CN223110367U - An electronic speed regulator with good heat dissipation - Google Patents
An electronic speed regulator with good heat dissipationInfo
- Publication number
- CN223110367U CN223110367U CN202421837911.5U CN202421837911U CN223110367U CN 223110367 U CN223110367 U CN 223110367U CN 202421837911 U CN202421837911 U CN 202421837911U CN 223110367 U CN223110367 U CN 223110367U
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- Prior art keywords
- circuit board
- shell
- heat dissipation
- speed regulator
- electronic device
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Abstract
The utility model discloses an electronic speed regulator with good heat dissipation, and relates to the field of heat dissipation of RC model motor control. The electronic speed regulator comprises a shell, a first circuit board and a second circuit board which are arranged in the shell, and a first electronic device with serious heating condition and arranged on the first circuit board with a power conversion function, the heat can be transferred to the shell through the heat conducting part to dissipate heat, meanwhile, the heat conducting sheet can be conveniently welded and fixed on the first circuit board through the fixing part and the connecting part, so that good heat dissipation performance is generally realized, potential safety hazards are eliminated, and the high-current state of the electronic speed regulator is enabled to continuously and safely run.
Description
Technical Field
The utility model relates to the field of heat dissipation of RC model motor control, in particular to an electronic speed regulator with good heat dissipation.
Background
At present, RC models (car models, aeromodelling, unmanned aerial vehicle and the like) mainly comprise motors arranged in the motor, the output of power is determined by the rotating speed of the motors, and the rotating speed of the motors is controlled by an electronic speed regulator.
The electronic speed regulator mainly comprises a control processing part and a power conversion part. The control processing part receives the remote control signal from the remote controller, decodes the remote control signal to obtain an effective control signal, and the electronic speed regulator controls the power conversion part according to the obtained effective control signal. Meanwhile, the power conversion part bears the effect of overcurrent, and the higher the working voltage is, the larger the passing current is, the more the power tube heats, and the faster the temperature rise is.
Taking a vehicle model system as an example, the model is usually used in a high-temperature environment and has poor heat dissipation environment. However, the larger the proportion of the vehicle model is, the larger the motor power is correspondingly, the lithium battery pack used by the vehicle model is mainly in a low voltage range, and the electronic speed regulator is often required to output larger current so as to meet the motor rotating speed control. The greater the current of the electronic governor, the more heat is generated.
Because the exterior of the vehicle model needs to be designed to be consistent with the corresponding vehicle model, the interior installation space is often very compact. The volume of the electronic speed regulator is limited by the design of a vehicle model, and meanwhile, the large current output is considered, so that the heat dissipation efficiency cannot meet the heat dissipation requirement. The electronic speed regulator is easy to reach a temperature protection value, the working time of the electronic speed regulator is reduced, and the electronic speed regulator is easy to overheat and ignite under special conditions, and potential safety hazards are caused.
In conclusion, the internal heat dissipation efficiency of the existing electronic speed regulator is low, the heat dissipation requirement cannot be met, the overcurrent performance of the electronic speed regulator is affected, and potential safety hazards are easy to occur.
Disclosure of utility model
In order to solve the problems in the prior art, the main purpose of the utility model is to provide the electronic speed regulator with good heat dissipation, so that the internal heat dissipation efficiency of the electronic speed regulator can be improved, and the potential safety hazard is eliminated.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
The electronic speed regulator comprises a shell, and a first circuit board and a second circuit board which are arranged in the shell, wherein the first circuit board and the second circuit board are electrically connected with each other, a first electronic device and a heat conducting fin are arranged on the first circuit board, and the first electronic device is welded on the first circuit board in a way of bonding one side of the first electronic device;
the heat conducting fin comprises a fixing part, a connecting part and a heat conducting part,
The fixing part is welded on the first circuit board,
The heat conducting part is arranged between the inner wall of the shell and one surface of the first electronic device, which is opposite to the first circuit board,
The connecting part is respectively connected with the fixing part and the heat conducting part.
Optionally, the shell includes casing, well casing and lower casing, go up casing and well casing cooperation and form first cavity, well casing and lower casing cooperation form the second cavity, first circuit board is installed in first cavity, the second circuit board is installed in the second cavity, the upper surface and/or the lower surface of first circuit board are provided with first electronic device, heat conduction portion sets up between the one side and the first cavity inner wall of first electronic device's the first circuit board of dorsad.
