CN223038367U

CN223038367U - Radiator and server

Info

Publication number: CN223038367U
Application number: CN202322830280.6U
Authority: CN
Inventors: 李翔; 王庆; 张超
Original assignee: Shenglong Singapore Pte Ltd
Current assignee: Shenglong Singapore Pte Ltd
Priority date: 2023-10-20
Filing date: 2023-10-20
Publication date: 2025-06-27
Anticipated expiration: 2033-10-20

Abstract

The utility model provides a radiator and a server. The radiator includes: a substrate and a plurality of heat dissipation fins fixed to the substrate; the radiator is provided with a support portion, the support portion is located on a side of the substrate in the thickness direction where the heat dissipation fins are provided, and the support portion is configured to cooperate with a support member to support the radiator. In this way, when the server is assembled and erected, the radiator is supported not only by the fixed connection between the substrate and the circuit board, but also by the cooperation between the support portion and the support member. Since the support portion and the heat dissipation fins are located on the same side in the thickness direction of the substrate, the cooperation between the support portion and the support member can support the suspended portion of the radiator, thereby preventing the radiator from forming a cantilever beam structure, which can improve the structural stability of the radiator when resisting gravity or vibration, and is conducive to improving the situation where the radiator is affected by gravity, resulting in a decrease in the snap-fitting force on the chip and a decrease in heat dissipation performance.

Description

Radiator and server

Technical Field

The present application relates to the field of servers, and more particularly, to a heat sink and a server.

Background

At present, as the power consumption of the server circuit board increases, the size of the heat sink also increases, which results in an increase in the weight of the heat sink. Some servers are in a standing state in a use scene, the circuit board is in a standing state, and the radiator is in a horizontal state. Therefore, the gravity of the radiator can have a pulling force on the circuit board, so that the buckling force of the radiator on the circuit board is reduced, and the heat radiation performance is reduced.

Disclosure of utility model

The application provides a radiator and a server, which can improve the stability of the radiator of the server used immediately and reduce the adverse effect of gravity on the performance reduction of the radiator.

The radiator comprises a base plate and a plurality of radiating fins fixed on the base plate, wherein the radiator is provided with a supporting part, the supporting part is positioned on one side of the base plate, on which the radiating fins are arranged, in the thickness direction of the base plate, and the supporting part is arranged to be matched with a supporting piece to support the radiator.

In an exemplary embodiment, the radiator further comprises a supporting plate, the supporting plate is arranged opposite to the base plate at intervals, the plurality of radiating fins are arranged between the base plate and the supporting plate at intervals and are connected with the base plate and the supporting plate, and the supporting plate is provided with the supporting portion.

In an exemplary embodiment, the support plate is provided with a channel in which the support portion is provided, and/or the support plate is provided with positioning bosses on both sides of which the support portion is provided.

In an exemplary embodiment, the heat radiating fin is provided with the support portion.

In an exemplary embodiment, the support portion is disposed at an end of the heat dissipation fin away from the base plate.

In an exemplary embodiment, the support part includes a support protrusion and/or a support groove, and the support part is configured to be in concave-convex engagement with and fixedly connected to the support member to support the heat sink.

The embodiment of the application also provides a server, which comprises a case, a circuit board and a heat dissipation device, wherein the case is provided with a support piece, the circuit board is arranged in the case, the heat dissipation device is arranged in the case and corresponds to the circuit board and is used for dissipating heat of the circuit board, the heat dissipation device comprises at least one first heat radiator, the first heat radiator is arranged as the heat radiator in any one of the embodiments, and the substrate is connected with the circuit board.

In an exemplary embodiment, the chassis includes a case shell and a cover plate, where the cover plate is disposed on a side of the substrate facing away from the circuit board and is connected to the case shell, and the support member and the cover plate are in an integral structure, or the support member and the cover plate are in a split structure, and the support member is located between the radiator and the cover plate, and the support member is fixedly connected to the case shell and/or the cover plate.

In an exemplary embodiment, the support is provided with a support protrusion and/or a support recess adapted to the support.

In an exemplary embodiment, the heat dissipating device includes a plurality of heat sinks disposed side by side, at least a portion of the plurality of heat sinks being disposed as the first heat sink.

