigerating sheet refrigerates, make the coolant temperature in the water-cooling tank reduce, guarantee the fin continuously cool the product, the heat that the semiconductor refrigerating sheet produces dispels the heat through the cooling tube, then discharge from the cooling port, the heat-insulating coating avoids the heat in the cooling tube to transfer to the product, avoid the product to bond the dust because of radium carving the temperature is overheated;
2. According to the utility model, the fixing assembly is arranged, the handle is pulled to enable the fixing pin to be retracted into the movable groove, the reset spring is compressed, the sealing plate is placed in the middle of the product positioning plate, the handle is released, the fixing pin moves back under the elastic force of the reset spring, the fixing pin is inserted into the pin hole, rapid installation of the sealing plate is realized, time and labor are saved, and the use is convenient.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic diagram of a water-cooled heat sink assembly according to the present utility model;
FIG. 3 is a schematic view of the position structure of a semiconductor refrigeration sheet according to the present utility model;
FIG. 4 is a schematic view of a fixing assembly according to the present utility model;
The device comprises a sealing plate 1, a fixing assembly 2, a movable groove 21, a handle 22, a 23, a fixing pin 24, a reset spring 3, a pin hole 4, a product positioning plate 5, a sealing shell 6, a base 7, a negative pressure air inlet pipe 8, a product placing table 9, a water cooling heat dissipation assembly 91, a water cooling groove 92, a heat dissipation sheet 93, a mounting groove 94, a heat dissipation tube 95, a heat dissipation hole 96, a semiconductor refrigerating sheet 97, a heat insulation coating 10, a heat dissipation opening 11 and a product placing pad.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
Referring to fig. 1-4, the novel high Wen Leidiao dust bonding prevention mechanism comprises a base 6, a sealing shell 5 is arranged at the upper end of the base 6, a product placement table 8 is arranged in the middle of the upper end of the base 6, a product positioning plate 4 is arranged in the middle of the sealing shell 5, a sealing plate 1 is arranged in the middle of the product positioning plate 4, a water cooling and heat dissipation component 9 is arranged in the middle of the product placement table 8, a product placement pad 11 is arranged at the periphery of the upper end of the product placement table 8, heat dissipation openings 10 are arranged at two sides of the sealing shell 5, fixing components 2 are arranged at two sides of the sealing plate 1, pin holes 3 are arranged at two sides of a middle groove of the product positioning plate 4, and negative pressure air inlet pipes 7 are arranged at the sides of the base 6 and the sealing shell 5.
Specifically, the water cooling assembly 9 includes a water cooling tank 91, a heat sink 92 and a heat sink 95, wherein, the water cooling tank 91 is provided in the product placing table 8, the heat sink 92 is provided at the upper end of the water cooling tank 91, a plurality of heat sinks 95 are provided on the surface of the heat sink 92, and the upper end of the heat sink 92 is flush with the product placing pad 11.
Through adopting above-mentioned technical scheme, the product bottom contacts with the upper end of fin 92, and fin 92 heat conduction is with product heat conduction, absorbs through the coolant liquid in the water-cooling tank 91, avoids the heat accumulation.
Specifically, the water cooling assembly 9 further comprises a mounting groove 93, a radiating pipe 94 and a semiconductor refrigerating piece 96, wherein the bottom of the product placement table 8 is provided with the mounting groove 93, the semiconductor refrigerating piece 96 is arranged in the middle of the mounting groove 93, and the radiating pipes 94 are arranged on two sides of the mounting groove 93.
Through adopting above-mentioned technical scheme, the semiconductor refrigeration piece 96 refrigerates, makes the interior coolant liquid temperature of water-cooling tank 91 reduce, guarantees that fin 92 is continuous to the product cooling, and the heat that semiconductor refrigeration piece 96 produced is through cooling tube 94 heat dissipation, then discharges from thermovent 10.
Specifically, the surface of the radiating pipe 94 is provided with a heat-insulating coating 97, and the side edge of the radiating pipe 94 is tightly attached to the radiating port 10.