Optionally, the first electronic devices are MOS devices, and the heat conducting portion of one of the heat conducting fins may cover at least two first electronic devices.
Optionally, the heat conducting strip is bent by a rectangle copper sheet for the second time to form fixed part, connecting portion and heat conducting part, fixed part and heat conducting part are parallel to each other.
Optionally, the first circuit board is provided with the plug, the second circuit board is provided with the socket, well casing is provided with the through-hole, the plug of first circuit board pass the through-hole with socket on the second circuit board inserts to be connected, plug and socket are provided with the multiunit to distribute in the both sides that are opposite on first circuit board and the second circuit board.
Optionally, a fan is further included, and the fan is mounted on the outer side wall of the upper shell. The outer side wall of the upper shell is also provided with a heat dissipation tooth array, and the fan is arranged on the heat dissipation tooth array.
Optionally, a protruding part opposite to the side edge of the first circuit board is arranged at the side edge of the second circuit board, an indication lamp cover and an electric connector are arranged on the protruding part of the second circuit board, protruding structures corresponding to the protruding parts are arranged on the middle shell and the lower shell to wrap the protruding parts of the second circuit board, through holes are formed in the protruding structures of the middle shell to expose the indication lamp cover and the electric connector, and the fan is connected with the electric connector of the second circuit board through wires.
Optionally, the upper shell, the middle shell and the lower shell are respectively made of metal, a screw seat is arranged in the upper shell, a screw passing hole is formed in the middle shell, a screw mounting hole is formed in the lower shell, screws are arranged in the screw mounting hole and are fixedly connected to the screw seat through the mounting hole and the passing hole in sequence so as to enable the upper shell, the middle shell and the lower shell to be mutually fixed, the edge shape of the first cavity is matched with the edge shape of the first circuit board so as to enable the first circuit board to be clamped in the first cavity, and the edge shape of the second cavity is matched with the edge shape of the second circuit board so as to enable the second circuit board to be clamped in the second cavity.
Optionally, a first silica gel pad is disposed between the heat conducting part of the heat conducting sheet and the housing.
Optionally, the second circuit board is provided with the second electronic device, the second electronic device is the inductance device, the second electronic device is welded in the lower surface of second circuit board with one of them face laminating mode, be provided with the second silica gel pad between the one side of second electronic device back to the second circuit board and the shell.
Compared with the prior art, the utility model has the following beneficial effects:
(1) The electronic speed regulator provided by the utility model has the advantages that the first electronic device with a severe heating condition is arranged on the first circuit board with the power conversion function, heat can be transmitted to the shell for heat dissipation through the heat conducting part by arranging the heat conducting fin comprising the fixing part, the connecting part and the heat conducting part on the first electronic device, meanwhile, the fixing part and the connecting part enable the heat conducting fin to be conveniently welded and fixed on the first circuit board, so that the good heat dissipation performance is realized, the potential safety hazard is eliminated, and the high-current state of the electronic speed regulator is enabled to continuously and safely run.
(2) The electronic speed regulator of the utility model further comprises an outer shell which is composed of an upper shell, a middle shell and a lower shell, and two cavities for respectively installing the first circuit board and the second circuit board are formed to separate the two cavities. Meanwhile, the lower surface of the first circuit board is provided with the first electronic device and the heat conducting fin, so that the first electronic device on the lower surface can transfer heat to the middle shell body through the heat conducting fin to dissipate heat. Similarly, the upper surface of the first circuit board is also provided with the first electronic device and the heat conducting fin, so that the first electronic device on the upper surface has good heat dissipation performance.
(3) According to the electronic speed regulator, the first silica gel pad is further arranged between the heat conducting fin and the inner side wall of the shell, so that heat can be uniformly dispersed on the shell from the first electronic device through the heat conducting fin and the first silica gel pad, and the heat dissipation efficiency is further improved.
(4) According to the electronic speed regulator disclosed by the utility model, further, the fact that the heat dissipation configuration of the second circuit board is not added is considered, and the second silica gel pad is configured on the second electronic device which is arranged on the second circuit board and is easy to generate heat is taken into consideration, so that the heat of the second electronic device is dissipated to the shell through the second silica gel pad, the temperature inside the electronic speed regulator is reduced as a whole, and the performance reduction of the electronic speed regulator caused by the overhigh temperature is reduced.
The utility model is further described below with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic perspective view of an electronic speed governor with good heat dissipation according to the present utility model.
