Disclosure of utility model
In order to solve at least one technical problem mentioned in the background art, an object of the present utility model is to provide a heat dissipating device for a wind turbine generator system.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
The heat dissipation device for the wind generating set is used for being installed on a case of the generating set and comprises a partition piece and a refrigerating mechanism, an inner space of the case is partitioned through the partition piece to form a cooling channel and an installation space for installing the generating set, the cooling channel comprises an air inlet side and an air outlet side, the air inlet side comprises a circulating fan used for introducing air flow in the installation space into the cooling channel, the air flow in the cooling channel flows back into the installation space through the air outlet side, the refrigerating mechanism is installed on the case in a closed mode, and the refrigerating mechanism comprises a refrigerating end which is at least partially located in the cooling channel and located between the air inlet side and the air outlet side.
Compared with the prior art, the scheme has the advantages that:
Through setting up the refrigeration end of refrigeration mechanism in cooling passageway in this scheme to set up circulating fan, so, can extract the air current through circulating fan work and circulate between installation space and cooling passageway, so the air current can be cooled off the end cooling by refrigeration and form cold wind when passing through the refrigeration end, and cold wind is from giving vent to anger in the side backward flow entering installation space alright cool down the heat dissipation to the generating set in the installation space.
The scheme is equivalent to utilizing cold air to radiate the generator set, compared with the traditional water-cooled radiator, cold air, namely air flow, can be dispersed in each area in the installation space, so that the generator set in the installation space can be uniformly radiated and cooled.
In addition, in the scheme, although the air cooling mode is adopted for heat dissipation, the air flow is internally circulated in the case, and the air flow outside the case cannot be introduced into the case, so that foreign matters such as dust and the like outside can be prevented from being brought into the case.
In summary, the scheme can uniformly dissipate heat of the generator set, and impurities such as external dust and the like cannot be introduced into the case to influence the operation of the generator set.
Optionally, the refrigerating mechanism is a water cooling mechanism and comprises a heat exchange tube capable of circularly introducing a refrigerant, wherein the heat exchange tube is at least partially positioned in the cooling channel, and/or the refrigerating mechanism is an air conditioning system, and an evaporator of the air conditioning system is positioned in the cooling channel.
Optionally, the heat exchange tube has a serpentine tube structure.
Optionally, the refrigerating mechanism includes one or more semiconductor refrigerating sheets installed on the side wall of the case, the semiconductor refrigerating sheets include a refrigerating surface and a radiating surface, the refrigerating surface of the semiconductor refrigerating sheets faces the cooling channel, and the radiating surface is located outside the case.
Optionally, a mounting opening for a semiconductor refrigeration sheet to pass through is formed in the side wall of the case, the refrigeration mechanism further comprises a first heat conducting plate, the first heat conducting plate is mounted on the case and covers the mounting opening, the radiating surface of the semiconductor refrigeration sheet is attached to the first heat conducting plate, and/or the refrigeration mechanism further comprises a second heat conducting plate, and the second heat conducting plate is located in the cooling channel and attached to the refrigeration surface of the semiconductor refrigeration sheet.
Optionally, a side wall of the first heat conducting plate far away from the semiconductor refrigerating sheet is provided with a first radiating fin group, and/or a side wall of the second heat conducting plate far away from the semiconductor refrigerating sheet is provided with a second radiating fin group.
Optionally, the refrigeration mechanism further comprises a heat insulation plate, a through hole for embedding the semiconductor refrigeration piece is formed in the heat insulation plate, the heat insulation plate is arranged between the first heat conduction plate and the second heat conduction plate, and the first heat conduction plate and the second heat conduction plate are detachably connected.
Optionally, the first heat conducting plate and the second heat conducting plate are connected through a bolt and nut assembly.
Optionally, the partition piece includes baffle and air-equalizing plate, baffle and air-equalizing plate enclose in quick-witted incasement to establish and form cooling channel and installation space, circulating fan installs on the baffle, the air-equalizing plate is located one side of keeping away from the pivot of generating set.
Optionally, a plurality of supporting blocks are arranged in the case, and the generator set is erected to a height through the supporting blocks.
