CN222939873U - Chip vacuum lamination device - Google Patents
Chip vacuum lamination device Download PDFInfo
- Publication number
- CN222939873U CN222939873U CN202421980637.7U CN202421980637U CN222939873U CN 222939873 U CN222939873 U CN 222939873U CN 202421980637 U CN202421980637 U CN 202421980637U CN 222939873 U CN222939873 U CN 222939873U
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- groove block
- sliding
- lower groove
- pressing
- face
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
本实用新型公开了一种芯片真空压膜装置，包括滑动台部，滑动台部包括基板和设置在基板上端面的滑动驱动件，滑动驱动件上设有用于压膜的负压下槽块件，基板的两端设有用于对负压下槽块件进行定位的限位件；压台部，压台部包括设置在基板上端面后端的支撑台和设置在支撑台上的上压槽件；优点：通过机械压膜，贴合紧密，提高了密封性，更加利于进行抽真空，且用于放置芯片的下槽块能够进行前后移动，能够从压台部的下方移出，方便将压膜完成后的芯片从下槽块上取出。
The utility model discloses a chip vacuum lamination device, comprising a sliding table portion, the sliding table portion comprising a substrate and a sliding driving member arranged on the upper end surface of the substrate, the sliding driving member being provided with a negative pressure lower groove block for lamination, and both ends of the substrate being provided with limit members for positioning the negative pressure lower groove block; a lamination portion, the lamination portion comprising a supporting table arranged at the rear end of the upper end surface of the substrate and an upper lamination groove member arranged on the supporting table; advantages: through mechanical lamination, the lamination is tightly fitted, the sealing is improved, and it is more conducive to vacuuming, and the lower groove block for placing the chip can move forward and backward and can be moved out from the bottom of the lamination portion, so that the chip after lamination is conveniently taken out from the lower groove block.
Description
Technical Field
The utility model relates to the technical field of laminating, in particular to a chip vacuum film pressing device.
Background
Film lamination generally refers to laminating a film to a substrate, and existing film lamination apparatuses generally position a film sheet and a substrate in a vacuum chamber portion, and then perform film lamination in a vacuum environment. CN212991052U discloses a vacuum film covering device for chip manufacture, which comprises a workbench, a film pressing frame and an air suction cavity, wherein the air suction cavity is formed in the workbench, the bottom of the air suction cavity is connected with a three-way valve through a thread groove, one end of the bottom of the three-way valve is connected with an electromagnetic valve through the thread groove, one end of the bottom of the workbench is provided with an air suction pump through a mounting frame, the top of the workbench is provided with a reserved groove, the bottom of the reserved groove is provided with a chip groove, and two sides of the chip groove are provided with a screen plate through mounting grooves. However, the above device has the following drawbacks in use:
1. The chip is placed in the chip groove of the workbench, the film laminating operation is carried out by manually moving down the film laminating frame, and the manual pressing tightness is low.
2. After the film pressing is finished, the film pressing frame is positioned above the workbench, and the chip is taken out, so that the operation is inconvenient.
Disclosure of utility model
The utility model aims to solve the technical problems that the existing laminating operation adopts manual pressing and sealing performance is low, and the operation is inconvenient when a chip is taken out after the lamination is completed, and provides a chip vacuum lamination device aiming at the problems, comprising
The sliding table part comprises a base plate and a sliding driving piece arranged on the upper end face of the base plate, a negative pressure lower groove block piece for film pressing is arranged on the sliding driving piece, and limiting pieces for positioning the negative pressure lower groove block piece are arranged at two ends of the base plate;
The pressing table part comprises a supporting table arranged at the rear end of the upper end face of the substrate and an upper pressing groove piece arranged on the supporting table.
According to the technical scheme, the lower groove block of the negative pressure lower groove block piece is connected with the sliding seat on the electric screw rod, so that the lower groove block can move forwards and backwards on the substrate, when film pressing is carried out, the electric screw rod drives the lower groove block to move to the position below the pressing table portion, after film pressing is finished, the electric screw rod drives the lower groove block to move out of the position below the pressing table portion, a chip after film pressing is conveniently taken out of the lower groove block, the pneumatic cylinder is arranged at the upper end of the supporting table, the telescopic end of the pneumatic cylinder is connected with the sliding plate through the connecting shaft, the upper groove block is arranged at the lower end face of the sliding plate, the pneumatic cylinder drives the sliding plate to move downwards, the upper groove block is tightly pressed on the lower groove block, and compared with traditional manual pressing, the pressing degree is higher, the sealing performance is better, and the vacuum pump is more beneficial to vacuumizing treatment.
