CN222979992U

CN222979992U - Water-cooling radiator

Info

Publication number: CN222979992U
Application number: CN202421921633.1U
Authority: CN
Inventors: 赵凯
Original assignee: Mingkai Precision Technology Suzhou Co ltd
Current assignee: Mingkai Precision Technology Suzhou Co ltd
Priority date: 2024-08-09
Filing date: 2024-08-09
Publication date: 2025-06-13
Anticipated expiration: 2034-08-09

Abstract

The utility model relates to the technical field of radiators, in particular to a water-cooling radiator which comprises a radiating component, a water-cooling component and a liquid pump, wherein a water outlet copper pipe and a water supply copper pipe are arranged between the radiating component and the water-cooling component, the liquid pump is arranged on the water supply copper pipe, the radiating component comprises radiating fins, an aluminum base and a plurality of groups of copper pipes, the copper pipes of the plurality of groups are embedded at the bottom of the aluminum base at equal intervals, the bottom of the copper pipe is a plane, and the plane is flush with the aluminum base. Through the subassembly that radiator unit, water-cooling subassembly and liquid pump are constituteed, realize the use for electronic components such as treater, display card, provide a set of water-cooling formula radiator structure, can directly reach the electronic component position with the cooling water, make electronic component obtain better cooling treatment, realize initiatively cooling to the cooling water by semiconductor refrigeration structure and fin cooperation simultaneously, make the sustainable higher cooling effect that keeps of cooling water, make the stability of electronic component work better.

Description

Water-cooling radiator

Technical Field

The utility model relates to the technical field of radiators, in particular to a water-cooling radiator.

Background

The radiator is an indispensable component in the computer, ensures the stable operation of the electronic element through effective heat dissipation, prevents performance degradation or damage caused by overheat, and is an important auxiliary component of the processor and the display card.

The existing single fin or fan has low efficiency of cooling and radiating the electronic element, and can not actively cool and assist in cooling, so that the electronic element is difficult to work at a stable temperature under high-power operation, and the electronic element can better exert the performance thereof, therefore, the water-cooling radiator is provided for the use of electronic elements such as a processor, a display card and the like, the water-cooling radiator structure can directly send cooling water to the position of the electronic element, so that the electronic element can be better cooled, meanwhile, the semiconductor refrigeration structure and the fins are matched to actively cool the cooling water, the cooling water can continuously keep a higher cooling effect, and the electronic element can work more stably.

Disclosure of utility model

Aiming at the problems in the prior art, the utility model provides a water-cooling radiator which is used for electronic components such as a processor, a display card and the like, and provides a water-cooling radiator structure which can directly send cooling water to the position of the electronic component so that the electronic component can be better cooled, and meanwhile, the semiconductor refrigeration structure and the fins are matched to actively cool the cooling water so that the cooling water can continuously keep a higher cooling effect and the electronic component can work stably and better.

The technical scheme adopted by the utility model for solving the technical problems is that the water-cooling radiator comprises a radiating component, a water-cooling component and a liquid pump, wherein a water outlet copper pipe and a water supply copper pipe are arranged between the radiating component and the water-cooling component, and the liquid pump is arranged on the water supply copper pipe;

the heat dissipation assembly comprises heat dissipation fins, an aluminum base and a plurality of groups of copper pipes, wherein the copper pipes are embedded in the bottom of the aluminum base at equal intervals, the bottom of each copper pipe is a plane, and the plane is flush with the aluminum base.

Through adopting above-mentioned technical scheme, through the subassembly that radiator unit, water-cooling subassembly and liquid pump are constituteed, realize the use for electronic components such as treater, display card, provide a set of water-cooling formula radiator structure, can directly reach the electronic component position with the cooling water, make electronic component can obtain better cooling treatment, realize initiatively cooling to the cooling water by semiconductor refrigeration structure and fin cooperation simultaneously, make the sustainable higher cooling effect that keeps of cooling water, make the stability of electronic component work better.

Specifically, both ends of the copper pipe respectively penetrate through the tops of both ends of the radiating fins, one end of the copper pipe is a water outlet connector, and the other end of the copper pipe is a water inlet connector.

Specifically, the water cooling assembly comprises a lower aluminum plate, an upper aluminum plate and a U-shaped copper pipe, wherein the U-shaped copper pipe is embedded between the lower aluminum plate and the upper aluminum plate, the corner between the lower aluminum plate and the upper aluminum plate is fixed through bolts, and the water inlet end and the water outlet end of the U-shaped copper pipe penetrate out of the lower aluminum plate and the upper aluminum plate.

By adopting the technical scheme, the water cooling is carried out on the fin area through the water cooling assembly.

Specifically, go up aluminum plate top and inlay and be equipped with the semiconductor refrigeration piece, the refrigeration end and the last aluminum plate contact of semiconductor refrigeration piece, semiconductor refrigeration piece radiating end is provided with the exhaust fan, the casing of exhaust fan passes through the bolt and goes up aluminum plate installation.

