CN222943089U - Copper precipitation solution filtration system and circuit board copper precipitation equipment - Google Patents

Abstract

The utility model discloses a copper deposition solution filtering system, including a cylinder body, a filtering assembly and a filter plate. The cylinder body has an upper cavity and a lower cavity that are interconnected, and the upper cavity is located above the lower cavity. The filtering assembly includes a pump body and a filtering device that are interconnected. The pump body is connected to the lower cavity, and the filtering device is connected to the upper cavity. The filtering device has a filter element that can filter small particle impurities. Among them, a filter plate is also provided in the cylinder body, and the filter plate is located between the upper cavity and the lower cavity, and the filter plate has a plurality of filter holes that can allow small particle impurities to pass through. In this way, small particle impurities can be isolated in the lower cavity, thereby reducing the risk of small particle impurities clogging the circuit board vias. Improve the copper deposition quality of the circuit board. In addition, the utility model also discloses a circuit board copper deposition device equipped with the above-mentioned copper deposition solution filtering system.

Description

Copper deposition solution filtration system and circuit board copper deposition equipment

Technical Field

The utility model relates to the technical field of circuit board processing, in particular to a copper deposition solution filtering system and circuit board copper deposition equipment.

Background Art

In the production process of circuit boards, a layer of copper film is deposited on the surface of the non-conductive substrate or the inner wall of the via through a chemical copper deposition process to facilitate the subsequent electroplating of the board surface, thereby realizing the subsequent formation of printed circuits through etching or realizing the interconnection between the inner and outer layers of multi-layer circuit boards.

Existing circuit board copper deposition equipment usually includes multiple main tanks of rectangular structure, and the main tanks contain copper deposition solution. When copper deposition is performed on the circuit board, the circuit board is loaded into the hanging basket, and then the hanging basket is transported to different main tanks for immersion by the overhead crane to finally achieve the purpose of copper deposition. In the copper deposition process, impurities such as copper powder, copper residue and powder chips brought by the printed circuit board substrate are inevitably present. These impurities not only accelerate the aging of the chemical copper deposition solution, but also small particles of impurities are easy to block the vias of the circuit board, seriously affecting the quality of the metallized coating on the surface of the circuit board. For this reason, the copper deposition solution usually needs to be filtered.

The existing copper deposition solution filtering system is shown in Figures 1 and 2. The copper deposition solution filtering system includes a main tank 700, a filter barrel 730, a pressure pump 720 and a sub-tank 710 which are sequentially connected through pipelines. The main tank 700 is used to hold the copper deposition solution to perform chemical copper deposition on the circuit board. The copper deposition solution in the main tank 700 flows into the sub-tank 710 by overflow, and then enters the filter barrel 730 for filtration through the pump body, and finally flows back to the main tank 700 from the upper part of the main tank 700. Although the copper deposition solution filtering system can filter impurities, a large amount of impurities will be deposited at the bottom of the main tank 700 during long-term use. When the circuit board is immersed in the bottom of the main tank 700, the small particle impurities at the bottom of the main tank 700 are easily lifted up and spread throughout the main tank 700 due to their light weight, which eventually leads to problems such as blockage of vias in the circuit board undergoing chemical copper deposition.

Utility Model Content

The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a copper deposition solution filtering system, which can reduce the risk of via blockage in a circuit board and improve the copper deposition quality of the circuit board.

The utility model also provides a circuit board copper deposition equipment with the copper deposition solution filtering system.

According to the copper plating solution filtering system of the embodiment of the utility model, it includes: a cylinder body, the cylinder body has an upper cavity and a lower cavity that are interconnected, the upper cavity is located above the lower cavity; a filtering component, including a pump body and a filtering device that are interconnected, the pump body is connected to the lower cavity, the filtering device is connected to the upper cavity, and the filtering device has a filter element inside that can filter small particle impurities; wherein a filter plate is also arranged in the cylinder body, the filter plate is located between the upper cavity and the lower cavity, and the filter plate has a plurality of filter holes that can allow small particle impurities to pass through.