Fig. 2 is a schematic cross-sectional view of an electronic governor with good heat dissipation according to the present utility model.
Fig. 3 is an enlarged cross-sectional structure of fig. 2 according to the present utility model.
Fig. 4 is a schematic diagram of an exploded structure of a component of an electronic governor with good heat dissipation according to the present utility model.
FIG. 5 is a schematic diagram showing an exploded view of a component of an electronic governor with good heat dissipation according to the present utility model.
FIG. 6 is a schematic diagram of a third exploded view of a component of an electronic governor with good heat dissipation according to the present utility model.
Reference numerals 10, upper case, 11, heat radiating tooth array, 20, middle case, 30, lower case, 12, first cavity, 32, second cavity, 40, first circuit board, 41, first electronic device, 42, plug, 50, second circuit board, 51, second electronic device, 52, socket, 53, protruding part, 54, indicating lamp cover, 55, electric connector, 60, heat conducting sheet, 61, fixing part, 62, connecting part, 63, heat conducting part, 70, first silica gel pad, 80, second silica gel pad, 90, fan, 91, wire.
Detailed Description
For a better illustration of the objects, technical solutions and advantages of the present utility model, the following detailed description of the present utility model will be given with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model and are not intended to limit the scope of the utility model.
As shown in fig. 1 to 6, an electronic governor with good heat dissipation according to an embodiment of the present utility model is provided. The electronic governor includes a first circuit board 40, a second circuit board 50, a casing composed of an upper casing 10, a middle casing 20 and a lower casing 30, and a fan 90. The first circuit board 40 is configured to have a power conversion function. The second circuit board 50 is configured to have a control processing function. The upper case 10 and the middle case 20 cooperate to form a first cavity 12, and the first circuit board 40 is mounted in the first cavity 12. The middle housing 20 and the lower housing 30 cooperate to form a second cavity 32, and a second circuit board 50 is mounted within the second cavity 32. In other words, the first circuit board 40 and the second circuit board 50 are mounted inside the housing and are separated by the middle housing 20, avoiding interaction therebetween. The first circuit board 40 and the second circuit board 50 are electrically connected to each other, thereby realizing an electronic speed regulation function. The fan 90 is installed on the outer side wall of the upper housing 10 to radiate heat from the housing, and particularly radiate heat from the first circuit board 40 in the first cavity 12.
Referring to fig. 2 and 3, a first electronic device 41 is provided on the first circuit board 40. In order to save space, the first electronic device 41 is soldered to the first circuit board 40 in such a manner that one surface thereof is bonded to the surface of the first circuit board 40. The first electronic device 41 typically generates more heat during power conversion, such as a MOS device. For this reason, in the present embodiment, the heat conductive sheet 60 is provided on the first circuit board 40. The heat conductive sheet 60 includes a fixing portion 61, a connecting portion 62, and a heat conductive portion 63. The fixing portion 61 is soldered to the first circuit board 40 such that the heat conductive sheet 60 is fixed to the first circuit board 40. The solder may be a patch or via type solder. The connection portion 62 connects the fixing portion 61 and the heat conduction portion 63, respectively, such that the fixing portion 61, the connection portion 62, and the heat conduction portion 63 are formed integrally. After the fixing portion 61 is soldered to the first circuit board 40, the heat conducting portion 63 is located on a side of the first electronic device 41 facing away from the first circuit board 40. After the first circuit board 40 is mounted inside the housing, the heat conducting portion 63 is interposed between the inner wall of the housing and a side of the first electronic device 41 facing away from the first circuit board 40. The heat generated by the first electronic device 41 is transferred to the housing through the heat conduction of the heat conductive sheet 60, thereby achieving rapid heat dissipation.
In one aspect, the lower surface of the first circuit board 40 is provided with a plurality of first electronic devices 41. The first electronic device 41 of each lower surface is provided with a heat conductive sheet 60. The heat conducting part 63 of the heat conducting fin 60 is arranged between the inner side wall of the middle shell 20 and one surface of the first electronic device 41, which is opposite to the first circuit board 40, so that heat generated by the first electronic device 41 on the lower surface is transferred to the middle shell 20 through heat conduction of the heat conducting fin 60, heat dissipation by the middle shell 20 is realized, and poor heat dissipation caused by being far away from the fan 90 is avoided.
