CN223157294U - A circuit board heat dissipation structure - Google Patents
A circuit board heat dissipation structureInfo
- Publication number
- CN223157294U CN223157294U CN202422410914.7U CN202422410914U CN223157294U CN 223157294 U CN223157294 U CN 223157294U CN 202422410914 U CN202422410914 U CN 202422410914U CN 223157294 U CN223157294 U CN 223157294U
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- heat dissipation
- bottom plate
- board body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本实用新型公开了一种电路板散热结构，包括：电路板本体、第一导热部、散热底板以及第二导热部，所述散热底板间隔设于电路板本体下方，所述第一导热部设于电路板本体与所述散热底板之间，并与两者接触，所述散热底板底部设置若干散热片，左侧设置有散热侧板，所述第二导热部设于所述散热侧板右侧，且其左侧与散热侧板接触、底部与所述电路板本体顶部接触。采用上述技术方案，通过设置第一导热部可以将电路板本体上的热能传导到散热底板和散热片上，通过散热底板和散热片可以快速将热能散发出去，通过设置第二导热部可以将电路板本体顶部的热能传导到散热侧板上进行散热，实现电路板快速散热，提升散热效果，从而可以提升电路板的使用寿命。
The utility model discloses a heat dissipation structure of a circuit board, including: a circuit board body, a first heat-conducting part, a heat-dissipating bottom plate and a second heat-conducting part, wherein the heat-dissipating bottom plate is arranged below the circuit board body, the first heat-conducting part is arranged between the circuit board body and the heat-dissipating bottom plate and contacts both of them, a plurality of heat-dissipating fins are arranged at the bottom of the heat-dissipating bottom plate, a heat-dissipating side plate is arranged on the left side, and the second heat-conducting part is arranged on the right side of the heat-dissipating side plate, and its left side contacts the heat-dissipating side plate, and its bottom contacts the top of the circuit board body. By adopting the above technical scheme, the heat energy on the circuit board body can be conducted to the heat-dissipating bottom plate and the heat-dissipating fins by arranging the first heat-conducting part, and the heat energy can be quickly dissipated through the heat-dissipating bottom plate and the heat-dissipating fins, and the heat energy can be quickly dissipated by arranging the second heat-conducting part, and the heat energy on the top of the circuit board body can be conducted to the heat-dissipating side plate for heat dissipation, thereby realizing rapid heat dissipation of the circuit board and improving the heat dissipation effect, thereby improving the service life of the circuit board.
Description
Technical Field
The utility model relates to the technical field related to circuit boards, in particular to a circuit board heat dissipation structure.
Background
The circuit board is generally installed in the prior electrical components (such as a voltage reducer, a charger and the like), some electronic components with large heating value are generally arranged on the circuit board, the functional requirements of the circuit board are met, when the electrical components are in a working state for a long time, a large amount of heat is generated on the internal circuit board, if the heat on the circuit board is not discharged in time, the circuit board and the electronic components on the circuit board are in a high-temperature state, the circuit board and the electronic components are damaged, and the service life of the circuit board is shortened.
Disclosure of utility model
In order to overcome the defects of the prior art, the utility model aims to provide a circuit board heat dissipation structure for solving the technical problems.
The technical scheme adopted for solving the technical problems is as follows:
According to one aspect of the utility model, a circuit board radiating structure is designed, and comprises a circuit board body, a first heat conducting part, a radiating bottom plate and a second heat conducting part, wherein the radiating bottom plate is arranged below the circuit board body at intervals, the first heat conducting part is arranged between the circuit board body and the radiating bottom plate and is in contact with the circuit board body and the radiating bottom plate, a plurality of radiating fins are arranged at the bottom of the radiating bottom plate, a radiating side plate is arranged on the left side of the radiating bottom plate, the second heat conducting part is arranged on the right side of the radiating side plate, the left side of the second heat conducting part is in contact with the radiating side plate, and the bottom of the second heat conducting part is in contact with the top of the circuit board body.