By adopting the above technical scheme, the heat-insulating coating 97 prevents heat in the radiating pipe 94 from being transferred to the product, and ensures the radiating effect.
When the embodiment is used, a product is placed on the product placing pad 11, then the protective pad and the sealing plate 1 are placed above and fixed, the bottom of the product is contacted with the upper end of the cooling fin 92, the product is processed through the radium carving processing opening in the middle of the sealing plate 1, and the negative pressure air inlet pipe 7 continuously sucks air into the sealed shell 5 when radium carving is carried out, so that heat, dust and the like generated during radium carving are sucked to the outside of the sealed shell 5 by the negative pressure air inlet pipe 7, the cooling fin 92 conducts heat, the heat of the product is conducted, the cooling liquid in the water cooling tank 91 is absorbed, heat accumulation is avoided, the semiconductor cooling fin 96 cools, the temperature of the cooling liquid in the water cooling tank 91 is reduced, the cooling fin 92 is guaranteed to continuously cool the product, the heat generated by the semiconductor cooling fin 96 is radiated through the cooling pipe 94, and then discharged from the cooling opening 10, and the heat insulation coating 97 prevents the heat in the cooling pipe 94 from being transmitted to the product, and the product is prevented from adhering to dust due to overheat due to the carving temperature;
Example 1
The embodiment is different from the embodiment 1 in that the fixed assembly 2 comprises a movable groove 21, a handle 22, a fixed pin 23 and a return spring 24, wherein the movable groove 21 is arranged on two sides of the sealing plate 1, the return spring 24 is arranged in the movable groove 21, the fixed pin 23 is connected to the side edge of the return spring 24, and the handle 22 is arranged on one side, close to the return spring 24, of the upper end of the fixed pin 23.
Through adopting above-mentioned technical scheme, pulling handle 22 makes fixed pin 23 draw in movable groove 21, and reset spring 24 compresses, and closing plate 1 is placed in the middle of product locating plate 4 after, unclamp handle 22, and fixed pin 23 moves back under reset spring 24's elasticity effect, and fixed pin 23 inserts in pinhole 3, realizes quick installation, labour saving and time saving.
Specifically, the fixing pin 23 is always inserted into the pin hole 3 by the elastic force of the return spring 24.
Through adopting above-mentioned technical scheme, fixed pin 23 inserts in pinhole 3 under reset spring 24's elasticity effect, realizes quick installation, avoids fixed pin 23 to drop easily.
When the embodiment is used, a product is placed on the product placing pad 11, then a protection pad is placed above the product placing pad, the handle 22 is pulled to enable the fixing pin 23 to be retracted into the movable groove 21, the reset spring 24 is compressed, the handle 22 is loosened after the sealing plate 1 is placed in the middle of the product positioning plate 4, the fixing pin 23 moves back under the elastic force of the reset spring 24, the fixing pin 23 is inserted into the pin hole 3, rapid installation is achieved, time and labor are saved, and the use is convenient.
