CN223182534U - Heat abstractor and contravariant boost all-in-one for all-in-one - Google Patents

Abstract

The present invention provides a heat dissipation device for an inverter-boost integrated machine and an inverter-boost integrated machine. The heat dissipation device for the inverter-boost integrated machine includes: a power conversion box for accommodating semiconductor power devices; a transformer room for accommodating a winding structure; a main power mechanism for driving a cooling airflow into the transformer room to dissipate heat from the transformer room; wherein the heat generated in the power conversion box is transported to the flow path of the cooling airflow in the transformer room by a cooling medium, wherein the cooling medium includes: a coolant or a heat conductor or a cooling airflow driven by a main power mechanism. The technical solution of the present invention solves the problem of high cost, high power consumption and high noise in the inverter-boost integrated machine in the prior art due to the provision of two sets of heat dissipation systems.

Description

Heat abstractor and contravariant boost all-in-one for all-in-one

Technical Field

The utility model relates to the technical field of inversion and boosting integrated machines, in particular to a heat dissipation device for an inversion and boosting integrated machine and the inversion and boosting integrated machine.

Background

The existing inversion boosting all-in-one machine comprises a Power Converter (PCS), a dry transformer and the like. The Power Converter (PCS) generally adopts an air cooling, liquid cooling or thermosiphon (phase change) mode to cool and dissipate heat of the semiconductor power device 3, wherein, as shown in fig. 1, the Power Converter (PCS) adopts an air cooling mode to dissipate heat, the fan 2 is arranged at the top of the power conversion box 1, the air firstly dissipates heat of the semiconductor power device 3, then blows to the reactor 5 to dissipate heat, and then brings the heat out of the power conversion box 1. The heating source of the transformer room 8, namely the high-low voltage winding and the iron core 7 are placed in the transformer room 1, forced air cooling is carried out through the fan 2 arranged in the transformer room, and heat is brought out of the transformer room 8 under the assistance of the cross-flow fan 6, so that the dry transformer is cooled. As shown in fig. 2, the Power Converter (PCS) dissipates heat by liquid cooling or thermosiphon (phase change), the semiconductor power device 3 in the power conversion box 1 is cooled on the evaporator 4, the heat is carried away by external wind through the condenser 9 under the action of one fan 2, and the reactor 5 is forced air cooled by the other fan 2. The heating source of the transformer room 8, namely the high-low voltage winding and the iron core, is arranged in the transformer room 1, forced air cooling is carried out through the fan 2 arranged in the transformer room, and heat is brought out of the transformer room 8 under the assistance of the cross-flow fan, so that the dry transformer is cooled.

In summary, in actual operation, the power conversion box and the transformer room have independent heat dissipation systems, and each set of heat dissipation system is equipped with the fan 2. However, the fans of the two sets of heat dissipation systems can cause higher cost and power consumption, and also cause higher noise of the inversion and boosting integrated machine.

Disclosure of utility model

The utility model mainly aims to provide a heat dissipation device for an inversion and boosting integrated machine and the inversion and boosting integrated machine, and solves the problems of high cost, power consumption and noise caused by the arrangement of two sets of heat dissipation systems in the inversion and boosting integrated machine in the prior art.

The utility model provides a heat dissipation device for an inversion boosting all-in-one machine, which comprises a power conversion box, a transformation room, a main power mechanism and a cooling medium, wherein the power conversion box is used for accommodating a semiconductor power device, the transformation room is used for accommodating a winding structure, the main power mechanism is used for driving cooling air flow to flow into the transformation room to dissipate heat of the transformation room, heat generated in the power conversion box is conveyed to a flow path of the cooling air flow of the transformation room by the cooling medium, and the cooling medium comprises cooling liquid or a heat conduction piece or the cooling air flow driven by the main power mechanism.

The heat dissipation device for the inversion boosting integrated machine further comprises an air duct shell, wherein the air duct shell is provided with an air inlet and an air outlet, the air inlet is communicated with the inside of the power conversion box, the air outlet is communicated with the inside of the transformation room, the power conversion box is provided with an air inlet, the transformation room is provided with an air outlet, and the main power mechanism drives cooling air to sequentially flow through the air inlet, the air outlet and the air outlet of the power conversion box.

Further, the heat dissipating device for the inversion and boost integrated machine further comprises a heat sink positioned in the power conversion box, and the heat sink is configured to dissipate heat of the semiconductor power device.

Further, the air inlet and the air flow inlet of the power conversion box are positioned at two sides of the radiator, and/or the air outlet and the air flow outlet of the transformer room are positioned at two sides of the winding structure.

Further, the power conversion box comprises a first box body and a second box body, wherein a condenser is arranged in the first box body, an evaporator used for radiating the semiconductor power device is arranged in the second box body, the first box body is provided with an air inlet and an air outlet, the second box body is provided with the air inlet and the air outlet, the air outlet of the first box body and the air outlet of the second box body are both communicated with the air inlet of the air duct shell, or the first box body is provided with the air inlet and the air outlet, the air outlet of the first box body is communicated with the air inlet of the air duct shell, or the first box body is provided with the air inlet and the air outlet, the air outlet of the second box body is communicated with the air inlet of the first box body, and the air outlet of the first box body is communicated with the air inlet of the air duct shell.

The power conversion box is internally provided with an evaporator, the semiconductor power device is connected with the evaporator in a thermal coupling way, the heat dissipation device for the inversion and boosting integrated machine further comprises a condenser communicated with the evaporator, the condenser is arranged in or on the transformation room, and the power conversion box and the transformation room are provided with an air inlet and an air outlet.