Compared with the related art, the application has the following beneficial effects:

Through add supporting part on the radiator, when the server assembly is accomplished after and when standing up, the radiator can also obtain the support through the cooperation of supporting part and support piece except that obtaining the support through the fixed connection of base plate and circuit board. The circuit board, the base plate and the radiating fins are sequentially arranged along the thickness direction of the base plate by taking the thickness direction of the base plate as a reference, and the supporting part and the radiating fins are positioned on the same side of the base plate, namely, the supporting part is positioned on one side of the base plate away from the circuit board, so that the supporting part and the supporting part are matched to support the suspended part of the radiator, the radiator is prevented from forming a cantilever beam structure, the structural stability of the radiator when the radiator resists gravity or vibration can be improved, and the situation that the heat radiation performance is reduced due to the fact that the fastening force of the chip is reduced due to the influence of the gravity is improved.

Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application. Other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and drawings.

Drawings

Fig. 1 is a schematic partial perspective view of a server according to some embodiments of the present application;

FIG. 2 is a schematic diagram illustrating an assembly of a heat dissipating device and a circuit board according to some embodiments of the present application;

FIG. 3 is a schematic side view of the structure of FIG. 2;

FIG. 4 is a schematic perspective view of a support according to some embodiments of the present application;

FIG. 5 is a schematic partial perspective view of a server according to other embodiments of the present application;

FIG. 6 is a schematic diagram illustrating an assembly of a heat dissipating device and a circuit board according to another embodiment of the present application;

FIG. 7 is a schematic view of a support member according to other embodiments of the present application;

FIG. 8 is a schematic diagram illustrating an assembly of a heat dissipating device and a circuit board according to still other embodiments of the present application;

FIG. 9 is a schematic perspective view of a support member according to still other embodiments of the present application;

FIG. 10 is a schematic front view of a cover plate and a support member according to still other embodiments of the present application;

FIG. 11 is a schematic perspective view of the structure of FIG. 10;

FIG. 12 is a schematic perspective view of a cover plate and a support member according to still other embodiments of the present application;

FIG. 13 is a right side schematic view of the structure of FIG. 12;

FIG. 14 is a schematic left-hand view of the structure of FIG. 12;

Fig. 15 is a schematic perspective view of a server according to still other embodiments of the present application.

In the drawings, the list of components represented by the various numbers is as follows:

1 machine case, 11 case, 12 cover plate, 13 supporting piece, 131 supporting concave part, 132 supporting convex part, 133 limiting boss and 14 connecting piece;

2a circuit board, 21 chips;

3 heat sink, 31 heat sink, 311 substrate, 312 heat sink fins, 313 support plate, 3131 channel, 314 support boss, 315 support groove, 316 positioning boss, 32 spring screw assembly, 33 thermally conductive interface material.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, embodiments of the present application will be described in detail hereinafter with reference to the accompanying drawings. It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be arbitrarily combined with each other.

The embodiment of the application provides a radiator 31, and the radiator 31 can be used for a server to radiate heat of a circuit board 2 of the server. The circuit board 2 may be a PCB board.

As shown in fig. 2, the heat sink 31 includes a base plate 311 and a plurality of heat dissipation fins 312. A plurality of heat radiating fins 312 may be fixed to a side plate surface of the base plate 311. The plurality of heat dissipation fins 312 may be disposed in parallel at equal intervals. The heat dissipation fins 312 may be fixed to the base plate 311 by welding or the like. The heat dissipation fins 312 and the substrate 311 may be made of a material with good heat conductivity, such as aluminum or aluminum alloy.

The substrate 311 may contact the chip 21 with a component (such as the chip 21) with a relatively high heat productivity on the circuit board 2 of the server through the thermal interface material 33, so as to achieve efficient heat dissipation. The base plate 311 may be fixed to the body of the circuit board 2 by means of a spring screw assembly 32, as shown in fig. 2 and 3. The spring screw assembly 32 can provide a certain fastening force to fasten the heat sink 31 to the circuit board 2. The spring screw assembly 32 includes a screw, which can be fixedly connected with the board body of the circuit board 2, and a spring sleeved on the screw. Thus, when the server is used vertically, as shown in fig. 1, the circuit board 2 is in a standing state, the radiator 31 is in a horizontally-arranged horizontal state, one end of the radiator 31 in the horizontal direction (i.e. the end where the substrate 311 is located) is fixed on the circuit board 2, and the other end of the radiator 31 is suspended, so that a cantilever-like structure is formed. Since the heat sink 31 has a large weight and is affected by gravity, the heat sink 31 may generate a tensile force on the circuit board 2, reducing the fastening force of the substrate 311 to the chip 21, and reducing the heat dissipation performance.

