CN222980486U

CN222980486U - Thimble device

Info

Publication number: CN222980486U
Application number: CN202422132446.1U
Authority: CN
Inventors: 李健
Original assignee: Verizon United Semiconductor Beijing Co ltd
Current assignee: Verizon United Semiconductor Beijing Co ltd
Priority date: 2024-08-30
Filing date: 2024-08-30
Publication date: 2025-06-13
Anticipated expiration: 2034-08-30

Abstract

The utility model belongs to the technical field of wafer processing, and discloses a thimble device, which comprises a first jacking component and a second jacking component which are arranged side by side along the horizontal direction, wherein the first jacking component and the second jacking component respectively comprise a thimble, an elastic piece and a support which are sequentially connected from top to bottom, the thimble is provided with a first position, a second position and a third position which are sequentially lowered along the height direction, in an initial state, the thimble of the first jacking component is positioned at the first position, the thimble of the second jacking component is positioned at the second position, and when the thimbles of the first jacking component and the second jacking component are positioned at the third position, the acting forces born by the thimble of the first jacking component and the thimble of the second jacking component are the same. According to the utility model, the elastic piece of the first jacking component can store force earlier than the elastic piece of the second jacking component, so that the stress of the product can be ensured to be consistent when the first jacking component and the second jacking component jointly jack the product finally.

Description

Thimble device

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a thimble device.

Background

After the whole wafer is cut into a plurality of chips, the chips are still adhered to a round adhesive film with the same size as the wafer, in the subsequent stripping process, the adhesive film carrying the cut chips is fixed on a chuck of stripping equipment, a thimble at the bottom of the chuck rises to jack up the chips, so that the bottoms of the chips are separated from the adhesive film, then a suction head at the top sucks the chips away and puts the chips into a carrier tape, and the chips are provided for the subsequent process.

In stripping equipment, the lower side of the chuck is provided with a single thimble or a double thimble, a double thimble structure is generally adopted for a chip with larger size, in the existing design, the double thimble is fixed on the same die, and the die can move up and down, so that the two thimbles are driven to jack up the chip together. When the suction head is operated, each chip is sequentially sucked from the adhesive film until all chips on the adhesive film are sucked, and all chips are placed into the carrier tape.

The arrangement direction of the two ejector pins is consistent with the direction of sucking the chip by the suction head, the suction head is set to suck the chips from left to right in sequence, so that when the chips are jacked by the double ejector pins, the chips on the left side of the chips are already taken away, the chips on the right side of the chips are also stuck on the adhesive film, the two ejector pins are affected by the fact that the stress of the two ejector pins is different, the stress (F1) of the ejector pin close to the left side is smaller, the ejector pin close to the right side is affected by the chips on the right side, the stress (F2) is larger, and therefore, the stress of the left side and the right side of the chips is inconsistent when the chips are jacked,

When the acting forces of the two thimbles born by the chip are inconsistent, the left thimble is smaller in stress and the right thimble is larger in stress, so that the top mark corresponding to the left thimble on the chip is shallower, the top mark corresponding to the right thimble is deeper, the stress of the chip is uneven, cracking or hidden cracking is easy to occur, the hidden cracking is difficult to be found by the high-power micro-mirror, the chip can not find functional failure until the chip is used, and irrecoverable economic loss is caused.

Disclosure of utility model

The utility model aims to provide a thimble device, wherein the plurality of thimbles have the same ejection force during operation.

To achieve the purpose, the utility model adopts the following technical scheme:

The ejector pin device is used for ejecting the product from the bottom of the adhesive film with the product and comprises a first ejector component and a second ejector component, wherein the first ejector component and the second ejector component are arranged side by side along the horizontal direction and respectively comprise ejector pins, elastic pieces and a support which are sequentially connected from top to bottom;

The thimble is provided with a first position, a second position and a third position which are sequentially lowered along the height direction;

In an initial state, the thimble of the first jacking component is positioned at a first position, and the thimble of the second jacking component is positioned at a second position;

when the ejector pins of the first ejector component and the second ejector component are both positioned at the second position, the elastic piece of the first ejector component is compressed, and the elastic piece of the second ejector component is not compressed;

when the ejector pins of the first ejector component and the second ejector component are positioned at the third position, the elastic parts of the first ejector component and the second ejector component are compressed, and the acting forces of the elastic parts on the ejector pins of the first ejector component and the second ejector component are the same.

Preferably, the first ejector component is provided with a plurality of ejector pins, and the ejector pins of the plurality of first ejector components are sequentially lowered in the height direction along the direction close to the second ejector component.

Preferably, the device further comprises a base, and the support is adjustably mounted on the base in the vertical position.