The copper precipitation solution filtering system according to the embodiment of the utility model at least has the following

Beneficial effects:

In the copper plating solution filtering system of the embodiment of the utility model, the cylinder body is used to contain the copper plating solution. The cylinder body is divided into an upper cavity and a lower cavity, and a filter plate is arranged between the upper cavity and the lower cavity, and the filter plate has a plurality of filter holes for small particle impurities to pass through. Therefore, the small particle impurities can be isolated in the lower cavity. When copper plating is performed on the circuit board, the circuit board is immersed in the upper cavity. In this process, the small particle impurities in the lower cavity are blocked by the filter plate and are not easily lifted up and flow into the upper cavity, thereby reducing the risk of small particle impurities clogging the vias of the circuit board. In addition, by connecting the pump body with the lower cavity and connecting the filter device with the lower cavity, under the action of the pump body, the copper deposition solution and small particle impurities in the lower cavity can be transported to the filter device, and the small particle impurities in the copper deposition solution are filtered by the filter element in the filter device. The clean copper deposition solution after filtration is then transported back to the upper cavity, thereby being able to clean up the small particle impurities in the lower cavity in time, further ensuring the cleanliness of the copper deposition solution in the upper cavity, thereby further reducing the risk of via blockage in the circuit board during copper deposition, which is beneficial to improving the copper deposition quality of the circuit board.

According to some embodiments of the present invention, the lower portion of the upper cavity is a tapered cavity whose cross-sectional area gradually decreases from top to bottom.

According to some embodiments of the present invention, the pump body is communicated with the bottom of the lower cavity.

According to some embodiments of the utility model, the filter assembly also includes a spray part connected to the output end of the filter device, the spray part is provided with a plurality of spray holes connected to the filter device, the spray part is located in the upper cavity or above the upper cavity, and the filter device is connected to the upper cavity through the spray part.

According to some embodiments of the present invention, the spraying member is connected to a floating member, the floating member and the spraying member are both located in the upper cavity, and the floating member can rise and fall following the liquid level of the upper cavity.

According to some embodiments of the utility model, a telescopic tube is provided between the spray element and the filter device, one end of the telescopic tube is connected to the filter device, and the other end is connected to the spray element and connected to all the spray holes.

According to some embodiments of the present invention, the spray element is movably mounted on the inner side wall of the upper cavity and can reciprocate in the up and down directions relative to the upper cavity; and/or the floating element is movably mounted on the inner side wall of the upper cavity and can reciprocate in the up and down directions relative to the upper cavity.

According to some embodiments of the present invention, the number of the filter components is at least two groups, and all the spraying parts are arranged at intervals from each other.

According to some embodiments of the present invention, all the spraying parts are arranged at intervals along the circumference of the upper cavity.

According to the circuit board copper deposition equipment of the embodiment of the utility model, a copper deposition solution filtering system of any one of the above embodiments is provided.

The circuit board copper deposition equipment according to the embodiment of the utility model has at least the following beneficial effects:

In the circuit board copper deposition equipment of the embodiment of the utility model, by adopting the copper deposition solution filtering system of any of the above embodiments, the filter plate can isolate small particle impurities in the lower cavity, thereby reducing the risk of small particle impurities blocking the via holes of the circuit board. In addition, under the action of the pump body, the copper deposition solution and small particle impurities in the lower cavity can be transported to the filtering device, and the clean copper deposition solution after filtration is transported back to the upper cavity, thereby timely cleaning the small particle impurities in the lower cavity, further ensuring the cleanliness of the copper deposition solution in the upper cavity, thereby reducing the risk of via hole blockage in the circuit board, which is beneficial to improving the copper deposition quality of the circuit board.

Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

FIG1 is a schematic diagram of a copper precipitation solution filtration system in the prior art;

FIG2 is a top view of a copper deposition solution filtration system in the prior art;

FIG3 is a schematic diagram of a copper deposition solution filtering system according to an embodiment of the present invention;

FIG4 is a schematic diagram of a cylinder of a copper deposition solution filtering system according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a spray component of a copper plating solution filtering system according to an embodiment of the present utility model.