To this end, the structure of the heat sink 31 is improved according to the embodiment of the present application, in which the heat sink 31 is provided with a supporting portion, such as a supporting protrusion 314 and a supporting groove 315 as shown in fig. 2. The support portion is located at one side in the thickness direction of the substrate 311 and at one side of the substrate 311 where the heat dissipation fins 312 are provided, and is provided to cooperate with the support 13 to support the heat sink 31. The supporting member 13 may be made of metal, such as a sheet metal, so as to ensure that the supporting member 13 has a certain structural strength. The number of the supporting members 13 may be one or plural, and the number of the supporting members 13 may be the same or different.

By adding the support portion to the heat sink 31, when the server is assembled and standing up, the heat sink 31 can be supported by the cooperation of the support portion and the support member 13, as shown in fig. 1, in addition to being supported by the fixed connection of the substrate 311 and the circuit board 2. The circuit board 2, the substrate 311 and the radiating fins 312 are sequentially arranged along the thickness direction of the substrate 311 by taking the thickness direction of the substrate 311 as a reference, and the supporting part and the radiating fins 312 are positioned on the same side of the substrate 311, namely, the supporting part is positioned on the side of the substrate 311 away from the circuit board 2, so that the supporting part and the supporting piece 13 are matched to support the suspended part of the radiator 31, thereby avoiding the radiator 31 from forming a cantilever beam structure, improving the structural stability of the radiator 31 when the radiator 31 resists gravity or vibration, and being beneficial to improving the situation that the heat dissipation performance is reduced due to the fact that the buckling force of the chip 21 is reduced due to the influence of the gravity.

In some exemplary embodiments, the support includes support protrusions 314 and/or support grooves 315, as shown in fig. 2, 6, and 8. The support portion is provided in a concavo-convex engagement and fixedly connected with the support 13 to support the heat sink 31. The support 13 is provided with support protrusions 132 and/or support recesses 131 adapted to the support, as shown in fig. 4, 7 and 9.

The supporting part adopts concave-convex fit with the supporting piece 13, so that the supporting piece 13 can play an effective supporting role on the radiator 31, and the structural stability of the radiator 31 is effectively improved.

The supporting part and the supporting piece 13 can be fixedly connected in a riveting way, a screw connection way and the like, so that the matching reliability of the supporting part and the supporting piece 13 is improved.

The supporting portion may include only the supporting protrusion 314 (as shown in fig. 6), may include only the supporting groove 315 (as shown in fig. 8), and may include both the supporting protrusion 314 and the supporting groove 315 (as shown in fig. 2), and the supporting protrusion 314 and the supporting groove 315 may be alternately disposed. Accordingly, the support 13 may be provided with only the support concave portion 131, only the support convex portion 132, or both the support concave portion 131 and the support convex portion 132.

The number and distribution of the supporting protrusions 314/supporting grooves 315 are not limited, and may include one or more, and may include a plurality of supporting protrusions/supporting grooves. The shape of the support protrusions 314/support grooves 315 is also not limited, and may be, but not limited to, square (as shown in fig. 6 and 8), triangular, racetrack (as shown in fig. 2), circular, oval, etc. When the number of the supporting protrusions 314/supporting grooves 315 is plural, the sizes of the supporting protrusions 314/supporting grooves 315 may be uniform, or may be partially uniform, or may be completely non-uniform, or the shapes of the supporting protrusions 314/supporting grooves 315 may be partially uniform, or may be completely non-uniform.

In some exemplary embodiments, the heat sink 31 further includes a support plate 313, as shown in fig. 2, 6, and 8. The thickness of the support plate 313 may be in the range of, but not limited to, about 1mm to 5 mm.

Wherein the support plate 313 is disposed opposite to the substrate 311 with a space therebetween. The plurality of heat dissipation fins 312 are arranged between the base plate 311 and the support plate 313 at intervals, and are connected with the base plate 311 and the support plate 313. The support plate 313 is provided with a support portion. The support plate 313 and the heat dissipation fins 312 may be fixedly connected by a process such as welding. The support plate 313 may be made of a material having good heat conductivity such as aluminum or aluminum alloy.

