CN223181110U - Semiconductor element magnetic moving carrier - Google Patents

Abstract

The present utility model discloses a magnetic moving carrier for semiconductor components, comprising a semiconductor component carrier plate and a U-shaped placement plate. The top of the semiconductor component carrier plate is evenly provided with storage grooves, and both ends of the semiconductor component carrier plate are provided with guide slides. The guide slides are slidably installed inside the guide slides, and a discharge push plate is installed on the inner side of the guide slides. The bottom of the semiconductor component carrier plate is evenly provided with mounting holes. The present utility model is equipped with a U-shaped placement plate, a protective baffle, a first magnetic block and a second magnetic block. When in use, the semiconductor component can be placed inside the U-shaped placement plate, and the first magnetic block and the second magnetic block are magnetically attracted together. The U-shaped placement plate can be quickly stored and fixed inside the storage groove, so that the semiconductor component can be quickly stored inside the semiconductor component carrier plate.

Description

Semiconductor element magnetic moving carrier

Technical Field

The utility model relates to the technical field of semiconductor element processing equipment, in particular to a magnetic moving carrier for a semiconductor element.

Background

Semiconductor devices are electronic devices that have electrical conductivity between good electrical conductors and insulators, and that utilize the specific electrical characteristics of semiconductor materials to perform specific functions, and often require placement of the semiconductor device by a mobile carrier to facilitate movement to a designated location for processing during the production of the semiconductor device.

The utility model relates to a semiconductor element moving carrier, the bulletin number is CN203300619U, a plurality of mounting blocks are respectively and correspondingly clamped and fixed in a plurality of mounting concave parts of a body, and an element placing concave cavity is arranged on the upper surface of each mounting block so as to correspondingly put in a semiconductor element, so that the mounting blocks with different specifications can share the same body, the preparation cost and the storage management problem of the semiconductor element moving carrier can be effectively reduced, however, in the implementation process of the semiconductor element moving carrier, the moving carrier is required to be fixed through a plurality of groups of positioning bead elements and the like, the operation of the semiconductor element fixing process is inconvenient, and after the semiconductor element is moved to a designated position, the semiconductor element is inconvenient to quickly take out from the carrier, and the device is inconvenient to use.

Disclosure of utility model

The present utility model is directed to a magnetic mobile carrier for semiconductor devices, which solves the above-mentioned problems.

The magnetic moving carrier for the semiconductor element comprises a semiconductor element bearing disc and a U-shaped placing plate, wherein the top of the semiconductor element bearing disc is uniformly provided with a containing groove, both ends of the inside of the semiconductor element bearing disc are respectively provided with a guide sliding groove, the inside of each guide sliding groove is slidably provided with a guide sliding block, the inside of each guide sliding block is provided with a discharging push plate, the bottom of the semiconductor element bearing disc is uniformly provided with a mounting through hole, the mounting through holes are communicated with the containing groove, the top of each discharging push plate is uniformly provided with a discharging push rod, each discharging push rod penetrates through the mounting through hole and extends to the inside of the containing groove, the top of each discharging push rod is provided with the U-shaped placing plate, and the bottom of each U-shaped placing plate is provided with a second magnetic block.

Preferably, the bottom inside the accommodating groove is provided with the first magnetic attraction blocks.

Preferably, both sides of the U-shaped placing plate are provided with protective baffles.

Preferably, return springs are mounted at two ends of the top of the discharging push plate, and one ends of the return springs, which are far away from the discharging push plate, are connected with the semiconductor element bearing plate.

Preferably, the one end of board is placed to the U type all is provided with the round hole, and the push rod is all installed to the inside of round hole, the push pedal is all installed to the one end that the push rod is close to the board is placed to the U type, and the connecting plate is all installed to the one end that the push rod kept away from the push pedal.

Preferably, the outside of push rod all overlaps and is equipped with the extension spring, the one end of extension spring all is connected with the board is placed to the U type, and the one end that the extension spring kept away from the board is placed to the U type all is connected with the connecting plate.

Preferably, handles are mounted at the tops of the two ends of the semiconductor element bearing plate, and finger grooves are formed in the inner sides of the handles.

