CN222951769U

CN222951769U - Mounting device for CMOS on laser sensor

Info

Publication number: CN222951769U
Application number: CN202422055194.7U
Authority: CN
Inventors: 谢宜鹏; 奚星星; 王旭东
Original assignee: Suzhou Boe Sensing Technology Co ltd
Current assignee: Suzhou Boe Sensing Technology Co ltd
Priority date: 2024-08-23
Filing date: 2024-08-23
Publication date: 2025-06-06
Anticipated expiration: 2034-08-23

Abstract

The utility model discloses a CMOS installation device on a laser sensor, which belongs to the technical field of CMOS installation on a laser sensor. The installation device installs the CMOS on a sensor housing, and includes a positioning part, which positions and installs the sensor housing; a mounting part, which includes an adjustment platform and a clamping member, which clamps the CMOS, and the adjustment platform adjusts the clamping member to change the position of the CMOS on the sensor housing; and an optical test board, wherein the distance between the optical test board and the CMOS is adjustable to detect the installation position of the CMOS. The CMOS installation device on a laser sensor of the utility model can quickly install the CMOS on the sensor housing, and can perform real-time detection of the CMOS during the installation process to improve the installation accuracy of the CMOS. Compared with traditional manual operations, the installation efficiency of the CMOS is improved.

Description

Mounting device for CMOS on laser sensor

Technical Field

The utility model belongs to the technical field of CMOS (complementary metal oxide semiconductor) installation on a laser sensor, and particularly relates to an installation device of the CMOS on the laser sensor.

Background

CMOS belongs to one of the important parts on laser sensor, in the production and processing process of laser sensor, need install CMOS on the sensor housing accurately to guarantee the finished product sensor quality that forms, and at present to CMOS's installation processing, usually adopt manual mode to carry out, namely the operator manually installs CMOS on the sensor housing, detect the installation position of CMOS again after the installation is accomplished, if the precision is not enough then need disassemble, install again, this kind of installation mode can't detect the installation position of CMOS in real time in the installation, it is time-consuming laborious, inefficiency, still need disassemble it again when the installation problem appears.

Disclosure of utility model

The utility model overcomes the defects of the prior art and provides a CMOS mounting device on a laser sensor to solve the problems in the prior art.

The technical scheme of the utility model is that the CMOS mounting device for the laser sensor is used for mounting the CMOS on the sensor shell and comprises

The positioning part is used for positioning and mounting the sensor shell;

The mounting part comprises an adjusting carrier and a clamping piece, the clamping piece clamps the CMOS, and the adjusting carrier adjusts the clamping piece to change the position of the CMOS on the sensor shell;

And the distance between the optical test board and the CMOS is adjustable so as to detect the mounting position of the CMOS.

In a preferred embodiment of the present utility model, the present utility model further includes a base, and the positioning portion and the mounting portion are both disposed on the base.

In a preferred embodiment of the present utility model, a scale block is disposed on one side of the base, and the optical test board is mounted on the scale block and moves along the length direction of the scale block.

In a preferred embodiment of the present utility model, a guide rail is disposed on the scale block, and the optical test board is mounted on the guide rail through a sliding bracket.

In a preferred embodiment of the present utility model, the positioning portion includes a positioning table, a positioning block, and a positioning press pin, where an accommodating cavity is provided on the positioning table to accommodate the sensor housing, and the positioning block and the positioning press pin position and install the sensor housing located in the accommodating cavity.

In a preferred embodiment of the utility model, a negative pressure joint is arranged at the bottom of the positioning table, and the negative pressure joint is communicated with the accommodating cavity so as to position the sensor shell in the accommodating cavity at a negative pressure.

In a preferred embodiment of the present utility model, a filter is disposed at one side of the positioning table, and the filter is disposed parallel to the optical test board, so as to filter the CMOS.

In a preferred embodiment of the present utility model, the clamping member is a movable clamping jaw for clamping the CMOS.

The utility model solves the defects existing in the background technology, and has the following beneficial effects:

The CMOS mounting device on the laser sensor can rapidly mount the CMOS on the sensor shell, and can detect the CMOS in real time in the mounting process so as to improve the mounting precision of the CMOS.

Drawings

The utility model is further described below with reference to the drawings and examples;

FIG. 1 is a schematic view of the overall structure of a preferred embodiment of the present utility model;

FIG. 2 is a schematic view of a partial structure of a preferred embodiment of the present utility model;

FIG. 3 is a schematic view of a positioning portion according to a preferred embodiment of the present utility model;

10, a positioning part; 11, a positioning table, 111, a containing cavity, 12, a positioning block, 13, a positioning press pin, 20, a mounting part, 21, an adjusting carrier, 22, a clamping piece, 30, an optical test board, 40, a base, 50, a scale block, 51, a guide rail, 60, a sliding bracket, 70, a negative pressure joint, 80 and an optical filter.

