CN223157304U - High-precision multilayer PCB integrated circuit board - Google Patents
High-precision multilayer PCB integrated circuit boardInfo
- Publication number
- CN223157304U CN223157304U CN202421487412.8U CN202421487412U CN223157304U CN 223157304 U CN223157304 U CN 223157304U CN 202421487412 U CN202421487412 U CN 202421487412U CN 223157304 U CN223157304 U CN 223157304U
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- circuit board
- mounting
- multilayer pcb
- precision
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型涉及抗静电耐压性好的集成电路板领域，且公开了一种具体为安装板和集成电路板安装装置盒，安装板的表面固定有集成电路板安装装置盒,集成电路板安装装置盒的两端固定连接有便捷安装的自攻螺丝，集成电路板安装装置盒呈长方形且内部连接固定高精密多层PCB集成电路板本体简图，合集成电路板安装装置扣的一字螺丝连接固定高精密多层PCB集成电路板本体简图和集成电路板安装装置盒，通过高精密多层PCB集成电路板本体简图预留的安装孔位，将高精密多层PCB集成电路板本体简图安装于集成电路板安装装置盒中，由集成电路板安装装置扣来将高精密多层PCB集成电路板本体简图固定于集成电路板安装装置盒上，面对于面的夹击安装方式。
The utility model relates to the field of integrated circuit boards with good antistatic and pressure resistance, and discloses a mounting plate and an integrated circuit board mounting device box, wherein the integrated circuit board mounting device box is fixed on the surface of the mounting plate, and both ends of the integrated circuit board mounting device box are fixedly connected with self-tapping screws for convenient installation, the integrated circuit board mounting device box is rectangular and internally connected and fixed with a high-precision multi-layer PCB integrated circuit board body schematic diagram, a slotted screw engaged with an integrated circuit board mounting device buckle connects and fixes the high-precision multi-layer PCB integrated circuit board body schematic diagram and the integrated circuit board mounting device box, the high-precision multi-layer PCB integrated circuit board body schematic diagram is installed in the integrated circuit board mounting device box through a mounting hole position reserved for the high-precision multi-layer PCB integrated circuit board body schematic diagram, and the high-precision multi-layer PCB integrated circuit board body schematic diagram is fixed to the integrated circuit board mounting device box by the integrated circuit board mounting device buckle, in a face-to-face clamping installation manner.
Description
Technical Field
The utility model relates to the field of integrated circuit boards with good antistatic and pressure resistance, in particular to a mounting plate and an integrated circuit board mounting device box, wherein the surface of the mounting plate is fixedly provided with the integrated circuit board mounting device box, two ends of the integrated circuit board mounting device box are fixedly connected with self-tapping screws which are convenient to mount, the integrated circuit board mounting device box is rectangular and internally connected with a high-precision multilayer PCB integrated circuit board body sketch, four corners of the high-precision multilayer PCB integrated circuit board body sketch are provided with straight screws matched with integrated circuit board mounting device buckles, the straight screws matched with the integrated circuit board mounting device buckles are connected with and fix the high-precision multilayer PCB integrated circuit board body sketch and the integrated circuit board mounting device box, the high-precision multilayer PCB integrated circuit board sketch is mounted in the integrated circuit board mounting device box through mounting hole sites reserved by the high-precision multilayer PCB integrated circuit board body sketch, and the high-precision multilayer PCB integrated circuit board sketch is fixed on the integrated circuit board mounting device box in a surface-to-facing clamping mounting mode.
Background
In the trend of miniaturization and high performance, the internal structure of the multilayer PCB integrated circuit board is more and more complex, and the conductive lines are more and more dense. The high-density layout increases the risk of high-temperature short circuit between circuits, the heat dissipation is seriously affected by the installation mode and the fin shape of the metal heat dissipation plate, and the reliability and the service life of the integrated circuit are greatly shortened. The circuit pitch is reduced, and the heat dissipation installation problem is increasingly prominent. Therefore, the short-circuit overheat caused by the short-circuit overheat can not only lead to the failure of the circuit function, but also possibly cause safety accidents, and therefore, a high-precision multilayer PCB integrated circuit board is provided.
