CN223050130U - Semiconductor dehumidifier - Google Patents

Abstract

The utility model discloses a semiconductor dehumidification device, comprising: a shell, a first cavity and a second cavity are arranged in the shell; a semiconductor refrigeration plate, a cooling end of which is connected to a first heat exchange member, and a heating end of which is connected to a second heat exchange member; the second heat exchange member comprises a heat-conducting member fitted with the heating end, a copper pipe extending in a horizontal direction, and a plurality of heat exchange fins for the copper pipe to pass through and arranged at intervals, and the gaps between adjacent heat exchange fins face the second vent; a fan is arranged in the second cavity. The heat generated by the heating end of the semiconductor refrigeration plate can be transferred along the extension direction of the copper pipe so that each position of the copper pipe is evenly heated, and the heat transfer fins can be used to fully realize the heat conduction, and then the gas is driven by the fan to pass through the gaps between the heat exchange fins and then discharged from the second vent, which not only increases the heat exchange area, but also improves the heat exchange efficiency, thereby achieving the purpose of improving the heat exchange efficiency to promote the dehumidification effect.

Description

Semiconductor dehumidifier

Technical Field

The utility model relates to the technical field of household appliances, in particular to a semiconductor dehumidification device.

Background

The working principle of the semiconductor dehumidifier is that the semiconductor dehumidifier dehumidifies by utilizing the temperature difference between the cold end and the hot end of a semiconductor refrigerating sheet, wet air enters a condensation place to be liquefied into water, the cold end of the semiconductor refrigerates and the hot end of the semiconductor heats to form a circulation temperature difference, the higher the machine power is, the larger the temperature difference between the cold end and the hot end is, the better the dehumidification effect is, if the heat dissipation effect of the hot end is not good, the semiconductor can enter a protection state, and the power can be reduced.

The heat dissipation of the heat end of the semiconductor cooling fin of the semiconductor dehumidifier on the market is generally achieved by extending aluminum fins from the back, the heat dissipation area of the aluminum fins is limited, the heat dissipation effect is poor, and finally the dehumidification effect is affected.

Disclosure of utility model

In order to overcome the defects of the prior art, one of the purposes of the utility model is to provide a semiconductor dehumidification device which promotes the dehumidification effect by improving the heat exchange efficiency.

The semiconductor dehumidification device comprises a shell, a semiconductor refrigeration piece, a fan and a heat blower, wherein a first cavity and a second cavity are arranged in the shell, the shell is provided with a first vent communicated with the first cavity and a second vent communicated with the second cavity, the semiconductor refrigeration piece is arranged in the shell and is provided with a refrigeration end positioned in the first cavity and a heating end positioned in the second cavity, the refrigeration end of the semiconductor refrigeration piece is connected with a first heat exchange piece, the heating end of the semiconductor refrigeration piece is connected with a second heat exchange piece, the second heat exchange piece comprises a heat conduction piece attached to the heating end of the semiconductor refrigeration piece, a copper pipe connected with the heat conduction piece and extending in the horizontal direction, a plurality of heat exchange fins penetrating the copper pipe and arranged at intervals along the length direction of the copper pipe, gaps between the adjacent heat exchange fins face the second vent, and the fan is arranged in the second cavity and can drive gas to pass through the gaps between the adjacent heat exchange fins and discharge the gas outwards.

The semiconductor dehumidifying device provided by the embodiment of the utility model has at least the following beneficial effects:

The heat that the heating end of semiconductor refrigeration piece produced passes through the heat conduction piece and transmits for the copper pipe fitting, and the heat can be evenly heated along the extending direction of copper pipe fitting transmission in order to make each position of copper pipe fitting, and the heat transfer fin of following the length direction interval arrangement of copper pipe fitting can fully conduct the heat to the heat transfer fin on, and the rethread fan drives the gas and outwards discharges from the second air vent after passing through the clearance between the heat transfer fin, has not only increased heat transfer area, has still improved heat exchange efficiency to reach the purpose that promotes heat exchange efficiency in order to promote dehumidification effect.

In some embodiments of the present utility model, two semiconductor cooling fins are provided, two second heat exchange pieces are correspondingly provided, two semiconductor cooling fins and two second heat exchange pieces are arranged at intervals, the fan is located between the two second heat exchange pieces, and the fan drives a travelling path of gas flow to point to the second air vent.

In some embodiments of the present utility model, two semiconductor refrigeration sheets and two second heat exchange pieces are arranged at intervals along a vertical direction, the second ventilation opening is arranged at the top of the shell, and the shell is provided with an air inlet structure communicated with the second cavity.