Detailed Description

Various embodiments of the present utility model are disclosed in the following drawings, in which details are set forth in the following description for the sake of clarity. However, it should be understood that these physical details should not be used to limit the utility model. That is, in some embodiments of the present utility model, these physical details are not necessary. Moreover, for the purpose of simplifying the drawings, some conventional structures and components are shown in the drawings in a simplified schematic manner.

In addition, the descriptions of the "first," "second," and the like, herein are for descriptive purposes only and are not intended to be specifically construed as order or sequence, nor are they intended to limit the utility model solely for distinguishing between components or operations described in the same technical term, but are not to be construed as indicating or implying any relative importance or order of such features. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The embodiment provides a mounting device for a CMOS on a laser sensor, which is used for mounting the CMOS on a sensor shell, and the mounting device can be used for rapidly mounting the CMOS on the sensor shell, and can detect the CMOS in real time in the mounting process so as to improve the mounting precision of the CMOS.

As shown in fig. 1 to 3, the mounting device for CMOS on laser sensor of the present embodiment includes a positioning portion 10, a mounting portion 20 and an optical test board 30, the positioning portion 10 positions and mounts the sensor housing, the mounting portion 20 mounts the CMOS at a corresponding position of the sensor housing, and the optical test board 30 performs real-time optical detection on the CMOS so that the mounting portion 20 adjusts the position of the CMOS.

In this embodiment, the mounting device further includes a base 40, the positioning portion 10 and the mounting portion 20 are disposed on the base 40, a scale block 50 is disposed on one side of the base 40, the optical test board 30 is mounted on the scale block 50 and moves along the length direction of the scale block 50, the scale block 50 can rapidly determine the position of the optical test board 30, and the position of the optical test board 30 is changed to realize multi-position detection of the CMOS, thereby facilitating rapid and accurate mounting of the CMOS.

Specifically, the scale block 50 is provided with a guide rail 51, the optical test board 30 is mounted on the guide rail 51 through a sliding bracket 60, the optical test board 30 is close to or far away from the CMOS under the cooperation of the sliding bracket 60 and the guide rail 51, and the detection of the CMOS is realized by changing the distance between the optical test board 30 and the CMOS.

As shown in fig. 1 and 3, the positioning portion 10 of the present embodiment includes a positioning table 11, a positioning block 12 and a positioning press pin 13, where an accommodating cavity 111 is provided on the positioning table 11 to accommodate a sensor housing, the positioning block 12 and the positioning press pin 13 position and mount the sensor housing located in the accommodating cavity 111, the sensor housing is placed in the accommodating cavity 111 of the positioning table 11 in the present embodiment, the positioning block 12 and the positioning press pin 13 position the sensor housing, and the bottom of the positioning table 11 is provided with a negative pressure joint 70, the negative pressure joint 70 is communicated with the accommodating cavity 111 to position the sensor housing located in the accommodating cavity 111 under the negative pressure adsorption of the negative pressure joint 70, and under the positioning action of the positioning block 12 and the positioning press pin 13, the sensor housing is stably mounted in the accommodating cavity 111 so as to perform mounting processing on the CMOS, and the positioning press pin 13 in the present embodiment is provided with a buffer spring to realize the buffer positioning of the positioning press pin 13 on the CMOS.

In this embodiment, the mounting portion 20 includes an adjusting carrier 21 and a clamping member 22, the clamping member 22 clamps the CMOS, the adjusting carrier 21 adjusts the clamping member 22 to change the position of the CMOS on the sensor housing, the adjusting carrier 21 of this embodiment is composed of a plurality of adjusting blocks, each adjusting block is provided with an adjusting head, the adjusting head adjusts the adjusting blocks to change the position of the CMOS, and the mounting process of the CMOS on the sensor housing is completed, and the clamping member 22 adopted in this embodiment is a movable clamping jaw to clamp the CMOS.

Further, the optical filter 80 is disposed on one side of the positioning table 11 in the embodiment, and the optical filter 80 is disposed parallel to the optical test board 30, so that the CMOS can be filtered, and in the process of detecting the CMOS, the optical filter 80 can perform filtering processing, so that the CMOS can be stably detected, and the detection accuracy is improved.