Further, the heat dissipation device for the inversion boosting integrated machine further comprises a heat dissipation structure, wherein the heat dissipation structure comprises a mounting piece and a plurality of heat dissipation pieces, the mounting piece is mounted on the air duct shell, the heat dissipation pieces are arranged on the mounting piece at intervals, one end of each heat dissipation piece stretches into the air duct shell, and the other end of each heat dissipation piece is located outside the air duct shell.

Further, an auxiliary power mechanism is arranged in the pressure changing room and used for accelerating the flow of cooling air flow.

Further, the main power mechanism comprises a fan, and at least one of the power conversion box, the transformation room and the air duct shell is provided with the fan.

Further, according to another aspect of the utility model, the utility model provides an inversion and boosting integrated machine, which comprises the heat dissipation device for the inversion and boosting integrated machine, a winding structure, a semiconductor power device and a power conversion box, wherein the winding structure is arranged in a transformation room.

Further, a reactor is arranged in the power conversion box or the transformation room.

By applying the technical scheme of the utility model, the heat generated in the power conversion box is transmitted to the flow path of the cooling airflow of the transformation room through the cooling medium, so that the power conversion box and the transformation room share the main power mechanism for heat dissipation, and compared with the prior art that the power converter and the dry transformation transformer are respectively provided with a set of heat dissipation system (namely, the inversion boosting integrated machine needs two sets of heat dissipation systems (namely, the main power mechanism), the heat dissipation of the power converter and the dry transformation transformer can be realized simultaneously by using one set of heat dissipation system (namely, the main power mechanism), thus the quantity of the heat dissipation systems (namely, the main power mechanism) can be reduced, the resource integration is realized, and the power consumption, the cost and the noise of the heat dissipation device for the inversion boosting integrated machine can be reduced.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model. In the drawings:

Fig. 1 shows a schematic structural diagram of an inversion and boosting integrated machine (radiating by adopting an air cooling mode) in the prior art;

fig. 2 shows a schematic structural diagram of an inversion and boosting integrated machine in the prior art (adopting liquid cooling, thermosiphon or vapor compression heat dissipation);

Fig. 3 is a schematic structural diagram of a first embodiment of the inversion boosting integrated machine of the present utility model;

fig. 4 shows a schematic structural diagram of a second embodiment of the inversion boosting integrated machine of the present utility model;

fig. 5 shows a schematic structural diagram of a third embodiment of the inversion boosting integrated machine of the present utility model;

fig. 6 shows a schematic structural diagram of a fourth embodiment of the inversion boosting integrated machine of the present utility model;

fig. 7 shows a schematic structural diagram of a fifth embodiment of the inversion boosting integrated machine of the present utility model;

fig. 8 shows a schematic structural diagram of a sixth embodiment of the inversion boosting integrated machine of the present utility model;

Fig. 9 shows a schematic structural diagram of a seventh embodiment of the inversion boosting integrated machine of the present utility model;

fig. 10 is a schematic diagram showing the structure of an embodiment eight of the inversion boosting integrated machine of the present utility model;

fig. 11 is a schematic diagram showing the structure of a ninth embodiment of the inversion boosting integrated machine of the utility model;

fig. 12 is a schematic diagram showing a structure of an embodiment ten of an inversion boosting integrated machine of the present utility model;

fig. 13 shows a schematic structural diagram of an eleventh embodiment of the inversion boosting integrated machine of the present utility model;

fig. 14 shows a schematic structural diagram of an embodiment twelve of the inversion boosting integrated machine of the present utility model;

fig. 15 is a schematic structural view showing a thirteenth embodiment of the inversion boosting integrated machine of the utility model;

fig. 16 is a schematic diagram showing the structure of an embodiment fourteen of an inversion boosting integrated machine of the present utility model;

fig. 17 is a schematic diagram showing the structure of an embodiment fifteen of the inversion boosting integrated machine of the present utility model;

fig. 18 shows a structural schematic diagram of an embodiment sixteen of the inversion boosting all-in-one machine of the present utility model;

FIG. 19 illustrates a schematic diagram of one embodiment of a heat dissipating structure of the inversion boost all-in-one machine of FIG. 3;

FIG. 20 is a schematic diagram illustrating another embodiment of a heat dissipation structure of the inversion and boost all-in-one machine of FIG. 3;

Fig. 21 shows an assembly structure schematic diagram of a heat dissipation structure of the inversion boosting integrated machine of fig. 3.

Wherein the above figures include the following reference numerals:

11. The device comprises a transformer room, 12 parts of auxiliary power mechanisms, 21 parts of power conversion boxes, 211 parts of first boxes, 212 parts of second boxes, 22 parts of main power mechanisms, 23 parts of radiators, 24 parts of semiconductor power devices, 25 parts of condensers, 26 parts of evaporators, 27 parts of reactors, 50 parts of air duct shells, 51 parts of air flow inlets, 52 parts of air flow outlets, 53 parts of installation parts, 54 parts of heat dissipation parts, 55 parts of winding structures and 56 parts of shielding members.

Detailed Description

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. The utility model will be described in detail below with reference to the drawings in connection with embodiments.

