CN223053300U - Multilayer circuit board installation structure and corresponding intelligent information communication chassis - Google Patents

Multilayer circuit board installation structure and corresponding intelligent information communication chassis Download PDF

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Publication number
CN223053300U
CN223053300U CN202422028836.4U CN202422028836U CN223053300U CN 223053300 U CN223053300 U CN 223053300U CN 202422028836 U CN202422028836 U CN 202422028836U CN 223053300 U CN223053300 U CN 223053300U
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China
Prior art keywords
circuit board
plate
mounting
cover plate
end cover
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CN202422028836.4U
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Chinese (zh)
Inventor
李青勇
刘小宝
张立鹏
鲁宾
张昌泳
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Shenzhen Jiaerxing Technology Co ltd
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Shenzhen Jiaerxing Technology Co ltd
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Abstract

The utility model provides a mounting structure of a multilayer circuit board and a corresponding intelligent information communication case, wherein the mounting structure of the multilayer circuit board comprises a bottom plate, a plurality of mounting frames are mounted at the top of the bottom plate near two ends along the vertical direction, a plurality of flanges are arranged on the side walls of the mounting frames to form a limit convex edge, a limit track is arranged between the adjacent limit convex edges, the circuit board is mounted in the limit track, the limit track is horizontally arranged, one ends of the plurality of mounting frames are connected through a connecting plate, a plurality of end cover plates are mounted at one ends of the adjacent mounting frames far away from the connecting plate, the end cover plates are arranged opposite to the circuit board, and the circuit board is limited between the end cover plates and the connecting plate.