Reference numerals:

Cylinder body 100, upper cavity 110, conical cavity 111, lower cavity 120, pump body 200, filter device 300, filter plate 400, filter hole 410, spray part 500, spray hole 510, floating part 520, telescopic tube 530, connecting tube 600;

Main tank 700 , sub-tank 710 , pressure pump 720 , and filter barrel 730 .

DETAILED DESCRIPTION

The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

3 and 4, an embodiment of the utility model provides a copper precipitation solution filtering system, including a cylinder 100, a filter assembly and a filter plate 400, wherein the cylinder 100 has an upper cavity 110 and a lower cavity 120 that are interconnected, and the upper cavity 110 is located above the lower cavity 120. The filter assembly includes a pump body 200 and a filter device 300 that are interconnected, wherein the pump body 200 is connected to the lower cavity 120, and the filter device 300 is connected to the upper cavity 110, and the filter device 300 has a filter element capable of filtering small particle impurities inside. Among them, a filter plate 400 is also provided in the cylinder 100, and the filter plate 400 is located between the upper cavity 110 and the lower cavity 120, and the filter plate 400 has a plurality of filter holes 410 capable of allowing small particle impurities to pass through.

In the copper plating solution filtration system of the embodiment of the utility model, the cylinder body 100 is used to contain the copper plating solution. The cylinder body 100 is divided into an upper cavity 110 and a lower cavity 120, and a filter plate 400 is arranged between the upper cavity 110 and the lower cavity 120. The filter plate 400 has a plurality of filter holes 410 for small particle impurities to pass through. Therefore, the small particle impurities can be isolated in the lower cavity 120. When copper plating is performed on the circuit board, the circuit board is immersed in the upper cavity 110. In this process, the small particle impurities located in the lower cavity 120 are blocked by the filter plate 400 and are not easily lifted up and flow into the upper cavity 110, thereby reducing the risk of small particle impurities clogging the vias of the circuit board. In addition, referring to Figures 3 and 4, the direction of the arrow is the flow direction of the copper deposition solution. By connecting the pump body 200 with the lower cavity 120, and connecting the filter device 300 with the lower cavity 120, under the action of the pump body 200, the copper deposition solution and small particle impurities in the lower cavity 120 can be transported to the filter device 300, and the small particle impurities in the copper deposition solution are filtered by the filter element in the filter device 300. The clean copper deposition solution after filtration is then transported back to the upper cavity 110, thereby being able to clean up the small particle impurities in the lower cavity 120 in time, further ensuring the cleanliness of the copper deposition solution in the upper cavity 110, thereby further reducing the risk of via blockage in the circuit board during copper deposition, which is beneficial to improving the copper deposition quality of the circuit board.

In addition, by setting up a filter plate 400, the filter plate 400 has a plurality of filter holes 410 for small particle impurities to pass through, so that the small particle impurities generated during the copper plating process can flow into the lower cavity 120 through the filter holes 410, while the large particle impurities will be blocked by the filter plate 400 and deposited in the upper cavity 110. The large particle impurities are large in volume, so it is not easy to cause blockage to the via holes of the circuit board, and this structure can prevent large particle impurities from entering the filter assembly, thereby preventing large particle impurities from getting stuck in the pump body 200 or the filter device 300 and affecting the normal operation of the copper plating solution filtration system.

In some embodiments, the filter element can specifically adopt a filter cotton core, which can effectively adsorb small particle impurities in the copper deposition solution, so that the filter device 300 has better filtering ability, thereby making the copper deposition solution flowing back from the filter device 300 to the upper cavity 110 cleaner.

It is understandable that, in addition to the filter cotton core, the filter element may also be a filter particle or a filter screen, etc., and the present invention does not make any specific limitation on this.

3 and 4 , in some embodiments, the lower portion of the upper cavity 110 is a tapered cavity 111 whose cross-sectional area gradually decreases from top to bottom.

By adopting the above structure, the lower part of the upper cavity 110 is set as a conical cavity 111 that is larger at the top and smaller at the bottom, which is beneficial for guiding small particle impurities into the lower cavity 120. In addition, when the circuit board is immersed in the upper cavity 110 for copper deposition, this structure is also beneficial for preventing impurities from being lifted up and affecting the copper deposition process of the circuit board.