As shown in fig. 3 to 17, the present utility model provides a heat dissipating device for an inverter and booster integrated machine. The heat dissipation device for the inversion and boosting integrated machine comprises a power conversion box 21, a transformation room 11 and a main power mechanism 22, wherein the power conversion box 21 is used for accommodating a semiconductor power device 24, the transformation room 11 is used for accommodating a winding structure 55, the main power mechanism 22 is used for driving cooling air flow to flow into the transformation room 11 to dissipate heat of the transformation room 11, and heat generated in the power conversion box 21 is conveyed to a flow path of the cooling air flow of the transformation room 11 by a cooling medium, wherein the cooling medium comprises cooling liquid or a heat conducting piece or the cooling air flow driven by the main power mechanism.

In the above technical solution, the heat generated in the power conversion box 21 is transferred to the flow path of the cooling air flow of the transformer room 11 through the cooling medium, so that the power conversion box 21 and the transformer room 11 share the main power mechanism 22 to dissipate heat, and compared with the prior art that the power converter and the dry transformer are respectively provided with a set of heat dissipation system (i.e. the inversion boosting integrated machine needs two sets of heat dissipation systems (i.e. the main power mechanism), in the utility model, a set of heat dissipation system (namely the main power mechanism 22) can be utilized to simultaneously realize heat dissipation of the power converter and the dry transformer, so that the number of the heat dissipation systems (namely the main power mechanism 22) can be reduced, and the resource integration is realized, thereby reducing the power consumption, the cost and the noise of the heat dissipation device for the inversion and boosting integrated machine.

Specifically, as shown in fig. 3 to 18, in the embodiment of the present utility model, the main power mechanism 22 includes a blower, and at least one of the power conversion box 21, the transformer room 11, and the air duct housing 50 is provided with a blower. In this way, the fan may provide a cooling air flow to simultaneously cool the power conversion box 21 and the transformer room 11.

In the embodiment of the present utility model, the fan is disposed on the transformer room 11, which means that the fan may be disposed outside the transformer room 11, or may be disposed on a wall of the transformer room, that is, a groove is formed in the wall of the transformer room, and the fan is mounted in the groove, and similarly, the fan is disposed on the air duct housing 50, which means that the fan may be disposed outside the air duct housing 50, or may be disposed on a housing wall of the air duct housing 50.

As shown in fig. 3 to 18, in the embodiment of the present utility model, an auxiliary power unit 12 is provided in the variable pressure room 11, and the auxiliary power unit 12 is used for accelerating the flow of the cooling air.

Through the arrangement, when the main power mechanism 22 is utilized to radiate heat to the power conversion box 21 and the components in the transformer room 11, the air flow in the transformer room 11 can be smoothly discharged out of the transformer room 11 under the turbulence and the assistance of the auxiliary power mechanism 12, so as to assist in bringing the heat in the transformer room 11 to the outside.

Preferably, in an embodiment of the present utility model, the auxiliary power unit 12 is a crossflow blower.

As shown in fig. 3 to 17, an embodiment of the present utility model provides an inversion boosting integrated machine. The inverter and booster integrated machine comprises the heat dissipation device for the inverter and booster integrated machine, a winding structure 55 arranged in the transformation room 11, and a semiconductor power device 24 arranged in the power conversion box 21. In this way, the air flow generated by the main power mechanism 22 may dissipate heat from both the semiconductor power device 24 and the winding structure 55.

It should be noted that, in the embodiment of the present utility model, the semiconductor power device 24 is installed in the power conversion box 21 to form a Power Converter (PCS), and the winding structure 55 is located in the transformer room 11 to form a dry-type transformer.

Specifically, in an embodiment of the present utility model, the winding structure 55 includes a high-low voltage winding and an iron core.

Specifically, as shown in fig. 3, in the embodiment of the present utility model, two sides of the winding structure 55 are provided with shielding members 56, and the two shielding members 56 define an air flow channel for placing the winding structure 55, so that more air flows pass between the winding structures 55, thereby increasing the heat dissipation effect of the dry transformer.

Preferably, in the embodiment of the present utility model, the shielding member 56 is provided as a baffle plate, and as shown in fig. 3, both the left and right sides of the winding structure 55 are provided with baffle plates.

As shown in fig. 3 to 17, in the embodiment of the present utility model, a reactor 27 is provided in the power conversion box 21 or in the transformer room 11. In this way, the cooling air flow can be used to dissipate heat from the reactor 27. The reactor 27 is located in the power conversion box 21, and the cooling medium (the cooling medium may be the cooling air flow in the first embodiment or the cooling liquid in the thirteenth embodiment) may be used to transfer the heat generated by the reactor 27 to the flow path of the cooling air flow in the transformer room 11, and the reactor 27 is located in the transformer room 11, and the heat generated by the reactor 27 may be directly dissipated by the cooling air flow in the transformer room 11.

Further, when the reactor 27 is moved into the transformer room 11, the space in the transformer room 11 can be fully utilized to reduce the volume of the power conversion box 21, thereby improving the power density of the inversion-boost integrated machine.

Example 1

As shown in fig. 3, in the first embodiment of the utility model, the heat dissipating device for the inversion and boost integrated machine further comprises an air duct shell 50, which is provided with an air inlet 51 and an air outlet 52, wherein the air inlet 51 is communicated with the inside of the power conversion box 21, the air outlet 52 is communicated with the inside of the transformation room 11, the power conversion box 21 is provided with an air inlet, the transformation room 11 is provided with an air outlet, and the main power mechanism 22 drives cooling air to flow through the air inlet, the air inlet 51, the air outlet 52 and the air outlet of the transformation room 11 of the power conversion box 21 in sequence.