Preferably, the base is provided with a receiving groove, and the support is mounted in the receiving groove.

Preferably, the support is screwed to the base.

Preferably, the device further comprises a driver, the support is connected to an output end of the driver, and the driver is configured to drive the support to move vertically.

Preferably, the adhesive film packaging device further comprises a carrier, wherein the top surface of the carrier is configured to bear the adhesive film with the product, and the first top moving component and the second top moving component are arranged on the lower side of the carrier.

Preferably, the device further comprises a guide die, wherein the guide die is provided with a needle penetrating hole, and the thimble penetrates through the needle penetrating hole.

Preferably, the stiffness coefficient of the elastic member of the first top moving assembly is K1, the stiffness coefficient of the elastic member of the second top moving assembly is K2, and K1 is smaller than K2;

in the initial state, the height difference value of the ejector pins of the first ejector component and the second ejector component is L0;

When the ejector pins of the first ejector component and the second ejector component are both positioned at the third position, the compression deformation of the elastic piece of the first ejector component is L1, the compression deformation of the elastic piece of the second ejector component is L2, L1 is larger than L2, the difference between L1 and L2 is equal to L0, and the product of L1 and K1 is equal to the product of L2 and K2.

Preferably, the support of the first jacking assembly is positioned higher than the support of the second jacking assembly in the height direction, or

The vertical length of the elastic piece of the first jacking component is greater than the vertical length of the elastic piece of the second jacking component.

The utility model has the beneficial effects that:

The initial height of the first jacking component is higher than that of the second jacking component, so that when the jacking product is lifted, the elastic piece of the first jacking component can store force earlier than the elastic piece of the second jacking component, and when the first jacking component and the second jacking component are jacking the product together, the stress of the product can be ensured to be consistent, and the cracking or hidden cracking risk of the product caused by inconsistent stress is effectively reduced.

Drawings

FIG. 1 is a front view of a first ejector assembly of an ejector pin assembly in a first position and a second ejector assembly in a second position;

FIG. 2 is a schematic view of a first ejector assembly of the ejector device according to the present utility model in a first position and a second ejector assembly in a second position;

FIG. 3 is a front view of a thimble assembly according to an embodiment of the present utility model, with the first and second thimble assemblies in a third position;

FIG. 4 is a schematic view of a structure of a thimble device according to an embodiment of the present utility model, in which the thimble of the first and second ejector assemblies are in the third position.

In the figure:

100. 200, adhesive film;

1. a thimble;

2. an elastic member;

3. A support;

4. A base 41, a containing groove;

5. An objective table;

6. And guiding the die.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar parts throughout, or parts having like or similar functions. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be interpreted broadly, as for example, they may be fixedly connected, or may be detachably connected, or may be electrically connected, or may be directly connected, or may be indirectly connected through an intermediary, or may be in communication with one another in two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present utility model, unless explicitly stated and limited otherwise, a first feature "above" or "below" a second feature may include the first feature and the second feature being in direct contact, or may include the first feature and the second feature not being in direct contact but being in contact by another feature therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.

As shown in fig. 1-4, the present utility model provides a thimble device, which is used for ejecting a product 100 from the bottom of a glue film 200 with the product 100, and comprises a first ejection assembly and a second ejection assembly, wherein the first ejection assembly and the second ejection assembly are arranged side by side along a horizontal direction, each of the first ejection assembly and the second ejection assembly comprises a thimble 1, an elastic member 2 and a support 3 which are sequentially connected from top to bottom, the thimble 1 has a first position, a second position and a third position which are sequentially lowered along a height direction, in an initial state, the thimble 1 of the first ejection assembly is in the first position, the thimble 1 of the second ejection assembly is in the second position, when the thimble 1 of the first ejection assembly and the thimble 1 of the second ejection assembly are both in the second position, the elastic member 2 of the first ejection assembly is compressed, and the elastic member 2 of the second ejection assembly is not compressed, and when the thimble 1 of the first ejection assembly and the second ejection assembly are both in the third position, the elastic member 2 of the first ejection assembly and the second ejection assembly is compressed, and the elastic member 2 of the first ejection assembly is stressed the same.

In the utility model, the initial height of the first jacking component is higher than that of the second jacking component, so that when the jacking product 100 is lifted, the elastic piece 2 of the first jacking component can store force earlier relative to the elastic piece 2 of the second jacking component, and when the product 100 is jacked together by the final first jacking component and the second jacking component, the stress of the product 100 can be ensured to be consistent, and the cracking or hidden cracking risk of the product 100 caused by inconsistent stress is effectively reduced.

