CN223182533U - Radiating assembly and power conversion equipment - Google Patents

Abstract

The present application relates to the field of heat dissipation technologies of devices, and in particular, to a heat dissipation assembly and a power conversion device. This cooling module includes liquid cooling board, heat exchanger and water pump, and the liquid cooling board includes first face and second face, and first face is used for carrying out the heat transfer with the heating element, and the liquid cooling board has water inlet and intercommunication export, and liquid cooling board, heat exchanger and water pump intercommunication form circulation cooling circuit, and the heat exchanger is including the first connecting portion and the second connecting portion of intercommunication, and first connecting portion have the intercommunication import, and the second connecting portion has the delivery port, and first connecting portion sets up in second face and intercommunication import and intercommunication export intercommunication. The heat radiation component provided by the application realizes the heat radiation of the heating device and ensures the heat radiation and cooling effects of the heating device. In addition, this cooling module can be as an organic whole with liquid cooling board and heat exchanger integration, has reduced cooling module's occupation space, has improved the cooling effect of dispelling the heat to the heating device.

Description

Radiating assembly and power conversion equipment

Technical Field

The present application relates to the field of heat dissipation technologies of devices, and in particular, to a heat dissipation assembly and a power conversion device.

Background

The power conversion device is a power conversion device and is used for converting electric energy from one form to another form, so that energy transmission and control under different power requirements are realized. As the power of the power conversion equipment increases, the heat flux density of the power conversion equipment is higher and higher, so that the heat dissipation assembly is required to dissipate heat and cool the power conversion equipment so as to ensure the normal operation of the power conversion equipment.

With the development of power electronic devices in the direction of small volume and high integration, the space for installing the heat dissipation assembly is often insufficient. However, if the power device does not have good heat dissipation measures, not only the application scenario of the power device is limited, but also the optimization of the product performance is hindered. How to enhance the heat dissipation capability of a power device under the condition of high power density becomes a key problem to be solved.

Disclosure of utility model

The application aims to provide a heat dissipation assembly and power conversion equipment, so as to improve the heat dissipation and cooling effects on heating devices and reduce the occupied space of the heat dissipation assembly.

To achieve the purpose, the application adopts the following technical scheme:

A heat dissipating assembly, comprising:

The liquid cooling plate comprises a first plate surface and a second plate surface, wherein the first plate surface is used for exchanging heat with the heating device and is provided with a water inlet and a communication outlet, and

The heat exchanger comprises a first connecting part and a second connecting part which are communicated, the first connecting part is provided with a communication inlet, the second connecting part is provided with a water outlet, and the first connecting part is arranged on the second plate surface and communicated with the communication outlet.

Alternatively, the second connecting portion is also disposed on the second plate surface.

As an alternative scheme, the heat exchanger is a serpentine flat tube heat exchanger, the heat exchanger further comprises a main body portion, the first connecting portion, the main body portion and the second connecting portion are sequentially communicated, and the main body portion is serpentine.

As an alternative, the heat exchanger is a serpentine flat tube heat exchanger, and the heat exchanger further comprises:

a bottom plate arranged on the second plate surface, a plurality of communication channels arranged in the bottom plate at intervals, and

The heat exchange pipelines are all U-shaped, a plurality of heat exchange pipelines are sequentially arranged and arranged in the bottom plate, two adjacent communication channels are communicated through one heat exchange pipeline, the heat exchange pipeline at the head end is communicated with the first connecting part, and the heat exchange pipeline at the tail end is communicated with the second connecting part.

Alternatively, the heat exchanger is a parallel flow heat exchanger, and the heat exchanger further includes:

the flat pipes are connected in parallel and at intervals, and each flat pipe is communicated between the first connecting part and the second connecting part.

Alternatively, a plurality of the connecting flat pipes are arranged at intervals along the horizontal direction.

As an alternative, a plurality of the connection flat pipes are arranged at intervals along the vertical direction, and in two adjacent connection flat pipes, the inner diameter size of the connection flat pipe positioned above is larger than the inner diameter size of the connection flat pipe positioned below.

Alternatively, the heat dissipation assembly further includes:

The heat exchanger comprises a plurality of radiating fins, wherein a plurality of radiating fins are arranged on the heat exchanger at intervals.

The power conversion equipment comprises an equipment box body, a heating device and the heat dissipation assembly, wherein a heat dissipation air duct is arranged in the equipment box body, and the heat exchanger is positioned in the heat dissipation air duct.

Alternatively, the heat dissipation assembly further includes:

and the heat radiation fan is arranged in the heat radiation air duct.

As an alternative, the heat dissipation air duct includes an outer circulation heat dissipation air duct, the heating device includes a power device, the power device is located in the outer circulation heat dissipation air duct, and the first board is attached to the power device.