According to the technical scheme, the sliding driving piece comprises an electric screw rod arranged in the middle of the upper end face of the base plate and positioning rods arranged on two sides of the upper end face of the base plate, the sliding seat is in threaded connection with the electric screw rod, the bottom face of the sliding seat is attached to the base plate, the sliding block is in sliding connection with the positioning rods, the electric screw rod drives the sliding seat to move forwards and backwards, and the sliding block is further used for assisting in preventing a structure connected with the sliding seat from shaking in moving to cause dislocation.
According to the technical scheme, the electric screw rod is parallel to the positioning rod, the positioning rod is identical to the electric screw rod in extending direction, and the device can normally operate.
According to the technical scheme, the negative pressure lower groove block piece comprises a lower groove block arranged on the upper surface of the sliding seat, the lower surfaces of the two sides of the lower groove block are connected with the sliding block, a groove for placing a chip is arranged in the lower groove block, a vacuum pump is arranged on the outer wall of one side of the lower groove block, the lower groove block slides on the sliding seat, so that film pressing is convenient to complete, the chip can be conveniently taken out after the film pressing is completed, and the vacuum pump is used for forming a vacuum environment.
According to the technical scheme, the limiting piece comprises the supporting frame, the supporting frame is arranged at the front end and the rear end of the upper end face of the substrate, the buffering limiter is arranged on the supporting frame and used for limiting the position, so that the negative pressure groove block piece and the upper groove pressing piece are aligned in the vertical direction, and the subsequent film pressing is conveniently finished.
According to the technical scheme, the supporting table comprises a plurality of supporting columns arranged on a substrate, the upper ends of all the supporting columns are connected with the bedplate, the sliding plate is slidably connected to the supporting columns, the supporting table is used for supporting the upper pressing groove part, the sliding plate can move up and down along the supporting columns, the upper pressing groove part is attached to the negative pressing groove block part, and a vacuum cavity is formed under the action of the vacuum pump.
For the optimization of the technical scheme of the utility model, the upper pressing groove part comprises a pneumatic cylinder arranged on the bedplate, a connecting shaft is arranged at the telescopic end of the pneumatic cylinder and is connected with the upper end surface of the sliding plate, an upper groove block is arranged at the lower end surface of the sliding plate, and the pneumatic cylinder is a driving part, so that the pneumatic cylinder can move up and down, and the upper groove block and the lower groove block are tightly attached under the action of the pneumatic cylinder.
Compared with the prior art, the utility model has the following beneficial effects:
According to the technical scheme, the lower groove block of the negative pressure lower groove block piece is connected with the sliding seat on the electric screw rod, so that the lower groove block can move forwards and backwards on the substrate, when film pressing is carried out, the electric screw rod drives the lower groove block to move to the position below the pressing table portion, after film pressing is finished, the electric screw rod drives the lower groove block to move out of the position below the pressing table portion, a chip after film pressing is conveniently taken out of the lower groove block, the pneumatic cylinder is arranged at the upper end of the supporting table, the telescopic end of the pneumatic cylinder is connected with the sliding plate through the connecting shaft, the upper groove block is arranged at the lower end face of the sliding plate, the pneumatic cylinder drives the sliding plate to move downwards, the upper groove block is tightly pressed on the lower groove block, and compared with traditional manual pressing, the pressing degree is higher, the sealing performance is better, and the vacuum pump is more beneficial to vacuumizing treatment.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic perspective view of a sliding table portion according to the present utility model;
FIG. 3 is a schematic perspective view of a platen portion according to the present utility model;
The device comprises a 100-sliding table part, a 110-base plate, a 120-sliding driving assembly, a 121-electric screw rod, a 122-positioning rod, a 123-sliding block, a 130-negative pressure lower groove block piece, a 131-lower groove block, a 132-groove position, a 133-vacuum pump, a 140-limiting piece, a 141-supporting frame, a 142-buffering limiter, a 200-pressing table part, a 210-supporting table, a 211-supporting column, a 212-platen, a 213-sliding plate, a 220-upper groove block piece, a 221-pneumatic cylinder, a 222-connecting shaft and a 223-upper groove block.