In some embodiments of the present utility model, two semiconductor refrigeration sheets and two second heat exchange pieces are arranged at intervals along a horizontal direction, the second air vent is arranged on a side wall of the shell, and the side wall of the shell is provided with an air inlet arranged face to face with the second air vent.

In some embodiments of the present utility model, the heat conducting member has a contact plane attached to the heating end of the semiconductor refrigeration sheet, a positioning groove matched with the outer diameter of the copper pipe fitting is concavely provided on the contact plane, two ends of the positioning groove penetrate through two opposite sides of the heat conducting member, a part of the copper pipe fitting is accommodated in the positioning groove and can be abutted to the heating end of the semiconductor refrigeration sheet, and two ends of the copper pipe fitting respectively extend out of two ends of the positioning groove and horizontally extend along a direction away from the heat conducting member.

In some embodiments of the present utility model, the semiconductor cooling device further includes a mounting bar, two ends of the mounting bar are respectively provided with a waist-shaped through hole, a bracket for fixing the semiconductor cooling fin is arranged in the housing, a mounting hole opposite to the waist-shaped through hole is arranged on the bracket, and a bolt fastener is arranged through the waist-shaped through hole and the corresponding mounting hole so that the mounting bar compresses the heat conducting piece on the bracket.

In some embodiments of the utility model, the plurality of heat exchange fins are aluminum fins and/or copper fins.

In some embodiments of the utility model, a frame member is disposed within the housing, the first cavity is located in a region between the housing and the frame member, and an interior space of the frame member forms the second cavity to isolate the first cavity and the second cavity from each other.

In some embodiments of the present utility model, a partition plate disposed along a vertical direction is disposed in the housing, the partition plate divides an internal space of the housing into the first cavity and the second cavity, and a gas communication port for communicating the first cavity with the second cavity is formed in the partition plate.

In some embodiments of the present utility model, a switch mechanism for adjusting the opening size of the gas communication port is provided on the partition plate.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The utility model will be further described with reference to the drawings and examples.

Fig. 1 is an external view schematically showing a first embodiment of a semiconductor dehumidifying apparatus of the present utility model;

FIG. 2 is a schematic view of section A-A of the embodiment of FIG. 1;

FIG. 3 is a schematic view of the second heat exchange member, fan mounting to the partition plate of the embodiment of FIG. 1;

FIG. 4 is a schematic cross-sectional view of a second embodiment of a semiconductor dehumidification device of the present disclosure;

FIG. 5 is an exploded view of the embodiment of FIG. 4;

Fig. 6 is a schematic view showing an internal structure of a third embodiment of the semiconductor dehumidifying apparatus of the present utility model.

Reference numerals:

the heat exchanger comprises a housing 100, a first cavity 110, a first air vent 111, a second cavity 120, a second air vent 121, an air inlet 122, a bracket 130, a mounting hole 131, a frame member 140, a partition 150, a gas communication hole 151, a semiconductor refrigeration sheet 200, a first heat exchange member 300, a second heat exchange member 400, a heat conducting member 410, a positioning groove 411, a copper pipe member 420, a heat exchange fin 430, a fan 500, a mounting strip 600 and a waist-shaped through hole 610.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In the description of the present utility model, it should be understood that references to orientation descriptions such as terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are based on the orientation or positional relationship shown in the drawings, are merely for convenience of describing the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present utility model.

In the description of the present utility model, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present utility model, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intermediate medium, or in communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1 to 3, or referring to fig. 4 and 5, the semiconductor dehumidifying device of the present utility model comprises a housing 100, wherein a first cavity 110 and a second cavity 120 are provided in the housing 100, the housing 100 is provided with a first air vent 111 communicated with the first cavity 110 and a second air vent 121 communicated with the second cavity 120, a semiconductor refrigerating plate 200 is provided in the housing 100, the semiconductor refrigerating plate 200 is provided with a refrigerating end positioned in the first cavity 110 and a heating end positioned in the second cavity 120, the refrigerating end of the semiconductor refrigerating plate 200 is connected with a first heat exchanging member 300, the heating end of the semiconductor refrigerating plate 200 is connected with a second heat exchanging member 400, the second heat exchanging member 400 comprises a heat conducting member 410 attached to the heating end of the semiconductor refrigerating plate 200, a copper pipe member 420 connected with the heat conducting member 410 and extending in a horizontal direction, a plurality of heat exchanging fins arranged in a penetrating manner by the copper pipe member 420 and arranged in a length direction of the copper pipe member 420, the heat exchanging fins can be arranged between the adjacent heat exchanging fins 430 from the second air vent 430 to the second air vent 430.