On the other hand, the upper surface of the first circuit board 40 is also provided with a plurality of first electronic devices 41. The first electronic device 41 of each upper surface is provided with a heat conductive sheet 60. The heat conducting part 63 of the heat conducting sheet 60 is arranged between the inner side wall of the upper housing 10 and the side of the first electronic device 41 facing away from the first circuit board 40, so that the heat generated by the first electronic device 41 on the upper surface is transferred to the upper housing 10 through the heat conduction of the heat conducting sheet 60, and then rapidly dissipates heat through the fan 90. This embodiment greatly increases the efficiency of heat dissipation compared to the case where the electronic device transfers heat to the upper case 10 through the air.
Therefore, in the present utility model, the first electronic device 41 with high heat generation is configured with the heat conducting fin 60 on the first circuit board 40 with the power conversion function, so that the heat is transferred to the middle housing 20 and the upper housing 10 for heat dissipation, and good heat dissipation performance can be realized, thereby eliminating potential safety hazards and improving the operation efficiency of the electronic speed regulator in a high current state.
Further, a first silica gel pad 70 is provided between the heat conductive portion 63 of the heat conductive sheet 60 of the lower surface of the first circuit board 40 and the inner side wall of the middle case 20. The heat of the heat conductive sheet 60 is more uniformly transferred to the middle case 20 through the heat conduction of the first silica gel pad 70, so that the heat dissipation efficiency is further improved. Similarly, the first silica gel pad 70 is also provided between the heat conductive part 63 of the heat conductive sheet 60 on the upper surface of the first circuit board 40 and the inner side wall of the upper case 10, so that heat is better transferred to the upper case 10 through the first silica gel pad 70. In a preferred embodiment, all of the lower heat conductive sheets 60 are connected to the inner side wall of the upper case 10 at intervals by only one first silica gel pad 70, and all of the lower heat conductive sheets 60 are connected to the inner side wall of the middle case 20 at intervals by only one first silica gel pad 70.
It can be seen that, in the present utility model, the first silica gel pad 70 is further provided on the heat conductive sheet 60 on the first circuit board 40 having the power conversion function, and the heat is further uniformly transferred to the middle case 20 and the upper case 10 through the first silica gel pad 70, thereby further improving the heat dissipation efficiency.
Generally, the second circuit board 50 operates at a lower current, and thus generates less heat. But since the second circuit board 50 is far away from the fan 90, the temperature of the second circuit board 50 is also easily increased. For this purpose, a second electronic device 51 is provided on a second circuit board 50 having a control processing function. The second electronic device 51 is also an inductive device that generates more heat during operation. The second electronic device 51 is soldered on the lower surface of the second circuit board 50 in a manner of bonding one surface thereof, and a second silica gel pad 80 is disposed between the surface of the second electronic device 51 facing away from the second circuit board 50 and the inner surface of the lower housing 30, so that heat generated by the second electronic device 51 is transferred to the lower housing 30 for heat dissipation through heat conduction of the second silica gel pad 80.
Therefore, in the present utility model, not only the first electronic device 41 of the first circuit board 40, which is easy to generate heat, but also the second electronic device 51 of the second circuit board 50, which is easy to generate heat, with a small heat dissipation method are used for heat dissipation, so that the temperature in the electronic speed regulator is reduced as a whole, and the operation efficiency of the electronic speed regulator in a high current state is improved.
To further improve the heat dissipation efficiency, in the present embodiment, the upper case 10, the middle case 20, and the lower case 30 are respectively made of metal, so that heat from the heat conductive sheet 60, the first silica gel pad 70, and the second silica gel pad 80 is rapidly dissipated to the outside. The outer side wall of the upper housing 10 is further provided with a heat dissipation tooth array 11, and the fan 90 is arranged above the heat dissipation tooth array 11, so that flowing air is convenient to take away heat on the heat dissipation tooth array 11.
Referring to fig. 3 to 6, in the present embodiment, in particular, the first electronic device 41 as a MOS device is generally in a flat rectangular parallelepiped block shape, and is mounted with one of the largest-sized faces facing the first circuit board 40, and the heat conduction portion 63 of the heat conduction sheet 60 covers the largest-sized face opposite to the first electronic device 41. In a preferred embodiment of the heat conducting strip 60, the heat conducting strip 60 is formed by secondarily bending a rectangular copper sheet to form the fixing portion 61, the connecting portion 62 and the heat conducting portion 63. The length of the heat conducting portion 63 extending from the connecting portion 63 is slightly larger than the width of the first electronic device 41. The width of the heat conductive portion 63 may be greater than the length between the two first electronic devices 41 juxtaposed so as to cover both the first electronic devices 41 at the same time. The width of the heat conductive portion 63 may be greater than the length between the three first electronic devices 41 juxtaposed so as to cover the three first electronic devices 41 at the same time. The first circuit board 40 may be provided with bare copper foil wires beside the position where the first electronic device 41 is provided. The copper foil wire is not electrically connected with other copper foil wires of the first circuit board 40 but is used for soldering the fixing portion 61 of the heat conductive sheet 60, so that the heat conductive sheet 60 can be soldered to the first circuit board 40 by means of a paste.
