CN222967181U

CN222967181U - A magnetic carrier for SMT process and solder paste printing device using the same

Info

Publication number: CN222967181U
Application number: CN202421936756.2U
Authority: CN
Inventors: 张峰; 李能飞
Original assignee: Cixi Shunfa Electronics Co ltd
Current assignee: Cixi Shunfa Electronics Co ltd
Priority date: 2024-08-12
Filing date: 2024-08-12
Publication date: 2025-06-10
Anticipated expiration: 2034-08-12

Abstract

The application relates to the technical field of electronic assembly, in particular to a magnetic carrier for an SMT (surface mounting technology) process and a solder paste printing device applying the magnetic carrier. The magnetic carrier is applied to solder paste printing of FPC (flexible printed circuit) boards in an SMT (surface mount technology) process and comprises a carrier body, wherein magnetic pieces are arranged in the carrier body, a magnetic sheet is arranged on the surface of the carrier body, the middle of the magnetic sheet is hollowed to form a printing space, the edge of the FPC board is arranged between the magnetic sheet and the carrier body, and the FPC board is fixed on the carrier body through magnetic attraction between the magnetic sheet and the magnetic pieces. The magnetic carrier utilizes magnetic force to fix the FPC board on the carrier smoothly, effectively prevents the corner of the FPC board from swelling to cause various bad production processes, and simultaneously can greatly improve the production efficiency and reduce the labor operation cost and the material cost compared with the traditional mounting and fixing process.

Description

Magnetic carrier for SMT process and solder paste printing device using same

Technical Field

The application relates to the technical field of electronic assembly, in particular to a magnetic carrier for an SMT (surface mounting technology) process and a solder paste printing device applying the magnetic carrier.

Background

In the electronic field, SMT refers to surface mount technology (Surface Mount Technology). The technology is a very popular and stable mature technology in the electronic assembly industry, and is mainly used for mounting a pin-free or short-lead surface assembly component (SMC/SMD for short, chinese called a sheet component) on the surface of a printed circuit board or the surface of other substrates, and then performing welding assembly by a reflow soldering, wave soldering and other methods. SMT technology originated in the 60 s of the 20 th century and developed gradually with the advent of miniaturized electronic devices.

In the prior art, the SMT technology generally comprises the following steps of printing solder paste, placing parts, welding and fixing, checking, repairing and the like, wherein the action of the printing solder paste is important, and the mounting quality and the welding reliability of subsequent components are directly affected. With the development of technology, flexible printed circuit boards (Flexible Printed Circuit, abbreviated as FPCs) are increasingly used as substrates, and the FPCs are highly reliable and have excellent flexibility, which are made of polyimide or mylar as a substrate. Its main characteristics include high wiring density, light weight, thin thickness and good flexibility. These characteristics of FPC boards have led to its widespread use in a variety of electronic devices requiring high integration, thinness, and flexibility.

Because of the flexible characteristics of the FPC board, the thickness of the FPC board is usually thinner and only about 0.1mm, the FPC board is extremely easy to bulge in each SMT process, and the FPC board has great challenges on the yield of Cheng Pinzhi manufactured in each SMT process. The traditional methods generally adopt mechanical clamps or adhesives to fix the FPC board on the carrier, but because the FPC board is too thin, the methods often have the problems of easy bulge of corners, unstable fixation, complex operation and the like, so that the poor yield of the process is increased and the production efficiency is low. Meanwhile, the upper and lower sides of each FPC board are fixed by sticking a plurality of adhesive tapes, so that the manual operation efficiency is extremely low, and more serious, if a worker sticks the adhesive tapes off-site, the bonding pad positions of the board are covered, and scrapping is generated.

Disclosure of Invention

The application designs a magnetic carrier for SMT technology and a solder paste printing device using the same aiming at the defects of the prior art, the magnetic carrier utilizes magnetic force to fix the FPC board on the carrier smoothly, and effectively prevents various bad processes caused by the bulge of the corners of the FPC board.

