CN223192356U - Infrared sensor and detection assembly - Google Patents
Infrared sensor and detection assemblyInfo
- Publication number
- CN223192356U CN223192356U CN202422275054.0U CN202422275054U CN223192356U CN 223192356 U CN223192356 U CN 223192356U CN 202422275054 U CN202422275054 U CN 202422275054U CN 223192356 U CN223192356 U CN 223192356U
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Abstract
本实用新型公开一种红外传感器及检测组件，涉及半导体技术领域，红外传感器包括隔热外壳、感应芯片和信号采集芯片，隔热外壳具有腔体以及与腔体连通的连接孔；感应芯片设于隔热外壳，用于在感应到红外信号时输出感应信号；信号采集芯片包括芯片本体、第一导电件和第二导电件，芯片本体设于腔体内，第一导电件设于芯片本体并与感应芯片电连接，第二导电件设于芯片本体并从连接孔伸出，用于与电路板电连接；芯片本体用于采集感应芯片输出的感应信号，并将采集到的感应信号转发至电路板。本实用新型的技术方案可以提高红外传感器在装配上的便捷性及效率。
This utility model discloses an infrared sensor and detection assembly, relating to the field of semiconductor technology. The infrared sensor includes a heat-insulating housing, a sensing chip, and a signal acquisition chip. The heat-insulating housing has a cavity and a connection hole connected to the cavity. The sensing chip is disposed in the heat-insulating housing and is configured to output a sensing signal when it senses an infrared signal. The signal acquisition chip includes a chip body, a first conductive member, and a second conductive member. The chip body is disposed in the cavity. The first conductive member is disposed in the chip body and electrically connected to the sensing chip. The second conductive member is disposed in the chip body and extends through the connection hole for electrical connection to a circuit board. The chip body is configured to collect the sensing signal output by the sensing chip and forward the collected sensing signal to the circuit board. The technical solution of this utility model can improve the convenience and efficiency of infrared sensor assembly.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to an infrared sensor and a detection assembly.
Background
The existing infrared sensor is generally in direct insertion type, an inserting piece is needed to be used in assembly, the infrared sensor is inserted on a circuit board, after the insertion is completed, the connection part of the infrared sensor and the circuit board is welded and fixed, and finally redundant pins are manually sheared off.
Disclosure of utility model
The utility model mainly aims to provide an infrared sensor and a detection assembly, and aims to improve convenience and efficiency of the infrared sensor in assembly.
To achieve the above object, the present utility model provides an infrared sensor comprising:
a heat insulation housing having a cavity and a connection hole communicating with the cavity;
the induction chip is arranged on the heat insulation shell and is used for outputting induction signals when sensing infrared signals;
The signal acquisition chip comprises a chip body, a first conductive piece and a second conductive piece, wherein the chip body is arranged in the cavity, the first conductive piece is arranged on the chip body and is electrically connected with the induction chip, the second conductive piece is arranged on the chip body and extends out of the connecting hole and is used for being electrically connected with the circuit board, and the chip body is used for acquiring induction signals output by the induction chip and forwarding the acquired induction signals to the circuit board.
In an embodiment, the heat-insulating shell comprises a heat-insulating bottom plate and a shell body which is connected with the heat-insulating bottom plate and encloses to form the cavity, and the heat-insulating bottom plate is provided with the connecting hole.
In an embodiment, the heat insulation bottom plate is provided with a limit groove, the bottom of the chip body is arranged in the limit groove, the top of the chip body extends out of the limit groove, and the first conductive piece and the second conductive piece are respectively arranged at the top of the chip body.
In an embodiment, the shell body extends outwards to form a fixing portion, and one side, facing the heat insulation bottom plate, of the fixing portion is fixedly attached to the heat insulation bottom plate.
In an embodiment, the second conductive member includes a first electrical connection portion and a second electrical connection portion, the first electrical connection portion is disposed on the chip body, one end of the second electrical connection portion is connected to the first electrical connection portion, and the other end of the second electrical connection portion extends from the connection hole and then bends towards the width direction of the chip body.
In one embodiment, the plurality of second conductive members are arranged at intervals along the length direction of the chip body, the plurality of connecting holes are arranged, and the plurality of second conductive members extend out of the plurality of connecting holes one by one.
In an embodiment, the signal acquisition chip is an SOP8 chip;
And/or, the first conductive element is a bonding pad;
and/or, the second conductive piece is a pin.