When the semiconductor dehumidifying device with the above structure works, gas with higher humidity enters the first cavity 110 from the first air vent 111, water vapor in the gas contacts the first heat exchange piece 300 to liquefy so as to realize dehumidification, heat generated by the heating end of the semiconductor refrigerating piece 200 is transferred to the copper pipe fitting 420 through the heat conducting piece 410, the heat can be transferred along the extending direction of the copper pipe fitting 420 so that each position of the copper pipe fitting 420 is uniformly heated, the heat exchange fins 430 arranged at intervals along the length direction of the copper pipe fitting 420 can fully conduct the heat to the heat exchange fins 430, and then the gas is driven by the fan 500 to pass through gaps among the heat exchange fins 430 and then is discharged outwards from the second air vent 121.

Referring to fig. 2 and 3, or referring to fig. 4 and 5, in some embodiments of the present utility model, two semiconductor cooling fins 200 are provided, two second heat exchanging elements 400 are provided corresponding to each other, two semiconductor cooling fins 200 and two second heat exchanging elements 400 are arranged at intervals, the fan 500 is located between the two second heat exchanging elements 400, and a travelling path of the fan 500 for driving the gas to flow is directed to the second air vent 121. Because the gaps between the adjacent heat exchange fins 430 face the second air vent 121, the travelling path of the air flow driven by the fan 500 is also directed to the second air vent 121, that is, under the driving action of the fan 500, the air enters the air inlet side of the fan 500 after passing through one of the second heat exchange pieces 400, then is discharged from the air outlet side of the fan 500 and passes through the other second heat exchange piece 400, and then can be discharged from the second air vent, thereby further improving the heat exchange efficiency. It will be appreciated that if the air exhausted from the exhaust side of the blower 500 needs to pass through the two second heat exchange members 400 in sequence and then be exhausted from the second through holes, a part of the air flow driven by the blower 500 is easy to recoil, resulting in low utilization rate of the air flow, and the layout manner of the blower 500 between the two second heat exchange members 400 can improve the above problem.

In addition, in other embodiments, the number of the semiconductor refrigeration sheets 200 and the second heat exchanging elements 400 may be three or more, and may be configured according to actual needs.

Referring to fig. 2 and 3, in some embodiments of the present utility model, two semiconductor refrigeration sheets 200 and two second heat exchange members 400 are disposed at intervals along a vertical direction, the second ventilation opening 121 is formed at the top of the housing 100, and the housing 100 is provided with an air inlet structure that is communicated with the second cavity 120. It should be noted that, the hot air flow has a movement tendency of flowing upwards, convection can be formed between the air inlet structure and the second air vent 121, and the external air or the air passing through the first heat exchange member 300 flows upwards under the driving of the blower 500 after entering from the air inlet structure, so that the air is discharged from the second air vent 121 after passing through the two second heat exchange members 400 in turn, which is beneficial to accelerating the flow rate of the air to improve the heat exchange efficiency. At this time, the intake side of the blower 500 is located below, and the exhaust side of the blower 500 is located above.

Referring to fig. 4 and 5, in some embodiments of the present utility model, two semiconductor refrigeration sheets 200 and two second heat exchangers 400 are disposed at intervals along a horizontal direction, the second air vent 121 is disposed on a side wall of the housing 100, and the side wall of the housing 100 is provided with an air inlet 122 disposed opposite to the second air vent 121. The above layout manner is that the two second heat exchange pieces 400 and the fan 500 are horizontally arranged along a certain straight line direction, convection can be formed between the air inlet 122 and the second air outlet 121, external air is discharged from the second air outlet 121 after passing through the two second heat exchange pieces 400 under the driving of the fan 500 after entering from the air inlet 122, the flowing direction of the air is approximately straight line, and the wind noise is small.