Alternatively, the power conversion apparatus further includes:

and the reactor is electrically connected with the heating device and is positioned in the external circulation heat dissipation air duct.

As an alternative scheme, the heat dissipation wind channel includes independent outer circulation heat dissipation wind channel and inner loop heat dissipation wind channel, the power device and the electronic device that generate heat the device and be connected including the electricity, and the heat exchanger is including first heat exchanger and the second heat exchanger that is linked together, be provided with on the second face first heat exchanger with the second heat exchanger, the power device with first heat exchanger all is located in the outer loop heat dissipation wind channel, the electronic device with the second heat exchanger all is located in the inner loop heat dissipation wind channel, and first face with the power device laminating is connected.

The application provides a heat radiation assembly, which comprises a liquid cooling plate, a heat exchanger and a water pump, wherein the liquid cooling plate, the heat exchanger and the water pump are communicated to form a circulating heat radiation loop, and a first plate surface on the liquid cooling plate is used for exchanging heat with a heating device, so that the heat radiation and cooling effects on the heating device are realized. In addition, the liquid cooling plate has water inlet and intercommunication export, the heat exchanger includes the first connecting portion and the second connecting portion of intercommunication, first connecting portion has the intercommunication import, the second connecting portion has the delivery port, intercommunication import and intercommunication export intercommunication, and first connecting portion sets up in the second face of liquid cooling plate, thereby with liquid cooling plate and heat exchanger integration as an organic whole, need not to communicate through extra pipeline and plug between liquid cooling plate and the heat exchanger, the cost is reduced, also reduced the risk of weeping, also reduced the intercommunication route between liquid cooling plate and the heat exchanger, and then reduced the heat transfer route of whole heat dissipation group, the radiating effect has been improved. In addition, through integrating liquid cooling board and heat exchanger as an organic whole, also reduced the occupation space of radiator unit.

The application also provides power conversion equipment, which is characterized in that by applying the heat dissipation assembly, the liquid cooling plate and the heat exchanger are not communicated through an additional pipeline and a plug, so that the cost is reduced, the risk of liquid leakage is also reduced, the heat dissipation and cooling effect on a heating device is improved, and the occupied space of the heat dissipation assembly is also reduced.

Drawings

Fig. 1 is a schematic diagram of a partial structure of a heat dissipating assembly according to a first embodiment of the present application;

fig. 2 is a schematic diagram of a part of a heat dissipating assembly according to a first embodiment of the present application;

fig. 3 is a block diagram of a power conversion apparatus according to a first embodiment of the present application;

Fig. 4 is a schematic diagram of a partial structure of a heat dissipating assembly according to a second embodiment of the present application;

Fig. 5 is a schematic diagram of a part of a heat dissipating component according to a second embodiment of the present application;

Fig. 6 is a schematic diagram of a partial structure of a heat dissipating assembly according to a third embodiment of the present application;

Fig. 7 is a schematic diagram of a part of a heat dissipating assembly according to a third embodiment of the present application;

Fig. 8 is a schematic diagram of a part of a heat dissipating assembly according to a third embodiment of the present application;

Fig. 9 is a block diagram of a power conversion apparatus according to a fourth embodiment of the present application;

Fig. 10 is a block diagram of a power conversion apparatus according to a fifth embodiment of the present application.

In the figure:

1. The device comprises a device box body, a heat dissipation air duct, a 111 external circulation heat dissipation air duct, a 112 internal circulation heat dissipation air duct, a 113, an air inlet, a 114 and an air outlet;

2. 21, power device, 22, electronic device;

3. The heat dissipation assembly comprises a heat dissipation assembly, a 31, a liquid cooling plate, a 311, a water inlet, a 312, a first plate surface, a 313, a second plate surface, a 3131, a first plane, a 3132, a second plane, a 314, a communicating outlet, a 32, a heat exchanger, a 301, a first heat exchanger, a 302, a second heat exchanger, a 321, a first connecting part, a 3211, a communicating inlet, a 322, a main body part, a 323, a second connecting part, a 324, a water outlet, a 325, a bottom plate, a 3250, a partition plate, a 3251, a communicating runner, a 326, a heat exchange pipeline, a 327, a connecting flat pipe, a 33, a water pump, a 34, a heat dissipation fan, a 341, a first heat dissipation fan, a 342, a second heat dissipation fan, a 35 and a heat dissipation fin;

4. a reactor.

Detailed Description

In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the application more clear, the technical scheme of the application is further described below by a specific embodiment in combination with the attached drawings.

