CN223030298U - A circulating diode injection molding machine mold - Google Patents
A circulating diode injection molding machine mold Download PDFInfo
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- CN223030298U CN223030298U CN202422225420.1U CN202422225420U CN223030298U CN 223030298 U CN223030298 U CN 223030298U CN 202422225420 U CN202422225420 U CN 202422225420U CN 223030298 U CN223030298 U CN 223030298U
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Abstract
The utility model discloses a circulating diode injection molding machine die, which belongs to the technical field of diode injection molding and comprises a shell, wherein a die cavity is arranged in the shell, a cooling cavity for assisting in accelerating the molding of a diode is arranged in the inner wall of the shell, a water stop plate is arranged in the cooling cavity, a cooling component for cooling water in the cooling cavity is arranged on one side of the surface of the shell, a cooling box is connected to one side of the shell, a radiating pipe is arranged in the cooling box, two ends of the radiating pipe are respectively communicated with an inner cavity of the cooling cavity through a water inlet pipe and a water outlet pipe, and a flow guide component for guiding internal liquid is arranged in the cooling box.
Description
Technical Field
The utility model relates to the technical field of diode injection molding, in particular to a circulating diode injection molding machine die.
Background
In addition, there is an early vacuum electronic diode, which is an electronic device with unidirectional current conduction, and a PN junction and two lead terminals are arranged in the semiconductor diode, the electronic device has unidirectional current transduction according to the direction of applied voltage, and the common diode is manufactured by injection molding, so that the diode is shaped slowly, and the deformation of the diode is easy to be caused, thus an injection molding machine die with a circulation heat dissipation function is needed.
In the prior art, the utility model of CN209812972U discloses a circulating diode injection molding machine die, and particularly discloses a circulating diode injection molding machine die which can refrigerate water in the range of a cold guide plate through a refrigerating device and can pump water and drain water through a water pump to achieve the effect of circulating refrigeration. Therefore, we need to propose a cyclic diode injection molding machine mold.
Disclosure of utility model
The utility model aims to provide a circulating diode injection molding machine die, which can further improve the cooling range in the use process of the diode injection molding machine die, improve the cooling efficiency, achieve the effect of circulating refrigeration, have good refrigeration effect, accelerate the molding speed of the diode, avoid the deformation of the diode in the cooling process, and ensure the production efficiency so as to solve the problems in the prior art.
The utility model provides a circulating diode injection molding machine die, which comprises a shell, wherein a die cavity is formed in the shell, a cooling cavity for assisting in accelerating the molding of a diode is formed in the inner wall of the shell, a water stop plate is arranged in the cooling cavity, a cooling component for cooling water in the cooling cavity is arranged on one side of the surface of the shell, a cooling box is connected to one side of the shell, a radiating pipe is arranged in the cooling box, two ends of the radiating pipe are respectively communicated with an inner cavity of the cooling cavity through a water inlet pipe and a water outlet pipe, a flow guide component is arranged in the cooling box and used for guiding internal liquid, and semiconductor refrigerating sheets for cooling the internal liquid are embedded on two sides of the cooling box.
Preferably, the water inlet pipe is communicated with the cooling cavity at one side of the water stop plate through the miniature water pump, the other end of the water outlet pipe is communicated with the cooling cavity at one side of the water stop plate, and one side of the shell is respectively provided with a water outlet and a water feeding mouth which are communicated with the cooling cavity.
Preferably, the cooling assembly comprises a refrigeration plate which is arranged in the cooling box and is embedded on the surface of the cooling cavity, a heat release surface of the refrigeration plate is connected with a connecting plate, and a drainage fan is arranged on the surface of the connecting plate.
Preferably, the flow guide assembly comprises a fixed block connected to the inner wall of the cooling box and a flow guide fan movably inserted on the fixed block, wherein a limiting clamping groove is formed in the surface of the fixed block, the top of the fixed block is connected with a positioning rod, and the flow guide fan is arranged in the assembly frame.
Preferably, one side of the assembly frame is connected with a positioning clamping plate, the assembly frame is movably inserted into the limiting clamping groove through the positioning clamping plate, and the top end of the positioning rod is clamped in the positioning clamping plate in a matched mode.
Preferably, the top of cooling tank is sealed to be installed the guard plate, the bottom of cooling tank is provided with the drain pipe.
Preferably, the heat absorbing surface of the semiconductor refrigeration sheet is connected with heat absorbing fins, and the heat absorbing fins are arranged in the cooling box.
