CN222979990U - Water-cooling integrated heat dissipation device for computer - Google Patents
Water-cooling integrated heat dissipation device for computer Download PDFInfo
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- CN222979990U CN222979990U CN202421465160.9U CN202421465160U CN222979990U CN 222979990 U CN222979990 U CN 222979990U CN 202421465160 U CN202421465160 U CN 202421465160U CN 222979990 U CN222979990 U CN 222979990U
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Abstract
本实用新型公开了一种计算机用水冷一体散热装置，包括机箱，其特征在于：所述机箱顶部内安装有水箱，所述水箱底部设置有水管，所述水管底部设置有外壳，所述外壳内部开设有冷却腔，所述外壳正面安装有顶盖，所述冷却腔背面设置有散热板，所述机箱右侧安装有保护罩，所述保护罩内部设置有散热平台，所述散热平台内部开设有圆孔，所述圆孔内安装有风扇，所述散热平台正面设置有散热管，所述散热平台顶部设置有水泵箱，所述水泵箱底部和散热管连接。所述水泵箱顶部通过水管和水箱连接。通过将散热装置设置在机箱外部，机箱内空气处于内循环状态，隔绝了灰尘进入机箱，有效的防止因灰尘沉积对设备仪器产生干扰和破坏的情况发生。
The utility model discloses a water-cooled integrated heat dissipation device for a computer, comprising a chassis, characterized in that: a water tank is installed inside the top of the chassis, a water pipe is arranged at the bottom of the water tank, a shell is arranged at the bottom of the water pipe, a cooling cavity is provided inside the shell, a top cover is installed at the front of the shell, a heat sink is provided at the back of the cooling cavity, a protective cover is installed at the right side of the chassis, a heat dissipation platform is provided inside the protective cover, a circular hole is provided inside the heat dissipation platform, a fan is installed in the circular hole, a heat dissipation pipe is provided at the front of the heat dissipation platform, a water pump box is arranged at the top of the heat dissipation platform, and the bottom of the water pump box is connected to the heat dissipation pipe. The top of the water pump box is connected to the water tank through a water pipe. By arranging the heat dissipation device outside the chassis, the air inside the chassis is in an internal circulation state, dust is isolated from entering the chassis, and interference and damage to equipment and instruments due to dust deposition are effectively prevented.
Description
Technical Field
The utility model relates to the technical field of computer heat dissipation, in particular to a water cooling integrated heat dissipation device for a computer.
Background
In a common personal computer, two power consumption households often exist, one is a CPU, the other is a display card, high energy consumption naturally represents high heat generation, how to match a proper CPU radiator to form a heat-proof topic which is unchanged for many years, and a water-cooling integrated heat dissipation device is one of a plurality of heat dissipation modes, and the heat dissipation of the parts such as the CPU or the display card is realized through the cooperation of a water-cooling heat dissipation pipe and a fan.
In a conventional water-cooling integrated heat dissipation device, because of the cooperation of a heat dissipation pipe and a fan, the space is reduced for installation convenience, the fan is usually required to be installed on a side wall to realize air circulation inside and outside a case, and the fan falls on equipment, as in the prior art, CN207623903U is arranged, the high-efficiency heat dissipation device for the computer mainframe comprises a U-shaped base, a first metal dustproof net is fixed in the middle of an inner cavity of the U-shaped base, a heat dissipation fan is arranged below the first metal dustproof net, a case main body is arranged on the surface of the first metal dustproof net, a plurality of air inlet holes are uniformly formed in the bottom of the case main body at equal intervals, a snake-shaped cooling water pipe is installed on the side wall around the inner cavity of the case main body, a return pipe is fixed at the top of the inner cavity of the case main body, a plurality of heat absorption holes are uniformly formed in the return pipe, and the end part of the return pipe is connected with an exhaust fan through the exhaust pipe.
The other prior art is as follows:
CN218446601U computer water cooling structure
CN207623903U high-efficiency heat dissipation device for computer mainframe
After the scheme is used for realizing the radiating effect, external air dust easily enters the machine box through the circulation of the fan, and equipment in the machine box is easy to deposit dust after long-time use, and if the equipment is not cleaned, the equipment can be influenced.
Disclosure of utility model
The utility model aims to provide a water cooling integrated heat dissipation device for a computer, which is used for solving the problems in the background technology.
The water cooling integrated heat dissipation device for the computer comprises a case and is characterized in that a water tank is installed in the top of the case, a water pipe is arranged at the bottom of the water tank, a shell is arranged at the bottom of the water pipe, a cooling cavity is formed in the shell, a top cover is installed on the front surface of the shell, a heat dissipation plate is arranged on the back surface of the cooling cavity, a protection cover is installed on the right side of the case, a heat dissipation platform is arranged in the protection cover, a round hole is formed in the heat dissipation platform, a fan is installed in the round hole, a heat dissipation pipe is arranged on the front surface of the heat dissipation platform, a water pump box is arranged at the top of the heat dissipation platform, and the bottom of the water pump box is connected with the heat dissipation pipe. The top of the water pump box is connected with the water tank through a water pipe.
Preferably, the front surface of the heat dissipation plate is provided with heat dissipation fins, and the heat dissipation plate and the heat dissipation fins are made of copper or aluminum.
Preferably, a water pump is arranged in the water pump box.
Preferably, a rubber gasket is arranged between the heat dissipation plate and the shell, and the rubber gasket is watertight rubber.
Preferably, the four corners of the shell are provided with clamping claws.
Preferably, the surface of the water pipe is provided with a heat insulating material.
Preferably, the diameter of the radiating pipe is smaller than that of the water pipe.