In the description of the present application, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may, for example, be fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the application. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

Example 1

In prior art, the radiating component in the power conversion equipment comprises a liquid cooling plate, a heat exchanger and a water pump, wherein the liquid cooling plate, the heat exchanger and the water pump are communicated to form a circulating radiating loop, and the liquid cooling plate is used for exchanging heat to the heating device to realize radiating and cooling to the heating device. But all need be connected through extra pipeline and plug between liquid cooling board and the heat exchanger, the setting of pipeline and plug has greatly increased radiating cost, has also increased the risk of weeping. In addition, because the liquid cooling plate and the heat exchanger are arranged in a split mode, the occupied space of the whole heat dissipation assembly is greatly increased, the heat exchange path is increased, and the heat dissipation effect is reduced.

In order to solve the above-mentioned problems, as shown in fig. 1-3, the present embodiment provides a heat dissipating assembly 3, the heat dissipating assembly 3 includes a liquid cooling plate 31, a heat exchanger 32 and a water pump 33, wherein the liquid cooling plate 31 includes a first plate surface 312 and a second plate surface 313, the first plate surface 312 is used for exchanging heat with a heat generating device 2, the liquid cooling plate 31 has a water inlet 311 and a communication outlet 314, the liquid cooling plate 31, the heat exchanger 32 and the water pump 33 are communicated to form a circulating heat dissipating loop, the heat exchanger 32 includes a first connecting portion 321 and a second connecting portion 323 which are communicated, the first connecting portion 321 has a communication inlet 3211, the second connecting portion 323 has a water outlet 324, the communication inlet 3211 is communicated with the communication outlet 314, and the first connecting portion 321 is disposed on the second plate surface 313. The heat dissipation assembly 3 provided in this embodiment forms a circulating heat dissipation loop by making the liquid cooling plate 31, the heat exchanger 32 and the water pump 33 communicate, and makes the first plate surface 312 of the liquid cooling plate 31 exchange heat with the heat generating device 2, thereby realizing the heat dissipation and cooling effect on the heat generating device 2. In addition, through making intercommunication import 3211 and intercommunication export 314 intercommunication to set up the first connecting portion 321 of heat exchanger 32 in the second face 313 of liquid cooling board 31, thereby with liquid cooling board 31 and heat exchanger 32 integration as an organic whole, make between liquid cooling board 31 and the heat exchanger 32 need not to communicate through extra pipeline and plug, reduced cost and weeping risk, also reduced the communication path between liquid cooling board 31 and the heat exchanger 32, and then reduced the heat transfer path of whole radiating component 3, improved the radiating effect. In addition, by integrating the liquid cooling plate 31 and the heat exchanger 32, the occupation space of the entire heat radiation assembly 3 is also reduced.

Alternatively, in the present embodiment, the water outlet 324 communicates with the water inlet 311 through the water pump 33, so that the liquid cooling plate 31, the heat exchanger 32, and the water pump 33 communicate sequentially to form a circulation heat dissipation circuit.

Alternatively, in the present embodiment, as shown in fig. 1 and 2, the second connecting portion 323 is also provided on the second plate surface 313. By the arrangement, the heat exchange path of the whole heat dissipation assembly 3 and the occupied space of the heat dissipation assembly 3 are further reduced.

Alternatively, in the present embodiment, the liquid cooling plate 31 and the heat exchanger 32 may be integrally formed, that is, both the first connection portion 321 and the second connection portion 323 are integrally formed with the second plate surface 313. In other embodiments, the liquid cooling plate 31 and the heat exchanger 32 may be integrated into a single structure by welding, that is, both the first connection portion 321 and the second connection portion 323 are welded to the second plate surface 313.

Alternatively, in the present embodiment, as shown in fig. 1 and 2, the heat exchanger 32 is a serpentine flat tube heat exchanger. The serpentine flat tube heat exchanger has the advantages of simple structure, convenient operation and management and high pressure bearing. Specifically, the heat exchanger 32 further includes a main body 322, and the first connection portion 321, the main body 322, and the second connection portion 323 are sequentially connected, and the main body 322 has a serpentine shape. The specific structural design of the heat exchanger 32 enables the first connecting portion 321 and the second connecting portion 323 to be integrated with the liquid cooling plate 31, and the main body portion 322 is bent, so that the production and processing are facilitated.

Specifically, as shown by the direction of the arrow in fig. 2, the cooling medium enters the liquid cooling plate 31 through the water inlet 311, then enters the first connection portion 321 through the communication outlet 314 and the communication inlet 3211 in this order, then enters the second connection portion 323 through the main body portion 322 in the first connection portion 321, and then flows back into the liquid cooling plate 31 through the water outlet 324 on the second connection portion 323 by the action of the water pump 33. It should be noted that, the heat generating device 2 is disposed on the first plate surface 312, the water inlet 311 is disposed at one end of the heat generating device 2, the communication outlet 314 is disposed at the other end of the heat generating device 2, the cooling liquid in the liquid cooling plate 31 completely passes through the heat generating device 2 and then enters the communication inlet 3211 of the heat exchanger 32, and the cooling channel of the liquid cooling plate 31 is communicated with but completely isolated from the heat exchange channel in the main body 322 of the heat exchanger 32, so as to ensure that the cooling liquid enters the heat exchanger 32 after completely exchanging heat with the heat generating device 2.