Additional advantages and effects of the utility model are set forth in the detailed description and drawings.
Detailed Description
The technical solutions of the embodiments of the present utility model will be explained and illustrated below with reference to the drawings of the embodiments of the present utility model, but the following embodiments are only preferred embodiments of the present utility model, and not all embodiments. Based on the examples in the implementation manner, other examples obtained by a person skilled in the art without making creative efforts fall within the protection scope of the present utility model.
In the following description, directional or positional relationships such as the terms "inner", "outer", "upper", "lower", "left", "right", etc., are presented for convenience in describing the embodiments and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model.
The wind driven generator mainly utilizes wind energy to generate electricity and mainly comprises a machine case, a generator set and fan blades, wherein the generator set is arranged in the machine case, the fan blades are arranged outside the machine case and are fixed with a rotating shaft of the generator set, and when the wind driven generator is in operation, natural wind blows the fan blades to rotate so as to drive the rotating shaft to rotate, so that the generator set is driven to realize electricity generation.
The utility model provides a heat dissipation device (hereinafter referred to as heat dissipation device) for a wind power generator set, which is used for being installed on a case of the generator set in order to solve the technical problem that how to uniformly dissipate heat of the generator set and not to cause influence on the generator set due to the fact that external impurities are introduced into the case during heat dissipation.
The heat dissipation device comprises a partition piece and a refrigerating mechanism, wherein the inner space of the case is partitioned through the partition piece to form a cooling channel and an installation space for installing the generator set, the cooling channel comprises an air inlet side and an air outlet side, the air inlet side comprises a circulating fan used for introducing air flow in the installation space into the cooling channel, the air flow in the cooling channel flows back into the installation space through the air outlet side, the refrigerating mechanism is installed on the case in a closed mode, the refrigerating mechanism comprises a refrigerating end, and the refrigerating end is at least partially positioned in the cooling channel and is positioned between the air inlet side and the air outlet side.
Example 1
As shown in fig. 1, the partition member includes a partition plate 31 and an air equalizing plate 32, where the partition plate 31 and the air equalizing plate 32 are enclosed in the chassis 1 to form the cooling channel 12 and the installation space 11, for example:
The baffle plate 31 is horizontally arranged at the upper part in the case 1, the air equalizing plate 32 is vertically fixed in the case 1 and is fixed or abutted against one end of the baffle plate 31 far away from the rotating shaft 21, so that the baffle plate 31 and the air equalizing plate 32 integrally form an L-shaped plate structure, an installation space 11 is formed by surrounding the inner side of the baffle plate 31 and the inner side of the air equalizing plate 32 in the case 1, and an L-shaped cooling channel 12 is formed by surrounding the outer side of the baffle plate 31 and the outer side of the air equalizing plate 32 in the case 1.
The installation space 11 is mainly used as an installation area of the generator set 2, and the cooling channel 12 is an airflow channel.
In some embodiments, the circulating fan 4 forms an air inlet end of the cooling channel 12, for example, the circulating fan 4 is installed on one side of the partition plate 31 near the rotating shaft 21, the air inlet end faces the installation space 11, and the air outlet end faces the cooling channel 12, so that under the action of the circulating fan 4, air flow in the installation space 11 can be introduced into the cooling channel 12.
The air outlet side is formed by the air equalizing plate 32, the air equalizing plate 32 refers to a plate body with vent holes uniformly distributed on the plate surface, and when the cooling channel 12 is in operation, air flow in the cooling channel flows back into the installation space 11 through the vent holes on the air equalizing plate 32 under the action of the circulating fan 4, so that air internal circulation is formed between the installation space 11 and the cooling channel 12.
The air equalizing plate 32 is used as the air outlet side, and it is considered that the air flow outputted from the cooling passage 12 can be uniformly introduced into the installation space 11 through the air equalizing plate 32.
The refrigeration mechanism is mainly used for refrigerating and cooling the air flow flowing through the cooling channel 12, and is provided with a refrigeration end, namely a part which is refrigerated during operation.