In this way, the support plate 313 can fix the end of the heat dissipation fins 312 away from the base plate 311, which is beneficial to improving the position stability of the plurality of heat dissipation fins 312. The supporting portion is disposed on the supporting plate 313, so that the opposite ends of the heat sink 31 can be effectively supported, which is beneficial to obviously improving the structural stability of the heat sink 31 when the heat sink 31 resists gravity or vibration, and obviously improving the situation that the heat sink 31 is affected by gravity to reduce the fastening force with the chip 21, thereby reducing the heat dissipation performance.

On the other hand, the support part is also convenient to process and mold, so that the position stability of the support part is improved, and the stability of the support part and the support piece 13 after being assembled is further improved.

In some embodiments, the support plate 313 is provided with a channel 3131, as shown in fig. 2, with a support within the channel 3131. This is advantageous in reducing the thickness of the support plate 313 after it is engaged with the support 13, thereby advantageously reducing the volume of the server. In addition, the channel 3131 may be a part of the supporting portion for embedding a corresponding structure (such as the limiting boss 133 described below) of the supporting member 13, so as to further improve the supporting effect. Of course, the support plate 313 may be provided with a support portion directly on the plate surface of the support plate 313 without providing the channel 3131.

In other embodiments, the support plate 313 is provided with a positioning boss 316, and as shown in fig. 6, both sides of the positioning boss 316 are provided with support portions.

The positioning boss 316 can position the supporting member 13, which is beneficial to improving the assembly efficiency of the supporting portion and the supporting member 13. The support parts are arranged on the two sides of the positioning boss 316, so that the stress balance of the radiator 31 and the support piece 13 is facilitated, and the structural stability of the radiator 31 is further improved. In addition, the side wall of the positioning boss 316 can also be in stop fit with the supporting piece 13, so that the supporting effect is further improved.

In other exemplary embodiments (not shown), the heat dissipation fins 312 are provided with support portions. In this way, the supporting plate 313 can be omitted, and the connecting procedure between the supporting plate 313 and the radiating fins 312 can be omitted, thereby being beneficial to improving the production efficiency and reducing the production cost.

In some embodiments, the support is provided at an end of the heat sink fin 312 remote from the base plate 311. Therefore, the two opposite ends of the radiator 31 can be effectively supported, so that the structural stability of the radiator 31 against gravity or vibration is improved obviously, and the situation that the heat dissipation performance is reduced due to the fact that the buckling force of the radiator 31 with the chip 21 is reduced due to the influence of gravity is improved obviously.

In other embodiments, the supporting portion may be disposed at other portions of the radiator 31, such as the middle portion of the heat dissipation fin 312, so long as the supporting portion can support the radiator 31, so as to reduce the adverse effect of gravity on the heat dissipation performance of the radiator 31.

As shown in fig. 1, 5 and 15, the embodiment of the application further provides a server, which comprises a chassis 1, a circuit board 2 and a heat dissipation device 3.

The cabinet 1 is provided with a support 13, and the support 13 is used for supporting the radiator 31.

The circuit board 2 is disposed in the chassis 1. The circuit board 2 may include a board body and a chip 21 (shown in fig. 3) provided to the board body. The chip 21 is a component with larger power consumption of the circuit board 2, and generates higher heat. The higher the power consumption of the chip 21, the larger the size and the weight of the heat sink 31.

The heat dissipation device 3 is disposed in the chassis 1 and corresponds to the circuit board 2, and is configured to dissipate heat from the circuit board 2. The heat dissipation device 3 includes at least one first heat sink, which is configured as the heat sink 31 according to any of the above embodiments, and the substrate 311 is connected to the circuit board 2, so that the foregoing advantages are all achieved, and will not be repeated herein.

In this way, at least the first radiator will not decrease the heat dissipation performance due to the influence of gravity, so that the heat dissipation effect of the circuit board 2 is improved, and the use reliability of the server is improved.

In some exemplary embodiments, chassis 1 includes a case 11 (shown in fig. 5 and 15) and a cover 12 (shown in fig. 10 and 15). The cover plate 12 is disposed on a side of the base plate 311 facing away from the circuit board 2, and is connected to the case 11, and may be fixedly connected by a plurality of screws.

In some embodiments, the support 13 is of unitary construction with the cover plate 12, as shown in fig. 10-15. Therefore, the case 1 does not need to additionally increase other parts, which is beneficial to reducing the number of parts of the server and further beneficial to improving the assembly efficiency of the server.

The supporting member 13 may be formed into an integral structure with the cover plate 12 by punching (as shown in fig. 12 to 15), casting, welding (as shown in fig. 10 and 11), or the like.