Compared with the prior art, the utility model has the beneficial effects that:

1. The semiconductor element magnetic moving carrier is provided with the U-shaped placing plate, the protective baffle, the first magnetic attraction block and the second magnetic attraction block, when the semiconductor element magnetic moving carrier is used, the semiconductor element can be placed in the U-shaped placing plate, the semiconductor element is magnetically attracted together through the magnetism of the first magnetic attraction block and the second magnetic attraction block, the U-shaped placing plate can be quickly accommodated and fixed in the accommodating groove, and the semiconductor element can be quickly accommodated in the semiconductor element bearing disc;

2. After the device is moved to a designated position, a worker can push the discharging push plate upwards, the discharging push plate drives the U-shaped placing plate to move together through the discharging push rod, the first magnetic block and the second magnetic block can be separated, the U-shaped placing plate can be pushed out from the accommodating groove, and then the semiconductor element can be taken out from the semiconductor element carrying disc;

3. The semiconductor element magnetic moving carrier is provided with the connecting plate, the telescopic spring, the push plate and the push rod, a worker can push the connecting plate, the connecting plate drives the push plate to move through the push rod, and the semiconductor element is pushed out of the U-shaped placing plate through the push plate, so that the semiconductor element can be taken out conveniently.

Drawings

FIG. 1 is a schematic view in front cross-section of the present utility model;

FIG. 2 is a schematic side view of a U-shaped placement plate of the present utility model;

Fig. 3 is an enlarged view of the structure of fig. 1 at a in accordance with the present utility model.

The semiconductor element bearing plate comprises a semiconductor element bearing plate 1, a guide chute 3, a handle, a U-shaped placing plate 4, a containing groove 5, a discharging push rod 6, a guide slide block 7, an installation through hole 8, a reset spring 9, a discharging push plate 10, a protective baffle 11, a first magnetic block 12, a second magnetic block 13, a 14, a connecting plate 15, a telescopic spring 16, a round hole 17, a push plate 18 and a push rod.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, an embodiment of the utility model provides a semiconductor element magnetic moving carrier, which comprises a semiconductor element carrying tray 1 and a U-shaped placing plate 4, wherein the top of the semiconductor element carrying tray 1 is uniformly provided with a storage groove 5, both ends of the inside of the semiconductor element carrying tray 1 are respectively provided with a guide chute 2, the inside of the guide chute 2 is slidably provided with a guide slide block 7, the inside of the guide slide block 7 is provided with a discharge push plate 10, the bottom of the semiconductor element carrying tray 1 is uniformly provided with a mounting through hole 8, the mounting through hole 8 is communicated with the storage groove 5, the top of the discharge push plate 10 is uniformly provided with a discharge push rod 6, the discharge push rod 6 penetrates through the mounting through hole 8 and extends to the inside of the storage groove 5, the top of the discharge push rod 6 is provided with the U-shaped placing plate 4, both ends of the top of the discharge push plate 10 are respectively provided with a reset spring 9, one end of the reset spring 9 far away from the discharge push plate 10 is connected with the semiconductor element carrying tray 1, the inside of the reset spring 9 is in a sliding manner, the inside of the guide slide block 7 is provided with a discharge push plate 10 which is pushed to move downwards, the discharge push plate 10 is driven by the discharge push plate 6 to drive the U-shaped placing plate 4 to move together with the U-shaped placing plate 4, the semiconductor element carrying tray 4 can be conveniently placed by the two sides of the U-shaped placing plate 4 are arranged at the two sides of the bottom of the semiconductor element carrying tray 1, the semiconductor element carrying tray 4 is provided with two sides, the two sides of the semiconductor element carrying tray 4 can be conveniently placed by the U-shaped holding tray 4 are protected by the protection plate 3, the semiconductor element magnetic carrier is provided with two side protection boards, the two side protection boards 11 and the semiconductor element magnetic carrier is convenient to be placed by the protection boards and the protection board and the semiconductor element magnetic carrier has the semiconductor element and the carrier has the semiconductor element magnetic carrier and the carrier has a safety device and the safety device.

As shown in fig. 1-3, the bottom of the storage groove 5 is provided with the first magnetic attraction block 12, the semiconductor element is placed in the U-shaped placing plate 4, the first magnetic attraction block 12 and the second magnetic attraction block 13 are magnetically attracted together, the U-shaped placing plate 4 can be quickly stored and fixed in the storage groove 5, and the semiconductor element can be quickly stored in the semiconductor element bearing disc 1.

As shown in fig. 1, one end of the U-shaped placing plate 4 is provided with a round hole 16, a push rod 18 is installed in the round hole 16, a push plate 17 is installed at one end of the push rod 18 close to the U-shaped placing plate 4, a connecting plate 14 is installed at one end of the push rod 18 far away from the push plate 17, a telescopic spring 15 is sleeved at the outer side of the push rod 18, one end of the telescopic spring 15 is connected with the U-shaped placing plate 4, one end of the telescopic spring 15 far away from the U-shaped placing plate 4 is connected with the connecting plate 14, a worker can push the connecting plate 14, the connecting plate 14 drives the push plate 17 to move through the push rod 18, and a semiconductor element can be pushed out of the U-shaped placing plate 4 through the push plate 17, so that the semiconductor element can be conveniently taken out, and when the pushing of the connecting plate 14 is stopped, the elastic action of the telescopic spring 15 enables the connecting plate 14 to move and reset.