It can be understood that, referring to Figures 3 and 4, the upper part of the upper cavity 110 is a rectangular cavity connected to the conical cavity 111. When copper is deposited on the circuit board, the circuit board is immersed in the rectangular cavity housing. The setting of the rectangular cavity is conducive to placing the copper deposit into the upper cavity 110, which is convenient for copper deposition on the circuit board.

It can be understood that the lower part of the above-mentioned upper cavity 110 is a conical cavity 111 whose cross-sectional area gradually decreases from top to bottom, wherein the conical cavity 111 can specifically be conical, that is, the cross-section of the conical cavity 111 is circular, or, the conical cavity 111 can also be pyramidal, such as a triangular pyramid, a quadrangular pyramid, a pentagonal pyramid, etc. The utility model does not make any specific limitation on this, and it is only required that the cross-sectional area of the conical cavity 111 gradually decreases from top to bottom.

3 and 4, in some embodiments, the lower cavity 120 is also in a cone shape with a large top and a small bottom, which can facilitate the deposition and output of small particle impurities. It is understandable that the lower cavity 120 can also be in a cone or pyramid shape, which is not specifically limited by the present invention.

3 and 4 , in some embodiments, the pump body 200 is communicated with the bottom of the lower cavity 120 .

In the above structure, since small particle impurities are generally deposited at the bottom of the lower cavity 120, by connecting the pump body 200 with the bottom of the lower cavity 120, the small particle impurities in the lower cavity 120 can be better extracted and transported to the filter device 300 for filtration, which is conducive to more comprehensive removal of the small particle impurities in the lower cavity 120, and further reducing the risk of small particle impurities clogging the vias of the circuit board.

3 to 5 , in some embodiments, the filter assembly further includes a spray member 500 connected to the output end of the filter device 300, the spray member 500 is provided with a plurality of spray holes 510 communicated with the filter device 300, the spray member 500 is located in the upper cavity 110 or above the upper cavity 110, and the filter device 300 is communicated with the upper cavity 110 through the spray member 500.

In the above structure, by arranging a spray member 500 between the filter device 300 and the upper cavity 110, the copper deposition solution filtered and cleaned by the filter device 300 can be returned to the upper cavity 110 through multiple spray holes 510. Since the spray member 500 has multiple spray holes 510, the copper deposition solution filtered and cleaned can be returned to the upper cavity 110 more evenly, thereby making the concentration, activity, cleanliness and other properties of the copper deposition solution at various positions in the upper cavity 110 less different, which is beneficial to ensure that the thickness of the copper film formed by copper deposition at various positions of the same circuit board is relatively consistent, and further beneficial to ensure the copper deposition quality of the circuit board.

3 to 5 , in some embodiments, the spray member 500 is connected to a floating member 520 . Both the floating member 520 and the spray member 500 are located in the upper cavity 110 . The floating member 520 can rise and fall along with the liquid level of the upper cavity 110 .

By adopting the above structure, the spray member 500 is connected to the floating member 520, and the floating member 520 can drive the spray member 500 to rise and fall with the liquid level of the upper cavity 110, that is, a floating sprayer is adopted. Therefore, during the copper deposition process, it is not easy to cause the copper deposition solution sprayed by the spray member 500 to enter the lower cavity 120 due to the long distance between the spray member 500 and the liquid level of the copper deposition solution. The spray member 500 can always be in an absolute position state with the liquid level of the copper deposition solution. Therefore, there is no need to adjust the height of the spray member 500 according to the liquid level height, which is more convenient to use.

3 to 5 , in some embodiments, a telescopic tube 530 is provided between the spray element 500 and the filter device 300 , one end of the telescopic tube 530 is connected to the filter device 300 , and the other end is connected to the spray element 500 and connected to all the spray holes 510 .