The application provides a magnetic carrier for SMT technology, which is applied to tin paste printing of FPC (flexible printed circuit) boards in SMT technology, and comprises a carrier body, wherein magnetic pieces are arranged in the carrier body, a magnetic sheet is arranged on the surface of the carrier body, a printing space is formed by hollowing out the middle of the magnetic sheet, the edge of the FPC board is pressed between the magnetic sheet and the carrier body, and the FPC board is fixed on the carrier body through magnetic attraction between the magnetic sheet and the magnetic pieces. The magnetic carrier of the application stably fixes the flexible FPC board on the carrier by utilizing the magnetic attraction between the magnetic sheet and the magnetic piece, thereby eliminating the step of sticking the high-temperature adhesive tape to fix the FPC board and greatly improving the operation efficiency.

Further, in order to ensure that the attraction of the magnetic piece cannot attract components on the surface of the FPC board after the components are attached, a first safety distance is arranged between the edge of the magnetic piece and the components, and the first safety distance is more than or equal to 5mm.

Further, in order to prevent steps from occurring, the solder paste is coated excessively, poor welding occurs to the product, a second safety distance is arranged between the edge of the magnetic sheet and the position of the bonding pad, and the second safety distance is more than or equal to 3mm.

Further, in order to facilitate installation of the magnetic piece, a first counter bore is formed in one side, away from the FPC board, of the carrier body, and the magnetic piece is embedded into the first counter bore.

Furthermore, in order to facilitate the manufacture of the magnetic piece, the magnetic sheet is made of steel, and the thickness of the sheet piece is less than or equal to 0.1mm.

Further, in order to ensure the magnetic attraction effect, the magnetic pieces are arranged at the outer edge positions corresponding to the magnetic sheets.

Further, in order to reduce the manufacturing cost of the magnetic piece, the magnetic piece comprises a plurality of round magnets, and at least one row of magnets are arranged at intervals corresponding to the outer edge of the magnetic sheet.

Further, in order to facilitate positioning of the magnetic sheet, a second counter bore is formed in one side, facing the FPC board, of the carrier body, and the magnetic sheet is arranged in the second counter bore.

Further, in order to facilitate positioning of the FPC board on the carrier, the magnetic sheet is provided with a first positioning hole, and the FPC board is provided with a second positioning hole corresponding to the first positioning hole.

In a second aspect, the present application provides a solder paste printing device, which includes the magnetic carrier of the first aspect.

The beneficial effects of the application are as follows:

1. The swelling phenomenon caused by thinness and softness of the FPC board in the traditional tooling technology for fixing the FPC board by using the adhesive tape is improved, and the safety guarantee is improved for SMT common-procedure production;

2. The working efficiency of the workstation is effectively improved, and the manpower is liberated;

3. In the traditional FPC fixing process, the adhesive tape is disposable and cannot be recycled, so that waste is large.

Drawings

FIG. 1 is a schematic diagram showing the mating structure of the magnetic carrier and the FPC sheet according to some embodiments of the present application;

FIG. 2 is a schematic diagram of a carrier body of the magnetic carrier according to some embodiments of the application;

Fig. 3 illustrates a schematic structural view of a magnetic sheet in the magnetic carrier, according to some embodiments of the present application.

Detailed Description

The technical features and advantages of the present application are described in more detail below with reference to the accompanying drawings so that the advantages and features of the present application can be more easily understood by those skilled in the art, and thus the scope of the present application is more clearly and clearly defined.

It should be noted that, in the description of the present application, terms such as "upper," "lower," "left," "right," "inner," "outer," and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the apparatus or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.

The terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying an importance of the illustrated technical features.

In addition, it should be noted that, in the description of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, or may be directly connected, or may be indirectly connected through an intermediate medium, or may be in communication with the inside of two elements. The specific meaning of the above terms in the present application can be understood by those skilled in the art according to the specific circumstances.