In actual use, the mounting device of the embodiment is used for quickly and accurately mounting the CMOS on the sensor housing, the positioning part 10 can accurately position the sensor housing, the mounting part 20 can drive the CMOS to move, the CMOS is quickly mounted on the sensor housing, the detection part can detect the mounted CMOS so as to adjust the mounting position of the CMOS, the detection part can monitor the CMOS in real time, the mounting efficiency and the mounting precision of the CMOS can be effectively improved, and the consumption of manpower is reduced.

While the utility model has been described above with reference to various embodiments, it should be understood that many changes and modifications can be made without departing from the scope of the utility model. That is, the methods, systems, devices, etc. discussed above are examples. Various configurations may omit, replace, or add various procedures or components as appropriate. For example, in alternative configurations, the methods may be performed in a different order than described, and/or various stages may be added, omitted, and/or combined. Moreover, features described with respect to certain configurations may be combined in various other configurations. The different aspects and elements of the configuration may be combined in a similar manner. Furthermore, many elements are examples only as technology evolves and do not limit the scope of the disclosure or the claims.

Specific details are given in the description to provide a thorough understanding of exemplary configurations involving implementations. However, the configuration may be practiced without these specific details, e.g., well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary detail in order to avoid obscuring the configuration. This description provides only an example configuration and does not limit the scope, applicability, or configuration of the claims. Rather, the foregoing description of the configuration will provide those skilled in the art with an enabling description for implementing the described techniques. Various changes may be made in the function and arrangement of elements without departing from the spirit or scope of the disclosure.

Further, although each operation may describe the operation as a sequential process, many of the operations can be performed in parallel or concurrently. In addition, the order of operations may be rearranged. One process may have other steps. Furthermore, examples of methods may be implemented by hardware, software, firmware, middleware, code, hardware description language, or any combination thereof. When implemented in software, firmware, middleware or code, the program code or code segments to perform the necessary tasks may be stored in a non-transitory computer readable medium such as a storage medium and the described tasks are performed by a processor.

It is intended that the foregoing detailed description be regarded as illustrative rather than limiting, and that it be understood that it is the following claims, including all equivalents, that are intended to define the spirit and scope of this utility model. The above examples should be understood as illustrative only and not limiting the scope of the utility model. Various changes and modifications to the present utility model may be made by one skilled in the art after reading the teachings herein, and such equivalent changes and modifications are intended to fall within the scope of the utility model as defined in the appended claims.

Claims

1. A CMOS mounting device on a laser sensor, which mounts the CMOS on a sensor housing, characterized in that it includes:

A positioning portion (10), wherein the positioning portion (10) positions and installs the sensor housing;

A mounting part (20), the mounting part (20) comprising an adjustment platform (21) and a clamping member (22), the clamping member (22) clamps the CMOS, and the adjustment platform (21) adjusts the clamping member (22) to change the position of the CMOS on the sensor housing;

An optical test board (30) having an adjustable distance between the optical test board (30) and the CMOS so as to detect the installation position of the CMOS.

2. A CMOS mounting device on a laser sensor according to claim 1, characterized in that it also includes a base (40), and the positioning portion (10) and the mounting portion (20) are both arranged on the base (40).

3. A CMOS mounting device on a laser sensor according to claim 2, characterized in that a scale block (50) is provided on one side of the base (40), and the optical test board (30) is mounted on the scale block (50) and moves along the length direction of the scale block (50).

4. The installation device of CMOS on a laser sensor according to claim 3, characterized in that a guide rail (51) is provided on the scale block (50), and the optical test board (30) is installed on the guide rail (51) through a sliding bracket (60).

5. According to a CMOS installation device on a laser sensor as described in claim 1, it is characterized in that the positioning part (10) includes a positioning platform (11), a positioning block (12) and a positioning pin (13), and the positioning platform (11) is provided with a receiving cavity (111) to accommodate the sensor housing, and the positioning block (12) and the positioning pin (13) position and install the sensor housing located in the receiving cavity (111).

6. According to the installation device of CMOS on a laser sensor according to claim 5, it is characterized in that a negative pressure connector (70) is provided at the bottom of the positioning platform (11), and the negative pressure connector (70) is connected to the accommodating cavity (111) to negatively position the sensor housing located in the accommodating cavity (111).

7. A CMOS installation device on a laser sensor according to claim 5, characterized in that a filter (80) is provided on one side of the positioning platform (11), and the filter (80) is arranged in parallel with the optical test board (30) to filter the CMOS.

8. The device for mounting CMOS on a laser sensor according to claim 1, characterized in that the clamping member (22) is a movable clamping claw for clamping the CMOS.