When the heat radiation device is used, a product is placed on the product placing pad 11, then a protective pad is placed above the product placing pad, the handle 22 is pulled to enable the fixing pin 23 to be retracted into the movable groove 21, the reset spring 24 is compressed, the sealing plate 1 is placed in the middle of the product positioning plate 4, then the handle 22 is loosened, the fixing pin 23 moves back under the elastic force of the reset spring 24, the fixing pin 23 is inserted into the pin hole 3, rapid installation is realized, the bottom of the product is contacted with the upper end of the radiating fin 92, the product is processed through a radium carving processing opening in the middle of the sealing plate 1, while radium carving is carried out, the negative pressure air inlet pipe 7 continuously sucks the inside of the sealing shell 5, so that heat, dust and the like generated during radium carving are sucked to the outside of the sealing shell 5 by the negative pressure air inlet pipe 7, the radiating fin 92 conducts heat, the heat of the product is absorbed through cooling liquid in the water cooling groove 91, heat accumulation is avoided, the semiconductor cooling fin 96 cools, the temperature of the cooling liquid in the water cooling groove 91 is reduced, the product cooling is ensured, the product cooling is continuously carried out by the radiating fin 92, the heat generated by the semiconductor cooling fin 96 is enabled to pass through the pipe 94, and then the heat radiation coating 10 is discharged from the radiating opening 10 to the radiating heat radiation layer 97, and the heat is prevented from being adhered to the product.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The novel anti-high Wen Leidiao dust bonding mechanism comprises a base (6), a sealing shell (5) is arranged at the upper end of the base (6), a product placement table (8) is arranged in the middle of the upper end of the base (6), a product positioning plate (4) is arranged in the middle of the sealing shell (5), and a sealing plate (1) is arranged in the middle of the product positioning plate (4), and is characterized in that a water cooling assembly (9) is arranged in the middle of the product placement table (8), product placement pads (11) are arranged at the periphery of the upper end of the product placement table (8), heat dissipation ports (10) are arranged at two sides of the sealing shell (5), fixing assemblies (2) are arranged at two sides of a middle groove of the sealing plate (1), pin holes (3) are formed in two sides of the middle groove of the product positioning plate (4), and negative pressure air inlet pipes (7) are arranged at the sides of the base (6) and the sealing shell (5).
2. The novel anti-high Wen Leidiao dust bonding mechanism according to claim 1, wherein the water cooling heat dissipation assembly (9) comprises a water cooling groove (91), heat dissipation fins (92) and heat dissipation holes (95), wherein the water cooling groove (91) is arranged in the product placement table (8), the heat dissipation fins (92) are arranged at the upper end of the water cooling groove (91), a plurality of heat dissipation holes (95) are formed in the surface of the heat dissipation fins (92), and the upper ends of the heat dissipation fins (92) are flush with the product placement pad (11).
3. The novel anti-high Wen Leidiao dust bonding mechanism according to claim 2, wherein the water-cooling heat dissipation assembly (9) further comprises a mounting groove (93), a heat dissipation pipe (94) and a semiconductor refrigerating sheet (96), wherein the bottom of the product placement table (8) is provided with the mounting groove (93), the semiconductor refrigerating sheet (96) is arranged in the middle of the mounting groove (93), and the heat dissipation pipes (94) are arranged on two sides of the mounting groove (93).
4. The novel anti-high Wen Leidiao dust bonding mechanism according to claim 3, wherein a heat-insulating coating (97) is arranged on the surface of the radiating pipe (94), and the side edge of the radiating pipe (94) is tightly attached to the radiating opening (10).
5. The novel anti-high Wen Leidiao dust bonding mechanism according to claim 1, wherein the fixing component (2) comprises a movable groove (21), a handle (22), fixing pins (23) and a return spring (24), wherein the movable groove (21) is arranged on two sides of the sealing plate (1), the return spring (24) is arranged in the movable groove (21), the fixing pins (23) are connected to the side edges of the return spring (24), and the handle (22) is arranged on one side, close to the return spring (24), of the upper end of the fixing pins (23).
6. The novel dust bonding mechanism for preventing high Wen Leidiao is characterized in that the fixing pin (23) is always inserted into the pin hole (3) under the action of the elastic force of the return spring (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422309301.4U CN223222688U (en) | 2024-09-20 | 2024-09-20 | A new type of high temperature resistant laser engraving dust bonding mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422309301.4U CN223222688U (en) | 2024-09-20 | 2024-09-20 | A new type of high temperature resistant laser engraving dust bonding mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223222688U true CN223222688U (en) | 2025-08-15 |
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ID=96693266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202422309301.4U Active CN223222688U (en) | 2024-09-20 | 2024-09-20 | A new type of high temperature resistant laser engraving dust bonding mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223222688U (en) |
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2024
- 2024-09-20 CN CN202422309301.4U patent/CN223222688U/en active Active
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