In the above structure, since the liquid level of the copper plating solution in the upper cavity 110 will also change during the production process, a telescopic tube 530 is provided between the spray part 500 and the filter device 300, so that the height of the spray part 500 can change with the liquid level in the upper cavity 110, while the filter device 300 can maintain its position unchanged, thereby making the operation of the copper plating solution filtration system more stable.

It can be understood that the level of the spray member 500 should be higher than the level of the circuit board, so that the spray range of the spray member 500 can cover the circuit board as much as possible.

3 to 5 , in some embodiments, the telescopic tube 530 is installed on the inner wall of the upper cavity 110 , and the filtering device 300 is connected to the telescopic tube 530 through the connecting tube 600 , thereby further stabilizing the operation of the copper plating solution filtering system.

3 to 5 , in some embodiments, the spray member 500 and the floating member 520 are both movably mounted on the inner wall of the upper cavity 110 and can reciprocate in the up-and-down direction relative to the upper cavity 110 .

By adopting the above structure, the spray part 500 and the floating part 520 can be limited to prevent the floating part 520 from driving the spray part 500 to float arbitrarily in the upper cavity 110 when the copper deposition solution fluctuates; in addition, by movably installing the spray part 500 and the floating part 520 on the inner wall of the upper cavity 110, the circuit board can be placed in the middle of the upper cavity 110 for copper deposition, thereby avoiding interference and collision between the circuit board and the spray part 500 and the floating part 520, which is beneficial to ensure the smooth copper deposition of the circuit board.

It can be understood that since the floating part 520 is connected to the spray part 500, in order to limit the spray part 500 and the floating part 520, in addition to movably installing both the spray part 500 and the floating part 520 on the inner wall of the upper cavity 110, in some embodiments, only the spray part 500 can be movably installed on the inner wall of the upper cavity 110, or only the floating part 520 can be movably installed on the inner wall of the upper cavity 110, and the present invention does not make specific limitations on this.

It can be understood that the spray component 500 and/or the floating component 520 are movably installed on the inner wall of the upper cavity 110, wherein the spray component 500 and/or the floating component 520 can be directly adsorbed on the inner wall of the upper cavity 110, or the spray component 500 and/or the floating component 520 can also be movably installed on the inner wall of the upper cavity 110 through structures such as slide rails and slide grooves, and the present invention does not make specific limitations on this.

3 and 4 , in some embodiments, the number of filter assemblies is two groups, and the two spraying members 500 are arranged at an interval.

By adopting the above structure, the number of filtering components is set to two groups, that is, the small particle impurities of the copper deposition solution in the lower cavity 120 are filtered by two filtering devices 300, thereby improving the filtering efficiency of the copper deposition solution filtering system, making the copper deposition solution in the upper cavity 110 cleaner. In addition, by arranging the two spraying parts 500 at intervals, the clean copper deposition solution can be sprayed back into the upper cavity 110 from multiple directions, and the clean copper deposition solution can be distributed more evenly in the upper cavity 110, that is, the concentration, activity, cleanliness and other properties of the copper deposition solution at various positions in the upper cavity 110 are more consistent, which is conducive to ensuring that the thickness of the copper film formed by copper deposition at various positions of the same circuit board is relatively consistent, and thus is conducive to ensuring the copper deposition quality of the circuit board.

It is understandable that the two groups of filter components mentioned above are merely an exemplary illustration of FIG. 3 and FIG. 4 . In some embodiments, the number of filter components may be three, four, five or more groups, and the present invention does not impose any specific limitation on this.

3 and 4 , in some embodiments, all the spray elements 500 are arranged at intervals along the circumference of the upper cavity 110 .

By adopting the above structure, the clean copper plating solution can be sprayed from the side to the middle of the upper cavity 110. When copper plating, the circuit board is immersed in the upper cavity 110, so that the upper cavity 110 is located between all the spray parts 500, so that the clean copper plating solution sprayed by the spray parts 500 can cover the circuit board immersed in the upper cavity 110 in a larger range, which is beneficial to improving the copper plating quality of the circuit board.