In the above technical solution, the power conversion box 21 and the inside of the transformer room 11 are communicated by additionally arranging the air duct shell 50, so that the air in the transformer room 11 and the air in the power conversion box 21 can circulate, and thus, the air flow generated by the main power mechanism 22 can enter the transformer room 11 from the power conversion box 21, and the heat dissipation of the dry transformer and the power converter can be realized by utilizing the main power mechanism 22, so that, on one hand, the number of the main power mechanism 22 can be reduced, and the power consumption, the cost and the noise of the heat dissipation device for the inversion and boosting integrated machine can be reduced, and on the other hand, the air duct shell 50 can guide the air flow to further reduce the noise of the air flow.

In fig. 3, in the first embodiment of the present utility model, the main power mechanism 22 includes a fan, the fan is located in the power conversion box 21, the cooling medium is a cooling air flow, and the fan drives the cooling air flow to transfer the heat generated in the power conversion box 21 to the flow path of the cooling air flow in the transformer room 11 through the air inlet, the air inlet 51 and the air outlet 52 of the power conversion box 21.

Specifically, as shown in fig. 3, in the first embodiment of the present utility model, a reactor 27 is provided in the power conversion box 21, and the cooling air flow in the power conversion box 21 transfers the heat generated by the reactor 27 to the flow path of the cooling air flow in the transformer room 11.

Specifically, in the first embodiment of the present utility model, the air duct case 50 may further provide a mounting space for noise reduction accessories (i.e., a heat dissipation structure described below).

As shown in fig. 19 to 21, in the first embodiment of the present utility model, the heat dissipating device for an inverter and booster integrated machine further includes a heat dissipating structure, the heat dissipating structure includes a mounting member 53 mounted on the air duct housing 50, and a plurality of heat dissipating members 54 disposed on the mounting member 53 at intervals, wherein one end of each heat dissipating member 54 extends into the air duct housing 50, and the other end of each heat dissipating member 54 is located outside the air duct housing 50. In this way, heat from the air duct housing 50 can be transferred to the external environment, thereby effectively reducing the temperature within the air duct housing 50, thereby increasing the heat dissipation effect of the power conversion box 21 or reducing the temperature entering the transformer room 11.

It should be noted that, a proper number, size, and model of heat dissipation members 54 may be selected according to the heat dissipation requirement, and a space for installing the mounting members 53 may be reserved on the air duct case 50 in advance. The manner of fixing the air duct case 50 to the heat dissipation mounting member 53 is not limited, such as a screw lock attachment.

In the first embodiment of the present utility model, a heat dissipation structure may be disposed on the wall of the power conversion box 21 and/or the wall of the transformer room 11 to increase the heat dissipation effect.

In the first embodiment of the present utility model, the heat sink 54 is a heat sink, for example, a double-sided relieved tooth structure, as shown in fig. 19, or the heat sink 54 may be a heat dissipation post, as shown in fig. 20.

As shown in fig. 3, in the first embodiment of the present utility model, the Power Converter (PCS) adopts an air-cooled heat dissipation mode, and the heat dissipation device for an inverter and boost integrated machine further includes a heat sink 23 located in the power conversion box 21, where the heat sink 23 is configured to dissipate heat from the semiconductor power device 24.

Through the arrangement, under the action of the main power mechanism 22, air flows into the power conversion box 21 through the air inlet of the power conversion box 21, the air flows in the power conversion box 21 through the radiator 23 and the reactor 27 and then is blown into the transformer room 11 through the air inlet 51, the air duct shell 50 and the air outlet 52, and the air flow in the transformer room 11 can smoothly flow out of the transformer room 11 through the auxiliary action of the auxiliary power mechanism 12, so that compared with the inversion boosting integrated machine (the power converter of which adopts an air cooling heat dissipation mode) in the prior art, the two fans are adopted to respectively realize the heat dissipation of the power converter and the dry transformer, the main power mechanism 22 in the transformer room 11 in the prior art can be omitted, the number of the main power mechanism 22 is reduced, the air flow generated by one main power mechanism 22 in the power conversion box 21 can enter the transformer room 11 to dissipate heat of the winding structure 55 in the transformer room 11, and can enter the power conversion box 21 to dissipate heat of the reactor 27 and the semiconductor power device 24 in the power conversion box 21, and therefore the cost of the inversion boosting integrated machine and the heat dissipation device can be reduced.

As shown in fig. 3, in the first embodiment of the present utility model, the air inlet and the air inlet 51 of the power conversion box 21 are located at both sides of the radiator 23, and/or the air outlet and the air outlet 52 of the transformer room 11 are located at both sides of the winding structure 55. In this way, the area of the cooling air flow through the heat sink and/or the winding structure 55 may be increased, thereby improving the heat dissipation.

Specifically, in the first embodiment of the present utility model, the main power mechanism 22 is disposed at the top of the power conversion box 21, and the reactor 27 is disposed below the semiconductor power device 24, so that the air flow firstly dissipates the heat of the semiconductor power device 24, then blows to the reactor 27 to dissipate the heat, and the air flow of the power conversion box 21 is guided into the transformer room 11 through the air duct shell 50, and the air flow can be more smoothly discharged out of the transformer room 11 through the winding structure 55 under the turbulence and the assistance of the original auxiliary power mechanism 12 of the transformer room 11.

In one embodiment, the primary power mechanism 22 may be provided only within the transformer substation 11.