Referring to fig. 3, in some embodiments of the present utility model, the heat conducting member 410 has a contact plane attached to the heating end of the semiconductor refrigeration sheet 200, a positioning groove 411 adapted to the outer diameter of the copper pipe member 420 is concavely disposed on the contact plane, two ends of the positioning groove 411 penetrate through two opposite sides of the heat conducting member 410, a portion of the copper pipe member 420 is accommodated in the positioning groove 411 and can abut against the heating end of the semiconductor refrigeration sheet 200, and two ends of the copper pipe member 420 respectively extend out of two ends of the positioning groove 411 and horizontally extend in a direction away from the heat conducting member 410. It can be understood that the peripheral wall of the portion of the copper pipe 420 located in the positioning groove 411 can directly contact the heating end of the semiconductor refrigeration sheet 200, so that a portion of heat generated by the heating end of the semiconductor refrigeration sheet 200 is directly transferred to the copper pipe 420, and another portion of heat generated by the heating end of the semiconductor refrigeration sheet 200 is transferred to the copper pipe 420 through the heat conducting member 410, thereby not only realizing positioning and fixing of the copper pipe 420, but also improving heat conduction efficiency of the second heat exchanging member 400. In this embodiment, the copper pipe 420 extends from both ends of the positioning groove 411, then bends and extends in the horizontal direction, and each heat exchange fin 430 is provided with a hole site through which the end of the copper pipe 420 can pass, and the hole site can be tightly matched with the outer peripheral wall of the copper pipe 420.

Referring to fig. 4 and 5, in order to facilitate the installation of the second heat exchanging element 400, the semiconductor dehumidifying apparatus of the present utility model further comprises a mounting bar 600, wherein two ends of the mounting bar 600 are respectively provided with a waist-shaped through hole 610, a bracket 130 for fixing the semiconductor refrigerating sheet 200 is provided in the housing 100, the bracket 130 is provided with a mounting hole 131 opposite to the waist-shaped through hole 610, and a bolt fastener is inserted through the waist-shaped through hole 610 and the corresponding mounting hole 131 so that the mounting bar 600 presses the heat conducting element 410 to the bracket 130. The mounting hole 131 on the bracket 130 is a threaded hole, the heat conducting member 410 can be pressed and fixed by the mounting bar 600 when the bolt fastener is screwed on the threaded hole, and the waist-shaped through holes 610 at two ends of the mounting bar 600 can be matched with the heat conducting members 410 with various sizes.

In some embodiments of the utility model, the plurality of heat exchange fins 430 are aluminum fins and/or copper fins. The heat exchange fins 430 have the effect of increasing the contact area with the air flow, so that heat is carried out by the air flow to thereby achieve heat dissipation. The heat exchange fins 430 are aluminum fins, the cost is low, the weight is light, the cost of the heat exchange fins 430 is increased, but the heat dissipation effect is better, a part of the heat exchange fins 430 are aluminum fins, and a part of the heat exchange fins 430 are copper fins.

Referring to fig. 6, in some embodiments of the present utility model, a frame member 140 is disposed within the housing 100, the first cavity 110 is located at a region between the housing 100 and the frame member 140, and an inner space of the frame member 140 constitutes the second cavity 120, so that the first cavity 110 and the second cavity 120 are isolated from each other. When the first cavity 110 and the second cavity 120 are independent of each other, the first heat exchange member 300 and the second heat exchange member 400 work independently, and the cooling capacity in the first cavity 110 cannot be shifted into the second cavity 120, which is beneficial for the cooling end and the heating end of the semiconductor refrigeration sheet 200 to have a larger temperature difference.

Referring to fig. 2 and 3, in some embodiments of the present utility model, a partition 150 is disposed in the housing 100 and along a vertical direction, the partition 150 divides an internal space of the housing 100 into the first cavity 110 and the second cavity 120, and a gas communication port 151 for communicating the first cavity 110 with the second cavity 120 is formed in the partition 150. It can be appreciated that, in order to increase the rate of entering and exiting the second cavity 120 with the humid air, and thus increase the dehumidification efficiency, a power structure capable of driving the external air to enter the second cavity 120 and leave the second cavity 120 is required, but in the above embodiment, due to the existence of the air communication port 151, under the action of the blower 500, a negative pressure can be formed at the air communication port 151, at least part of the air in the first cavity 110 can enter the second cavity 120, and convection is formed between the air communication port 151 and the first air vent 111, so as to increase the dehumidification efficiency.

In some embodiments of the present utility model, the partition 150 is provided with a switch mechanism for adjusting the opening size of the gas communication port 151, and the opening size of the gas communication port 151 is adjusted by using the switch mechanism, which is beneficial to adjusting a better dehumidification effect, and the switch mechanism may be a baffle plate capable of shielding a portion of the gas communication port 151 by moving. Of course, in other embodiments, when manufacturing the partition 150, the surplus material may be cut off according to the use requirement to obtain the gas communication ports 151 with corresponding dimensions, and when assembling, the partition 150 with different opening sizes of the gas communication ports 151 may be selected according to the semiconductor dehumidification devices with different specifications.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents.