The cooling end is at least partially located in the cooling channel 12 and located between the air inlet side and the air outlet side, in short, the cooling end is at least partially located on the airflow flowing path in the cooling channel 12, so that when the airflow flows in the cooling channel 12, the airflow can be cooled by the cooling end to form cold air when passing through the cooling end, the cold air flows back into the installation space 11 by the air equalizing plate 32 to cool the generator set 2 in the installation space 11, and then the airflow in the installation space 11 is led into the cooling channel 12 again by the circulating fan 4 to cool again, and thus the reciprocating circulation is performed, an airflow internal circulation path is established in the case 1 to circularly cool the generator set 2.
Compared with the traditional water cooling heat dissipation mode, the embodiment has the advantages that cold air can be dispersed in each area in the installation space 11, so that the generator set 2 in the installation space 11 can be evenly cooled.
In addition, although the heat dissipation is performed by adopting the air cooling mode in the embodiment, the air flow is internally circulated in the case 1, and the air flow outside the case 1 is not led into the case 1, so that foreign matters such as dust outside can be prevented from being brought into the case 1.
Therefore, the heat dissipation device can uniformly dissipate heat of the generator set 2, and impurities such as external dust cannot be introduced into the case 1 to influence the operation of the generator set 2.
In addition, in order to improve the heat dissipation range of the generator set 2, in some embodiments, a plurality of supporting blocks 6 are disposed in the chassis 1 at intervals, the generator set 2 is fixedly mounted on the supporting blocks 6, and the generator set 2 is lifted up to a height by the supporting blocks 6, so that a channel through which air flows is provided at the bottom of the generator set 2, and thus, the cooling air can cool the whole periphery of the generator set 2.
In some embodiments, the refrigeration mechanism is a water cooling mechanism, and uses cooling liquid or cold water as a refrigerant, and the refrigeration mechanism comprises a heat exchange tube 54, when the refrigeration mechanism works, the refrigerant enters the heat exchange tube 54 from a liquid inlet end of the heat exchange tube 54, flows back out from a liquid outlet end of the other end of the heat exchange tube 54, and circulates in this way, so that the refrigerant always circulates in the heat exchange tube 54, and the refrigerant exchanges heat with air outside the heat exchange tube 54 through the heat exchange tube 54 to achieve the purpose of cooling.
In particular, in this embodiment, the heat exchange tube 54 is at least partially disposed in the cooling channel 12, and in some embodiments, in order to improve the flow of the refrigerant, the heat exchange tube 54 adopts a serpentine tube structure.
Example 2
The present embodiment provides another heat dissipating device for the wind generating set 2 on the basis of embodiment 1, and the difference between the present embodiment and embodiment 1 is that the two refrigeration mechanisms are different, and in the present embodiment, the air conditioning system is adopted as the refrigeration mechanism.
The air conditioning system is widely applied and described in the prior art, and will not be described in detail herein, it mainly uses an evaporator as a refrigerating end for refrigerating, and in this embodiment, the evaporator (not shown in the figure) of the air conditioning system is installed in the cooling channel 12.
Example 3
As shown in fig. 2 and 3, the present embodiment provides another heat dissipating device for a wind turbine generator set 2 on the basis of embodiment 1, which differs from embodiment 1 in that the two refrigeration mechanisms are different from each other, and in the present embodiment, the semiconductor refrigeration sheet 50 is used for refrigeration.
The semiconductor refrigeration sheet 50 is a common refrigeration component and has many applications and descriptions in the prior art, and generally includes two working surfaces on opposite sides, one of which is used for refrigeration and the other is used for heat dissipation and is used as a heat dissipation surface (also commonly referred to as a heating surface or a heating surface).
The semiconductor refrigeration sheet 50 can switch the two working surfaces according to different current flowing directions.
In this embodiment, the refrigerating mechanism includes one or more semiconductor refrigerating sheets 50 mounted on the side wall of the cabinet 1, for example, in this embodiment, 6 semiconductor refrigerating sheets 50 are used.
The cooling surface of each semiconductor cooling fin 50 faces the cooling channel 12, and the cooling surface is located outside the case 1, so that the air flow can be cooled to form cold air when flowing through the cooling surface in the cooling channel 12, and then the generator set 2 is cooled by air cooling.