Referring to fig. 1-3, an embodiment of the application provides a magnetic carrier applied to solder paste printing of an FPC board in an SMT process, comprising a carrier body 1, wherein a magnetic piece 3 is arranged inside the carrier body 1, a magnetic sheet 2 is arranged on the upper surface of the carrier body 1, a printed area 201 for solder paste printing is formed by hollowing out the middle of the magnetic sheet 2, an FPC board 4 is arranged between the carrier bodies 1, the magnetic sheet 2 just presses the edge position of the FPC board 4, and the FPC board 4 is flatly fixed on the carrier by utilizing the magnetic attraction between the magnetic piece 3 and the magnetic sheet 2, so that the precision and stability of solder paste printing of the FPC board 4 are effectively improved, the production efficiency is improved, and the manual operation cost is reduced.

Referring to fig. 2, the carrier body 1 as a support for the whole structure in this embodiment may be made of a high-strength synthetic stone material or an aluminum alloy material to ensure sufficient rigidity and stability.

In order to reduce the cost, the magnetic carrier of the present embodiment may be obtained by modifying the existing carrier. Specifically, a first counterbore 101 is formed on the surface of the carrier body 1 facing away from the FPC, and the magnetic member 3 is embedded into the first counterbore 101, so that the carrier can generate magnetic attraction to the magnetic sheet 2. In order to provide sufficient magnetic attraction, the embedding depth of the magnetic member 3, the volume of the magnetic member 3, and the like may be determined according to the thickness of the carrier body 1, the material, and the area of the magnetic sheet 2.

In order to facilitate positioning and mounting of the magnetic sheet 2, the upper surface of the carrier body 1 may be provided with a second counterbore 102, the size of the second counterbore 102 is matched with the outer edge size of the magnetic sheet 2, and positioning and mounting of the magnetic sheet 2 can be realized by embedding the magnetic sheet 2 into the second counterbore 102.

The magnetic member 3 is used for providing magnetic force, so that the magnetic member 3 generates magnetic attraction force to the magnetic sheet 2 and does not affect printing and assembly of the components 5 on the FPC board 4, the magnetic member 3 can be designed into an integral structure which is matched with the outer edge structure of the magnetic sheet 2 and has a certain width dimension, or a plurality of magnetic members 3 can be arranged at intervals according to the outer edge shape of the magnetic sheet 2 in order to reduce the manufacturing cost of the magnetic member 3. In this embodiment, a plurality of round neodymium-iron-boron magnets are uniformly arranged inside the carrier body 1 as the magnetic members 3, and the round magnets may be arranged in parallel in a plurality of rows to generate sufficient magnetic attraction force.

In this embodiment, in order to ensure that the magnetic attraction of the magnetic component 3 does not attract the component 5 on the surface of the FPC board 4 after mounting, a first safety distance D1 needs to be ensured between the magnetic component 3 and the component 5, and according to the actual application of the applicant, the first safety distance D1 is greater than or equal to 5mm.

Referring to fig. 3, the magnetic sheet 2 is used to cooperate with the magnetic member 3 to fix the FPC board 4, and the middle of the magnetic sheet 2 is hollowed out to form a printing space 201, and the size of the printing space 201 is determined according to the size of the printing area of the FPC board 4. The magnetic sheet 2 can paste the edge of the FPC board 4 on the carrier body 1, so that the smooth fixing of the FPC board 4 is realized, and the bulge phenomenon can not occur in each SMT process because the edges of the FPC board 4 are uniformly compacted on the carrier body 1, thereby effectively ensuring the production quality and the production efficiency.

The magnetic sheet 2 may be made of a magnetic steel material, and in order to prevent the occurrence of steps, the magnetic sheet 2 should be made as thin as possible, in this embodiment, the magnetic sheet 2 is made of a 0.06mm thick steel material, and further, the edge of the magnetic sheet 2 and the pad position of the FPC board 4 should be kept at the second safe distance D2, so as to prevent the solder paste from being coated excessively and causing a bad soldering phenomenon. Through the practical application of the applicant, the second safety distance D2 can be more than or equal to 3mm so as to fully ensure the printing quality of the solder paste.