Detailed Description
The following describes the technical solution in the embodiment of the present utility model in detail with reference to fig. 1 to 3 in the embodiment of the present utility model.
Example 1
As shown in fig. 1-3, the present utility model is a chip vacuum film pressing apparatus, comprising:
The sliding table part 100, the sliding table part 100 comprises a base plate 110 and a sliding driving piece 120 arranged on the upper end surface of the base plate 110, a negative pressure groove block piece 130 for film pressing is arranged on the sliding driving piece 120, and limiting pieces 140 for positioning the negative pressure groove block piece 130 are arranged at two ends of the base plate 110;
The platen 200, the platen 200 includes a support table 210 fixedly provided at one end of an upper end of the substrate 110 and an upper pressing groove 220 mounted on the support table 210.
As shown in fig. 2, the sliding driving member 120 includes an electric screw rod 121, the electric screw rod 121 is fixedly installed in the middle of the upper end surface of the base plate 110, positioning rods 122 are provided at both sides of the electric screw rod 121, and the positioning rods 122 are parallel to the electric screw rod 121 and fixedly installed at both sides of the upper end surface of the base plate 110.
The electric screw 121 is connected with the sliding seat through threads, the bottom surface of the sliding seat is attached to the base plate 110, so that when the electric screw 121 is started, the sliding seat moves on the electric screw 121, and the sliding block 123 is slidably connected to the positioning rod 122.
The negative pressure lower groove block 130 comprises a lower groove block 131, the lower groove block 131 is fixedly arranged on a sliding seat on the electric screw rod 121, two side bottoms of the lower groove block 131 are fixedly connected with the sliding block 123, the lower groove block 131 is in a box shape without a cover, a platform is formed by protruding the middle of the lower groove block, the upper end face of the platform is inwards concave to form a groove 132 for placing a chip, a vacuum pump 133 is fixedly arranged on the side wall of the lower groove block 131, and the vacuum pump 133 vacuumizes the inside of the lower groove block 131 to form negative pressure when film pressing is performed.
After the electric screw rod 121 is started, the lower groove block 131 moves along with the sliding seat, the sliding block 123 further assists in moving, shaking is prevented, when film pressing is carried out, the electric screw rod 121 drives the lower groove block 131 to move to the lower side of the pressing table portion 200, after film pressing is finished, the electric screw rod 121 drives the lower groove block 131 to move out from the lower side of the pressing table portion 200, and chips after film pressing is finished are conveniently taken out from the lower groove block 131.
The limiting member 140 includes a supporting frame 141, the supporting frame 141 is fixedly mounted at the front end and the rear end of the upper end surface of the substrate 110, the buffering limiter 142 is fixedly mounted on the supporting frame 141, the buffering limiter 142 can limit the lower groove block 131 during moving, the limiting member 140 at the rear end can align with the upper groove block 223 when the lower groove block 131 moves to the lower part of the upper groove block 220, the film pressing operation can be conveniently completed, the limiting member 140 at the front end can enable the lower groove block 131 which completes the film pressing to move to the outermost side, and the chip can be conveniently taken out.
As shown in fig. 3, the support table 210 includes a platen 212, a support 211 is fixedly supported around the bottom of the platen 212 by welding, the bottom of the support column 211 is fixedly mounted at the rear end of the substrate 110 by welding, and the periphery of the slide plate 213 passes through the support column 211 and can move up and down in the vertical direction.
The upper pressing groove 220 comprises a pneumatic cylinder 221, a fixed end of the pneumatic cylinder 221 is mounted on the platen 212, a telescopic end of the pneumatic cylinder 221 is fixedly connected with a connecting shaft 222, the connecting shaft 222 is fixedly connected with the upper end face of the sliding plate 213, the sliding plate 213 can be driven to move up and down under the action of the pneumatic cylinder 221, and an upper groove block 223 is fixedly mounted on the lower end face of the sliding plate 213.
When the negative pressure depression block 130 moves to the rear end under the action of the sliding driving piece 120 until the negative pressure depression block 130 is attached to the limit piece 140 at the rear end, the lower groove block 131 of the negative pressure depression block 130 is located under the upper groove block 223 of the upper pressure depression block 220, and under the action of the pneumatic cylinder 221, the sliding plate 213 moves downwards to press the upper groove block 223 on the lower groove block 131, so that the upper groove block is tightly attached.