In an embodiment, the infrared sensor further includes a filter, where the filter is disposed on the heat insulation housing and is disposed towards the sensing chip, and the filter is used for filtering light rays other than infrared light.
In an embodiment, the infrared sensor further includes a conductive bracket, where the conductive bracket is disposed in the cavity, and the conductive bracket electrically connects the sensing chip and the first conductive member.
The utility model also proposes a detection assembly comprising a circuit board and/or an infrared sensor as described above.
The technical scheme includes that the heat insulation shell, the induction chip and the signal acquisition chip are arranged, the heat insulation shell is provided with a cavity and a connecting hole communicated with the cavity, the induction chip is arranged on the heat insulation shell and used for outputting induction signals when sensing infrared signals, the signal acquisition chip comprises a chip body, a first conductive piece and a second conductive piece, the chip body is arranged in the cavity, the first conductive piece is arranged on the chip body and is electrically connected with the induction chip, the second conductive piece is arranged on the chip body and extends out of the connecting hole, and therefore when the infrared sensor is actually applied, the second conductive piece can be directly electrically connected with a circuit board outside the heat insulation shell, connection by using an insert is not needed, and welding and fixing of the connecting position between the second conductive piece and the circuit board are not needed, so that the electric connection between the signal acquisition chip and the circuit board can be realized, the chip body can acquire induction signals output by the induction chips and transmit the acquired induction signals to the circuit board, and therefore signal transmission is realized, the structure of the infrared sensor is simplified, and convenience and efficiency of the infrared sensor in assembly are improved. In addition, the utility model has simple structure and convenient installation, and can test the induction chip and the signal acquisition chip to judge whether the chip is normal or not and reassemble the chip, thereby improving the production yield.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic structural view of an infrared sensor according to the present utility model;
FIG. 2 is a front view of FIG. 1;
FIG. 3 is a rear view of FIG. 1;
Fig. 4 is an exploded view of fig. 1.
Reference numerals illustrate:
100. The infrared sensor comprises an infrared sensor, a heat insulation shell, 11 parts, a heat insulation bottom plate, 111 parts, a connecting hole, 112 parts, a limiting groove, 12 parts, a shell body, 13 parts, a fixing part, 2 parts, an induction chip, 3 parts, a signal acquisition chip, 31 parts, a chip body, 32 parts, a first conductive piece, 33 parts, a second conductive piece, 331 parts, a first electric connecting part, 332 parts, a second electric connecting part, 4 parts, a light filter piece, 5 parts and a conductive bracket.
The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The existing infrared sensor is generally in direct insertion type, an inserting piece is needed to be used in assembly, the infrared sensor is inserted on a circuit board, after the insertion is completed, the connection part of the infrared sensor and the circuit board is welded and fixed, and finally redundant pins are manually sheared off.
Therefore, the present utility model provides an infrared sensor 100, which aims to improve the convenience and efficiency of the assembly of the infrared sensor 100.
Referring to fig. 1 to 4, in an embodiment of the present utility model, the infrared sensor 100 includes:
a heat insulating housing 1 having a cavity and a connection hole 111 communicating with the cavity;
The induction chip 2 is arranged on the heat insulation shell 1 and is used for outputting induction signals when sensing infrared signals;
The signal acquisition chip 3 comprises a chip body 31, a first conductive piece 32 and a second conductive piece 33, wherein the chip body 31 is arranged in the cavity, the first conductive piece 32 is arranged on the chip body 31 and is electrically connected with the induction chip 2, the second conductive piece 33 is arranged on the chip body 31 and extends out of the connecting hole 111 and is electrically connected with the circuit board, and the chip body 31 is used for acquiring induction signals output by the induction chip 2 and forwarding the acquired induction signals to the circuit board.
In the present embodiment, the heat insulating housing 1 may be designed according to the mounting requirements of the sensing chip 2 and the signal acquisition chip 3. As an example, the heat insulation housing 1 has a cylindrical structure, the heat insulation housing 1 has a cavity and a connection hole 111 communicating with the cavity, and the connection hole 111 is provided at the bottom of the heat insulation housing 1. The heat insulating housing 1 is made of a heat insulating material, and heat generated by the circuit board is isolated outside the heat insulating housing 1 as much as possible through the heat insulating housing 1, so that the influence of the heat on electric components in the heat insulating housing 1 is reduced.