Working principle:

When the device is used, a worker can push the discharging push plate 10 upwards firstly, the discharging push plate 10 compresses the reset spring 9, the discharging push plate 10 drives the discharging push rod 6 to move together, the discharging push rod 6 drives the U-shaped placing plate 4 to move upwards, and the U-shaped placing plate 4 can be pushed out from the storage groove 5;

The staff can place the multiunit semiconductor component respectively in the inside of different U type place board 4, then unclamp ejection of compact push pedal 10, and at this moment, the elasticity effect of reset spring 9 makes it promote ejection of compact push pedal 10 to move down and reset, and ejection of compact push pedal 10 drives U type place board 4 through ejection of compact push rod 6 and moves together, can accomodate U type place board 4 to accomodate inside recess 5;

The U-shaped placing plate 4 drives the second magnetic attraction blocks 13 to move together, and the magnetism of the first magnetic attraction blocks 12 and the magnetism of the second magnetic attraction blocks 13 enable the second magnetic attraction blocks to be attracted together, so that the U-shaped placing plate 4 can be quickly stored and fixed in the storage groove 5, and semiconductor elements can be quickly stored in the semiconductor element bearing disc 1;

After the semiconductor element is moved to a designated position, a worker can push the discharging push plate 10 upwards, the discharging push plate 10 drives the U-shaped placing plate 4 to move together through the discharging push rod 6, the first magnetic block 12 and the second magnetic block 13 can be separated, and the U-shaped placing plate 4 can be pushed out from the accommodating groove 5;

Then, the worker can push the connecting plate 14, the connecting plate 14 drives the pushing plate 17 to move through the pushing plate 18, and the semiconductor element can be pushed out of the U-shaped placing plate 4 through the pushing plate 17, so that the semiconductor element can be taken out conveniently.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (7)

1. The utility model provides a semiconductor element magnetism removes carrier, includes semiconductor element loading tray (1) and U type and places board (4), its characterized in that, semiconductor element loading tray (1) top evenly is provided with accomodates recess (5), and semiconductor element loading tray (1) inside both ends all are provided with direction spout (2), the inside of direction spout (2) all slidable mounting has direction slider (7), and the inboard of direction slider (7) installs ejection of compact push pedal (10), semiconductor element loading tray (1) bottom evenly is provided with installation through-hole (8), and installation through-hole (8) all communicate with accomodate recess (5), ejection of compact push pedal (10) top evenly installs ejection of compact push rod (6), ejection of compact push rod (6) all pass installation through-hole (8) and extend to accomodate the inside of recess (5), and ejection of compact push rod (6) top all installs U type and place board (4), second magnet (13) are all installed to the bottom of U type and place board (4).

2. The semiconductor device magnetic mobile carrier according to claim 1, wherein the first magnetic blocks (12) are mounted at the bottoms of the storage grooves (5).

3. The magnetic mobile carrier for semiconductor devices according to claim 1, wherein the U-shaped placing plate (4) is provided with a protective baffle (11) on both sides.

4. The semiconductor device magnetic mobile carrier of claim 1, wherein the two ends of the top of the discharging push plate (10) are provided with the return springs (9), and one ends of the return springs (9) far away from the discharging push plate (10) are connected with the semiconductor device bearing disc (1).

5. The magnetic mobile carrier for semiconductor devices according to claim 1, wherein the U-shaped placing plates (4) are provided with round holes (16) at one ends, push rods (18) are installed in the round holes (16), push plates (17) are installed at one ends, close to the U-shaped placing plates (4), of the push rods (18), and connecting plates (14) are installed at one ends, far away from the push plates (17), of the push rods (18).

6. The semiconductor device magnetic mobile carrier of claim 5, wherein the outer sides of the push rods (18) are sleeved with telescopic springs (15), one ends of the telescopic springs (15) are connected with the U-shaped placing plate (4), and one ends of the telescopic springs (15) far away from the U-shaped placing plate (4) are connected with the connecting plate (14).

7. The magnetic mobile carrier for semiconductor devices according to claim 1, wherein handles (3) are mounted on top of both ends of the semiconductor device carrying tray (1), and finger grooves are formed on inner sides of the handles (3).