In order to enable the cooling surface of the semiconductor cooling fin 50 to act on the cooling channel 12, in some embodiments, an installation opening through which the semiconductor cooling fin 50 passes is formed on the upper side wall of the chassis 1.
In order to improve the heat dissipation efficiency of the heat dissipation surface of the semiconductor refrigeration sheet 50, in some embodiments, the refrigeration mechanism further includes a first heat-conducting plate 51, where the first heat-conducting plate 51 is mounted on the top wall of the chassis 1 and covers the mounting opening, and in some embodiments, the first heat-conducting plate 51 may be mounted on the chassis 1 by using a bolt-fixing manner.
The heat dissipation surface of the semiconductor refrigeration sheet 50 is attached to the first heat conduction plate 51, so that heat generated by the heat dissipation surface can be transferred to the first heat conduction plate 51 and dissipated by the first heat conduction plate 51, and in addition, the first heat conduction plate 51 can also shield the mounting opening, so that the sealing performance of the interior of the case 1 is ensured, and external dust and impurities are prevented from entering the case 1 through the mounting opening.
In addition, in order to improve the heat dissipation effect of the first heat-conducting plate 51, a side wall of the first heat-conducting plate 51 far from the semiconductor refrigeration sheet 50 is provided with a first heat-dissipating fin group 511, wherein the first heat-dissipating fin group 511 and the first heat-conducting plate 51 are in an integrated structure, for example, the first heat-conducting plate 51 may be made of copper, aluminum or other heat-conducting plates.
Similarly, in order to increase the heat exchange area between the cooling surface of the semiconductor cooling fin 50 and the air flow in the cooling channel 12, in this embodiment, the cooling mechanism further includes a second heat-conducting plate 52, and the second heat-conducting plate 52 is located in the cooling channel 12 and is attached to the cooling surface of the semiconductor cooling fin 50.
The cooling surface exchanges heat with the air flow in the cooling channel 12 through the second heat-conducting plate 52, so that the air flow is cooled.
In order to improve the heat exchange efficiency between the second heat-conducting plate 52 and the air flow in the cooling channel 12, in this embodiment, a second heat-dissipating fin set 521 is disposed on a side wall of the second heat-conducting plate 52 away from the semiconductor cooling fin 50, wherein the second heat-dissipating fin set 521 and the second heat-conducting plate 52 are integrally formed.
In some embodiments, the first heat-conducting plate 51 and/or the second heat-conducting plate 52 may be made of copper, aluminum or other heat-conducting plate materials.
In order to realize the installation of the semiconductor refrigeration sheet 50 and prevent excessive heat exchange between the first heat conducting plate 51 and the second heat conducting plate 52, in this embodiment, as shown in fig. 3, the refrigeration mechanism further includes a heat insulating plate 53, where the heat insulating plate 53 refers to a plate with heat insulating property, for example, a rock wool plate, a foam plate, or the like may be used.
As shown in fig. 3, the thermal insulation plate 53 is provided with openings 531 for embedding the semiconductor cooling fins 50, the size and shape of the openings 531 are adapted to the semiconductor cooling fins 50, and the number of the openings 531 is the same as the number of the semiconductor cooling fins 50 and corresponds to one.
The heat insulating plate 53 is disposed between the first heat conductive plate 51 and the second heat conductive plate 52, and the first heat conductive plate 51 and the second heat conductive plate 52 are detachably connected, for example, the first heat conductive plate 51 and the second heat conductive plate 52 are connected by a bolt-and-nut assembly.
At this time, the first heat-conducting plate 51 and the second heat-conducting plate 52 are locked by the bolts and the nuts, so that the heat-insulating plate 53 is clamped between the first heat-conducting plate 51 and the second heat-conducting plate 52, and at the same time, the semiconductor refrigeration piece 50 is clamped between the first heat-conducting plate 51 and the second heat-conducting plate 52, thereby realizing the installation of the semiconductor refrigeration piece 50.
It should be noted that, in this embodiment, the size of the mounting opening is enough for the second heat conducting plate 52 and the heat insulating plate 53 to vertically pass through.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.