In this embodiment, the product 100 is a chip, the elastic member 2 is a spring, the bottom end of the elastic member extends vertically, the top end of the elastic member is connected to the top surface of the support 3, the top end of the elastic member is connected to the bottom end of the ejector pin 1, and the product 100 is sucked by a suction head above the product 100 at the moment of being lifted by the ejector pins 1 of the first ejector assembly and the second ejector assembly, so that the product is peeled from the adhesive film 200.

In other embodiments, the product 100 may be a component such as a power amplifier module that is fixed on the adhesive film 200 after being packaged, and the elastic member 2 may be another elastic support such as a rubber rod.

In one embodiment, the first ejector components are provided in plurality, and the ejector pins 1 of the plurality of first ejector components are sequentially lowered in the height direction along the direction approaching the second ejector components. And the second jacking assemblies are used as references, and the jacking forces applied by the first jacking assemblies to the chip are the same, so that the chip is stressed at multiple points, and the chip is safer and more reliable. The first jacking assembly may be provided with two or three depending on the size of the product 100.

In another embodiment, the first top moving assembly is provided with one, one first top moving assembly is matched with one second top moving assembly, the structure is simpler, and the matching is more reliable.

Specifically, the thimble device also comprises a base 4, and the vertical position of the support 3 is adjustably arranged on the base 4. Through setting up base 4, can more reliably drive first top and move the subassembly and the lift of second top in step to support 3 vertical position on base 4 is adjustable, makes can be according to specific service conditions, adjusts support 3 for the position of base 4, guarantees that first top moves the thimble 1 of subassembly and second top and moves the subassembly and all is in when the third position, and first top moves the effort that thimble 1 that subassembly and second top moved the subassembly received the same.

More specifically, the base 4 is provided with a receiving groove 41, and the holder 3 is mounted in the receiving groove 41. By arranging the accommodating groove 41, the support 3 and the thimble 1 and the elastic piece 2 on the support 3 can be more reliably protected, an avoidance space can be provided for the floating of the thimble 1 and the elastic piece 2,

In one embodiment, the support 3 is screwed to the base 4. The arrangement enables the vertical position of the support 3 relative to the base 4 to be adjusted through the rotary support 3, is simple in matching structure and convenient to adjust and operate, and enables the height of the thimble 1 of the first jacking component and the height of the thimble 1 of the second jacking component to be independently adjusted.

The support 3 is specifically screwed to the bottom of the accommodating groove 41, and adjusts the vertical height based on the bottom of the accommodating groove 41.

In another embodiment, the ejector pin device further comprises a driver, the support 3 being connected to an output of the driver, the driver being configured to drive the support 3 to move vertically, each support 3 being configured with a driver, the supports 3 of the first and second ejector assemblies being independently adjustable. By the arrangement, manual operation is omitted, so that the vertical position of the support 3 is adjusted more efficiently, and the independent adjustment of the heights of the ejector pins 1 of the first ejector component and the second ejector component is realized.

The driver may be an electric push rod, an electric cylinder, etc., and is mounted at the bottom of the accommodating groove 41, with its output end facing upwards, and connected to the bottom of the support 3.

Specifically, the ejector pin device further includes an objective table 5, wherein the top surface of the objective table 5 is configured to carry the adhesive film 200 with the product 100, and the first ejector component and the second ejector component are disposed on the lower side of the objective table 5. By providing the stage 5, the adhesive film 200 with the product 100 can be supported more stably, so that the first jacking component and the second jacking component can be conveniently jacked.

More specifically, the thimble device further comprises a guide die 6, the guide die 6 is provided with a needle penetrating hole, and the thimble 1 penetrates through the needle penetrating hole. The guide die 6 guides and limits the thimble 1 through the needle penetrating hole, so that the thimble 1 can be lifted safely and reliably.

In this embodiment, the first top moving assembly and the second top moving assembly share a guiding mold 6, and the guiding mold 6 is closely attached to the bottom surface of the stage 5.

Specifically, the stiffness coefficient of the elastic member 2 of the first ejector component is K1, the stiffness coefficient of the elastic member 2 of the second ejector component is K2, K1 is smaller than K2, in an initial state, the height difference between the ejector pins 1 of the first ejector component and the second ejector component is L0, when the ejector pins 1 of the first ejector component and the second ejector component are both in the third position, the compression deformation amount of the elastic member 2 of the first ejector component is L1, the compression deformation amount of the elastic member 2 of the second ejector component is L2, L1 is greater than L2, the difference between L1 and L2 is equal to L0, and the product of L1 and K1 is equal to the product of L2 and K2. By the arrangement, the elastic pieces 2 with different stiffness coefficients are configured, so that when the first jacking component and the second jacking component jack the product 100, the stress consistency of the product 100 can be ensured.