It can be understood that, referring to Figures 3 and 4, there are two groups of filter components, and the two spray parts 500 are correspondingly distributed on the inner walls on both sides of the upper cavity 110. As a result, the clean copper plating solution can flow from both ends of the upper cavity 110 to the middle, so that the clean copper plating solution sprayed by the spray parts 500 can cover a larger range of the circuit board immersed in the upper cavity 110, which is beneficial to improving the copper plating quality of the circuit board.

An embodiment of the utility model further provides a circuit board copper deposition equipment, and the circuit board copper deposition equipment is provided with the copper deposition solution filtering system of any of the above embodiments.

In the copper deposition equipment for circuit boards of the embodiments of the utility model, by adopting the copper deposition solution filtering system of any of the above embodiments, the filter plate 400 can isolate small particle impurities in the lower cavity 120, thereby reducing the risk of small particle impurities blocking the vias of the circuit board. In addition, under the action of the pump body 200, the copper deposition solution and small particle impurities in the lower cavity 120 can be transported to the filtering device 300, and the clean copper deposition solution after filtration is then transported back to the upper cavity 110, thereby timely cleaning the small particle impurities in the lower cavity 120, further ensuring the cleanliness of the copper deposition solution in the upper cavity 110, thereby reducing the risk of via blockage in the circuit board, which is beneficial to improving the copper deposition quality of the circuit board.

The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims (10)

1. The copper precipitation solution filtration system is characterized by comprising:

The cylinder body (100), the cylinder body (100) is provided with an upper cavity (110) and a lower cavity (120) which are communicated with each other, and the upper cavity (110) is positioned above the lower cavity (120);

The filtering assembly comprises a pump body (200) and a filtering device (300) which are communicated with each other, the pump body (200) is communicated with the lower cavity (120), the filtering device (300) is communicated with the upper cavity (110), and a filtering piece capable of filtering small particle impurities is arranged inside the filtering device (300);

the cylinder body (100) is internally provided with a filter plate (400), the filter plate (400) is positioned between the upper cavity (110) and the lower cavity (120), and the filter plate (400) is provided with a plurality of filter holes (410) through which small particle impurities can pass.

2. The copper deposition solution filtration system as recited in claim 1, wherein a lower portion of the upper chamber (110) is a tapered chamber (111) having a cross-sectional area gradually decreasing from top to bottom.

3. The copper precipitation solution filtration system according to claim 2, wherein the pump body (200) is in communication with the bottom of the lower cavity (120).

4. The copper precipitation solution filtering system according to claim 1, wherein the filtering assembly further comprises a spraying member (500) connected to the output end of the filtering device (300), the spraying member (500) is provided with a plurality of spraying holes (510) communicated with the filtering device (300), the spraying member (500) is located in the upper cavity (110) or above the upper cavity (110), and the filtering device (300) is communicated with the upper cavity (110) through the spraying member (500).

5. The copper precipitation solution filtering system as recited in claim 4, wherein the spray member (500) is connected with a floating member (520), both the floating member (520) and the spray member (500) are located in the upper cavity (110), and the floating member (520) can be lifted and lowered along with the liquid level of the upper cavity (110).

6. The copper precipitation solution filtering system according to claim 5, wherein a telescopic tube (530) is provided between the spray member (500) and the filtering device (300), one end of the telescopic tube (530) is communicated with the filtering device (300), and the other end is connected to the spray member (500) and is communicated with all the spray holes (510).

7. The copper precipitation solution filtering system according to claim 6, wherein the spray member (500) is movably installed on an inner side wall of the upper chamber (110) and is capable of reciprocating in an up-down direction with respect to the upper chamber (110);

And/or the floating piece (520) is movably arranged on the inner side wall of the upper cavity (110) and can reciprocate along the up-down direction relative to the upper cavity (110).

8. The copper precipitation solution filtration system according to any of claims 4 to 7, wherein said filter assembly is in at least two groups, all of said spray members (500) being arranged at a distance from each other.

9. The copper precipitation solution filtration system according to claim 8, wherein all of said spray members (500) are circumferentially spaced along said upper cavity (110).

10. A circuit board copper deposition apparatus characterized in that a copper deposition solution filtration system according to any one of claims 1 to 9 is provided.