The application method of the chip vacuum film pressing device of the embodiment is as follows:
Firstly, the electric screw rod 121 is started to drive the negative pressure lower groove block 130 to move forwards until the negative pressure lower groove block 130 is attached to the limiting piece 140 at the front end, a chip is placed on the groove position 132 in the lower groove block 131 of the negative pressure lower groove block 130, then the electric screw rod 121 is started again to drive the negative pressure lower groove block 130 to move backwards until the negative pressure lower groove block 130 is attached to the limiting piece 140 at the rear end, at the moment, the lower groove block 131 of the negative pressure lower groove block 130 is positioned under the upper groove block 223 of the upper groove block 220, then the pneumatic cylinder 221 is started to enable the upper groove block 223 to move downwards and attach tightly to the lower groove block 131, and then the vacuum pump 133 is started to perform vacuumizing treatment between the upper groove block 223 and the lower groove block 131.
After the vacuum film pressing is completed, the vacuum pump 133 is turned off, air is injected to restore the air pressure to be normal, the air cylinder 221 is started to move the upper groove block 223 upwards, and the electric screw rod 121 is started to move the lower groove block 131 forwards, so that the film pressed chip can be taken out conveniently.
The above embodiments are only for illustrating the technical idea of the present utility model, and the protection scope of the present utility model is not limited thereto, and any modification made on the basis of the technical scheme according to the technical idea of the present utility model falls within the protection scope of the present utility model.
Claims (7)
1. A chip vacuum film pressing device is characterized by comprising
The sliding table part (100), the sliding table part (100) comprises a base plate (110) and a sliding driving piece (120) arranged on the upper end face of the base plate (110), a negative pressure lower groove block piece (130) for film pressing is arranged on the sliding driving piece (120), and limiting pieces (140) for positioning the negative pressure lower groove block piece (130) are arranged at two ends of the base plate (110);
The pressing table part (200), the pressing table part (200) comprises a supporting table (210) arranged at the rear end of the upper end face of the substrate (110) and an upper pressing groove piece (220) arranged on the supporting table (210).
2. The vacuum die pressing device of claim 1, wherein the sliding driving part (120) comprises an electric screw rod (121) arranged in the middle of the upper end face of the base plate (110) and positioning rods (122) arranged on two sides of the upper end face of the base plate (110), the sliding seat is in threaded connection with the electric screw rod (121), the bottom face of the sliding seat is attached to the base plate (110), and the sliding block (123) is in sliding connection with the positioning rods (122).
3. A chip vacuum film pressing device according to claim 2, wherein the electric screw rod (121) is parallel to the positioning rod (122).
4. The vacuum die pressing device for chips of claim 2, wherein the negative pressure lower groove block (130) comprises a lower groove block (131) arranged on the upper surface of the sliding seat, the lower surfaces of two sides of the lower groove block (131) are connected with the sliding block (123), a groove (132) for placing chips is arranged in the lower groove block (131), and a vacuum pump (133) is arranged on the outer wall of one side of the lower groove block (131).
5. The vacuum die assembly as claimed in claim 1, wherein the limiting member (140) comprises a supporting frame (141), the supporting frame (141) is disposed at front and rear ends of the upper end surface of the substrate (110), and the supporting frame (141) is provided with a buffer limiter (142).
6. The vacuum die assembly of claim 1, wherein the support base (210) comprises a plurality of support columns (211) disposed on the substrate (110), wherein the upper ends of all the support columns (211) are connected with the platen (212), and the slide plate (213) is slidably connected to the support columns (211).
7. The vacuum die pressing device of claim 6, wherein the upper pressing groove part (220) comprises a pneumatic cylinder (221) arranged on the platen (212), a connecting shaft (222) is arranged at the telescopic end of the pneumatic cylinder (221), the connecting shaft (222) is connected with the upper end face of the sliding plate (213), and an upper groove block (223) is arranged at the lower end face of the sliding plate (213).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421980637.7U CN222939873U (en) | 2024-08-15 | 2024-08-15 | Chip vacuum lamination device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421980637.7U CN222939873U (en) | 2024-08-15 | 2024-08-15 | Chip vacuum lamination device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222939873U true CN222939873U (en) | 2025-06-03 |
Family
ID=95837973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421980637.7U Active CN222939873U (en) | 2024-08-15 | 2024-08-15 | Chip vacuum lamination device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222939873U (en) |
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2024
- 2024-08-15 CN CN202421980637.7U patent/CN222939873U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |