CN222939455U

CN222939455U - Laptop computer radiator

Info

Publication number: CN222939455U
Application number: CN202421991482.7U
Authority: CN
Inventors: 马保军; 张治宇; 杨文山; 王武
Original assignee: Shenzhen Yigao Digital Technology Co ltd
Current assignee: Shenzhen Yigao Digital Technology Co ltd
Priority date: 2024-08-16
Filing date: 2024-08-16
Publication date: 2025-06-03
Anticipated expiration: 2034-08-16

Abstract

The utility model discloses a notebook computer radiator, which is provided with a heating device, wherein the notebook computer radiator comprises a heat conduction component and a fan mounting frame, the heat conduction component covers the heating device, the fan mounting frame is connected with the heat conduction component, radiating fins are arranged on the heat conduction component, a radiating fan is arranged on the fan mounting frame, an air inlet hole and a first air outlet hole are arranged on the fan mounting frame, the radiating fins are connected with the first air outlet hole, a second air outlet hole is arranged on one side, close to the heating device, of the fan mounting frame, and wind blown by the radiating fan can pass through the second air outlet hole and then blow to the heating device. According to the utility model, the second air outlet is formed in the fan mounting frame, so that air blown out by the cooling fan can be directly blown onto the heating device, heat dissipation of the heating device is accelerated, heat dissipation efficiency can be effectively improved, and the use requirement of high-performance products is met.

Description

Notebook computer radiator

Technical Field

The utility model relates to the technical field of computers, in particular to a radiator of a notebook computer.

Background

With miniaturization and high integration of chips, local heat flux density is greatly increased. The improvement of calculation power and speed brings huge power consumption and heat productivity, the problem of chip heating, and one of the main factors restricting the development of the high-calculation-power chip is heat dissipation capacity. At present, the whole consumer electronic chip industry actually goes into a strange circle with greatly improved performance and rapidly increased power consumption, and the trend of changing the performance with the power consumption is presented. The quality requirements of people on the notebook computer are higher and higher, the heat dissipation of the notebook computer is an important index, the heat dissipation performance affects the use feeling of people on one hand, and the loss speed of each part in the notebook computer can be accelerated due to the excessively high temperature on the other hand

The existing notebook computer radiator generally uses a heat conducting substrate to conduct heat, then the heat conducting substrate is subjected to heat dissipation through a fan, and the fan cannot directly blow to a heating device, so that the heat dissipation efficiency is lower.

Disclosure of utility model

In order to solve part or all of the problems in the prior art, the utility model provides a notebook computer radiator, which is provided with a heating device, wherein the notebook computer radiator comprises a heat conduction component and a fan mounting frame, the heat conduction component covers the heating device, the fan mounting frame is connected with the heat conduction component, a heat radiation fin is arranged on the heat conduction component, a heat radiation fan is arranged on the fan mounting frame, an air inlet hole and a first air outlet hole are arranged on the fan mounting frame, the heat radiation fin is connected with the first air outlet hole, a second air outlet hole is arranged on one side, close to the heating device, of the fan mounting frame, and wind energy blown by the heat radiation fan can pass through the second air outlet hole and then is blown to the heating device.

As a further improvement of the utility model, the notebook computer radiator further comprises a soaking plate, the soaking plate is covered on the heating device, the soaking plate is connected with the heat conduction component, and the air blown by the cooling fan can be blown to the soaking plate after passing through the second air outlet hole.

As a further improvement of the utility model, the fan mounting frame is provided with heat insulation cotton, the heat insulation cotton is arranged between the air inlet hole and the second air outlet hole, the heat insulation cotton is in sealing connection with the notebook computer, and the heat insulation cotton is used for preventing hot air on the heating device from being sucked into the cooling fan.

As a further improvement of the utility model, the heat conducting component comprises a heat conducting substrate and a heat conducting pipe, wherein the heat conducting substrate is covered on the heating device, one end of the heat conducting pipe is connected with the heat conducting substrate, and the other end of the heat conducting pipe is connected with the heat radiating fins.

As a further improvement of the utility model, the number of the fan mounting frames is two, and each fan mounting frame is provided with the heat dissipation fan.

Compared with the prior art, the utility model has the beneficial effects that:

the utility model not only reserves the function of radiating and cooling the radiating fins through the radiating fan, but also ensures that the wind blown out by the radiating fan can directly blow to the heating device after passing through the second air outlet hole by arranging the second air outlet hole on the fan mounting frame, thereby accelerating the radiating of the heating device, effectively improving the radiating efficiency and meeting the use requirement of high-performance products.

Drawings

In order to more clearly illustrate the utility model or the solutions of the prior art, a brief description will be given below of the drawings used in the description of the embodiments or the prior art, it being obvious that the drawings in the description below are some embodiments of the utility model and that other drawings can be obtained from them without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of the overall structure of an embodiment of the present utility model;

FIG. 2 is an exploded view of an embodiment of the present utility model.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs, the terms used in this description are for the purpose of describing particular embodiments only and are not intended to limit the utility model, and the terms "comprising" and "having" and any variations thereof in the description of the utility model and the claims and the above description of the drawings are intended to cover non-exclusive inclusions. The terms first, second and the like in the description and in the claims or in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order.

Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the utility model. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the described embodiments of the utility model may be combined with other embodiments.

In order to enable those skilled in the art to better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings.

1-2, A notebook computer radiator is provided, on which a heating device, such as a main board chip, is mounted, and is used for radiating and cooling the heating device, so as to prolong the service life of the heating device. The notebook computer radiator comprises a heat conduction component and a fan mounting frame 1, wherein the heat conduction component is covered on a heating device and used for guiding out heat generated by the operation of the heating device, the fan mounting frame 1 is fixedly connected with the heat conduction component, and the heat conduction component is provided with a heat radiation fin 2, so that the heat radiation area can be increased by arranging the heat radiation fin 2, and the heat radiation efficiency is improved. The cooling fan 3 is arranged on the fan mounting frame 1, the air inlet hole 11 and the first air outlet hole 12 are arranged on the fan mounting frame 1, the cooling fins 2 are connected with the first air outlet hole 12, and when the cooling fan 3 works, air can be sucked from the air inlet hole 11 and blown out towards the first air outlet hole 12. In this embodiment, the cooling fan 3 is a fan that blows air from two end faces to the side, the air intake holes 11 are respectively disposed on the front and rear end faces of the fan mounting frame 1, and the first air outlet hole 12 is disposed on the side edge of one side of the fan mounting frame 1.

When the notebook computer radiator works, heat generated by the working of a heating device is conducted to the radiating fins 2 through the heat conducting component, the radiating fan 3 works, air outside the air inlet 11 flows into the air inlet 11 and then is blown out to the radiating fins 2 through the first air outlet 12, the heat on the radiating fins 2 is taken away, the temperature of the radiating fins 2 is lowered, and the purpose of radiating the heating device is achieved along with the continuous working of the radiating fan 3.

The fan mounting bracket 1 is close to the one side of heating device and is equipped with second air outlet 13, and the wind that radiator fan 3 blown out can pass second air outlet 13 back and blow to the heating device. When the cooling fan 3 works, external air flows into the fan mounting frame 1 through the air inlet hole 11, a part of air is blown out through the first air outlet hole 12 to cool the cooling fins 2, and another part of air is blown out through the second air outlet hole 13 to the heating device, so that the heating device is directly blown, and the purpose of cooling the heating device is achieved.

This notebook computer radiator has not only kept the function of cooling down through radiator fan 3 to radiator fin 2, through set up second apopore 13 on fan mounting bracket 1 moreover for the wind energy that radiator fan 3 blew out can directly blow on the device that generates heat, thereby accelerates to generate heat the device and dispels the heat, can effectively improve radiating efficiency, satisfies the user demand of high performance product.

In order to further improve the heat dissipation performance, the notebook computer radiator further comprises a soaking plate 4, the soaking plate 4 can be any one of the existing soaking plates, the heat conductivity coefficient of the soaking plate is far greater than that of a common copper plate, the soaking plate 4 is covered on a heating device, the soaking plate 4 is connected with a heat conducting component, and air blown by the heat dissipation fan 3 can be blown to the soaking plate 4 after passing through a second air outlet hole 13. When the heat dissipation device works, heat generated by the heat dissipation device is conducted to the soaking plate 4, then conducted to the heat dissipation component through the soaking plate 4, and further conducted to the heat dissipation fins 2. The heat on the heating device can be conducted to the radiating fins 2 faster by arranging the vapor chamber 4, the radiating area is increased, and the radiating efficiency is improved, and the air blown by the radiating fan 3 can be directly blown to the vapor chamber 4 through the second air outlet 13, so that the radiating efficiency is further improved.

In order to prevent hot air on the heating device from being sucked by the cooling fan 3, the fan mounting frame 1 is provided with heat insulation cotton 5, the heat insulation cotton 5 is arranged between the air inlet 11 and the second air outlet 13, the heat insulation cotton 5 is in sealing connection with the notebook computer, and the heat insulation cotton 5 is used for preventing the hot air on the heating device from being sucked to the cooling fan 3. Through setting up thermal-insulated cotton 5 for fresh air inlet 11 and second apopore 13 keep apart each other, avoid the wind that second apopore 13 blown out to flow into fan mounting bracket 1 through fresh air inlet 11 again in, make hot-blast and cold wind can realize keeping apart, ensure that the wind that radiator fan 3 blown out is cold wind all the time, promote heat dispersion stability.

The heat conduction assembly comprises a heat conduction substrate 6 and a heat conduction pipe 7, wherein the heat conduction substrate 6 is covered on the heating device, heat generated by the operation of the heating device can be conducted out, one end of the heat conduction pipe 7 is connected with the heat conduction substrate 6, the other end of the heat conduction pipe 7 is connected with the heat radiation fins 2, and the heat on the heat conduction substrate 6 can be conducted to the heat radiation fins 2 through the heat conduction pipe 7. The heat generated on the heating device can be smoothly conducted to the radiating fins 2 through the matching of the heat conducting substrate 6 and the heat conducting pipe 7, so that the radiating fan 3 can blow to radiate the radiating fins 2, and the purpose of radiating and cooling the heating device is achieved.

In this embodiment, the number of fan mounting frames 1 is two, and a radiator fan 3 is all installed on each fan mounting frame 1, and two fan mounting frames 1 are installed respectively in the left and right sides of the device that generates heat to make two radiator fans 3 blow to the both sides of the device that generates heat, improve heat dispersion. In other embodiments, the number of fan mounts 1 and cooling fans 3 may be any other number.

The foregoing embodiments are preferred embodiments of the present utility model, and are not intended to limit the scope of the utility model, which is defined by the appended claims, but rather by the following claims.

Claims

1. A notebook computer radiator, wherein the notebook computer is provided with a heating device, characterized in that: the notebook computer radiator comprises a heat conducting component and a fan mounting frame, wherein the heat conducting component covers the heating device, the fan mounting frame is connected to the heat conducting component, the heat conducting component is provided with a heat dissipation fin, the fan mounting frame is provided with a heat dissipation fan, the fan mounting frame is provided with an air inlet and a first air outlet, and the heat dissipation fin is connected to the first air outlet;

A second air outlet is provided on one side of the fan mounting frame close to the heating device, and the air blown out by the heat dissipation fan can pass through the second air outlet and then blow toward the heating device.

2. The notebook computer radiator according to claim 1 is characterized in that: the notebook computer radiator also includes a heat spreader, the heat spreader covers the heating device, the heat spreader is connected to the heat conductive component, and the wind blown by the cooling fan can blow toward the heat spreader after passing through the second air outlet.

3. The notebook computer radiator according to claim 1 is characterized in that: the fan mounting frame is provided with heat insulation cotton, the heat insulation cotton is arranged between the air inlet and the second air outlet, the heat insulation cotton is sealed and connected to the notebook computer, and the heat insulation cotton is used to prevent the hot air on the heating device from being sucked into the cooling fan.

4. The notebook computer radiator according to any one of claims 1 to 3, characterized in that: the heat-conducting component comprises a heat-conducting substrate and a heat-conducting pipe, the heat-conducting substrate covers the heating device, one end of the heat-conducting pipe is connected to the heat-conducting substrate, and the other end is connected to the heat dissipation fin.

5. The notebook computer radiator according to claim 4, characterized in that: there are two fan mounting frames, and each fan mounting frame is provided with the cooling fan.