Description

Mounting structure of multilayer circuit board and corresponding intelligent information communication case
Technical Field
The utility model relates to the technical field of cabinets, in particular to a mounting structure of a multilayer circuit board and a corresponding intelligent information communication cabinet.
Background
The intelligent information communication case has perfect and powerful data application functions, lightning protection system and other functions, so that the number of circuit board modules in the case is generally large, and the structure is complex. The existing circuit board mounting structure in the chassis needs too many screws to fix the circuit board, the mounting and the dismounting are troublesome, the multi-layer circuit board heats seriously, the heat dissipation channel is unreasonable to design and easily causes high temperature, and the performance of chips on the circuit board is affected.
Therefore, it is necessary to provide a mounting structure of a multi-layer circuit board and a corresponding intelligent information communication chassis to solve the above technical problems.
Disclosure of utility model
In order to solve the technical problems, the utility model provides a mounting structure of a multi-layer circuit board and a corresponding intelligent information communication case.
The utility model provides a mounting structure of a multilayer circuit board, which comprises a bottom plate, wherein a plurality of mounting frames are mounted at the top of the bottom plate near two ends along the vertical direction, a limit convex edge formed by a plurality of flanging is arranged on the side wall of each mounting frame, a limit track is arranged between the adjacent limit convex edges, the circuit board is mounted in the limit track, the limit tracks are horizontally arranged, one end of each mounting frame is connected with the same connecting plate, one end, far away from the connecting plate, of each mounting frame is provided with the same end cover plate, the end cover plates are arranged right opposite to the circuit board, and the circuit board is limited between the end cover plates and the connecting plates.
In the utility model, the top and the bottom of the end cover plate are respectively provided with an upper bending part and a lower bending part which are perpendicular to the end cover plate, and the upper bending parts and the lower bending parts of the adjacent end cover plates are contacted with each other.
Further, a thread bush for fixing the circuit board is riveted and fixed on the lower bending part.
In addition, two adjacent end cover plates share a screw, a limiting plate is sleeved on the screw, one end cover plate is fixedly connected with the corresponding mounting frame through the screw, meanwhile, the screw forms fixed fit with the corresponding mounting frame through the limiting plate, a limiting block is arranged on the limiting plate, and a limiting hole connected with the limiting block is arranged on the adjacent end cover plate.
The utility model further provides an intelligent information communication case which comprises the mounting structure of the multilayer circuit board, and the intelligent information communication case further comprises a U-shaped cover plate matched with the bottom plate to form a case body, the U-shaped cover plate is fixedly connected with the top of the mounting frame, a front cover plate is mounted between the U-shaped cover plate and the bottom plate, and the front cover plate is arranged in parallel with the connecting plate.
Preferably, a fan frame is fixedly installed at one end of the top of the bottom plate, a cooling fan is fixed in the fan frame, a first cooling channel is arranged on the side wall of the fan frame, a second cooling channel is arranged on the mounting frame, and cooling holes are formed in the side walls of the two ends of the U-shaped cover plate.
Preferably, the four corners of the fan frame are respectively provided with a supporting bending part, and the bending parts are respectively contacted with the U-shaped cover plate and the bottom plate.
Preferably, the two sides of the U-shaped cover plate are both fixed with L-shaped mounting plates, and mounting holes are formed in the L-shaped mounting plates.
Preferably, the U-shaped cover plate, the mounting rack and the fan frame are all sheet metal parts.
Preferably, a fixing frame is fixed on the circuit board, one end of the fixing frame is hinged with a clamping plate, a fixed hard disk mounting groove is formed in the fixing frame, a clamping groove is formed in one end of the fixing frame, and a clamping plate matched with the clamping groove is arranged at one end of the clamping plate.
Preferably, the fixing frame is provided with a taking and placing notch.
Compared with the related art, the utility model has the following beneficial effects:
The mounting structure of the multi-layer circuit board enables the circuit board to be easy to mount, dismount and maintain, and maintainability and service life of equipment are improved.