Referring to fig. 3 to 6, in particular, the present embodiment is provided with a protrusion 53 at one side edge of the second circuit board 50 opposite to the side edge of the first circuit board 40, and one indicator cover 54 and three electrical connectors 55 are provided on the protrusion 53 of the second circuit board 50. The middle case 20 and the lower case 30 are provided with a protruding structure corresponding to the protruding portion 53 to wrap the protruding portion 53 of the second circuit board 50. The protruding structure of the middle housing 20 is provided with a through hole to expose the indicator housing 54 and the electrical connector 55. The fan 90 is connected to one of the electrical connectors 55 of the second circuit board 50 by a wire 91. The other two electrical connectors 55 may be used to connect the balanced charging interface and the RC signal receiver, respectively.
Referring to fig. 3 to 6, in particular, the present embodiment is provided with a plug 42 in the first circuit board 40, a socket 52 in the second circuit board 50 in the corresponding position of the plug 42, and a through hole in the middle housing 20 in the corresponding positions of the plug 42 and the socket 52. The plug 42 of the first circuit board 40 is inserted through the through hole to connect with the socket 52 of the second circuit board 50. The plugs 42 and sockets 52 are provided in three sets and are distributed on opposite sides of the first circuit board 40 and the second circuit board 50. The plug 42 and the socket 52 are connected to each other, so that not only can the electrical connection between the first circuit board 40 and the second circuit board 50 be realized, but also the electronic speed regulation function can be realized, and the first circuit board 40 and the second circuit board 50 can be mutually fixed.
Referring to fig. 3 to 6, in the embodiment, specifically, a screw seat is provided in the upper case 10, a screw passing hole is provided in the middle case 20, a screw mounting hole is provided in the lower case 30, and screws are provided in the screw mounting hole and are fixedly connected to the screw seat through the mounting hole and the passing hole in sequence, so that the upper case 10, the middle case 20 and the lower case 30 are fixed to each other. The edge shape of the first cavity 12 is matched with the edge shape of the first circuit board 40, so that the first circuit board 40 is clamped in the first cavity 12, and meanwhile, the edge shape of the second cavity 32 is matched with the edge shape of the second circuit board 50, so that the second circuit board 50 is clamped in the second cavity 32, and therefore the process step of installing screws is not needed. Meanwhile, the plug 42 of the first circuit board 40 and the socket 52 of the second circuit board 50 can fix the two circuit boards to each other when they are connected to each other, and the first silica gel pad 70 and the second silica gel pad 80 are matched to realize the effect of fixing the respective circuit boards from different directions, and the effect of firmly fixing the first circuit board 40 and the second circuit board 50 in the housing without screws is achieved.
The foregoing embodiments have described primarily the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421837911.5U CN223110367U (en) | 2024-07-31 | 2024-07-31 | An electronic speed regulator with good heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421837911.5U CN223110367U (en) | 2024-07-31 | 2024-07-31 | An electronic speed regulator with good heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223110367U true CN223110367U (en) | 2025-07-15 |
Family
ID=96318010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421837911.5U Active CN223110367U (en) | 2024-07-31 | 2024-07-31 | An electronic speed regulator with good heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223110367U (en) |
-
2024
- 2024-07-31 CN CN202421837911.5U patent/CN223110367U/en active Active
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000Guangdong ProvinceShenzhen CityLonghua DistrictDalong StreetGaoFeng CommunityHuarong Road 123Building B, 3rd Floor and 4th Floor Patentee after: Shenzhen Kayoudi Technology Co.,Ltd. Country or region after: China Address before: 518000 Guangdong Province Shenzhen City Meilin Street Meijing Community Liantangwei Fifth Road No. 2 Wanzeyunding Shangpin Garden Building 5 1901 Patentee before: Shenzhen Kayoudi Technology Co.,Ltd. Country or region before: China |
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| CP03 | Change of name, title or address |