Example two

As shown in fig. 4, the second embodiment of the present utility model is different from the first embodiment in that the main power mechanism 22 is placed at the bottom of the Power Converter (PCS) near one end of the duct case 50, so that the height of the power conversion case 21 can be reduced.

Other structures of the second embodiment are the same as those of the first embodiment, and will not be described here again.

Example III

The reactor 27 has a large wind resistance, so that the air flow generated by the main power mechanism 22 is blown to the transformer room 11 with a small air quantity and a high wind temperature. Therefore, as shown in fig. 5, the third embodiment of the present utility model is different from the first embodiment in that the reactor 27 in the power conversion box 21 can be moved into the transformer room 11 by structural deformation, so that the heat dissipation modes of the reactor 27 and the winding structure 55 are consistent, on one hand, the air output of the Power Converter (PCS) is increased and the air temperature is reduced, so that the heat dissipation effect of the dry transformer is further improved, and on the other hand, the space of the transformer room 11 can be fully utilized, the occupied space of the power conversion box 21 is reduced, and the power density of the inversion boosting integrated machine is improved.

Specifically, in the third embodiment of the present utility model, one of the two shielding members 56 is provided with a mounting through hole, and the reactor 27 is disposed in the mounting through hole.

Other structures of the third embodiment are the same as those of the first embodiment, and will not be described here again.

Example IV

As shown in fig. 6, the fourth embodiment of the present utility model is different from the second embodiment in that the reactor 27 in the power conversion box 21 can be moved into the transformer room 11 by structural deformation to make the heat dissipation modes of the reactor 27 and the winding structure 55 coincide, and at this time, the air output of the Power Converter (PCS) increases and the air temperature decreases, so that the heat dissipation effect of the dry transformer is further improved.

Other structures of the fourth embodiment are the same as those of the first embodiment, and will not be described here again.

Example five

As shown in fig. 7, the fifth embodiment of the present utility model is different from the first embodiment in that the main power mechanism 22 is disposed in the transformer room 11, that is, the main power mechanism 22 in the power conversion box 21 is moved to a side of the transformer room 11 near the air flow outlet 52, so that, on one hand, the space of the transformer room 11 can be fully utilized, the space occupied by the main power mechanism 22 in the power conversion box 21 is reduced, and the power density of the inversion boosting integrated machine is further improved, and on the other hand, the main power mechanism 22 is disposed in the transformer room 11, so that the heat dissipation of the Power Converter (PCS) and the dry transformer can be achieved by sharing one set of main power mechanism 22.

Other structures of the fifth embodiment are the same as those of the first embodiment, and will not be described here again.

Example six

As shown in fig. 8, the sixth embodiment of the present utility model is different from the third embodiment in that the main power mechanism 22 is disposed in the transformer room 11, that is, the main power mechanism 22 in the power conversion box 21 is moved to a side of the transformer room 11 near the air flow outlet 52, so that, on one hand, the space of the transformer room 11 can be fully utilized, the space occupied by the main power mechanism 22 in the power conversion box 21 is reduced, and the power density of the inversion boosting integrated machine is further improved, and on the other hand, the main power mechanism 22 is disposed in the transformer room 11, so that the heat dissipation of the Power Converter (PCS) and the dry transformer can be achieved by sharing one set of main power mechanism 22.

Other structures of the sixth embodiment are the same as those of the third embodiment, and will not be described here again.

Example seven

As shown in fig. 9, the seventh embodiment of the present utility model is different from the first embodiment in that the Power Converter (PCS) uses a heat dissipation mode of liquid cooling, thermosiphon or vapor compression refrigeration to dissipate heat, that is, the power converter 21 is not provided with the heat sink 23, the power converter 21 includes a first box 211 and a second box 212, the first box 211 is provided with the condenser 25, the second box 212 is provided with the evaporator 26 for dissipating heat of the semiconductor power device 24, the first box 211 has an air inlet and an air outlet, the second box 212 has an air inlet and an air outlet, and the air outlet of the first box 211 and the air outlet of the second box are both communicated with the air flow inlet 51 of the air duct shell 50.

Further, the reactor 27 is located in a case provided with the evaporator 26, and the main power mechanism 22 includes two fans, each of which is provided in the first case 211 and the second case 212.

Through the arrangement, under the action of the main power mechanism 22, air flows can enter the first box body 211 and the second box body 212 respectively through the two corresponding air inlets on the first box body 211 and the second box body 212, and the air flows in the first box body 211 and the second box body 212 can enter the air duct shell 50 through the two air inlets 51 respectively to be converged and blown to the transformer room 11 through the air flow outlet 52, so that the air flow in the second box body 212 can radiate the reactor 27, the air flow in the first box body 211 can radiate the condenser 25, and the air flow blown into the transformer room 11 from the air flow outlet 52 can radiate the transformer room 11 through turbulent flow and assistance of the auxiliary power mechanism 12, so as to radiate the winding structure 55 positioned in the transformer room 11, and thus, the number of the main power mechanism 22 can be reduced, and the power consumption, the cost and the noise of the radiating device for the inverter-integrated machine can be reduced.

In the seventh embodiment of the present utility model, the condenser 25 and the evaporator 26 are an evaporation end and a condensation end of the liquid cooling system, respectively.

Specifically, in the seventh embodiment of the present utility model, the semiconductor power device 24 is cooled at the evaporator 26, the heat thereof is carried away by the external wind through the condenser 25 of the first case 211, and the reactor 27 is placed in the second case 212 to be forced air-cooled by a fan.