Optionally, in this embodiment, as shown in fig. 1 and 2, the heat dissipating assembly 3 further includes a plurality of heat dissipating fins 35, and the heat exchanger 32 is provided with a plurality of heat dissipating fins 35 at intervals. By arranging the plurality of radiating fins 35 on the heat exchanger 32 at intervals, the heat exchange area of the heat exchanger 32 is increased, and the heat exchange performance of the heat exchanger 32 is effectively improved. Specifically, in the present embodiment, the plurality of heat dissipation fins 35 are provided at intervals on the serpentine-shaped main body portion 322, thereby improving the heat dissipation effect on the main body portion 322. Alternatively, in the present embodiment, the heat dissipation fins 35 may be V-shaped fins, and the heat dissipation fins 35 may also be U-shaped fins, and the specific form of the heat dissipation fins 35 is not limited in the present embodiment.

As shown in fig. 3, the present embodiment further provides a power conversion device, which includes a device box 1, a heating device 2, and the heat dissipation assembly 3 described above, where a heat dissipation air duct 11 is disposed in the device box 1, and a heat exchanger 32 is located in the heat dissipation air duct 11. The power conversion equipment provided by the embodiment is through applying above-mentioned radiator unit 3 for need not to communicate through extra pipeline and plug between liquid cooling board 31 and the heat exchanger 32, the cost is reduced, has also reduced the risk of weeping, has improved the cooling effect of dispelling the heat to the device 2 that generates heat, has still reduced radiator unit 3's occupation space.

Alternatively, in the present embodiment, as shown in fig. 3, the heat dissipation air duct 11 is an external circulation heat dissipation air duct 111, the heating device 2 is a power device 21, and the heat exchanger 32 is a first heat exchanger 301, the power device 21, the liquid cooling plate 31, and the first heat exchanger 301 are all located in the external circulation heat dissipation air duct 111, and the first plate surface 312 of the liquid cooling plate 31 is attached to the power device 21. By the arrangement, when the power device 21 is subjected to heat radiation, the cooling medium flowing into the liquid cooling plate 31 by the first heat exchanger 301 exchanges heat with the power device 21, so that the liquid cooling heat radiation of the power device 21 is realized, the cooling medium after heat exchange and temperature rise flows back to the first heat exchanger 301 under the action of the water pump 33, the first heat exchanger 301 exchanges heat in the external circulation heat radiation air duct 111, so that the cooling medium is cooled, and the cooled cooling medium flows into the liquid cooling plate 31 again to perform liquid cooling heat radiation on the power device 21, so that the cooling of the power device 21 is realized. It should be noted that, the device case 1 is provided with an air inlet 113 and an air outlet 114 which are communicated with the outside, two ends of the external circulation cooling air duct 111 are respectively communicated with the air inlet 113 and the air outlet 114, so that external cold air enters the external circulation cooling air duct 111 in the device case 1 through the air inlet 113, the cold air exchanges heat with the high-temperature cooling medium in the first heat exchanger 301 in the external circulation cooling air duct 111, the cold air after heat exchange heats up and is discharged from the air outlet 114, and the high-temperature cooling medium in the first heat exchanger 301 exchanges heat with the cold air to realize cooling, so that the cooled cooling medium flows into the liquid cooling plate 31 again to perform liquid cooling and heat dissipation on the power device 21.

Alternatively, in the present embodiment, the liquid cooling plate 31, the first heat exchanger 301, and the water pump 33 are sequentially connected end to form a circulation heat dissipation circuit. In addition, in this embodiment, the turbulent flow structure is disposed in the liquid cooling flow channel in the liquid cooling plate 31, so that the heat exchange area of the liquid cooling plate 31 is increased, the heat exchange performance of the liquid cooling plate 31 is improved, and the liquid cooling effect of the liquid cooling plate 31 on the power device 21 is further improved. Alternatively, in the present embodiment, the spoiler structure may be in the form of a spoiler post or a staggered tooth, and the specific form of the spoiler structure is not limited in the present embodiment.