By adopting the technical scheme, active refrigeration is realized through the semiconductor refrigeration piece, so that the cooling effect on the electronic element is improved.

Specifically, both ends of the water outlet copper pipe are respectively connected with the water outlet connector and the water inlet end of the U-shaped copper pipe, both ends of the water inlet copper pipe are respectively connected with the water inlet connector and the liquid outlet end of the liquid pump, and the liquid inlet end of the liquid pump is connected with the water outlet end of the U-shaped copper pipe.

And the U-shaped copper pipe, the water outlet copper pipe, the water supply copper pipe and the copper pipe are filled with cooling water.

By adopting the technical scheme, the cooling water circularly flows through the liquid pump.

The utility model has the beneficial effects that the components consisting of the heat dissipation component, the water cooling component and the liquid pump are used for electronic components such as a processor, a display card and the like, and the water cooling type radiator structure is provided, so that cooling water can be directly conveyed to the position of the electronic components, the electronic components can be better cooled, meanwhile, the semiconductor refrigeration structure and the fins are matched to actively cool the cooling water, so that the cooling water can continuously keep a higher cooling effect, the working stability of the electronic components is better, and the problems that the existing single fin or fan is low in cooling and heat dissipation of the electronic components, the electronic components cannot actively cool and assist in cooling, the electronic components are difficult to work at a stable temperature under high-power operation, and the electronic components can better exert the self performance are solved.

Drawings

The utility model will be further described with reference to the drawings and examples.

FIG. 1 is an overall schematic of the present utility model;

FIG. 2 is a schematic top view of a heat dissipating assembly according to the present utility model;

FIG. 3 is a schematic bottom view of a heat dissipating assembly according to the present utility model;

FIG. 4 is a schematic view of a water cooling assembly according to the present utility model;

1, a heat dissipation assembly; 11, radiating fins, 12, an aluminum base, 13, copper pipes, 14, a water outlet joint, 15, a water inlet joint, 16, a plane, 2, a water cooling assembly, 21, a lower aluminum plate, 22, an upper aluminum plate, 23, a U-shaped copper pipe, 24, a semiconductor refrigerating sheet, 25, an exhaust fan, 3, a water outlet copper pipe, 4, a water supply copper pipe, 5 and a liquid pump.

Detailed Description

The utility model is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In order to improve the cooling effect, as shown in fig. 1-4, the water-cooling radiator comprises a radiating component 1, a water-cooling component 2 and a liquid pump 5, wherein a water outlet copper pipe 3 and a water supply copper pipe 4 are arranged between the radiating component 1 and the water-cooling component 2, and the liquid pump 5 is arranged on the water supply copper pipe 4;

The heat dissipation assembly 1 comprises heat dissipation fins 11, an aluminum base 12 and a plurality of groups of copper pipes 13, wherein the copper pipes 13 are embedded at the bottom of the aluminum base 12 at equal distances, the bottom of the copper pipes 13 is a plane 16, and the plane 16 is flush with the aluminum base 12.

When the electronic component cooling device is used, the components consisting of the heat radiating component 1, the water cooling component 2 and the liquid pump 5 are used for electronic components such as a processor and a display card, the water cooling type radiator structure is provided, cooling water can be directly conveyed to the position of the electronic component, so that the electronic component can be better cooled, meanwhile, the semiconductor refrigeration structure and the fins are matched to actively cool the cooling water, the cooling water can continuously keep a higher cooling effect, and the electronic component can work stably and better.

The two ends of the copper pipe 13 respectively penetrate through the tops of the two ends of the radiating fin 11, one end of the copper pipe 13 is provided with a water outlet joint 14, and the other end is provided with a water inlet joint 15.

For water cooling, as shown in fig. 1 and 3, the water cooling assembly 2 further comprises a lower aluminum plate 21, an upper aluminum plate 22 and a U-shaped copper tube 23, wherein the U-shaped copper tube 23 is embedded between the lower aluminum plate 21 and the upper aluminum plate 22, the corners between the lower aluminum plate 21 and the upper aluminum plate 22 are fixed through bolts, and the water inlet end and the water outlet end of the U-shaped copper tube 23 penetrate through the outsides of the lower aluminum plate 21 and the upper aluminum plate 22.

In order to actively cool only, as shown in fig. 1-3, the utility model further includes, for example, that a semiconductor cooling plate 24 is embedded in the top of the upper aluminum plate 22, a cooling end of the semiconductor cooling plate 24 contacts with the upper aluminum plate 22, a cooling end of the semiconductor cooling plate 24 is provided with an air suction fan 25, and a casing of the air suction fan 25 is mounted with the upper aluminum plate 22 through bolts.

When the electronic component cooling device is used, the upper aluminum plate 22 contacted with the U-shaped copper pipe 23 is actively cooled through the semiconductor refrigerating piece 24, the heat dissipation end of the semiconductor refrigerating piece 24 is cooled by the air draft fan 25, so that cooling water passing through the U-shaped copper pipe 23 is refrigerated, and the copper pipe 13 can actively cool the electronic component after the cooling water passes through the copper pipe 13.

The two ends of the water outlet copper pipe 3 are respectively connected with the water outlet joint 14 and the water inlet end of the U-shaped copper pipe 23, the two ends of the water supply copper pipe 4 are respectively connected with the water inlet joint 15 and the liquid outlet end of the liquid pump 5, and the liquid inlet end of the liquid pump 5 is connected with the water outlet end of the U-shaped copper pipe 23.

The U-shaped copper pipe 23, the water outlet copper pipe 3, the water supply copper pipe 4 and the copper pipe 13 are filled with cooling water.

When the electronic device is used, the aluminum base 12 is covered on a processor or other electronic elements on a main board, the plane 16 at the bottom of the copper pipe 13 is in contact with the electronic elements, the two sides of the aluminum base 12 and the periphery of the water cooling assembly 2 are arranged on the main board or the frame through bolts, a power supply part in a use scene is used for supplying power to the electronic components, the copper pipe 13 is primarily cooled through the cooling fins 11, the liquid pump 5 works, cooling water in the U-shaped copper pipe 23 is pumped, negative pressure is formed in the water outlet copper pipe 3 and the copper pipe 13, cooling water circulates among the liquid pump 5, the water supply copper pipe 4, the copper pipe 13 and the water outlet copper pipe 3, so that the elements are further subjected to heat dissipation and cooling, the upper aluminum plate 22 in contact with the U-shaped copper pipe 23 is subjected to active cooling treatment through the semiconductor cooling plate 24, the cooling end of the semiconductor cooling plate 24 is cooled through the air draft fan 25, the copper pipe 13 can be subjected to active cooling on the electronic elements after the cooling water passes through the U-shaped copper pipe 23, the electronic elements can be kept at a stable temperature under the high load condition, and the electronic elements can be cooled, and the electronic elements can perform better self-cooling performance.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the foregoing examples, and that the foregoing description and description are merely illustrative of the principles of this utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The water-cooling type radiator is characterized by comprising a radiating component (1), a water-cooling component (2) and a liquid pump (5), wherein a water outlet copper pipe (3) and a water supply copper pipe (4) are arranged between the radiating component (1) and the water-cooling component (2), and the liquid pump (5) is arranged on the water supply copper pipe (4);

The heat dissipation assembly (1) comprises heat dissipation fins (11), an aluminum base (12) and a plurality of groups of copper pipes (13), wherein the copper pipes (13) are embedded in the bottom of the aluminum base (12) at equal distances, the bottom of each copper pipe (13) is a plane (16), and the planes (16) are flush with the aluminum base (12).

2. The water-cooled radiator according to claim 1, wherein two ends of the copper pipe (13) respectively penetrate through tops of two ends of the radiating fin (11), one end of the copper pipe (13) is a water outlet joint (14), and the other end of the copper pipe is a water inlet joint (15).

3. The water-cooled radiator according to claim 2, wherein the water-cooled assembly (2) comprises a lower aluminum plate (21), an upper aluminum plate (22) and a U-shaped copper tube (23), the U-shaped copper tube (23) is embedded between the lower aluminum plate (21) and the upper aluminum plate (22), corners between the lower aluminum plate (21) and the upper aluminum plate (22) are fixed through bolts, and a water inlet end and a water outlet end of the U-shaped copper tube (23) penetrate out of the lower aluminum plate (21) and the upper aluminum plate (22).

4. A water-cooled radiator according to claim 3, characterized in that a semiconductor refrigerating sheet (24) is embedded at the top of the upper aluminum plate (22), the refrigerating end of the semiconductor refrigerating sheet (24) is in contact with the upper aluminum plate (22), an exhaust fan (25) is arranged at the radiating end of the semiconductor refrigerating sheet (24), and a casing of the exhaust fan (25) is mounted with the upper aluminum plate (22) through bolts.

5. The water-cooled radiator according to claim 4, wherein two ends of the water outlet copper pipe (3) are respectively connected with the water outlet joint (14) and the water inlet end of the U-shaped copper pipe (23), two ends of the water supply copper pipe (4) are respectively connected with the water inlet joint (15) and the liquid outlet end of the liquid pump (5), and the liquid inlet end of the liquid pump (5) is connected with the water outlet end of the U-shaped copper pipe (23).

6. A water cooled radiator according to claim 5, wherein the U-shaped copper tube (23), the outlet copper tube (3), the feed copper tube (4) and the copper tube (13) are filled with cooling water.