The sensing chip 2 may be implemented as a ceramic sensing chip. The ceramic sensing piece can be arranged in the cavity of the heat insulation shell 1 or on the heat insulation shell 1. When the ceramic sensing piece is arranged in the cavity of the heat insulation shell 1, the heat insulation shell 1 is also provided with an opening communicated with the cavity, the position of the opening is correspondingly arranged with the position of the ceramic sensing piece, so that visible light and infrared signals of the external environment can be irradiated to the ceramic sensing piece through the opening, the ceramic sensing piece generates sensing signals and outputs the sensing signals to the signal acquisition chip 3 when sensing the infrared signals, and when the ceramic sensing piece is arranged on the heat insulation shell 1 and is positioned outside the heat insulation shell 1, the visible light and the infrared signals of the external environment are directly irradiated to the ceramic sensing piece, and when the ceramic sensing piece senses the infrared signals, sensing signals are generated and output to the signal acquisition chip 3.
The signal acquisition chip 3 may be implemented as an SOP8 chip. The SOP8 chip has the characteristics of small volume, low power consumption, excellent performance, easy integration and the like, and can effectively reduce the volume of the infrared sensor 100 and reduce the power consumption thereof. The SOP8 chip includes a chip body 31, a first conductive member 32, and a second conductive member 33. The chip body 31 is mounted in the cavity to reduce the influence of factors in the external environment on it. The first conductive member 32 may be implemented as a pad fixedly and electrically connected to the chip body 31 and electrically connected to the sensing chip 2, that is, the pad electrically connects the chip body 31 and the sensing chip 2. The second conductive piece 33 can be realized by adopting a pin, the welding pin is fixedly connected and electrically connected to the chip body 31, and extends out of the heat insulation shell 1 from the connecting hole 111, so that when the heat insulation shell is in practical application, the pin can be directly electrically connected with a circuit board of a product outside the heat insulation shell 1, an insert is not required to be manually used for connection, and the connection part between the second conductive piece 33 and the circuit board is not required to be manually welded, so that the connection between the signal acquisition chip 3 and the circuit board can be realized, the chip body 31 can acquire an induction signal output by the induction chip 2, and the acquired induction signal is forwarded to the circuit board, thereby realizing the signal transmission. Through the connection mode, the structure of the infrared sensor 100 can be simplified, and convenience and efficiency of the infrared sensor 100 in assembly can be improved.
According to the technical scheme, the heat insulation shell 1, the induction chip 2 and the signal acquisition chip 3 are arranged, the heat insulation shell 1 is provided with a cavity and a connecting hole 111 communicated with the cavity, the induction chip 2 is arranged on the heat insulation shell 1 and used for outputting induction signals when sensing infrared signals, the signal acquisition chip 3 comprises a chip body 31, a first conductive piece 32 and a second conductive piece 33, the chip body 31 is arranged in the cavity, the first conductive piece 32 is arranged on the chip body 31 and is electrically connected with the induction chip 2, the second conductive piece 33 is arranged on the chip body 31 and extends out of the connecting hole 111, and therefore in actual application, the second conductive piece 33 can be directly electrically connected with a circuit board outside the heat insulation shell 1 without using an insert for connection, and the electric connection between the signal acquisition chip 3 and the circuit board can be realized without manually welding and fixing the connecting part between the second conductive piece 33 and the circuit board, so that the chip body 31 can acquire the induction signals output by the induction chip 2 and transmit the acquired induction signals to the circuit board, and the signal transmission is realized, the structure of the infrared sensor 100 is simplified, and the efficiency of the infrared sensor 100 is improved, and the assembly efficiency is convenient and the assembly is realized. In addition, the utility model has simple structure and convenient installation, and can test the induction chip 2 and the signal acquisition chip 3 to judge whether the chips are normal or not and reassemble the chips, thereby improving the production yield.
It will be appreciated that the heat insulation housing 1 can be implemented in various manners, and referring to fig. 4, in an embodiment of the present utility model, the heat insulation housing 1 includes a heat insulation base plate 11 and a housing body 12 connected to the heat insulation base plate 11 to form the cavity, and the heat insulation base plate 11 is provided with the connection hole 111.