Specifically, as shown in fig. 9, in the seventh embodiment of the present utility model, the air duct housing 50 includes a first housing section and a second housing section that are connected and disposed at an included angle to form an L-shaped air duct housing 50, the first housing section and the second housing section are respectively connected to the first box 211 and the second box 212, the first housing section is connected to the inside of the transformer room 11, and in one embodiment, the air duct housing 50 may also be V-shaped.

Example eight

As shown in fig. 10, the eighth embodiment of the present utility model is different from the seventh embodiment in that a fan is disposed in the transformer room 11, that is, the fan in the first box 211 is moved to a side close to the air flow outlet 52 in the transformer room 11, the fan in the second box 212 is removed, and the fan in the first box 211 and the fan in the second box 212 can be moved into the transformer room 11, so that the space of the transformer room 11 can be fully utilized, the space occupied by the main power mechanism 22 in the power conversion box 21 is reduced, the power density of the inversion boosting integrated machine is improved, and the two parts of heat dissipation can be completed by sharing one fan set for the dry transformer and the Power Converter (PCS).

Other structures of the eighth embodiment are the same as those of the seventh embodiment, and will not be described here again.

Example nine

As shown in fig. 11, the difference between the embodiment nine and the embodiment seven of the present utility model is that a fan is disposed in either one of the first box 211 and the second box 212 and a fan is disposed in the transformer room 11, that is, the fan in the second box 212 is remained, and only the fan in the first box 211 is moved to the side of the transformer room 11 near the air flow outlet 52, so that the problem that the reactor 27 is far away from the main power mechanism 22 can be avoided, and the same way, the two-part heat dissipation can be achieved by sharing one set of fan by the dry transformer and the Power Converter (PCS).

Other structures of the ninth embodiment are the same as those of the seventh embodiment, and will not be described here again.

Examples ten

As shown in fig. 12, the tenth embodiment of the present utility model is different from the seventh embodiment in that, firstly, the first box 211 has an air inlet and an air outlet, the air outlet of the first box 211 is communicated with the air inlet 51 of the air duct case 50, secondly, the reactor 27 is moved into the transformer room 11 through structural deformation to make the heat dissipation modes of the reactor 27 and the winding structure 55 consistent, and thirdly, a fan, namely, the fan of the power conversion case 21 is arranged in the first box 211.

Through the arrangement, under the action of the main power mechanism 22, air flows into the first box 211 through the air inlet of the first box 211 and then into the air duct shell 50 through the air inlet 51, and the air flow in the air duct shell 50 is led to the positions of the reactor 27 and the winding structure 55 through the air outlet 52, so that heat dissipation of the reactor 27 and the dry transformer is completed. In this way, on one hand, the space of the transformer room 11 can be fully utilized, the volume of the power conversion box 21 is reduced, and on the other hand, the wind temperature blown to the transformer room 11 from the power conversion box 21 is reduced while the number of main power mechanisms 22 is reduced, so that the heat dissipation effect of the dry transformer and the reactor 27 is improved, and the heat dissipation cost and the power consumption of the inversion and boosting integrated machine are further reduced.

Specifically, in the tenth embodiment of the present utility model, one of the two shielding members 56 is provided with a mounting through hole, and the reactor 27 is disposed in the mounting through hole.

Other structures of the tenth embodiment are the same as those of the seventh embodiment, and will not be described here again.

Example eleven

As shown in fig. 13, the eleventh embodiment of the present utility model is different from the tenth embodiment in that a fan is disposed in the transformer room 11, that is, the fan in the first housing 211 is moved to a side of the transformer room 11 close to the air flow outlet 52, so that the space of the transformer room 11 can be fully utilized, the space occupied by the main power mechanism 22 in the power conversion box 21 is reduced, and the power density of the inversion-boost integrated machine is improved.

Other structures of the eleventh embodiment are the same as those of the tenth embodiment, and will not be described here again.

Example twelve

As shown in fig. 14, the difference between the twelfth embodiment and the tenth embodiment of the present utility model is that the first box 211 has an air inlet and an air outlet, the second box 212 has an air inlet and an air outlet, the air outlet of the second box 212 is communicated with the air inlet of the first box 211, the air outlet of the first box 211 is communicated with the air inlet 51 of the air duct case 50, i.e. the first box 211 and the second box 212 are arranged in series, and the second box 212 is positioned at the left side of the first box 211.

Through the above arrangement, under the action of the main power mechanism 22, the air flow enters the second box 212 through the air inlet of the second box 212, then enters the air inlet of the first box 211 through the air outlet of the second box 212, then enters the air duct shell 50 through the air outlet of the first box 211 and the air flow inlet 51, and the air flow in the air duct shell 50 is led to the positions of the reactor 27 and the winding structure 55 through the air flow outlet 52, so as to complete the heat dissipation of the reactor 27 and the dry transformer. In this way, the first case 211 and the second case 212 are connected in series, so that the cooling air flow and the evaporator 26 can simultaneously dissipate heat of the semiconductor power device 24 in the second case 212, thereby improving the heat dissipation effect.

Example thirteen

As shown in fig. 15, in the thirteenth embodiment of the present utility model, an evaporator 26 is disposed in the power conversion box 21, the semiconductor power device 24 is thermally coupled to the evaporator 26, the heat dissipation device for the inversion and boosting integrated machine further includes a condenser 25 communicating with the evaporator 26, the condenser 25 is disposed in the transformer room 11 or on the transformer room 11, and the power conversion box 21 and the transformer room 11 each have an air inlet and an air outlet.