In order to facilitate positioning of the FPC board 4, the magnetic sheet 2 may be provided with first positioning holes 202, the first positioning holes 202 may be disposed at four corners of the magnetic sheet 2, and the FPC board 4 may also be provided with corresponding second positioning holes, and when in installation, the first positioning holes 202 on the magnetic sheet 2 may be aligned with the corresponding second positioning holes on the FPC board 4.

The magnetic carrier of the present embodiment specifically comprises the following steps:

1. The manufacturing of the carrier body 1, namely, manufacturing the carrier body 1 by using a high-strength aluminum alloy material (or using the existing carrier), ensuring that the carrier body 1 has enough rigidity and stability, and forming a first counter bore 101 and a second counter bore 102 on the carrier body 1;

2. The magnetic piece 3 is arranged, wherein a plurality of round neodymium iron boron magnets are uniformly arranged in the first counter bore 101 of the carrier body 1 to serve as the magnetic piece 3 so as to generate enough magnetic attraction force;

3. the FPC board 4 is fixed, namely the edge of the FPC board 4 is lightly placed on the carrier body 1, so that the FPC board 4 is smooth and has no bulge;

4. The magnetic sheet 2 is installed, namely the magnetic sheet 2 is placed in the second counter bore 102 of the carrier body 1, the installation position of the FPC board 4 is adjusted through the first positioning hole 202 and the second positioning hole, automatic adsorption and fixation are realized through magnetic force, and the FPC board 4 is ensured to be fixed between the carrier body 1 and the magnetic sheet 2 in a flat and bulge-free manner;

5. And (3) solder paste printing, namely, using a solder paste printer to print the solder paste on the printing area of the FPC board 4, wherein the printing precision and stability are obviously improved because the FPC board 4 is firmly fixed.

Of course, the magnetic carrier can also be used for other procedures in the SMT process, such as procedures of part placement, welding and fixing, inspection, repair and the like, and can stably fix the FPC board on the carrier.

In the description of the present specification, reference to the terms "some implementations," "some embodiments," "exemplary," "example," "preferred," or "further" etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing description is only illustrative of the present application and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present application.

Claims

1. A magnetic carrier for SMT technology is applied to a solder paste printing process of FPC board in SMT technology and is characterized by comprising a carrier body, wherein a magnetic piece is arranged in the carrier body, a magnetic sheet is arranged on the surface of the carrier body, a printing space is formed by hollowing out the middle of the magnetic sheet, the edge of the FPC board is pressed between the magnetic sheet and the carrier body, and the FPC board is fixed on the carrier body through magnetic attraction between the magnetic sheet and the magnetic piece.

2. The magnetic carrier of claim 1, wherein a first safe distance is provided between the edge of the magnetic piece and the component, the first safe distance being greater than or equal to 5mm.

3. The magnetic carrier of claim 1, wherein a second safe distance is provided between an edge of the magnetic sheet and a bond pad location, the second safe distance being greater than or equal to 3mm.

4. The magnetic carrier of claim 1, wherein a side of the carrier body facing away from the FPC board is provided with a first counterbore, and the magnetic member is embedded in the first counterbore.

5. The magnetic carrier of claim 1, wherein the magnetic flakes are made of steel, and the magnetic flakes have a thickness of 0.1mm or less.

6. The magnetic carrier of claim 1, wherein the magnetic members are arranged corresponding to an outer edge shape of the magnetic flakes.

7. The magnetic carrier of claim 1, wherein the magnetic member comprises a plurality of circular magnets spaced apart from each other at positions corresponding to the outer edges of the magnetic sheet.

8. The magnetic carrier of claim 1, wherein a second counterbore is provided in a side of the carrier body facing the FPC board, the magnetic sheet being disposed in the second counterbore.

9. The magnetic carrier of claim 1, wherein the magnetic sheet has a first positioning hole, and the FPC board has a second positioning hole corresponding to the first positioning hole.

10. A solder paste printing apparatus comprising a magnetic carrier according to any one of claims 1 to 9.