By adopting the technical scheme, the heat energy on the circuit board body can be conducted to the heat radiating bottom plate and the heat radiating fins through the first heat conducting part, the heat energy can be rapidly emitted out through the heat radiating bottom plate and the heat radiating fins, the heat energy at the top of the circuit board body can be conducted to the heat radiating side plate to radiate through the second heat conducting part, the rapid heat radiation of the circuit board is realized, the heat radiation effect is improved, and the service life of the circuit board can be prolonged.
In order to better solve the technical defects, the utility model also has a better technical scheme:
In some embodiments, a thermally conductive insulating sheet is disposed between the circuit board body and the heat dissipating base plate. Therefore, the insulation performance between the circuit board body and the radiating bottom plate can be improved.
In some embodiments, the four corners of the heat dissipation bottom plate are respectively provided with a connecting pin, and the connecting pins are provided with mounting waist holes.
In some embodiments, the first heat conducting part is in a block structure or a sheet structure, and is provided with one or more.
In some embodiments, the second heat conducting part is in a block structure or a strip plate structure, and is provided with one or more.
In some embodiments, a pressing plate is arranged on the right side of the second heat conduction part, and the heat dissipation side plate is fixedly connected with the pressing plate through screws.
In some embodiments, the circuit board body is fixedly connected with the heat dissipation bottom plate through screws.
In some embodiments, a plurality of heat dissipation strips are distributed on the left side of the heat dissipation side plate, and the heat dissipation side plate and the heat dissipation bottom plate are integrally structured. Therefore, the heat dissipation performance of the circuit board can be further improved.
Drawings
Fig. 1 is a schematic diagram of a circuit board heat dissipation structure according to an embodiment of the present utility model;
FIG. 2 is a schematic view of a heat dissipation structure of a circuit board;
FIG. 3 is a schematic front view of a heat dissipation structure of a circuit board;
FIG. 4 is an exploded view of a circuit board heat dissipating structure;
Reference numerals:
1. The circuit board comprises a circuit board body, a first heat conducting part, a heat dissipation bottom plate, a connecting pin, a mounting waist hole, a heat dissipation fin, a heat dissipation side plate, a second heat conducting part, a pressing plate, a screw and a connecting pin.
Detailed Description
The objects, technical solutions and advantages of the present utility model will become more apparent by the following detailed description of the present utility model with reference to the accompanying drawings. It should be understood that the description is only illustrative and is not intended to limit the scope of the utility model. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the present utility model.
In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, mounting, connection, securing, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Referring to fig. 1 to 4, the present utility model provides a circuit board heat dissipation structure, which includes a circuit board body 1, a first heat conduction portion 2, a heat dissipation base plate 3, and a second heat conduction portion 4.
The heat dissipation base plate 3 is made of metal, specifically, the heat dissipation base plate 3 is made of aluminum or aluminum alloy or copper or silver, etc., and in this embodiment, the heat dissipation base plate 3 is preferably made of aluminum. The four corners of the radiating bottom plate 3 are respectively provided with a connecting pin 31, the connecting pins 31 are provided with mounting waist holes 32, and the mounting waist holes 32 are strip-shaped through holes with the length being greater than the width.
The heat dissipation bottom plate 3 is located circuit board body 1 below to keep the clearance with circuit board body 1, first heat conduction portion 2 is located between circuit board body 1 and the heat dissipation bottom plate 3, first heat conduction portion 2 top and circuit board body 1 contact, bottom and heat dissipation bottom plate 3 top contact, pass through the screw rigid coupling between circuit board body 1 and the heat dissipation bottom plate 3, wherein, first heat conduction portion 2 is massive structure or sheet structure, first heat conduction portion 2 is provided with one or more, when first heat conduction portion 2 is provided with one, first heat conduction portion 2 is a big sheet structure, set up a plurality ofly when first heat conduction portion 2, first heat conduction portion 2 is massive structure, and first heat conduction portion 2 is located the electronic component below that calorific capacity is big on the circuit board body 1. The first heat conduction part 2 is a heat conduction silica gel sheet.
A heat conducting insulating sheet is arranged between the circuit board body 1 and the heat radiating bottom plate 3, wherein the heat conducting insulating sheet is positioned between the circuit board body 1 and the first heat conducting part 2 or between the first heat conducting part 2 and the heat radiating bottom plate 3.