Compared with the prior art, the utility model has the beneficial effects that:
1. This integrative heat abstractor of water cooling for computer through setting up heat abstractor outside the quick-witted case, and the air in the quick-witted case is in the inner loop state, has isolated dust entering machine case, and the effectual circumstances that produces interference and destruction to the equipment instrument because of the dust deposit takes place.
2. This integrative heat abstractor of water cooling for computer, heat is conducted to the coolant liquid in the cooling chamber on from the heating panel, in the final cooling tube that gets into along the water pipe, increases the ambient air through the fan and flows, reduces the coolant liquid temperature in the cooling tube to reach the purpose of cooling.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a cross-sectional view of the structure of the present utility model;
FIG. 3 is a partial schematic view of the structure of the present utility model.
The device comprises a case 1, a water tank 2, a water pipe 3, a shell 4, a top cover 5, a clamping jaw 6, a cooling cavity 7, a heat dissipation plate 8, a heat dissipation fin 9, a rubber pad 10, a water pump case 11, a water pump 12, a water pump 13, a heat dissipation pipe 14, a heat dissipation platform 15, a fan 16 and a protection cover.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to FIG. 1, the present utility model provides a technical scheme of a water cooling integrated heat dissipating device for a computer.
Wherein install water tank 2 in the quick-witted case 1 top, water tank 2 bottom is provided with water pipe 3, and water pipe 3 bottom is provided with shell 4, and cooling chamber 7 has been seted up to shell 4 inside, and top cap 5 is installed in shell 4 front, and the cooling chamber 7 back is provided with heating panel 8, and the heating panel front is provided with heat radiation fins 9, is provided with rubber pad 10 between heating panel 8 and the shell 4. The protection cover 16 is installed on the right side of the case 1, the heat dissipation platform 14 is arranged inside the protection cover 16, a round hole is formed in the heat dissipation platform 14, the fan 15 is installed in the round hole, the heat dissipation platform 14 is provided with the heat dissipation pipe 13 on the front face, the water pump box 11 is arranged at the top of the heat dissipation platform 14, and the bottom of the water pump box 11 is connected with the heat dissipation pipe 13. The top of the water pump box 11 is connected with the water tank 2 through the water pipe 3.
In this embodiment, the temperature is transferred into the cooling liquid in the cooling cavity 7 through the heat dissipation plate 8, the cooling liquid enters the water tank 2 along the water pipe 3, then enters the water pump box 11, finally enters the heat dissipation pipe 13, the air flow around the heat dissipation pipe 13 is quickened through the fan 15, the surrounding temperature is reduced, the heat in the cooling liquid is dissipated into the air, then returns to the water tank 2 through the water pump box 11, and finally returns to the cooling cavity 7.
Wherein the heat dissipation plate 8 and the heat dissipation fins 9 are made of copper or aluminum materials.
In this embodiment, copper has better heat conduction performance, while aluminum has lower cost and higher cost performance although the heat conduction is inferior.
Wherein, a water pump 12 is arranged in the water pump box 11.
In this embodiment, the rotation directions of the water pumps 12 in the two water pump boxes 11 are different, the left water pump is used for injecting cooling liquid into the radiating pipe, and the right water pump is used for pumping cooling liquid out of the radiating pipe.
Wherein the rubber pad 10 is watertight rubber.
In this embodiment, the rubber pad 10 plays a role of isolating the cooling liquid, preventing the cooling liquid from flowing out to damage the internal equipment, and is generally made of nitrile rubber, and note that the rubber cannot contain a material that can react with the cooling liquid.
Wherein, the four corners of the shell are provided with clamping claws 6.
In this embodiment, the claw 6 has a hole, and can pass through the fastener to attach the heat dissipation plate to the CPU.
Wherein the surface of the water pipe 3 is provided with a heat insulating material.
In this embodiment, the heat insulating material insulates heat from being dissipated, and prevents damage to surrounding equipment caused by high temperature.
Wherein the diameter of the radiating pipe 13 is smaller than that of the water pipe 3.
In this embodiment, the diameter of the radiating pipe 13 is reduced, so that the flow speed is reduced, the flowing time of the cooling liquid on the radiating platform 14 is longer, and the contact surface between the cooling liquid distributed and the wind blown by the fan 15 is larger, so that better heat dissipation is achieved.
The working principle is that the surface of a CPU is coated with silicone grease, a heat radiating plate is pressed on the CPU, a claw 6 is locked in a case 1 through a screw, when the CPU heats, the temperature is transferred into cooling liquid in a cooling cavity 7 through a heat radiating plate 8, a water pump in a water pump box 11 operates, so that the cooling liquid in the device starts to circulate internally, the cooling liquid in the cooling cavity 7 enters a water tank 2 along a water pipe 3 and then enters the water pump box 11, finally enters a heat radiating pipe 13, the air flow around the heat radiating pipe 13 is quickened through a fan 15, the ambient temperature is reduced, the heat in the cooling liquid is dissipated into the air, and returns to the water tank 2 through the water pump box 11 and finally returns to the cooling cavity 7, and the circulation is completed.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediary, or in communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421465160.9U CN222979990U (en) | 2024-06-25 | 2024-06-25 | Water-cooling integrated heat dissipation device for computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421465160.9U CN222979990U (en) | 2024-06-25 | 2024-06-25 | Water-cooling integrated heat dissipation device for computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222979990U true CN222979990U (en) | 2025-06-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421465160.9U Active CN222979990U (en) | 2024-06-25 | 2024-06-25 | Water-cooling integrated heat dissipation device for computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222979990U (en) |
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2024
- 2024-06-25 CN CN202421465160.9U patent/CN222979990U/en active Active
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