Compared with the prior art, the utility model has the beneficial effects that:
The cooling device comprises a cooling cavity, a water stop plate, a radiating pipe, a cooling box, a cooling assembly, a diversion assembly and the like, wherein the cooling cavity is internally filled with water through a water supply port, the cooling plate is matched with the cooling cavity to cool water in the cooling cavity, a diode in the cooling cavity is cooled, the miniature water pump is matched with the water inlet pipe to circulate water in the cooling cavity, the circulating water is matched with the radiating pipe to radiate heat, the cooling efficiency of the internal water is accelerated, the cooling plate and the radiating pipe can be cooled through cooling water in the cooling box by the heat absorption fins, the cooling water in the cooling box can be circularly diverted by the diversion fan, and the cooling effect of the radiating pipe and the cooling plate on the cooling inside the cooling cavity is further ensured.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the internal structure of the cooling box according to the present utility model;
FIG. 3 is a schematic view of a heat pipe according to the present utility model;
Fig. 4 is a schematic view of an assembly frame structure of the present utility model.
In the figure, 1, a shell; 2, a mold cavity, 3, a cooling cavity, 4, a water stop plate, 5, a water outlet, 6, a water supply port, 7, a refrigerating plate, 8, a connecting plate, 9, a drainage fan, 10, a water inlet pipe, 11, a radiating pipe, 12, a water outlet pipe, 13, a first guiding device, 14, a cooling box, 15, a heat absorption fin, 16, a semiconductor refrigerating plate, 17, a fixed block, 18, a limiting clamping groove, 19, a positioning rod, 20, a positioning clamping plate, 21, an assembly frame, 22, a guiding fan, 23, a water drain pipe, 24 and a protection plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the utility model provides a circulating diode injection molding machine die, which comprises a shell 1, wherein a die cavity 2 is arranged in the shell 1, a cooling cavity 3 for assisting in accelerating the molding of a diode is arranged in the inner wall of the shell 1, a water stop plate 4 is arranged in the cooling cavity 3, a cooling component for cooling water in the cooling cavity 3 is arranged on one side of the surface of the shell 1, a cooling box 14 is connected to one side of the shell 1, a radiating pipe 11 is arranged in the cooling box 14, two ends of the radiating pipe 11 are respectively communicated with the inner cavity of the cooling cavity 3 through a water inlet pipe 10 and a water outlet pipe 12, a flow guide component is arranged in the cooling box 14 and used for guiding internal liquid, and semiconductor refrigerating sheets 16 used for cooling the internal liquid are embedded on two sides of the cooling box 14.
It is worth noting that, through the cooperation setting of cooling chamber 3, stagnant water board 4, cooling tube 11, cooler bin 14, cooling module and water conservancy diversion subassembly structure, can further improve the refrigerated scope of diode injection molding machine mould in the use, improve refrigerated efficiency simultaneously, reach the effect of circulation refrigeration, refrigeration effect is good for the shaping speed of diode, avoid the diode to warp at refrigerated in-process, guarantee the efficiency of production.
Specifically, inlet tube 10 passes through the cooling chamber 3 of miniature water pump intercommunication stagnant water board 4 one side, and the other end of outlet pipe 12 communicates the cooling chamber 3 of stagnant water board 4 one side, and one side of shell 1 is provided with outlet 5 and feed water mouth 6 of intercommunication cooling chamber 3 respectively. The heat absorbing surface of the semiconductor refrigeration sheet 16 is connected with heat absorbing fins 15, and the heat absorbing fins 15 are arranged inside the cooling box 14. A first diversion device 13 is arranged on one side of the radiating pipe 11, and the first diversion device 13 has the same integral structure with the diversion fan 22 and is used for diversion of water in the cooling box 14.
In addition, the water stop plate 4 limits the water in the cooling cavity 3, and cooperates with the micro water pump to circulate and cool the water in the cooling cavity 3, so that the cooperation of the water outlet pipe 12 and the water inlet pipe 10 can further improve the circulation effect, the semiconductor refrigerating sheet 16 is a component for cooling and cooling the cooling water at the temporal part of the cooling tank 14, and the heat absorption fin 15 increases the contact area of the semiconductor refrigerating sheet 16 to cooling water and improves the cooling effect.
The cooling assembly comprises a refrigeration plate 7 which is arranged in a cooling box 14 and is embedded on the surface of the cooling cavity 3, a heat release surface of the refrigeration plate 7 is connected with a connecting plate 8, and a drainage fan 9 is arranged on the surface of the connecting plate 8. The top of the cooling box 14 is provided with a protection plate 24 in a sealing way, the bottom of the cooling box 14 is provided with a drain pipe 23, the cooling box 14 is used for cooling the cooling plate 7, the cooling plate 7 is a component used for cooling water in the cooling cavity 3, the connecting plate 8 is a component used for accelerating the heat release effect of the cooling plate 7, the drainage fan 9 is a component used for accelerating the heat release of the cooling plate 7, and therefore the cooling structure is accelerated, and the protection plate 24 is used for protecting the cooling box 14.
The flow guiding assembly comprises a fixed block 17 connected to the inner wall of the cooling box 14 and a flow guiding fan 22 movably inserted on the fixed block 17, wherein a limiting clamping groove 18 is formed in the surface of the fixed block 17, a positioning rod 19 is connected to the top of the fixed block 17, and the flow guiding fan 22 is installed in the assembly frame 21. One side of the assembly frame 21 is connected with a positioning clamping plate 20, the assembly frame 21 is movably inserted into the limiting clamping groove 18 through the positioning clamping plate 20, and the top end of the positioning rod 19 is matched and clamped with the positioning clamping plate 20.