Optionally, in this embodiment, as shown in fig. 3, the heat dissipation assembly 3 provided in this embodiment further includes a heat dissipation fan 34, where the heat dissipation fan 34 is installed in the heat dissipation air duct 11. Specifically, in the present embodiment, the heat dissipation fan 34 is a first heat dissipation fan 341, and the first heat dissipation fan 341 is installed in the outer circulation heat dissipation air duct 111, so that air circulation in the outer circulation heat dissipation air duct 111 is promoted, and the ventilation and cooling effect of the outer circulation heat dissipation air duct 111 on the cooling medium in the first heat exchanger 301 is improved.

Alternatively, in the present embodiment, as shown in fig. 3, the power conversion apparatus further includes a reactor 4, the reactor 4 is electrically connected with the power device 21, and the reactor 4 is located in the outer circulation cooling air duct 111, thereby realizing a ventilation cooling effect for the reactor 4. In addition, through arranging the reactor 4 and the first heat exchanger 301 in the external circulation heat dissipation air duct 111, the first heat dissipation fan 341 is shared for ventilation and heat dissipation, so that the number of fans is effectively reduced, the power consumption and the cost are reduced, and the noise generated when the fans work is also reduced. In this embodiment, as shown by the arrow direction in fig. 3, under the action of the first heat dissipation fan 341, external cold air enters the external circulation heat dissipation air duct 111 through the air inlet 113, and after the cold air exchanges heat with the cooling medium in the first heat exchanger 301 through the first heat exchanger 301 in the external circulation heat dissipation air duct 111, the cold air cools and dissipates heat to the reactor 4 through the reactor 4, and finally is discharged through the air outlet 114. Alternatively, in other embodiments, the reactor 4 may be separately disposed in a wind tunnel, and the reactor 4 may be ventilated and cooled by a separate fan.

Example two

The heat dissipation assembly 3 provided in this embodiment is substantially the same as that in the first embodiment, and the difference between the heat dissipation assembly 3 provided in this embodiment and that in the first embodiment is that the specific structure of the heat exchanger 32 is different.

Specifically, in this embodiment, as shown in fig. 4 and 5, the heat exchanger 32 is a serpentine flat tube heat exchanger, and the heat exchanger 32 further includes a bottom plate 325 and a plurality of heat exchange tubes 326, where the bottom plate 325 is disposed on the second plate surface 313, a plurality of communication channels 3251 are disposed at intervals inside the bottom plate 325, each heat exchange tube 326 is in a U shape, the plurality of heat exchange tubes 326 are sequentially arranged and disposed on the bottom plate 325, two adjacent communication channels 3251 are communicated through one heat exchange tube 326, the heat exchange tube 326 at the head end is communicated with the first connection portion 321, and the heat exchange tube 326 at the tail end is communicated with the second connection portion 323. As shown by the arrow direction in fig. 5, the above arrangement is such that the cooling medium enters the liquid cooling plate 31 through the water inlet 311, then enters the first connection portion 321 through the communication outlet 314 and the communication inlet 3211 in sequence, enters the first heat exchange tube 326 through the first connection portion 321, then sequentially passes through each heat exchange tube 326 through the corresponding communication flow passage 3251, finally enters the second connection portion 323 through the heat exchange tube 326 at the end, and then returns to the liquid cooling plate 31 through the water outlet 324 on the second connection portion 323. The structural design of the heat exchanger 32 described above allows the plurality of heat exchange pipes 326 to be sequentially connected to form a serpentine channel, and the bottom plate 325 is disposed on the second plate surface 313, so that the structure of the heat exchanger 32 is more compact.

In the present embodiment, as shown in fig. 4 and 5, a partition plate 3250 is provided inside the bottom plate 325, and the partition plate 3250 partitions the internal cavity of the bottom plate 325 into respective communication flow passages 3251. In other embodiments, the liquid cooling plate 31 with cooling channels may be welded to the housing formed by the bottom plate 325 and the partition plate 3250 to form the communication channels 3251.

Optionally, in this embodiment, a plurality of heat dissipating fins 35 are disposed on each heat exchanging tube 326 at intervals, so as to improve the heat dissipating effect on the heat exchanging tube 326.

Example III

The heat dissipation assembly 3 provided in this embodiment is substantially the same as that in the first embodiment, and the difference between the heat dissipation assembly 3 provided in this embodiment and that in the first embodiment is that the specific structure of the heat exchanger 32 is different.

In this embodiment, as shown in fig. 6 to 8, the heat exchanger 32 in this embodiment is a parallel flow heat exchanger, and the parallel flow heat exchanger has the advantages of compact structure, large heat transfer coefficient, less dirt retention and small resistance.