And the heat radiation optimization is realized by designing a fan frame, a heat radiation fan, a heat radiation channel and heat radiation holes, so that an effective heat radiation system is formed, the temperature stability in the case is ensured, and the reliability and stability of equipment are improved.
Space utilization, namely the design of the multi-layer circuit board enables the space inside the case to be fully utilized, and the integration level and the space utilization rate of the equipment are improved.
The solid state disk is convenient to disassemble and assemble, the fixed hard disk is fixed in the fixed hard disk mounting groove through the clamping plate, and the fixed hard disk is connected with the circuit board through the data line. The clamping groove is matched with the clamping plate in a clamping way, so that the installation and the disassembly are convenient.
Drawings
FIG. 1 is a schematic view of a circuit board mounting location according to the present utility model;
FIG. 2 is a schematic distribution diagram of the mounting frame of the present utility model;
FIG. 3 is a schematic view of the relative positions of the base plate and the mounting bracket of the present utility model;
FIG. 4 is a schematic view of the structure of the mounting frame of the present utility model;
FIG. 5 is a schematic diagram of the overall structure of the present utility model;
FIG. 6 is a schematic diagram of an end cap plate structure of the present utility model;
FIG. 7 is a schematic view of a fixing frame according to the present utility model;
Fig. 8 is a schematic structural view of a blower housing according to the present utility model.
The number of the circuit board is 1, the circuit board is 2, the bottom board is 3, the mounting rack is 4, the limit convex edge is 5, the limit rail is 6, the connecting plate is 7, the end cover board is 8, the U-shaped cover board is 9, the front cover board is 10, the fan frame is 11, the cooling fan is 12, the first cooling channel is 13, the second cooling channel is 14, the cooling hole is 15, the support bending part is 16, the L-shaped mounting board is 17, the mounting hole is 18, the upper bending part is 19, the lower bending part is 20, the thread bush is 21, the fixing frame is 22, the clamping board is 23, the fixed hard disk mounting groove is 24, the clamping groove is 25, the clamping board is 26, the taking and placing notch is 27, the limit plate is 28, and the limit hole is 28.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The terms of directions used in the present utility model, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", "top" and "bottom", are used for explaining and understanding the present utility model only with reference to the orientation of the drawings, and are not intended to limit the present utility model.
The words "first," "second," and the like in the terminology of the present utility model are used for descriptive purposes only and are not to be construed as indicating or implying relative importance and not as limiting the order of precedence.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and are for example, as being a releasable connection, as being a one-piece structure, as being a mechanical connection, as being an electrical connection, as being a direct connection, as being an indirect connection via an intermediary, as being a communication between two elements or as being an interaction between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
The utility model provides an intelligent information communication case capable of solving the technical problems.
Referring to fig. 1 and 2 in combination, the design of the intelligent information communication chassis of the present embodiment follows the principles of modularization and heat dissipation optimization. The intelligent information communication chassis includes a mounting structure of a multi-layered circuit board in which a circuit board 1 is firmly fixed on a base plate 2 by a mounting bracket 3 which is carefully designed. The vertical direction installation in top of bottom plate 2 is followed to a plurality of mounting bracket 3, and the lateral wall of mounting bracket 3 is equipped with the spacing chimb 4 that a plurality of turn-ups formed, and is equipped with spacing track 5 between the adjacent spacing chimb 4, installs circuit board 1 in the spacing track 5, and spacing track 5 is the level setting, and the wherein one end of a plurality of mounting bracket 3 all is connected through connecting plate 6 with same, and same end cover plate 7 is installed to the one end that connecting plate 6 was kept away from to two adjacent mounting brackets 3, and end cover plate 7 just set up circuit board 1, has formed a structure that both stabilizes and be convenient for maintain. The circuit board 1 is accurately limited in the limiting rail 5 of the mounting frame 3, and the circuit board 1 is limited between the end cover plate 7 and the connecting plate 6, so that the stability and the maintainability of the circuit board 1 are ensured.