In other embodiments, the support 13 and the cover 12 are of a split type structure, as shown in fig. 1 and 5. In fig. 1 and 5, the cover plate 12 is omitted. The supporting member 13 is located between the radiator 31 and the cover 12, and the supporting member 13 is fixedly connected with the case 11 and/or the cover 12 (may be directly connected or indirectly connected through a connecting member 14, and the connecting member 14 may be an L-shaped folded plate, for example).

The structure and the size of the support piece 13 are arranged reasonably according to the requirement, the structure of the cover plate 12 is simplified, the cover plate 12 is kept flat, the cover plate 12 is shaped and processed conveniently, the support piece 13 can strengthen the chassis 1 of the server, and the structural strength of the chassis 1 is improved.

The supporting member 13 may be fixedly connected with the cover plate 12, or may be fixedly connected with the case 11, or may be fixedly connected with both the cover plate 12 and the case 11.

In some exemplary embodiments, the heat sink 3 includes a plurality of heat sinks 31 disposed side by side, as shown in fig. 2, 6 and 8. At least a part of the plurality of heat sinks 31 is provided as a first heat sink.

For example, at least the heat sinks 31 at both ends are provided as first heat sinks.

When the number of the heat sinks 31 is greater than or equal to three, the heat sinks 31 located between the heat sinks 31 at both ends may be referred to as second heat sinks. The second heat sink may not be provided with a support portion, and may take the form of a conventional heat sink 31. When the heat sinks 31 at both ends are effectively supported, the entire heat sink 3 can have relatively good heat dissipation performance.

Or the second heat sink may be provided as the first heat sink, i.e., a supporting portion, to ensure that each heat sink 31 is effectively supported.

Of course, the number of the heat sinks 31 may be one or two.

Some embodiments are described below.

Example one (as shown in FIGS. 1 to 4)

The heat sink 3 comprises three heat sinks 31 arranged side by side. The three heat sinks 31 are all provided with a support plate 313, the middle part of the support plate 313 is provided with a channel 3131, and a support part is arranged in the channel 3131. Each channel 3131 has a support protrusion 314 and a support recess 315 disposed therein. The support protrusion 314 and the support groove 315 have a racetrack shape.

The support 13 is of an integral structure or a split structure with the cover 12 (the cover 12 is omitted from fig. 1) of the chassis 1. The number of the supporting pieces 13 is one. The plate surface of the support 13 facing the radiator 31 is provided with a limit boss 133 adapted to the channel 3131, as shown in fig. 3 and 4. The limit projection 133 is provided with a support concave portion 131 fitted with the support projection 314 and a support convex portion 132 fitted with the support groove 315.

After the assembly is completed, the limit boss 133 of the cover plate 12 is embedded into the channel 3131 of the heat sink 3. The supporting protrusions 314 of the heat sink 31 are fitted into the supporting recesses 131 of the supporting member 13, and the supporting protrusions 132 of the supporting member 13 are fitted into the supporting grooves 315 of the heat sink 31. The outer plate surface of the cover plate 12 remains flat.

Example two (as shown in FIGS. 5 to 7)

The difference from the first embodiment is that the middle portion of the supporting plate 313 of the heat sink 31 is provided with a positioning boss 316, and both sides of the positioning boss 316 are provided with supporting portions. Each support plate 313 is provided with two symmetrically arranged support protrusions 314. The supporting protrusion 314 has a rectangular shape. The supporting piece 13 and the cover plate 12 of the case 1 are of a split type structure. The number of the supporting pieces 13 is two, and the two supporting pieces 13 are respectively positioned at two sides of the positioning boss 316 and are approximately flush with the positioning boss 316. Each support 13 is provided with three support recesses 131 which fit with the support protrusions 314. The case 11 is fixedly connected with a connecting piece 14, and two ends of each supporting piece 13 are fixed on the connecting piece 14 through screws, so that indirect fixed connection with the case 11 is realized.

Example III (as shown in FIGS. 8 to 11)

The difference from the first embodiment is that the support plates 313 are not provided with the channels 3131, the middle of each support plate 313 is provided with a rectangular support groove 315, and the three support grooves 315 are the same or different in size. The number of the supporting pieces 13 is three, the plate surface of the three supporting pieces 13 facing the radiator 31 is provided with supporting convex parts 132 respectively matched with the three supporting grooves 315, and as shown in fig. 9, the three supporting pieces 13 are in one-to-one correspondence with the three supporting grooves 315. Three supporting members 13 are welded to the inner plate surface of the cover plate 12 as shown in fig. 10. After assembly, the outside panel surface of the cover plate 12 remains flat as shown in fig. 11.

