CN223125174U

CN223125174U - Heat conduction structure of MOS tube of power plate of electronic speed regulator

Info

Publication number: CN223125174U
Application number: CN202421434548.2U
Authority: CN
Inventors: 潘龙良; 吴后建
Original assignee: Shenzhen Xiongcai Technology Co ltd
Current assignee: Shenzhen Xiongcai Technology Co ltd
Priority date: 2024-06-21
Filing date: 2024-06-21
Publication date: 2025-07-18
Anticipated expiration: 2034-06-21

Abstract

The utility model discloses a heat conduction structure of an MOS tube of an electronic speed regulator power board, which comprises a shell component, a circuit board, MOS tube pad pins, an MOS tube and a heat conduction piece, wherein the circuit board, the MOS tube pad pins, the MOS tube and the heat conduction piece are all arranged in the shell component, the MOS tube pad pins, the MOS tube and the heat conduction piece are all arranged on the circuit board, a plurality of MOS tube pad pins and a plurality of MOS tubes are arranged at the top of the circuit board, the MOS tube pad pins and the MOS tubes are adjacently arranged, and the heat conduction piece is arranged above the MOS tube. The utility model greatly increases the heat-conducting capacity of the MOS tube, leads the heat of the MOS tube to be quickly conducted to the heat-dissipating shell component by a method of opening a window on the lower surface of the circuit board and exposing the copper sheet, volatilizes the heat through the heat-dissipating shell component so as to achieve the purposes of more effectively and quickly reducing the working temperature of the MOS tube and improve the reliability and the stability of the electronic speed regulator and the service life, thereby having simple and compact structure, simple assembly and strong practicability.

Description

Heat conduction structure of MOS tube of power plate of electronic speed regulator

Technical Field

The utility model belongs to an electronic speed regulator, and particularly relates to a heat conduction structure of an MOS tube of a power plate of the electronic speed regulator.

Background

The reliability and stability of the electronic speed regulator have a vital effect on the performance of unmanned aerial vehicle products, the conventional MOS tube of the electronic speed regulator in the market at present is characterized in that the copper sheet is used as a heat conducting medium, the heat of the MOS tube is quickly led to an aluminum radiator through a heat conducting piece, and the heat is volatilized out through the aluminum radiator, so that the purpose of reducing the working temperature of the MOS tube is achieved, and the reliability, the stability and the service life of the electronic speed regulator are improved. The heat of the MOS tube of the speed regulator designed by the design can be only guided out through the heat conducting piece on the upper surface of the PCB, and the actual heat conducting effect is very limited.

Disclosure of utility model

The utility model aims to provide a heat conduction structure of an MOS tube of an electronic speed regulator power board, and aims to solve the problems in the background technology. In order to achieve the purpose, the utility model adopts the following technical scheme:

The utility model provides a heat conduction structure of electronic governor power board MOS pipe, including housing assembly, the circuit board, MOS pipe pad pin, MOS pipe and heat conduction spare, the inside at housing assembly is all installed to circuit board, MOS pipe pad pin, MOS pipe and heat conduction spare, a plurality of MOS pipe pad pins and a plurality of MOS pipe are all installed at the top of circuit board, MOS pipe pad pin and MOS pipe are adjacent to be put, the heat conduction spare is installed to the top of MOS pipe.

Preferably, the bottom of the circuit board is also provided with a windowing copper sheet which is communicated with the pins of the bonding pads of the MOS tube.

Preferably, the housing assembly comprises a heat dissipation upper shell and a heat dissipation lower shell, and the heat dissipation upper shell and the heat dissipation lower shell are detachably connected through screws.

Preferably, the heat dissipation upper shell and the heat dissipation lower shell are both made of aluminum.

Preferably, the surfaces of the upper heat dissipation shell and the lower heat dissipation shell are respectively provided with a plurality of heat dissipation fins.

Preferably, heat conduction silica gel sheets are arranged between the heat conduction piece and the heat dissipation upper shell and between the circuit board and the heat dissipation lower shell.

Preferably, the thermally conductive silicone sheet is a solid or a liquid.

Preferably, the surface of the heat conducting member is provided with a plurality of heat dissipation holes.

Preferably, the heat conducting piece is a heat conducting copper sheet.

Preferably, both sides of the heat conducting piece are bent, and both sides of the heat conducting piece are attached to the MOS tube bonding pad pins.

The MOS tube heat dissipation device has the advantages that through the structural design of the windowed copper sheet on the lower surface of the circuit board of the speed regulator, heat of the MOS tube on the upper surface of the circuit board can be quickly guided to the windowed copper sheet on the lower surface of the circuit board, the pins of the bonding pads of the MOS tube are communicated with the windowed copper sheet on the lower surface of the circuit board, then the heat of the windowed copper sheet on the lower surface of the circuit board is guided to the heat dissipation shell assembly through the heat dissipation shell assembly to be volatilized, the heat of the MOS tube is quickly guided to the heat dissipation shell assembly through the windowed copper sheet on the lower surface of the circuit board, and then the heat is volatilized through the heat dissipation shell assembly, so that the purposes of more effectively and quickly reducing the working temperature of the MOS tube are achieved, the reliability and stability of the electronic speed regulator are improved, the structure is simple and compact, the assembly is simple, and the practicability is very strong.

Drawings

FIG. 1 is a schematic view of an embodiment of the present utility model;

FIG. 2 is a schematic diagram of an overall explosion structure according to an embodiment of the present utility model;

FIG. 3 is a schematic view of a partial structure according to an embodiment of the present utility model;

fig. 4 is a schematic partial structure of an embodiment of the present utility model.