Through the arrangement, on one hand, under the action of the main power mechanism 22, air can cool the reactor 27 in the power conversion box 21 in an air-cooled manner, the semiconductor power device 24 in the power conversion box 21 is cooled at the evaporator 26, heat of the semiconductor power device is transferred to the condenser 25 in the transformer room 11, on the other hand, the cooling air can firstly cool the condenser 25 in the transformer room 11, then the air-cooled heat of the winding structure 55 is completed under the action of the auxiliary power mechanism 12, and finally the air is discharged out of the transformer room 11 under the action of the main power mechanism 22, so that on the one hand, the problem that the heat exchange area of the condenser 25 is limited due to the limited volume of the power conversion box 21 can be solved, the heat exchange area of the condenser 25 can be increased, the heat exchange amount can be improved, the volume of the transformer room 11 can be fully utilized, the volume of the power conversion box 21 can be reduced, on the other hand, the successful rate conversion (PCS) and the dry transformer can be realized under the action of the auxiliary power mechanism 12, and the cost of the Power Converter (PCS) can be reduced, and the cost of the heat dissipation of the integrated power converter can be lowered, and the noise of the inverter can be lowered.

Specifically, as shown in fig. 15, in the thirteenth embodiment of the present utility model, the reactor 27 is disposed in the power conversion box 21, the main power mechanism 22 includes two fans, the fans are disposed in the power conversion box 21 and the transformer room 11, the cooling medium is a cooling liquid, the evaporator 26 transfers the heat generated in the semiconductor power device 24 to the condenser 25 in the transformer room 11 through the cooling liquid, and the condenser 25 is located on the flow path of the cooling air flow in the transformer room 11. The cooling air flow generated by the fan in the power conversion box 21 blows the heat generated by the reactor 27 out of the power conversion box 21, and the fan in the transformer room 11 is used for generating the cooling air flow.

In the thirteenth embodiment of the present utility model, the condenser 25 is disposed at the air inlet of the transformer substation 11.

In the thirteenth embodiment of the present utility model, the fan of the transformer room 11 is disposed at the air outlet of the transformer room 11.

In one embodiment, the location of the fans within the transformer housing 11 is not limited, such as at the air outlet or air inlet of the transformer housing 11.

It should be noted that, in the thirteenth embodiment of the present utility model, the thermal coupling connection is a technique of connecting two or more objects by thermal conduction, and this connection manner can effectively conduct heat.

In the thirteenth embodiment of the present utility model, the condenser 25 is disposed on the transformer room 11, which means that the condenser 25 may be disposed outside the transformer room 11 or may be disposed on a wall of the transformer room 11, that is, a groove is formed in the wall of the transformer room, and the condenser 25 is installed in the groove.

Examples fourteen

As shown in fig. 16, the fourteenth embodiment of the present utility model is different from the thirteenth embodiment in that the fan of the transformer room 11 is disposed at a side close to the condenser 25, so that the distance between the condenser 25 and the fan can be shortened, so that the air flow can better pass through the condenser 25, and the air flow can smoothly flow through the high-low voltage winding and the iron core, thereby better realizing heat dissipation of the dry transformer, and further improving the heat dissipation effect of the inversion and boosting integrated machine.

Other structures of the fourteenth embodiment are the same as those of the thirteenth embodiment, and will not be described here again.

Example fifteen

As shown in fig. 17, the fifteen embodiment of the present utility model is different from the thirteenth embodiment in that, firstly, the reactor 27 in the power conversion box 21 can be moved into the transformer room 11 through structural deformation, so that the heat dissipation modes of the reactor 27 and the high-low voltage winding and the iron core are consistent, secondly, only the transformer room has an air inlet and an air outlet, and only a fan is arranged in the transformer room 11, so that, on one hand, the volume of the power conversion box 21 is further compressed, the space of the transformer room 11 is fully utilized, and on the other hand, the number of fans can be reduced, thereby reducing the cost, the power consumption and the noise of the inversion boosting all-in-one machine.

The other structures of the fifteenth embodiment are the same as those of the thirteenth embodiment, and will not be described here again.

Examples sixteen

As shown in fig. 18, the difference between the sixteenth embodiment and the fifteen embodiment of the present utility model is that the fan of the transformer room 11 is disposed at a side close to the condenser 25, so that the distance between the condenser 25 and the fan can be shortened, so that the air flow can better pass through the condenser 25, and the air flow can smoothly flow through the high-low voltage winding, the iron core and the reactor 27, so that the heat dissipation of the dry transformer is better realized, and the heat dissipation effect of the inversion and boosting integrated machine is further improved.

Other structures of the sixteenth embodiment are the same as those of the fifteen embodiment, and will not be described here again.

It should be noted that all the above schemes are applicable to the case that a plurality of Power Converters (PCS) are combined with one dry-type transformer. And through additionally arranging the air duct shell 50, the air outlet (or air inlet) of the Power Converter (PCS) is led to the transformation room 11, so that the mutual influence between the air outlets when the Power Converter (PCS) is in multiple parallel operation is avoided.