Referring to fig. 2 and 5, the intelligent information communication cabinet is composed of a base plate 2, a U-shaped cover plate 8, a front cover plate 9 and other key components, which together form a closed and protective space, thereby providing comprehensive protection for the internal circuit board 1 and electronic components. Wherein, the U-shaped cover plate 8 is tightly matched with the bottom plate 2 to form a main body part of the case, and the U-shaped cover plate is fixedly connected with the top of the mounting frame 3. The front cover plate 9 is arranged between the U-shaped cover plate 8 and the bottom plate 2, and is parallel to the connecting plate 6, so that the structural strength and stability of the chassis are further enhanced.
Referring to fig. 3 and 8, the design is also excellent in terms of heat dissipation. A fan frame 10 is fixedly installed at one end of the top of the base plate 2, and a high-efficiency cooling fan 11 is arranged in the fan frame. The side wall of the fan frame 10 is provided with a first heat dissipation channel 12, and the mounting frame 3 is provided with a second heat dissipation channel 13. The channels and the radiating holes 14 on the side walls of the two ends of the U-shaped cover plate 8 form an effective radiating path together, so that the heat in the case can be discharged in time, and the temperature inside the case is kept stable.
Referring to fig. 5, in addition, the design also allows for ease of installation and flexibility of use. The two sides of the U-shaped cover plate 8 are both fixed with L-shaped mounting plates 16, and mounting holes 17 are formed in the L-shaped mounting plates, so that the whole chassis module can be easily mounted in the cabinet. Meanwhile, the U-shaped cover plate 8, the mounting frame 3 and the fan frame 10 are all made of sheet metal parts, so that the U-shaped cover plate is convenient to process and manufacture, and has high strength and good heat dissipation performance.
Referring to fig. 6, in detail, the top and bottom of the end cover plate 7 are respectively provided with an upper bending portion 18 and a lower bending portion 19 perpendicular to the end cover plate 7. The upper bent portion 18 and the lower bent portion 19 of the adjacent end cover plates 7 are in contact with each other, so that the end cover plates 7 are more stably and reliably mounted. The lower bending portion 19 is further riveted with a screw sleeve 20 for fixing the circuit board 1, which facilitates the firm connection of the circuit board 1 with the end cap plate 7 by means of screws.
Referring to fig. 1 and 3, in this embodiment, two adjacent end cover plates 7 share a screw, a limiting plate 27 is sleeved on the screw, the screw fixedly connects one end cover plate 7 with the corresponding mounting frame 3, meanwhile, the screw forms a fixed fit with the adjacent end cover plate 7 and the corresponding mounting frame 3 through the limiting plate 27, a limiting block is arranged on the limiting plate 27, a limiting hole 28 connected with the limiting block is arranged on the adjacent end cover plate 7, the number of screws is saved, and the workload of disassembly and assembly is reduced.
Referring to fig. 1 and 7, in the prior art, the solid state disk needs to be fixed by screws, which is troublesome to assemble and disassemble. In this embodiment, a smart fixing frame 21 is also fixed on the circuit board 1. One end of the fixing frame 21 is hinged with a clamping plate 22, and a fixed hard disk mounting groove 23 is arranged in the fixing frame. One end of the fixing frame 21 is also provided with a clamping groove 24, and one end of the clamping plate 22 is provided with a clamping plate 25 matched with the clamping groove 24. The fixed hard disk can be conveniently fixed in the fixed hard disk mounting groove 23 through the design of the clamping plate 22, and the connection with the circuit board 1 is realized through a data line. The clamping engagement of the clamping groove 24 and the clamping plate 25 further simplifies the mounting and dismounting process. Meanwhile, the fixing frame 21 is also provided with a taking and placing notch 26, so that the solid state disk can be taken and placed more conveniently and rapidly by the design.
The design of the mounting structure of the multi-layer circuit board and the intelligent information communication case of the embodiment is based on the principles of modularization and heat dissipation optimization. The circuit board 1 is fixed on the bottom plate 2 through the mounting frames 3, and each mounting frame 3 is connected through the connecting plate 6 to form a stable structure. The circuit board 1 is limited in the limiting rail 5 of the mounting frame 3, and is fixed by the end cover plate 7 and the screws, so that the stability and the easy maintenance of the circuit board 1 are ensured. The intelligent information communication case is composed of a bottom plate 2, a U-shaped cover plate 8, a front cover plate 9 and the like, and forms a closed space to protect the circuit board 1 and electronic elements inside.
In terms of heat dissipation, the heat dissipation fan 11 in the fan frame 10 forms an effective heat dissipation path through the first heat dissipation channel 12, the second heat dissipation channel 13 and the heat dissipation holes in the U-shaped cover plate 8, so that heat in the case can be timely discharged, and the temperature in the case is kept stable.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.