Wherein, each reference sign in the figure:

1. The heat-dissipation shell comprises a shell component, a heat-dissipation upper shell, a heat-dissipation lower shell, a circuit board, a MOS tube bonding pad pin, a MOS tube, a heat-conducting piece, a windowed copper sheet, a heat-conducting silica gel sheet, a heat-dissipation fin and a heat-dissipation hole.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiments, and the terms "upper," "lower," "left," "right," "front," "back," and the like are used herein with reference to the positional relationship of the drawings.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The technical scheme of the patent is further described in detail below with reference to the specific embodiments.

As shown in fig. 1-4, the embodiment of the utility model provides a heat conduction structure of an electronic speed regulator power board MOS tube, which comprises a shell component 1, a circuit board 2, an MOS tube pad pin 3, an MOS tube 4 and a heat conduction piece 5, wherein the circuit board 2, the MOS tube pad pin 3, the MOS tube 4 and the heat conduction piece 5 are all arranged in the shell component 1, the MOS tube pad pin 3, the MOS tube 4 and the heat conduction piece 5 are all arranged on the circuit board 2, a plurality of MOS tube pad pins 3 and a plurality of MOS tubes 4 are arranged at the top of the circuit board 2, the MOS tube pad pins 3 and the MOS tubes 4 are adjacently arranged, and the heat conduction piece 5 is arranged above the MOS tubes 4.

In the embodiment, the bottom of the circuit board 2 is also provided with a windowed copper sheet 6, and the windowed copper sheet 6 is communicated with the MOS tube bonding pad pin 3.

In the embodiment, the housing assembly 1 includes the heat radiation upper case 11 and the heat radiation lower case 12, and the heat radiation upper case 11 and the heat radiation lower case 12 are detachably connected by screws.

In the embodiment, the heat dissipation upper case 11 and the heat dissipation lower case 12 are both made of aluminum.

In the embodiment, the surfaces of the upper heat dissipation case 11 and the lower heat dissipation case 12 are provided with a plurality of heat dissipation fins 8.

In the embodiment, the heat-conducting silicon sheets 7 are arranged between the heat-conducting piece 5 and the heat-radiating upper shell 11 and between the circuit board 2 and the heat-radiating lower shell 12.

In an embodiment, the thermally conductive silicone sheet 7 is solid or liquid.

In the embodiment, the surface of the heat conducting member 5 is provided with a plurality of heat dissipation holes 9.

In the embodiment, the heat conducting member 5 is a heat conducting copper sheet.

In the embodiment, two sides of the heat conducting piece 5 are bent, and two sides of the heat conducting piece 5 are attached to the MOS tube bonding pad pins 3.

The above embodiments are only for illustrating the present utility model, not for limiting the present utility model, and various changes and modifications may be made by one of ordinary skill in the relevant art without departing from the spirit and scope of the present utility model, and therefore, all equivalent technical solutions are also within the scope of the present utility model, and the scope of the present utility model is defined by the claims.

Claims

1. A heat conduction structure of a MOS tube of a power board of an electronic speed regulator, characterized in that it comprises a housing assembly, a circuit board, a MOS tube solder pad pin, a MOS tube and a heat conductive member, wherein the circuit board, the MOS tube solder pad pin, the MOS tube and the heat conductive member are all installed inside the housing assembly, the MOS tube solder pad pin, the MOS tube and the heat conductive member are all installed on the circuit board, a plurality of the MOS tube solder pad pins and a plurality of the MOS tubes are installed on the top of the circuit board, the MOS tube solder pad pins and the MOS tubes are placed adjacent to each other, and the heat conductive member is installed above the MOS tube.

2. The heat conduction structure of the MOS tube of the power board of an electronic speed regulator according to claim 1 is characterized in that: a window copper sheet is also provided at the bottom of the circuit board, and the window copper sheet is connected to the MOS tube pad pin.

3. The heat conduction structure of the MOS tube of the power board of an electronic speed regulator according to claim 2 is characterized in that: the housing assembly comprises a heat dissipation upper shell and a heat dissipation lower shell, and the heat dissipation upper shell and the heat dissipation lower shell are detachably connected by screws.

4. The heat conduction structure of the MOS tube of the power board of the electronic speed regulator according to claim 3, characterized in that the heat dissipation upper shell and the heat dissipation lower shell are both made of aluminum.

5. The heat conduction structure of the MOS tube of the power board of the electronic speed regulator according to claim 4, characterized in that: the surfaces of the heat dissipation upper shell and the heat dissipation lower shell are both provided with a plurality of heat dissipation fins.

6. The heat conduction structure of the MOS tube of the power board of the electronic speed regulator according to claim 3 is characterized in that a heat conduction silicone sheet is arranged between the heat conduction member and the heat dissipation upper shell and between the circuit board and the heat dissipation lower shell.

7 . The heat-conducting structure of the MOS tube of the power board of the electronic speed regulator according to claim 6 , wherein the heat-conducting silicone sheet is solid or liquid.

8 . The heat-conducting structure of the MOS tube of the power board of the electronic speed regulator according to claim 1 , wherein a plurality of heat-dissipating holes are formed on the surface of the heat-conducting member.

9 . The heat-conducting structure of the MOS tube of the power board of the electronic speed regulator according to claim 8 , wherein the heat-conducting member is a heat-conducting copper sheet.

10 . The heat conduction structure of the MOS tube of the power board of the electronic speed regulator according to claim 7 , characterized in that: the two sides of the heat conduction member are bent, and the two sides of the heat conduction member are in contact with the soldering pad pins of the MOS tube.