From the above description, it can be seen that the above embodiments of the present utility model achieve the following technical effects that, heat generated in the power conversion box is transferred to the flow path of the cooling airflow of the transformer room through the cooling medium, so that the power conversion box and the transformer room share the main power mechanism to dissipate heat, and compared with the prior art that the power converter and the dry transformer are respectively provided with a set of heat dissipation systems (i.e. the inversion boosting integrated machine needs two sets of heat dissipation systems (i.e. the main power mechanism), in the present utility model, the heat dissipation of the power converter and the dry transformer can be simultaneously achieved by using one set of heat dissipation systems (i.e. the main power mechanism), thus, the number of heat dissipation systems (i.e. the main power mechanism) can be reduced, and resource integration can be achieved, so that the power consumption, the cost and the noise of the heat dissipation device for the inversion boosting integrated machine can be reduced.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (12)

1. The utility model provides an contravariant heat abstractor for boost all-in-one which characterized in that includes:

A power conversion box (21) for accommodating a semiconductor power device (24);

A transformer room (11) for accommodating the winding structure (55);

A main power mechanism (22) for driving cooling air flow to flow into the transformer room (11) to dissipate heat of the transformer room (11);

Wherein heat generated in the power conversion box (21) is conveyed to a flow path of the cooling air flow of the pressure transformation room (11) by a cooling medium, and the cooling medium comprises cooling liquid or a heat conducting piece or the cooling air flow driven by a main power mechanism.

2. The heat dissipating device for an inversion and boost integrated machine according to claim 1, further comprising:

an air duct case (50) having an air flow inlet (51) and an air flow outlet (52), the air flow inlet (51) communicating with the interior of the power conversion box (21), the air flow outlet (52) communicating with the interior of the transformer room (11);

The power conversion box (21) is provided with an air inlet, and the transformation room (11) is provided with an air outlet;

The main power mechanism (22) drives cooling air flow to sequentially flow through an air inlet of the power conversion box (21), the air flow inlet (51), the air flow outlet (52) and an air outlet of the pressure transformation room (11).

3. The heat dissipating device for an inversion and boost integrated machine according to claim 2, further comprising a heat sink (23) located inside the power conversion box (21), the heat sink (23) being configured to dissipate heat of the semiconductor power device (24).

4. The heat dissipating apparatus for an inverter/booster integrated machine according to claim 3, wherein the air inlet of the power conversion box (21) and the air flow inlet (51) are located on both sides of the heat sink (23), and/or,

The air outlet of the transformer room (11) and the air flow outlet (52) are positioned on two sides of the winding structure (55).

5. The heat dissipating device for an inversion and boost integrated machine according to claim 2, wherein the power conversion box (21) comprises a first box (211) and a second box (212), a condenser (25) is provided in the first box (211), and an evaporator (26) for dissipating heat of the semiconductor power device (24) is provided in the second box (212);

The first box body (211) is provided with an air inlet and an air outlet, the second box body (212) is provided with an air inlet and an air outlet, the air outlet of the first box body (211) and the air outlet of the second box body are communicated with the air flow inlet (51) of the air duct shell (50), or

The first box body (211) is provided with an air inlet and an air outlet, the air outlet of the first box body (211) is communicated with the air flow inlet (51) of the air duct shell (50), or

The first box body (211) is provided with an air inlet and an air outlet, the second box body (212) is provided with an air inlet and an air outlet, the air outlet of the second box body (212) is communicated with the air inlet of the first box body (211), and the air outlet of the first box body (211) is communicated with the air inlet (51) of the air duct shell (50).

6. The heat dissipating device for an inversion and boost integrated machine according to claim 1, wherein an evaporator (26) is provided in the power conversion box (21), and the semiconductor power device (24) is thermally coupled to the evaporator (26);

The heat dissipation device for the inversion and boosting integrated machine further comprises a condenser (25) communicated with the evaporator (26), wherein the condenser (25) is arranged in the transformation room (11) or on the transformation room (11);

The power conversion box (21) and the transformation room (11) are provided with an air inlet and an air outlet.

7. The heat dissipating device for an inversion and boost integrated machine according to claim 1, wherein an evaporator (26) is provided in the power conversion box (21), and the semiconductor power device (24) is thermally coupled to the evaporator (26);

the heat dissipation device for the inversion and boosting integrated machine further comprises a condenser (25) communicated with the evaporator (26), wherein the condenser (25) is arranged in the transformation room (11) or on the transformation room (11);

the transformation room (11) is provided with an air inlet and an air outlet.

8. The heat dissipating device for an inversion and boost integrated machine according to any one of claims 2 to 5, further comprising a heat dissipating structure including:

a mounting member (53) mounted to the duct case (50);

The plurality of radiating pieces (54) are arranged on the mounting piece (53) at intervals, one end of each radiating piece (54) stretches into the air duct shell (50), and the other end of each radiating piece (54) is located outside the air duct shell (50).

9. The heat dissipating device for an inversion and boost integrated machine according to any one of claims 1 to 7, wherein an auxiliary power mechanism (12) is provided in the variable-pressure room (11), and the auxiliary power mechanism (12) is configured to accelerate the flow of the cooling air flow.

10. The heat dissipating device for an inversion and boost integrated machine according to any one of claims 2 to 5, wherein the main power mechanism (22) includes a blower, and the blower is provided to at least one of the power conversion box (21), the transformer room (11), and the duct case (50).

11. The utility model provides an contravariant boost all-in-one which characterized in that includes:

The heat dissipating device for an inversion boosting integrated machine according to any one of claims 1 to 10;

A winding structure (55) mounted in the transformer room (11);

And a semiconductor power device (24) mounted in the power conversion box (21).

12. The inversion and boost integrated machine according to claim 11, characterized in that a reactor (27) is provided in the power conversion box (21) or in the transformation room (11).