Specifically, as shown in fig. 6 to 8, the heat exchanger 32 further includes a plurality of connection flat tubes 327, and the plurality of connection flat tubes 327 are arranged in parallel and at intervals, and each connection flat tube 327 is connected between the first connection portion 321 and the second connection portion 323. As shown by the arrow direction in fig. 7 and 8, the above arrangement is such that the cooling medium enters the liquid cooling plate 31 through the water inlet 311, then enters the first connection portion 321 through the communication outlet 314 and the communication inlet 3211 in order, enters the second connection portion 323 through the respective connection flat pipes 327, and then flows back into the liquid cooling plate 31 through the water outlet 324 on the second connection portion 323.

Optionally, as shown in fig. 6 and fig. 7, the plurality of connection flat tubes 327 are arranged at intervals along the horizontal direction, so that the cooling medium in the first connection portion 321 can uniformly flow into each connection flat tube 327, and finally summarized to the second connection portion 323, so as to ensure the heat exchange effect of each connection flat tube 327.

As shown in fig. 8, if a plurality of connection flat pipes 327 are arranged at intervals in the vertical direction, and two connection flat pipes 327 arranged adjacently, the inner diameter size of the connection flat pipe 327 positioned above is larger than the inner diameter size of the connection flat pipe 327 positioned below. Above-mentioned setting for heat exchanger 32 adjusts the internal diameter size of each connection flat pipe 327 according to service scenario and angle of placement, increases the internal diameter size of connection flat pipe 327 that will be higher in position, thereby reduces the internal flow resistance of connection flat pipe 327 of higher department, thereby makes the flow of the cooling medium that flows into each connection flat pipe 327 even, increases the heat transfer effect.

Optionally, in this embodiment, a plurality of heat dissipation fins 35 are disposed between two adjacent flat connection pipes 327 at intervals, so as to improve the heat dissipation effect on the flat connection pipes 327.

Example IV

The present embodiment provides a power conversion apparatus, which is substantially the same as the first embodiment, and is different from the first embodiment in that:

As shown in fig. 9, in the present embodiment, the heat dissipation air duct 11 includes an outer circulation heat dissipation air duct 111 and an inner circulation heat dissipation air duct 112 that are independent of each other, the heat generating device 2 includes a power device 21 and an electronic device 22 that are electrically connected, the electronic device 22 and the power device 21 are both electrically connected with the reactor 4, and the heat exchanger 32 includes a first heat exchanger 301 and a second heat exchanger 302 that are communicated with each other, the liquid cooling plate 31, the first heat exchanger 301, the water pump 33, and the second heat exchanger 302 are sequentially communicated end to form a circulation heat dissipation loop, the heat dissipation fan 34 includes a first heat dissipation fan 341 and a second heat dissipation fan 342, the electronic device 22, and the second heat exchanger 302 are all located in the inner circulation heat dissipation air duct 112, the first heat dissipation fan 341 and the first heat exchanger 301 are all located in the outer circulation heat dissipation air duct 111, and the first plate surface 312 is in lamination connection with the power device 21, and the first connection portion 321 of the second heat exchanger 302 is disposed on the second plate surface 313.

By the arrangement, under the action of the water pump 33, the low-temperature cooling medium enters the second heat exchanger 302 to exchange heat with hot air in the inner circulation cooling air duct 112, so that cold air is formed by cooling the hot air in the inner circulation cooling air duct 112, and air cooling and heat dissipation of the electronic device 22 are realized under the action of the second cooling fan 342, the cooling medium in the second heat exchanger 302 then enters the liquid cooling plate 31 and exchanges heat with the power device 21 attached to the liquid cooling plate 31, liquid cooling and heat dissipation of the power device 21 are realized, then the cooling medium after temperature rise in the liquid cooling plate 31 enters the first heat exchanger 301, under the action of the first cooling fan 341, external cold air enters the outer circulation cooling air duct 111 through the air inlet 113, and after the cold air exchanges heat with the cooling medium in the first heat exchanger 301 in the outer circulation cooling air duct 111, the cooled cooling medium flows back to the second heat exchanger 302 in the first heat exchanger 301, so that the cooling medium reciprocates.

In this embodiment, the structures of the second heat exchanger 302 and the first heat exchanger 301 may be the serpentine flat tube heat exchanger in the first embodiment or the second embodiment, or may be the parallel flow heat exchanger in the third embodiment. And the second heat exchanger 302 and the first heat exchanger 301 are each provided with a heat radiation fin 35.

In addition, in the present embodiment, only the first connection portion 321 of the second heat exchanger 302 is disposed on the second plate surface 313, so that only the second heat exchanger 302 is integrated with the liquid cooling plate 31, and the first heat exchanger 301 is not integrated with the liquid cooling plate 31.

Alternatively, in the present embodiment, the reactor 4 is placed in one duct alone, and ventilation and heat dissipation are performed by one separate fan.