Disclosure of utility model
(One) solving the technical problems
Aiming at the defects of the prior art, the utility model provides a high-precision multilayer PCB integrated circuit board, which solves the problems.
(II) technical scheme
In order to achieve the above purpose, the present utility model provides the following technical solutions: the high-precision multilayer PCB integrated circuit board comprises a mounting plate and an integrated circuit board mounting device box, and is characterized in that the surface of the mounting plate is fixedly provided with the integrated circuit board mounting device box, the two ends of the integrated circuit board mounting device box are fixedly connected with self-tapping screws, the integrated circuit board mounting device box is rectangular and internally connected with and fixedly provided with a high-precision multilayer PCB integrated circuit board body, four corners of the high-precision multilayer PCB integrated circuit board body are provided with straight screws which are connected with and fixedly provided with the high-precision multilayer PCB integrated circuit board body and the integrated circuit board mounting device box, the surface of the high-precision multilayer PCB integrated circuit board body is provided with integrated circuit board mounting device buckles, the surface of the integrated circuit board mounting device box and the four corners of the surface of the high-precision multilayer PCB integrated circuit board body are provided with holes, the right end of the high-precision multilayer PCB integrated circuit board body is fixedly provided with a metal radiator, the integrated circuit board mounting device box is in threaded connection with a self-tapping screw through a module mounting part, the self-tapping screw penetrates through a mounting plate, the surface of the high-precision multilayer PCB integrated circuit board body is provided with an integrated circuit board mounting device buckle, the integrated circuit board mounting device buckle is provided with a straight screw which is convenient for fixing the high-precision multilayer PCB integrated circuit board body in the integrated circuit board mounting device box, the surface of the integrated circuit board mounting device box and four corners of the surface of the high-precision multilayer PCB integrated circuit board body are provided with holes, the disassembly of the high-precision multilayer PCB integrated circuit board body is facilitated, the right end of the high-precision multilayer PCB integrated circuit board body is fixedly provided with the metal radiator, the self-tapping screw can enable the integrated circuit board mounting device box to be fixedly mounted on the mounting plate, is convenient and quick.
Preferably, holes are formed in four corners of the surface of the high-precision multilayer PCB integrated circuit board body, a first integrated circuit board working module and a second integrated circuit board working module which are assembled in sequence are fixed at the left end of the surface, a first metal radiator mounting part is fixedly arranged on the surface of the lower end of the high-precision multilayer PCB integrated circuit board body, a first integrated circuit board working module is assembled in sequence at the right end of the high-precision multilayer PCB integrated circuit board body, and a first metal radiator mounting part is fixedly arranged on the upper surface of the second integrated circuit board working module.
Preferably, the integrated circuit board installation device box comprises an insulating heat dissipation box shell, an installation limiting part and a module installation part, wherein the module installation part is fixedly installed on two sides of the insulating heat dissipation box shell, the installation limiting part is fixedly installed on four corners of the inner wall of the insulating heat dissipation box shell, the installation limiting part is provided with a reserved installation hole site, and two groups of reserved installation positions are respectively arranged on two sides of the insulating heat dissipation box shell.
Preferably, the top end of the metal radiator mounting part at the bottom is fixedly provided with an arc transition, the surface of the arc transition is provided with a fin supporting part, and the surface of the fin supporting part is fixedly provided with annular sequence curved fins.
Preferably, the limiting part is arranged on the upper surface of the limiting mounting surface, the right end of the limiting mounting surface is connected with the fixed support rear plate, the left end of the support rear plate is connected with the lower part of the limiting mounting surface, the lower surface of the limiting mounting surface is provided with the threaded limiting part, and the threaded limiting part is inserted with the lengthened threaded limiting part.
(III) beneficial effects
Compared with the prior art, the utility model provides a high-precision multilayer PCB integrated circuit board, which has the following beneficial effects:
1. The high-precision multilayer PCB integrated circuit board body is mounted in the integrated circuit board mounting device box through the reserved mounting hole position, the high-precision multilayer PCB integrated circuit board body is fixed on the integrated circuit board mounting device box through the integrated circuit board mounting device, the high-precision multilayer PCB integrated circuit board body can be better protected from being damaged during mounting through a clamping mounting mode of the surface, the metal radiator is mounted on the first metal radiator mounting part through a special fixing mode, and the reserved mounting position can be used as a reserved mounting position of the integrated circuit board mounting device when heat can be transmitted.