Example IV (as shown in FIGS. 12 to 15)

The difference from the third embodiment is that the three support grooves 315 are the same size or different in size and the three support protrusions 132 are different in size. Three supports 13 are integrally formed on the cover plate 12 by punching, as shown in fig. 12 to 14. After the assembly, the outer panel surface of the cover plate 12 has a recessed portion, as shown in fig. 15.

Example five (not shown in the drawings)

The difference from the first to fourth embodiments is that the heat sink 31 is not provided with the support plate 313, which is provided on the heat radiating fins 312.

Example six (not shown in the drawings)

The difference from the first to fifth embodiments is that the plurality of heat sinks 31 are not all provided with the supporting portions, but only a part of the heat sinks 31 are provided with the supporting portions.

In the description of the embodiments of the present application, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "one side", "another side", "one end", "another end", "side", "opposite", "four corners", "periphery", "mouth" word structure ", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of describing the embodiments of the present application and simplifying the description, and are not indicative or implying that the structures referred to have a specific direction, are configured and operated in a specific direction, and thus are not to be construed as limiting the present application.

In describing embodiments of the present application, unless explicitly stated or limited otherwise, the terms "connected," "directly connected," "indirectly connected," "fixedly connected," "mounted," "assembled" should be construed broadly, e.g., as being either fixedly connected or detachably connected, or integrally connected, and the terms "mounted," "connected," "fixedly connected" may be either directly or indirectly connected via an intermediate medium, or may be in communication with each other between two elements. The specific meaning of the above terms in embodiments of the present application will be understood in detail by those of ordinary skill in the art.

Although the embodiments of the present application are described above, the embodiments are only used for facilitating understanding of the present application, and are not intended to limit the present application. It should be noted that the above-described examples or implementations are merely exemplary and not limiting. Accordingly, the application is not limited to what has been particularly shown and described herein. Various modifications, substitutions, or omissions may be made in the form and details of the embodiments without departing from the scope of the application.

Claims

1. A heat sink is characterized by comprising a base plate and a plurality of heat radiating fins fixed on the base plate;

The radiator is provided with a supporting part, the supporting part is positioned on one side of the substrate, which is provided with the radiating fins, in the thickness direction, and the supporting part is matched with the supporting piece to support the radiator.

2. The heat sink according to claim 1, the radiator is characterized by further comprising:

The support plates are arranged opposite to the base plate at intervals, and the plurality of radiating fins are arranged between the base plate and the support plates at intervals and are connected with the base plate and the support plates;

The support plate is provided with the support portion.

3. The heat sink of claim 2, wherein the support plate is provided with a channel in which the support portion is provided, and/or

The backup pad is equipped with the location boss, the both sides of location boss are equipped with the supporting part.

4. The heat sink of claim 1, wherein the heat radiating fins are provided with the support portions.

5. The heat sink of claim 4, wherein the support is provided at an end of the heat dissipating fin remote from the base plate.

6. The heat sink as claimed in any one of claims 1 to 5, wherein the support portion comprises a support protrusion and/or a support groove, the support portion being arranged to be in a male-female fit and fixedly connected with the support member for supporting the heat sink.

7. A server for a server, which comprises a server and a server, characterized by comprising the following steps:

the case is provided with a supporting piece;

a circuit board arranged in the case, and

The heat dissipation device is arranged in the chassis and corresponds to the circuit board and is used for dissipating heat of the circuit board, the heat dissipation device comprises at least one first heat radiator, the first heat radiator is arranged as the heat radiator according to any one of claims 1 to 6, and the substrate is connected with the circuit board.

8. The server according to claim 7, wherein the chassis includes a case housing and a cover plate, the cover plate being provided on a side of the substrate facing away from the circuit board and connected to the case housing;

The support piece and the cover plate are of an integrated structure, or the support piece and the cover plate are of a split structure, the support piece is positioned between the radiator and the cover plate, and the support piece is fixedly connected with the case shell and/or the cover plate.

9. The server according to claim 7, wherein the support is provided with support protrusions and/or support recesses adapted to the support.

10. The server according to any one of claims 7 to 9, characterized in that the heat dissipating device comprises a plurality of heat sinks arranged side by side, at least a part of the plurality of heat sinks being arranged as the first heat sink.