In this embodiment, the heat insulation housing 1 is configured as a split structure of the heat insulation bottom plate 11 and the housing body 12, so that the sensor chip 2 and the signal acquisition chip 3 can be conveniently arranged in the housing body 12, the convenience of the assembly of the infrared sensor 100 is improved, the connecting hole 111 is formed in the heat insulation bottom plate 11, when the heat insulation bottom plate 11 is placed on the circuit board, the second conductive piece 33 can be directly electrically connected with the circuit board through the connecting hole 111, the convenience of connection of the two is improved, and meanwhile, the connection distance between the second conductive piece 33 and the circuit board is shortened, so that the second conductive piece 33 can be designed to be smaller, and the volume of the infrared sensor 100 is reduced. In addition, the heat insulation bottom plate 11 is made of heat insulation materials, heat of the circuit board is insulated, and the influence of the heat on the chip is reduced.
Alternatively, the connection between the insulating base plate 11 and the case body 12 may be a fixed connection, such as welding, or may be a detachable connection, such as a magnetic connection, a plug connection, a snap connection, or the like.
If the heat insulation bottom plate 11 is fixedly connected with the shell body 12, the structural stability of the heat insulation shell 1 can be improved in a fixed mode, and if the heat insulation bottom plate 11 is detachably connected with the shell body 12, when the induction chip 2 or the signal acquisition chip 3 is damaged, the heat insulation shell 1 can be detached to realize maintenance or replacement of the induction chip 2 or the signal acquisition chip 3, so that the maintenance or replacement convenience of related components is improved.
According to the above, in order to enhance the mounting of the chip body 31, referring to fig. 4, in an embodiment of the present utility model, the heat insulation bottom plate 11 is provided with a limit groove 112, the bottom of the chip body 31 is disposed in the limit groove 112, the top of the chip body 31 extends out of the limit groove 112, and the first conductive member 32 and the second conductive member 33 are separately disposed on the top of the chip body 31.
In this embodiment, a limiting groove 112 is disposed on one side of the heat insulation bottom plate 11 located in the cavity, the bottom of the chip body 31 is adapted to be installed in the limiting groove 112 to fix the chip body 31, and the top of the chip body 31 extends out of the limiting groove 112, so as to conveniently set the first conductive member 32 and the second conductive member 33. The first conductive member 32 is disposed on the top surface of the chip body 31 to facilitate the electrical connection with the sensing chip 2, and the second conductive member 33 is disposed on the side surface of the chip body 31 to shorten the height distance between the chip body and the connection hole 111 and reduce the volume thereof.
Referring to fig. 4, in an embodiment of the present utility model, the casing body 12 extends outward to form a fixing portion 13, and the fixing portion 13 is fixedly attached to the heat insulation bottom plate 11 towards one side of the heat insulation bottom plate 11, so that a gap between the casing body 12 and the heat insulation bottom plate 11 due to connection can be reduced, sealability in a cavity of the heat insulation casing 1 is improved, dust and other substances entering the cavity is reduced, and life of devices in the cavity is prolonged.
It can be appreciated that the second conductive member 33 may be implemented in various manners, referring to fig. 4, in an embodiment of the present utility model, the second conductive member 33 includes a first electrical connection portion 331 and a second electrical connection portion 332, the first electrical connection portion 331 is disposed on the chip body 31, one end of the second electrical connection portion 332 is connected to the first electrical connection portion 331, and the other end of the second electrical connection portion 332 extends from the connection hole 111 in a bending manner in a width direction of the chip body 31.
In order to ensure normal transmission of signals, referring to fig. 4, in an embodiment of the present utility model, a plurality of second conductive members 33 are provided, a plurality of second conductive members 33 are spaced apart along the length direction of the chip body 31, a plurality of connection holes 111 are provided, and a plurality of second conductive members 33 are protruded from the plurality of connection holes 111 one-to-one for electrical connection with a circuit board. By the above arrangement, even if one or both of the second conductive members 33 are damaged or the connection is unstable, the other normal second conductive members 33 can maintain the connection of the infrared sensor 100 with the circuit board, thereby ensuring the normal transmission of signals.
Referring to fig. 4, in an embodiment of the present utility model, the infrared sensor 100 further includes a filter 4, where the filter 4 is disposed on the heat insulation housing 1 and is disposed towards the sensing chip 2, and the filter 4 is used for filtering light rays other than infrared light.
In this embodiment, the filter 4 may be implemented by using a filter that is mounted on the heat insulating housing 1 and disposed toward the sensing chip 2. The optical filter is used for filtering light except infrared light, so that the sensing chip 2 can quickly and accurately sense the infrared signal and output sensing signals to the signal acquisition chip 3, and the sensing signals are forwarded to the circuit board by the signal acquisition chip 3, so that the efficiency of signal transmission is improved.