Claims (8)

1. A semiconductor dehumidifying apparatus, comprising:

the device comprises a shell (100), wherein a first cavity (110) and a second cavity (120) are arranged in the shell (100), and the shell (100) is provided with a first vent (111) communicated with the first cavity (110) and a second vent (121) communicated with the second cavity (120);

The semiconductor refrigeration piece (200) is arranged in the shell (100), the semiconductor refrigeration piece (200) is provided with a refrigeration end positioned in the first cavity (110) and a heating end positioned in the second cavity (120), the refrigeration end of the semiconductor refrigeration piece (200) is connected with a first heat exchange piece (300), and the heating end of the semiconductor refrigeration piece (200) is connected with a second heat exchange piece (400);

The second heat exchange member (400) comprises a heat conduction member (410) attached to the heating end of the semiconductor refrigeration sheet (200), a copper pipe member (420) connected with the heat conduction member (410) and extending in the horizontal direction, and a plurality of heat exchange fins (430) which are used for the copper pipe member (420) to penetrate and are arranged at intervals along the length direction of the copper pipe member (420), wherein gaps between adjacent heat exchange fins (430) face the second air inlet (121);

The semiconductor refrigerating piece (200) is provided with two pieces, the second heat exchanging pieces (400) are correspondingly provided with two pieces, the two semiconductor refrigerating pieces (200) and the two second heat exchanging pieces (400) are arranged at intervals, the fan (500) is positioned between the two second heat exchanging pieces (400), the travelling path of the fan (500) driving the gas to flow is directed to the second air vent (121), a frame piece (140) is arranged in the shell (100), the first cavity (110) is positioned in the area between the shell (100) and the frame piece (140), and the inner space of the frame piece (140) forms the second cavity (120) so that the first cavity (110) and the second cavity (120) are isolated from each other.

2. A semiconductor dehumidifying device as claimed in claim 1, wherein:

The two semiconductor refrigerating sheets (200) and the two second heat exchange pieces (400) are arranged at intervals along the vertical direction, the second ventilation opening (121) is formed in the top of the shell (100), and the shell (100) is provided with a ventilation structure communicated with the second cavity (120).

3. A semiconductor dehumidifying device as claimed in claim 1, wherein:

The two semiconductor refrigerating sheets (200) and the two second heat exchange pieces (400) are arranged at intervals along the horizontal direction, the second air inlets (121) are formed in the side wall of the shell (100), and the side wall of the shell (100) is provided with the air inlets (122) which are arranged face to face with the second air inlets (121).

4. A semiconductor dehumidifying device as claimed in claim 1, wherein:

The heat conduction piece (410) is provided with a contact plane attached to the heating end of the semiconductor refrigeration piece (200), a positioning groove (411) matched with the outer diameter of the copper pipe piece (420) is concavely arranged in the contact plane, two ends of the positioning groove (411) penetrate through two opposite sides of the heat conduction piece (410), a part of the copper pipe piece (420) is accommodated in the positioning groove (411) and can be abutted to the heating end of the semiconductor refrigeration piece (200), and two ends of the copper pipe piece (420) extend out of two ends of the positioning groove (411) respectively and horizontally extend along the direction away from the heat conduction piece (410).

5. The semiconductor dehumidifying device as claimed in claim 4, wherein:

Still include installing strip (600), the both ends of installing strip (600) are equipped with a waist type through-hole (610) respectively, be equipped with in casing (100) and be used for fixing support (130) of semiconductor refrigeration piece (200), be equipped with on support (130) with mounting hole (131) that waist type through-hole (610) are relative, bolt fastener wears to locate waist type through-hole (610) and corresponding mounting hole (131) are in order to make installing strip (600) will heat-conducting piece (410) compress tightly in support (130).

6. A semiconductor dehumidifying device as claimed in claim 1, wherein:

the plurality of heat exchange fins (430) are aluminum fins and/or copper fins.

7. A semiconductor dehumidifying device as claimed in claim 1, wherein:

Be equipped with baffle (150) along vertical direction setting in casing (100), baffle (150) will the inner space of casing (100) is divided into first cavity (110) with second cavity (120), be seted up on baffle (150) will first cavity (110) with gas communication mouth (151) that second cavity (120) are linked together.

8. The semiconductor dehumidifying device as claimed in claim 7, wherein:

The partition plate (150) is provided with a switch mechanism for adjusting the opening size of the gas communication port (151).