Further, the fixing block 17 is a structure for positioning and clamping the positioning clamping plate 20, the guide fan 22 is a component for guiding cooling water in the cooling tank 14, the positioning rod 19 is a structure for assembling the positioning clamping plate 20, the assembling frame 21 is a structure for assembling the guide fan 22, the limiting clamping groove 18 is a structure matched with the positioning clamping plate 20, and the assembling frame 21 is positioned.
The cooling device is characterized in that water is injected into the cooling cavity 3 through the water feeding mouth 6, meanwhile, water in the cooling cavity 3 can be cooled by matching with the refrigerating plate 7, diodes in the die cavity 2 are cooled, the water in the cooling cavity 3 is circulated by matching with the water inlet pipe 10 through the miniature water pump, the circulated water is radiated by matching with the radiating pipe 11, the cooling efficiency of the internal water is accelerated, the cooling plate 7 and the radiating pipe 11 can be cooled by cooling water in the cooling box 14 through the heat absorption fins 15, the cooling water in the cooling box 14 can be circularly guided by matching with the guide fan 22, the cooling effect of the radiating pipe 11 and the cooling plate 7 on the inside of the cooling cavity 3 is further ensured, and when the guide fan 22 is damaged, the guide fan 22 can be conveniently taken down for replacement through matching and dismounting the positioning rod 19 and the positioning clamping plate 20.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A cyclic diode injection molding machine die, comprising:
The LED lamp comprises a shell (1), wherein a die cavity (2) is arranged in the shell (1), a cooling cavity (3) for assisting in accelerating the forming of a diode is arranged on the inner wall of the shell (1), a water stop plate (4) is arranged in the cooling cavity (3), and a cooling assembly for cooling water in the cooling cavity (3) is arranged on one side of the surface of the shell (1);
One side of the shell (1) is connected with a cooling box (14), a radiating pipe (11) is arranged in the cooling box (14), and two ends of the radiating pipe (11) are respectively communicated with an inner cavity of the cooling cavity (3) through a water inlet pipe (10) and a water outlet pipe (12);
The semiconductor refrigerating sheets (16) for cooling the internal liquid are embedded on two sides of the cooling box (14).
2. The circulating diode injection molding machine die according to claim 1, wherein the water inlet pipe (10) is communicated with the cooling cavity (3) at one side of the water stop plate (4) through a miniature water pump, the other end of the water outlet pipe (12) is communicated with the cooling cavity (3) at one side of the water stop plate (4), and one side of the shell (1) is respectively provided with a water outlet (5) and a water supply mouth (6) which are communicated with the cooling cavity (3).
3. The circulating diode injection molding machine die of claim 1, wherein the cooling assembly comprises a refrigeration plate (7) arranged inside the cooling box (14) and embedded on the surface of the cooling cavity (3), a heat release surface of the refrigeration plate (7) is connected with a connecting plate (8), and a drainage fan (9) is arranged on the surface of the connecting plate (8).
4. The circulating diode injection molding machine of claim 1, wherein the flow guide assembly comprises:
A fixed block (17) connected to the inner wall of the cooling tank (14), and
A guide fan (22) movably inserted on the fixed block (17);
The surface of the fixed block (17) is provided with a limiting clamping groove (18), the top of the fixed block (17) is connected with a positioning rod (19), and the guide fan (22) is arranged in the assembly frame (21).
5. The circulating diode injection molding machine die as claimed in claim 4, wherein one side of the assembly frame (21) is connected with a positioning clamping plate (20), the assembly frame (21) is movably inserted into the limiting clamping groove (18) through the positioning clamping plate (20), and the top end of the positioning rod (19) is clamped in the positioning clamping plate (20) in a matched mode.
6. A circulating diode injection molding machine mold as claimed in claim 1, wherein a protection plate (24) is mounted on the top of the cooling box (14) in a sealing manner, and a drain pipe (23) is arranged at the bottom of the cooling box (14).
7. The circulating diode injection molding machine die as claimed in claim 1, wherein the heat absorbing surface of the semiconductor refrigeration piece (16) is connected with heat absorbing fins (15), and the heat absorbing fins (15) are arranged in the cooling box (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422225420.1U CN223030298U (en) | 2024-09-11 | 2024-09-11 | A circulating diode injection molding machine mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422225420.1U CN223030298U (en) | 2024-09-11 | 2024-09-11 | A circulating diode injection molding machine mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223030298U true CN223030298U (en) | 2025-06-27 |
Family
ID=96128436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202422225420.1U Active CN223030298U (en) | 2024-09-11 | 2024-09-11 | A circulating diode injection molding machine mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223030298U (en) |
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2024
- 2024-09-11 CN CN202422225420.1U patent/CN223030298U/en active Active
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