2. The two metal radiators are mounted on the square two sides of the high-precision multilayer PCB integrated circuit board body, so that the two working modules I and II of the high-precision multilayer PCB integrated circuit board body can be cooled at the same time, and the whole high-precision multilayer PCB integrated circuit board body can be suspended in the air by reserving the mounting hole sites and the limiting design of the mounting limiting part, so that the heat dissipation area is increased.
3. The mounting design of the module mounting part can more conveniently mount the high-precision multilayer PCB integrated circuit board body suspended in the air at the working position of the module mounting part, the arc connection design with excessive arc can increase the integral singing effect of the metal radiator, the fin supporting part is a main supporting part of the radiating fin, the processing difficulty of the metal radiator can be greatly reduced, the radiating area of the metal radiator is greatly improved due to the design of the curved surface fin, the radiating efficiency of the metal radiator is remarkably improved, the design of the integrated circuit board mounting device buckle is surface clamping type fixing, the pressure between the surfaces is increased by screwing screws, the high-precision multilayer PCB integrated circuit board body is fixed through the increased surface friction, and the low damage rate of the high-precision multilayer PCB integrated circuit board body in the mounting process is greatly ensured.
Drawings
FIG. 1 is a schematic diagram of a high-precision multi-layer PCB integrated circuit board structure;
FIG. 2 is a schematic cross-sectional view of a high-precision multi-layer PCB integrated circuit board body of the present invention;
FIG. 3 is a schematic diagram of the operational modules of the present integrated circuit board;
FIG. 4 is a schematic diagram of a housing of the insulating heat dissipation case of the present invention;
FIG. 5 is a schematic view of a metal heat sink optimized for the present application;
fig. 6 is a schematic diagram of a circuit board mounting device.
In the figure, a 1-high-precision multilayer PCB integrated circuit board body, a 2-mounting plate, a 3-integrated circuit board mounting device box, a 4-metal radiator, a 5-integrated circuit board mounting device buckle, a 6-self-tapping screw, a 7-straight screw, a 8-metal radiator mounting part I, a 9-integrated circuit board working module I, a 10-integrated circuit board working module II, a 11-metal radiator mounting part II, a 12-insulating radiator box shell, a 13-reserved mounting hole position, a 14-reserved mounting position, a 15-mounting limiting part, a 16-module mounting part, a 17-arc transition part, a 18-metal radiator mounting part, a 19-fin supporting part, a 20-curved fin, a 21-guiding limiting part, a 22-limiting mounting surface, a 23-limiting mounting surface under, a 24-lengthening thread limiting part, a 25-thread limiting part, a 26-supporting rear plate and a 27-waist hole.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-6, a high-precision multi-layer PCB integrated circuit board comprises a mounting plate 2 and an integrated circuit board mounting device box 3, wherein the surface of the mounting plate 2 is fixed with the integrated circuit board mounting device box 3, both ends of the integrated circuit board mounting device box 3 are fixedly connected with tapping screws 6, the integrated circuit board mounting device box 3 is rectangular and internally connected with a high-precision multi-layer PCB integrated circuit board body 1, four corners of the high-precision multi-layer PCB integrated circuit board body 1 are provided with straight screws 7, the straight screws 7 are connected with and fixed with the high-precision multi-layer PCB integrated circuit board body 1 and the integrated circuit board mounting device box 3, the surface of the high-precision multi-layer PCB integrated circuit board body 1 is provided with integrated circuit board mounting device buckles 5, the surface of the integrated circuit board mounting device box 3 and the four corners of the surface of the high-precision multi-layer PCB integrated circuit board body 1 are provided with holes, the right end of the high-precision multilayer PCB integrated circuit board body 1 is fixedly provided with a metal radiator 4, the integrated circuit board mounting device box 3 is in threaded connection with a self-tapping screw 6 through a module mounting part 16, the self-tapping screw 6 penetrates through the mounting plate 2, the surface of the high-precision multilayer PCB integrated circuit board body 1 is provided with an integrated circuit board mounting device buckle 5, the integrated circuit board mounting device buckle 5 is provided with a straight screw 7 convenient for fixing the high-precision multilayer PCB integrated circuit board body 1 in the integrated circuit board mounting device box 3, the surface of the integrated circuit board mounting device box 3 and four corners of the surface of the high-precision multilayer PCB integrated circuit board body 1 are provided with holes, the disassembly of the high-precision multilayer PCB integrated circuit board body 1 is facilitated, the right end of the high-precision multilayer PCB integrated circuit board body 1 is fixedly provided with the metal radiator 4, the self-tapping screw 6 can enable the integrated circuit board mounting device box 3 to be fixedly mounted on the mounting plate 2, and is convenient and quick.