Example five

The present embodiment provides a power conversion apparatus, which is substantially the same as the first embodiment, and is different from the first embodiment in that:

In this embodiment, as shown in fig. 10, the heat dissipation air duct 11 includes an outer circulation heat dissipation air duct 111 and an inner circulation heat dissipation air duct 112 that are independent of each other, the heat generating device 2 includes a power device 21 and an electronic device 22 that are electrically connected, the electronic device 22 and the power device 21 are all electrically connected with the reactor 4, and the heat exchanger 32 includes a first heat exchanger 301 and a second heat exchanger 302 that are communicated, the liquid cooling plate 31, the first heat exchanger 301, the water pump 33 and the second heat exchanger 302 are sequentially communicated end to form a circulation heat dissipation loop, the heat dissipation fan 34 includes a first heat dissipation fan 341 and a second heat dissipation fan 342, the first heat exchanger 341, the first heat exchanger 301, the liquid cooling plate 31, the power device 21 and the reactor 4 are all located in the outer circulation heat dissipation air duct 111, the second heat dissipation fan 342, the electronic device 22 and the second heat exchanger 302 are all located in the inner circulation heat dissipation air duct 112, the first connection portion 321 of the first heat exchanger 301 and the first connection portion 321 of the second heat exchanger 302 are all disposed on the second plate surface 313 of the liquid cooling plate 31, and the first plate surface 312 is in a bonding connection with the power device 21.

By the arrangement, under the action of the water pump 33, the low-temperature cooling medium enters the second heat exchanger 302 to exchange heat with hot air in the inner circulation cooling air duct 112, so that cold air is formed by cooling the hot air in the inner circulation cooling air duct 112, and under the action of the second cooling fan 342, air cooling and heat dissipation of the electronic device 22 are realized, the cooling medium in the second heat exchanger 302 then enters the liquid cooling plate 31 and exchanges heat with the power device 21 attached to the liquid cooling plate 31, liquid cooling and heat dissipation of the power device 21 are realized, then the cooling medium after temperature rise in the liquid cooling plate 31 enters the first heat exchanger 301, under the action of the first cooling fan 341, external cold air enters the outer circulation cooling air duct 111 through the air inlet 113, after the cold air exchanges heat with the cooling medium in the first heat exchanger 301 in the outer circulation cooling air duct 111, the cooled cooling medium flows back to the second heat exchanger 302 again in the first heat exchanger 301, and finally the cooling medium passes through the first heat exchanger 301 in the outer circulation air duct 111, and then the cooling medium 4 passes through the reactor 4 and is discharged through the air reactor 114, and finally the cooling medium 4 is discharged through the air reactor 114. It should be noted that, because the first heat exchanger 301 and the second heat exchanger 302 are integrally disposed on the second plate surface 313 of the liquid cooling plate 31, the cost is further reduced, the risk of liquid leakage is reduced, and the heat exchange path of the heat dissipation assembly 3 and the occupied space of the heat dissipation assembly 3 are further reduced.

In this embodiment, the second plate surface 313 includes a first plane 3131 and a second plane 3132 that are connected at an included angle, where the first connection portion 321 of the first heat exchanger 301 is disposed on the first plane 3131, the first connection portion 321 of the second heat exchanger 302 is disposed on the second plane 3132, one communication outlet 314 is disposed at a corresponding position of the first plane 3131 and the second plane 3132, and the communication inlet 3211 on the first connection portion 321 of the first heat exchanger 301 is in communication with the communication outlet 314 on the first plane 3131, and the communication inlet 3211 on the first connection portion 321 of the second heat exchanger 302 is in communication with the communication outlet 314 on the second plane 3132.

Alternatively, in this embodiment, the structures of the second heat exchanger 302 and the first heat exchanger 301 may be both the serpentine flat tube heat exchanger in the first embodiment or the second embodiment, and the parallel flow heat exchanger in the third embodiment. And the second heat exchanger 302 and the first heat exchanger 301 are each provided with a heat radiation fin 35.

It should be noted that, in this embodiment, the internal circulation cooling air duct 112 is located in a single chamber to ensure a sealed protection level for the electronic device 22. In addition, in this embodiment, a communicating avoiding hole is formed between the outer circulation heat dissipation air duct 111 and the inner circulation heat dissipation air duct 112, and the second plane 3132 is connected to the second heat exchanger 302 in the inner circulation heat dissipation air duct 112 through the avoiding hole toward one side of the second heat exchanger 302. Preferably, in the present embodiment, the outer circumference of the avoidance hole is coated with sealant, and the sealant is located at the junction of the second plane 3132 and the second heat exchanger 302, thereby ensuring the sealing effect between the outer circulation heat dissipation air duct 111 and the inner circulation heat dissipation air duct 112.