In order to reduce the heating of the sensing chip 2, referring to fig. 4, in an embodiment of the present utility model, the infrared sensor 100 further includes a conductive bracket 5, where the conductive bracket 5 is disposed in the cavity, and the conductive bracket 5 electrically connects the sensing chip 2 and the first conductive member 32.
In this embodiment, the cavity of the heat insulation housing 1 is further provided with a conductive bracket 5, the conductive bracket 5 is located between the chip body 31 and the sensing chip 2, one end of the conductive bracket 5 is electrically connected to the sensing chip 2, the other end of the conductive bracket 5 is electrically connected to the first conductive member 32, that is, the conductive bracket 5 is used as a connection medium between the sensing chip 2 and the first conductive member 32, so that the number of structural layers is increased, heat conducted from the circuit board to the signal acquisition chip 3 to the sensing chip 2 can be isolated, heating of the sensing chip 2 is reduced, signal fluctuation of the sensing chip 2 is reduced, and detection performance of the infrared sensor 100 is improved.
The utility model also provides a detection assembly comprising a circuit board, and/or an infrared sensor 100, wherein the specific structure of the infrared sensor 100 refers to the above embodiment, and the detection assembly at least has all the beneficial effects brought by the technical solutions of the above embodiments because the detection assembly adopts all the technical solutions of the above embodiments, which are not described in detail herein.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.
Claims (10)
1. An infrared sensor, comprising:
a heat insulation housing having a cavity and a connection hole communicating with the cavity;
the induction chip is arranged on the heat insulation shell and is used for outputting induction signals when sensing infrared signals;
The signal acquisition chip comprises a chip body, a first conductive piece and a second conductive piece, wherein the chip body is arranged in the cavity, the first conductive piece is arranged on the chip body and is electrically connected with the induction chip, the second conductive piece is arranged on the chip body and extends out of the connecting hole and is used for being electrically connected with the circuit board, and the chip body is used for acquiring induction signals output by the induction chip and forwarding the acquired induction signals to the circuit board.
2. The infrared sensor of claim 1, wherein the heat-insulating housing comprises a heat-insulating base plate and a housing body connected with the heat-insulating base plate to enclose the cavity, and the heat-insulating base plate is provided with the connecting hole.
3. The infrared sensor of claim 2, wherein the heat-insulating base plate is provided with a limit groove, the bottom of the chip body is arranged in the limit groove, the top of the chip body extends out of the limit groove, and the first conductive member and the second conductive member are respectively arranged at the top of the chip body.
4. The infrared sensor of claim 2, wherein the housing body is outwardly extended with a fixing portion fixedly attached to the heat insulation base plate toward one side of the heat insulation base plate.
5. The infrared sensor of claim 1, wherein the second conductive member comprises a first electrical connection portion and a second electrical connection portion, the first electrical connection portion is disposed on the chip body, one end of the second electrical connection portion is connected to the first electrical connection portion, and the other end of the second electrical connection portion extends from the connection hole in a bending manner in a width direction of the chip body.
6. The infrared sensor of claim 1, wherein the second conductive members are provided in plurality and the second conductive members are provided at intervals along the length direction of the chip body, the connection holes are provided in plurality, and the second conductive members are projected from the connection holes one by one.
7. The infrared sensor of claim 1, wherein the signal acquisition chip is an SOP8 chip;
And/or, the first conductive element is a bonding pad;
and/or, the second conductive piece is a pin.
8. The infrared sensor of claim 1, further comprising a filter disposed on the thermally insulating housing and oriented toward the sensing die, the filter configured to filter light other than infrared light.
9. The infrared sensor of claim 1, further comprising a conductive mount disposed within the cavity, the conductive mount electrically connecting the sense die and the first conductive member.
10. A sensing assembly comprising a circuit board and/or an infrared sensor as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422275054.0U CN223192356U (en) | 2024-09-18 | 2024-09-18 | Infrared sensor and detection assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422275054.0U CN223192356U (en) | 2024-09-18 | 2024-09-18 | Infrared sensor and detection assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223192356U true CN223192356U (en) | 2025-08-05 |
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ID=96574225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202422275054.0U Active CN223192356U (en) | 2024-09-18 | 2024-09-18 | Infrared sensor and detection assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223192356U (en) |
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- 2024-09-18 CN CN202422275054.0U patent/CN223192356U/en active Active
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