Holes are formed in four corners of the surface of the high-precision multilayer PCB integrated circuit board body 1, a first integrated circuit board working module 9 and a second integrated circuit board working module 10 which are sequentially installed are fixed at the left end of the surface, a first metal radiator installation part 8 is fixedly installed on the surface of the lower end of the high-precision multilayer PCB integrated circuit board body 1, a first integrated circuit board working module 9 is sequentially installed at the right end of the high-precision multilayer PCB integrated circuit board body 1, and a first metal radiator installation part 8 is fixedly installed on the upper surface of the second integrated circuit board working module 10.
The integrated circuit board installation device box 3 includes insulating heat dissipation box casing 12, installation spacing portion 15 and module installation portion 16, and the equal fixed mounting in both sides of insulating heat dissipation box casing 12 has module installation portion 16, and the equal fixed mounting in four corners of inner wall of insulating heat dissipation box casing 12 has installation spacing portion 15, sets up on the installation spacing portion 15 and reserves installation hole site 13, two sets of reservation mounted position 14 have all been seted up to insulating heat dissipation box casing 12 both sides.
The top end of the bottom metal radiator mounting part 18 is fixedly provided with an arc transition 17, the surface of the arc transition 17 is provided with a fin supporting part 19, and the surface of the fin supporting part 19 is fixedly provided with annular sequence curved fins 20.
The surface of the limiting installation surface 26 is provided with a guiding limiting part 21, the right end of the limiting installation surface 22 is connected with a fixed support rear plate 26, the left end of the support rear plate 26 is connected with a limiting installation surface lower 23, the surface of the limiting installation surface lower 23 is provided with a thread limiting part 25, and the thread limiting part 25 is inserted with an lengthening thread limiting part 24.
The working principle is that the high-precision multilayer PCB integrated circuit board body 1 is installed in an integrated circuit board installation device box 3 through an installation hole site reserved in the high-precision multilayer PCB integrated circuit board body 1, the high-precision multilayer PCB integrated circuit board body 1 is fixed on the integrated circuit board installation device box 3 through an integrated circuit board installation device buckle 5, and the high-precision multilayer PCB integrated circuit board body 1 can be better protected from being damaged during installation in a clamping installation mode of a surface; the metal radiator 4 is arranged on the first metal radiator mounting part 8 in a special fixing mode, the reserved mounting position 14 can penetrate heat and can be used as a reserved mounting position of the integrated circuit board mounting device buckle 5, the two metal radiators 4 are arranged on the square two sides of the high-precision multilayer PCB integrated circuit board body 1 in a total mode, the first working module integrated circuit board working module 9 and the second working module 10 of the high-precision multilayer PCB integrated circuit board body 1 can be cooled simultaneously, the reserved mounting hole positions 13 and the limiting design of the mounting limiting part 15 can enable the high-precision multilayer PCB integrated circuit board body 1 to be suspended in the air in a whole mode, the heat radiating area is increased, the mounting design of the module mounting part 16 can enable the high-precision multilayer PCB integrated circuit board body 1 suspended in the air to be mounted at the working position more conveniently, the arc connection design of the arc transition 17 can increase the whole sing-down efficiency of the metal radiator 4, the fin supporting part 19 is a main supporting part of fins, the processing difficulty of the metal radiator 4 can be greatly reduced, the curved fin design of the curved fin 20 can greatly improve the heat radiating area of the metal radiator 4, the integrated circuit board mounting device buckle 5 is designed to be fixed in a surface clamping mode, the pressure between the surfaces is increased by screwing down screws, the high-precision multilayer PCB integrated circuit board body 1 is fixed by the increased surface friction, and the low damage rate of the high-precision multilayer PCB integrated circuit board body 1 in the mounting process is greatly ensured.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a high-precision multilayer PCB integrated circuit board, including mounting panel (2) and integrated circuit board installation device box (3), wherein the surface mounting of mounting panel (2) has integrated circuit board installation device box (3), integrated circuit board installation device box (3) are rectangle and internal connection fixed high-precision multilayer PCB integrated circuit board body (1), four angles of high-precision multilayer PCB integrated circuit board body (1) all have a word screw (7), a word screw (7) connect fixed high-precision multilayer PCB integrated circuit board body (1) and integrated circuit board installation device box (3), integrated circuit board installation device knot (5) have been seted up on the surface of high-precision multilayer PCB integrated circuit board body (1), the right-hand member fixed mounting metal radiator (4) of high-precision multilayer PCB integrated circuit board body (1).
2. The high-precision multilayer PCB integrated circuit board according to claim 1, wherein the module mounting parts (16) are arranged on two sides of the integrated circuit board mounting device box (3), waist holes (27) are formed in the module mounting parts (16), and the module mounting parts (16) are fixedly connected with the mounting plate (2) through self-tapping screws (6).
3. The high-precision multi-layer PCB integrated circuit board according to claim 1, wherein holes are formed in four corners of the surface of the high-precision multi-layer PCB integrated circuit board body (1), a first integrated circuit board working module (9) and a second integrated circuit board working module (10) which are sequentially assembled are fixed at the left end of the surface of the high-precision multi-layer PCB integrated circuit board body (1), and a first metal radiator mounting part (8) is fixedly mounted on the surface of the high-precision multi-layer PCB integrated circuit board body (1).
4. The high-precision multilayer PCB integrated circuit board of claim 1, wherein the four corners of the inner wall of the insulating heat dissipation box shell (12) are fixedly provided with installation limiting parts (15), the installation limiting parts (15) are provided with reserved installation hole sites (13), the positions of the reserved installation hole sites (13) correspond to the positions of the guiding limiting parts (21), the straight screws (7) penetrate through the reserved installation hole sites (13) and the guiding limiting parts (21) to be fixed, and two groups of reserved installation positions (14) are respectively arranged on two sides of the insulating heat dissipation box shell (12).
5. The high-precision multilayer PCB integrated circuit board of claim 1, wherein 4) comprises an arc transition (17), a metal radiator mounting part (18), a fin supporting part (19) and a curved fin (20), the arc transition (17) is fixedly mounted at the top end of the metal radiator mounting part (18) at the bottom, the fin supporting part (19) is mounted on the surface of the arc transition (17), and the annular sequence curved fin (20) is fixedly mounted on the surface of the fin supporting part (19).
6. The high-precision multilayer PCB integrated circuit board of claim 1, wherein the integrated circuit board mounting device buckle (5) comprises a guide limiting part (21), a limiting mounting surface upper part (22), a limiting mounting surface lower part (23), a thread limiting part (25) and a support rear plate (26), the guide limiting part (21) is arranged on the surface of the limiting mounting surface upper part (22), the right end of the limiting mounting surface upper part (22) is connected with the fixed support rear plate (26), the left end of the support rear plate (26) is connected, the thread limiting part (25) is arranged on the surface of the limiting mounting surface lower part (23), the thread limiting part (25) is inserted with an lengthening thread limiting part (24), and the integrated circuit board mounting device buckle (5) is fixedly arranged in the reserved mounting position (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421487412.8U CN223157304U (en) | 2024-06-27 | 2024-06-27 | High-precision multilayer PCB integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421487412.8U CN223157304U (en) | 2024-06-27 | 2024-06-27 | High-precision multilayer PCB integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223157304U true CN223157304U (en) | 2025-07-25 |
Family
ID=96457843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421487412.8U Active CN223157304U (en) | 2024-06-27 | 2024-06-27 | High-precision multilayer PCB integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223157304U (en) |
-
2024
- 2024-06-27 CN CN202421487412.8U patent/CN223157304U/en active Active
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