It is to be understood that the above examples of the present application are provided for clarity of illustration only and are not limiting of the embodiments of the present application. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the application are desired to be protected by the following claims.

Claims (12)

1. A heat dissipating assembly, comprising:

the liquid cooling plate (31) comprises a first plate surface (312) and a second plate surface (313), the first plate surface (312) is used for exchanging heat with the heating device (2), the liquid cooling plate (31) is provided with a water inlet (311) and a communication outlet (314), and

The heat exchanger (32) and water pump (33), liquid cooling board (31) heat exchanger (32) and water pump (33) intercommunication form circulation cooling circuit, heat exchanger (32) are including first connecting portion (321) and second connecting portion (323) of intercommunication, first connecting portion (321) have intercommunication import (3211), second connecting portion (323) have delivery port (324), first connecting portion (321) set up in second face (313) just intercommunication import (3211) with intercommunication export (314) intercommunication.

2. The heat dissipating assembly of claim 1, wherein the second connecting portion (323) is also disposed on the second plate surface (313).

3. The heat dissipation assembly according to claim 2, wherein the heat exchanger (32) is a serpentine flat tube heat exchanger, the heat exchanger (32) further comprises a main body portion (322), the first connection portion (321), the main body portion (322) and the second connection portion (323) are sequentially communicated, and the main body portion (322) is serpentine.

4. The heat sink assembly of claim 2 wherein the heat exchanger (32) is a serpentine flat tube heat exchanger, the heat exchanger (32) further comprising:

A bottom plate (325), wherein the bottom plate (325) is provided on the second plate surface (313), a plurality of communication flow passages (3251) are provided at intervals inside the bottom plate (325), and

A plurality of heat exchange pipeline (326), every heat exchange pipeline (326) all is the U-shaped, a plurality of heat exchange pipeline (326) arrange in proper order and set up in bottom plate (325), two adjacent intercommunication runner (3251) are through one heat exchange pipeline (326) intercommunication, be located the head end heat exchange pipeline (326) with first connecting portion (321) intercommunication, be located the end heat exchange pipeline (326) with second connecting portion (323) intercommunication.

5. The heat sink assembly of claim 2 wherein the heat exchanger (32) is a parallel flow heat exchanger, the heat exchanger (32) further comprising:

The flat connecting pipes (327) are parallel and are arranged at intervals, and each flat connecting pipe (327) is communicated between the first connecting part (321) and the second connecting part (323).

6. The heat dissipating assembly according to claim 5, wherein a plurality of the connection flat pipes (327) are arranged at intervals in a vertical direction, and an inner diameter size of the connection flat pipe (327) located above is larger than an inner diameter size of the connection flat pipe (327) located below among two connection flat pipes (327) arranged adjacently.

7. The heat dissipation assembly according to any one of claims 1-6, wherein the heat dissipation assembly (3) further comprises:

The heat exchanger comprises a plurality of radiating fins (35), wherein the radiating fins (35) are arranged on the heat exchanger (32) at intervals.

8. The power conversion equipment is characterized by comprising an equipment box body (1), a heating device (2) and the heat dissipation assembly according to any one of claims 1-7, wherein a heat dissipation air duct (11) is arranged in the equipment box body (1), and the heat exchanger (32) is positioned in the heat dissipation air duct (11).

9. The power conversion device according to claim 8, characterized in that the heat sink assembly (3) further comprises:

and the heat dissipation fan (34) is arranged in the heat dissipation air duct (11).

10. The power conversion apparatus according to claim 8 or 9, wherein the heat dissipation air duct (11) comprises an outer circulation heat dissipation air duct (111), the heat generating device (2) comprises a power device (21), the power device (21) is located in the outer circulation heat dissipation air duct (111), and the first plate surface (312) is in fit connection with the power device (21).

11. The power conversion device of claim 10, wherein the power conversion device further comprises:

And the reactor (4) is electrically connected with the heating device (2), and the reactor (4) is positioned in the external circulation heat dissipation air duct (111).

12. The power conversion apparatus according to claim 8 or 9, wherein the heat dissipation air duct (11) comprises an outer circulation heat dissipation air duct (111) and an inner circulation heat dissipation air duct (112) which are independent of each other, the heat generating device (2) comprises a power device (21) and an electronic device (22) which are electrically connected, the heat exchanger (32) comprises a first heat exchanger (301) and a second heat exchanger (302) which are communicated, the second plate surface (313) is provided with the first heat exchanger (301) and the second heat exchanger (302), the power device (21) and the first heat exchanger (301) are both located in the outer circulation heat dissipation air duct (111), the electronic device (22) and the second heat exchanger (302) are both located in the inner circulation heat dissipation air duct (112), and the first plate surface (312) is in fit connection with the power device (21).