The bottom of the radiating bottom plate 3 is provided with a plurality of radiating fins 33, and the radiating fins 33 and the radiating bottom plate 3 are integrally structured.
The left side of the heat dissipation bottom plate 3 is provided with a heat dissipation side plate 34, the heat dissipation side plate 34 and the heat dissipation bottom plate 3 are of an integrated structure, the second heat conduction part 4 is arranged on the right side of the heat dissipation side plate 34, the left side of the second heat conduction part 4 is in contact with the heat dissipation side plate 34, the bottom of the second heat conduction part 4 is in contact with the top of the circuit board body 1, the second heat conduction part 4 is of a block structure or a strip plate structure, one or more of the second heat conduction parts 4 are preferably in a block shape, the plurality of the second heat conduction parts are longitudinally arranged, the right side of the second heat conduction part 4 is provided with a pressing plate 5, the heat dissipation side plate 34 is fixedly connected with the pressing plate 5 through screws 6, specifically, one end of each screw 6 penetrates through holes on the heat dissipation side plate 34 and is in threaded hole threaded connection with the pressing plate 5 to fix the second heat conduction part 4, and the second heat conduction part 4 is a block-shaped heat conduction silica gel sheet.
In some embodiments, a plurality of heat dissipation strips are distributed at intervals on the left side of the heat dissipation side plate, and the heat dissipation strips and the heat dissipation side plate are integrally formed.
The foregoing is merely illustrative of some embodiments of the utility model, and it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the inventive concept.
Claims (8)
1. The circuit board heat radiation structure is characterized by comprising a circuit board body, a first heat conduction part, a heat radiation bottom plate and a second heat conduction part, wherein the heat radiation bottom plate is arranged below the circuit board body at intervals, the first heat conduction part is arranged between the circuit board body and the heat radiation bottom plate and is in contact with the circuit board body and the heat radiation bottom plate, a plurality of heat radiation fins are arranged at the bottom of the heat radiation bottom plate, a heat radiation side plate is arranged at the left side of the heat radiation bottom plate, the second heat conduction part is arranged at the right side of the heat radiation side plate, the left side of the second heat conduction part is in contact with the heat radiation side plate, and the bottom of the second heat conduction part is in contact with the top of the circuit board body.
2. The circuit board heat dissipation structure as defined in claim 1, wherein a heat conductive insulating sheet is disposed between the circuit board body and the heat dissipation base plate.
3. The circuit board heat dissipation structure according to claim 1 or 2, wherein the heat dissipation base plate is provided with connection pins at four corners, respectively, and the connection pins are provided with mounting waist holes.
4. The circuit board heat dissipation structure according to claim 1, wherein the first heat conducting portion has a block-like structure or a sheet-like structure, and is provided with one or more.
5. The circuit board heat dissipation structure according to claim 1, wherein the second heat conduction portion has a block structure or a long strip structure, and is provided with one or more.
6. The circuit board heat dissipation structure according to claim 1 or 5, wherein a pressing plate is disposed on the right side of the second heat conduction portion, and the heat dissipation side plate is fixedly connected with the pressing plate through screws.
7. The circuit board heat dissipation structure according to claim 1, wherein the circuit board body is fixedly connected with the heat dissipation base plate through screws.
8. The heat dissipation structure of claim 1, wherein a plurality of heat dissipation strips are distributed on the left side of the heat dissipation side plate, and the heat dissipation side plate and the heat dissipation bottom plate are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422410914.7U CN223157294U (en) | 2024-09-30 | 2024-09-30 | A circuit board heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422410914.7U CN223157294U (en) | 2024-09-30 | 2024-09-30 | A circuit board heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223157294U true CN223157294U (en) | 2025-07-25 |
Family
ID=96459434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202422410914.7U Active CN223157294U (en) | 2024-09-30 | 2024-09-30 | A circuit board heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223157294U (en) |
-
2024
- 2024-09-30 CN CN202422410914.7U patent/CN223157294U/en active Active
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