More specifically, the support 3 of the first jacking assembly is positioned higher than the support 3 of the second jacking assembly in the height direction, or the vertical length of the elastic member 2 of the first jacking assembly is longer than the vertical length of the elastic member 2 of the second jacking assembly. In the above-mentioned setting, to the product 100 of different shape sizes, can be as required, through the difference in height of support 3 or the length difference of elastic component 2, realize the difference in height of the thimble 1 of first top movable assembly and second top movable assembly to reach the unanimous effect of product 100 atress, further reduce the product 100 fracture or the hidden risk that the atress is uneven to lead to.

Taking a first ejector component and a second ejector component as examples, the debugging process of the ejector pin device is described:

During debugging, the top mark diameters of the two corresponding thimble 1 on the test product 100 are tested.

If the left crown mark is smaller, the height of the support 3 is adjusted higher and/or the longer elastic element 2 is replaced and/or the elastic element 2 with a higher stiffness coefficient is replaced for the first left crown block.

If the left crown mark is bigger, the height of the support 3 is adjusted down and/or the shorter elastic member 2 is replaced and/or the elastic member 2 with smaller stiffness coefficient is replaced for the first left crown block.

And (3) completing debugging until the diameters of the two top marks are consistent.

At this time, the left and right sides of the product 100 are forced uniformly at the moment of being lifted.

It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims

1. The ejector pin device is characterized by comprising a first ejector pin assembly and a second ejector pin assembly, wherein the first ejector pin assembly and the second ejector pin assembly are arranged side by side along the horizontal direction and respectively comprise an ejector pin (1), an elastic piece (2) and a support (3) which are sequentially connected from top to bottom;

The thimble (1) is provided with a first position, a second position and a third position which are sequentially lowered along the height direction;

In an initial state, the thimble (1) of the first jacking component is positioned at a first position, and the thimble (1) of the second jacking component is positioned at a second position;

When the ejector pins (1) of the first ejector component and the second ejector component are both positioned at the second position, the elastic piece (2) of the first ejector component is compressed, and the elastic piece (2) of the second ejector component is not compressed;

When the ejector pins (1) of the first ejector component and the second ejector component are both positioned at the third position, the elastic pieces (2) of the first ejector component and the second ejector component are compressed, and the ejector pins (1) of the first ejector component and the second ejector component are subjected to the same acting force of the elastic pieces (2).

2. The ejector pin device according to claim 1, wherein the first ejector pin assembly is provided in plurality, and the ejector pins (1) of the plurality of first ejector pin assemblies are lowered in sequence in the height direction in a direction approaching the second ejector pin assembly.

3. The thimble device according to claim 1, further comprising a base (4), said support (3) being vertically position-adjustably mounted to said base (4).

4. A thimble device according to claim 3, wherein said seat (4) is provided with a housing groove (41), said seat (3) being mounted in said housing groove (41).

5. A thimble device according to claim 3, wherein said seat (3) is screwed to said seat (4).

6. A thimble device as claimed in claim 3, further comprising a driver, said seat (3) being connected to an output of said driver, said driver being configured to drive said seat (3) in a vertical movement.

7. The ejector pin device of claim 1, further comprising a stage (5), a top surface of the stage (5) being configured to carry the adhesive film (200) with the product (100), the first and second ejector components being disposed on an underside of the stage (5).

8. The thimble device according to claim 1, further comprising a guide die (6), said guide die (6) being provided with a needle penetration hole, said thimble (1) being penetrated in said needle penetration hole.

9. The ejector pin device of any one of claims 1-8, wherein the stiffness coefficient of the elastic member (2) of the first ejector assembly is K1, the stiffness coefficient of the elastic member (2) of the second ejector assembly is K2, K1 being smaller than K2;

In an initial state, the height difference of the ejector pins (1) of the first ejector component and the second ejector component is L0;

When the ejector pins (1) of the first ejector component and the second ejector component are both positioned at the third position, the compression deformation of the elastic piece (2) of the first ejector component is L1, the compression deformation of the elastic piece (2) of the second ejector component is L2, L1 is larger than L2, the difference between L1 and L2 is equal to L0, and the product of L1 and K1 is equal to the product of L2 and K2.

10. Ejector pin device according to claim 9, characterized in that the seat (3) of the first ejector assembly is located higher in height than the seat (3) of the second ejector assembly, or

The vertical length of the elastic piece (2) of the first jacking assembly is greater than the vertical length of the elastic piece (2) of the second jacking assembly.