Claims (10)

1.一种多层电路板的安装结构,其特征在于,包括底板(2),所述底板(2)的顶部靠近两端处沿着竖直方向安装有若干个安装架(3),所述安装架(3)的侧壁设有若干个翻边形成的限位凸边(4),且相邻限位凸边(4)之间设有限位轨道(5),所述限位轨道(5)内安装有电路板(1),所述限位轨道(5)呈水平设置,若干个所述安装架(3)的其中一端均与同一个连接板(6)连接,相邻的两个所述安装架(3)远离所述连接板(6)的一端安装有同一个端盖板(7),所述端盖板(7)正对电路板(1)设置,所述电路板(1)限位在所述端盖板(7)和所述连接板(6)之间。1. A multi-layer circuit board installation structure, characterized in that it comprises a base plate (2), a plurality of mounting frames (3) are installed on the top of the base plate (2) near both ends along the vertical direction, the side walls of the mounting frames (3) are provided with a plurality of limit convex edges (4) formed by flanges, and a limit rail (5) is provided between adjacent limit convex edges (4), a circuit board (1) is installed in the limit rail (5), the limit rail (5) is arranged horizontally, one end of the plurality of mounting frames (3) is connected to the same connecting plate (6), and the ends of two adjacent mounting frames (3) away from the connecting plate (6) are provided with the same end cover plate (7), the end cover plate (7) is arranged opposite to the circuit board (1), and the circuit board (1) is limited between the end cover plate (7) and the connecting plate (6). 2.根据权利要求1所述的多层电路板的安装结构,其特征在于,所述端盖板(7)的顶部和底部分别设有与端盖板(7)垂直的上弯折部(18)和下弯折部(19),且相邻端盖板(7)的上弯折部(18)和下弯折部(19)相互接触。2. The installation structure of a multi-layer circuit board according to claim 1 is characterized in that the top and bottom of the end cover plate (7) are respectively provided with an upper bending portion (18) and a lower bending portion (19) perpendicular to the end cover plate (7), and the upper bending portion (18) and the lower bending portion (19) of adjacent end cover plates (7) are in contact with each other. 3.根据权利要求2所述的多层电路板的安装结构,其特征在于,所述下弯折部(19)上铆接固定有用于固定电路板(1)的螺纹套(20)。3. The multi-layer circuit board installation structure according to claim 2, characterized in that a threaded sleeve (20) for fixing the circuit board (1) is riveted and fixed on the lower bending portion (19). 4.根据权利要求2所述的多层电路板的安装结构,其特征在于,相邻的两个所述端盖板(7)共用螺钉,所述螺钉上套接有限位板(27),螺钉将一个所述端盖板(7)与相应的所述安装架(3)固定连接,同时螺钉通过所述限位板(27)将相邻的一个所述端盖板(7)与相应的所述安装架(3)形成固定配合,所述限位板(27)上设置有限位块,相邻的一个所述端盖板(7)上设置有与所述限位块连接的限位孔(28)。4. The installation structure of the multi-layer circuit board according to claim 2 is characterized in that two adjacent end cover plates (7) share a screw, a limiting plate (27) is sleeved on the screw, the screw fixes one end cover plate (7) with the corresponding mounting frame (3), and at the same time, the screw forms a fixed fit between an adjacent end cover plate (7) and the corresponding mounting frame (3) through the limiting plate (27), a limiting block is provided on the limiting plate (27), and a limiting hole (28) connected to the limiting block is provided on the adjacent end cover plate (7). 5.一种智能信息通讯机箱,其特征在于,包括权利要求1-4中任一所述的多层电路板的安装结构,所述智能信息通讯机箱还包括与底板(2)配合形成箱体的U型盖板(8),且U型盖板(8)与安装架(3)顶部固定连接,所述U型盖板(8)与底板(2)之间安装有正面盖板(9),且正面盖板(9)与所述连接板(6)平行设置。5. An intelligent information communication chassis, characterized in that it includes a mounting structure for a multi-layer circuit board as described in any one of claims 1 to 4, and the intelligent information communication chassis also includes a U-shaped cover (8) that cooperates with a base plate (2) to form a box body, and the U-shaped cover (8) is fixedly connected to the top of the mounting frame (3), and a front cover (9) is installed between the U-shaped cover (8) and the base plate (2), and the front cover (9) is arranged parallel to the connecting plate (6). 6.根据权利要求5所述的智能信息通讯机箱,其特征在于,所述底板(2)的顶部一端固定安装有风机架(10),所述风机架(10)内固定有散热风扇(11),所述风机架(10)侧壁设有第一散热通道(12),所述安装架(3)上设有第二散热通道(13),所述U型盖板(8)的两端侧壁均设有散热孔(14)。6. The intelligent information communication chassis according to claim 5 is characterized in that a fan rack (10) is fixedly installed at one end of the top of the base plate (2), a cooling fan (11) is fixed inside the fan rack (10), a first cooling channel (12) is provided on the side wall of the fan rack (10), a second cooling channel (13) is provided on the mounting frame (3), and cooling holes (14) are provided on the side walls of both ends of the U-shaped cover plate (8). 7.根据权利要求6所述的一种智能信息通讯机箱,其特征在于,所述风机架(10)的四角均设有支撑弯折部(15),且弯折部(15)分别与U型盖板(8)和底板(2)接触。7. An intelligent information communication chassis according to claim 6, characterized in that the four corners of the fan rack (10) are provided with supporting bending parts (15), and the bending parts (15) are respectively in contact with the U-shaped cover plate (8) and the bottom plate (2). 8.根据权利要求5所述的智能信息通讯机箱,其特征在于,所述U型盖板(8)的两侧均固定有L型安装板(16),所述L型安装板(16)上设有安装孔(17)。8. The intelligent information communication chassis according to claim 5 is characterized in that L-shaped mounting plates (16) are fixed on both sides of the U-shaped cover plate (8), and mounting holes (17) are provided on the L-shaped mounting plates (16). 9.根据权利要求5所述的智能信息通讯机箱,其特征在于,所述电路板(1)上固定有固定架(21),所述固定架(21)的一端铰接有夹板(22),所述固定架(21)内设有固定硬盘安装槽(23),所述固定架(21)的一端设有卡槽(24),所述夹板(22)一端设有与卡槽(24)配合的卡板(25)。9. The intelligent information communication chassis according to claim 5 is characterized in that a fixing frame (21) is fixed on the circuit board (1), one end of the fixing frame (21) is hinged with a clamping plate (22), a hard disk mounting groove (23) is provided in the fixing frame (21), one end of the fixing frame (21) is provided with a card slot (24), and one end of the clamping plate (22) is provided with a card plate (25) that cooperates with the card slot (24). 10.根据权利要求9所述的智能信息通讯机箱,其特征在于,所述固定架(21)上设有取放缺口(26)。10. The intelligent information communication box according to claim 9, characterized in that a pick-up and drop-off notch (26) is provided on the fixing frame (21).
CN202422028836.4U 2024-08-20 2024-08-20 Multilayer circuit board installation structure and corresponding intelligent information communication chassis Active CN223053300U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202422028836.4U CN223053300U (en) 2024-08-20 2024-08-20 Multilayer circuit board installation structure and corresponding intelligent information communication chassis

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202422028836.4U CN223053300U (en) 2024-08-20 2024-08-20 Multilayer circuit board installation structure and corresponding intelligent information communication chassis

Publications (1)

Publication Number Publication Date
CN223053300U true CN223053300U (en) 2025-07-01

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Application Number Title Priority Date Filing Date
CN202422028836.4U Active CN223053300U (en) 2024-08-20 2024-08-20 Multilayer circuit board installation structure and corresponding intelligent information communication chassis

Country Status (1)

Country Link
CN (1) CN223053300U (en)

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