Disclosure of utility model
The utility model aims to solve the problems in the prior art and provide a siphon radiator which has high heat exchange efficiency and low cost.
In order to solve the above problems, the present utility model provides a siphon radiator including:
A substrate, wherein a cavity is formed in the substrate, the cavity accommodates a working medium, the substrate is provided with a first surface and a second surface which are opposite, the first surface of the substrate is provided with a mounting area, the mounting area is used for connecting an object to be cooled, and the heat of the object to be cooled can enable the working medium to be changed from a liquid state to a gas state;
a first pipeline, wherein a first end of the first pipeline is connected with the upper part of the substrate and is communicated with the chamber of the substrate;
A condenser disposed in spaced relation to the base plate, the condenser being connected to the second end of the first conduit to receive and cool the working medium in a gaseous state from the base plate, the working medium being capable of changing from a gaseous state to a liquid state within the condenser, the condenser being at a height greater than the height of the base plate;
and the first end of the second pipeline is connected with the condenser, and the second end of the second pipeline is connected with the lower part of the substrate so as to input the liquid working medium in the condenser into the cavity of the substrate.
Further, the base plate and the condenser are both vertically arranged, and the bottom end of the condenser is higher than the top end of the base plate.
Further, the condenser comprises a plate-fin heat exchanger comprising:
The condenser is connected with the second end of the first pipeline through the first collecting pipe and the first end of the second pipeline through the second collecting pipe;
The flat pipes are vertically arranged, the top end and the bottom end of each flat pipe are respectively connected with the first collecting pipe and the second collecting pipe so as to be communicated with the first collecting pipe and the second collecting pipe.
Further, the plate fin heat exchanger further includes:
The plurality of groups of connecting pieces are respectively arranged in a plurality of gaps among the flat tubes in a one-to-one correspondence manner.
Further, the condenser includes:
And the fan is arranged at the front side or the rear side of the plate-fin heat exchanger.
Further, the condenser further includes:
the fan cover is used for covering one side of the plate-fin heat exchanger, which faces the fan, and is provided with a wind hole, and the fan covers the wind hole so as to blow or suck wind to the wind hole.
Further, the siphon radiator further comprises:
The two brackets are respectively positioned at the bottom ends of the wind hoods and are arranged at intervals along the length direction of the wind hoods.
Further, the substrate includes:
The first radiating plate is vertically arranged and comprises a first surface and a second surface which are arranged front and back, the first surface of the first radiating plate is provided with the mounting area, and the second surface of the first radiating plate is provided with a plurality of fins or pin fins;
The second radiating plate is connected with the first radiating plate, a groove is formed in the surface of one side of the second radiating plate, and the groove is used for wrapping the fins or the pin fins.
Further, the fins are formed as vertically arranged strip-shaped plates, and a plurality of strip-shaped plates are arranged at intervals along the length direction of the first heat dissipation plate.
Further, the first pipeline and the second pipeline comprise a plurality of first pipelines and a plurality of second pipelines which are arranged at intervals along the length direction of the substrate.
Due to the technical scheme, the utility model has the following beneficial effects:
The siphon radiator comprises a base plate, a first pipeline, a condenser and a second pipeline. The temperature of the working medium in the substrate is changed from a liquid state to a gas state due to the temperature rise, and the process absorbs the heat, so that the object to be cooled is cooled, and the object to be cooled is enabled to run normally. The gaseous working medium rises through the first line to the condenser due to pressure and buoyancy. The condenser cools the working medium such that the working medium is converted from a gaseous state to a liquid state. The condenser is higher than the base plate so that the liquid working medium in the condenser falls into the chamber of the base plate due to gravity. The liquid working medium falling into the chamber is then transferred by the heat of the object to be cooled into a gaseous state and flows into the condenser through the first pipeline. And thus, the object to be cooled is continuously and stably cooled. The siphon radiator with the structure has high radiating efficiency, belongs to passive radiating, does not need Villa power input, and can save energy. Compared with a common air-cooled radiator, the heat exchange efficiency can be improved, and compared with a liquid-cooled radiator, the cost can be saved.
Detailed Description
In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the utility model described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
Next, a siphon radiator according to an embodiment of the present utility model is described.
As shown in fig. 1 to 5, the siphon radiator according to the embodiment of the present utility model includes a substrate 100, a first pipe 210, a condenser 330, and a second pipe 220.
First, the substrate 100 is explained. The substrate 100 is formed with a chamber, the chamber accommodates a working medium, the substrate 100 has a first surface and a second surface opposite to each other, the first surface of the substrate 100 is formed with a mounting area, the mounting area is used for connecting an object to be cooled, and heat generated in the working process of the object to be cooled can enable the working medium to be changed from a liquid state to a gas state. Among them, the working medium capable of performing gas-liquid conversion is a known technology, and is not described in detail herein.
During operation, the object to be cooled (such as a chip, a power device/module and the like) generates heat, the heat is transferred to a working medium in the cavity, the working medium is converted from a liquid state to a gas state, and the heat is absorbed, so that the object to be cooled can be cooled.
Next, the first pipe 210 is explained. The first end of the first pipe 210 is connected to the upper portion of the substrate 100 and communicates with the chamber of the substrate 100.
The gaseous working medium may be transported through the first conduit 210 from a first end of the first conduit 210 to a second end of the first conduit 210.
Then, the condenser 330 is explained. The condenser 330 is disposed spaced apart from the substrate 100, and the condenser 330 is connected to the second end of the first pipe 210 to receive the gaseous working medium from the substrate 100 and cool the working medium, which can be changed from the gaseous state to the liquid state in the condenser 330.
The gaseous working medium flows through the first end of the first conduit 210 to the second end of the first conduit 210 and into the condenser 330. The condenser 330 cools the working medium so that the working medium changes from a gaseous state to a liquid state.
Finally, the second conduit 220 is described. The first end of the second pipe 220 is connected to the condenser 330, and the second end thereof is connected to the lower portion of the substrate 100, so as to input the liquid working medium in the condenser 330 into the chamber of the substrate 100.
The condenser 330 is higher than the substrate 100, and the liquid working medium flows into the chamber of the substrate 100 through the second pipe 220 due to gravity. The liquid working medium in the chamber is affected by the temperature of the object to be cooled, becomes gas, and moves upward due to the pressure and buoyancy, so that it flows into the condenser 330 again through the first pipe 210, and the condenser 330 changes the working medium from the gas state to the liquid state. This reciprocates so that the object to be cooled is continuously and stably cooled.
The above siphon radiator includes the substrate 100, the first pipe 210, the condenser 330, and the second pipe 220. The temperature of the working medium in the substrate 100 is changed from a liquid state to a gas state due to the temperature rise, and the process absorbs heat, so that the object to be cooled is cooled, and the object to be cooled is enabled to run normally. The gaseous working medium rises through the first conduit 210 to the condenser 330 due to pressure and buoyancy. The condenser 330 cools the working medium such that the working medium is converted from a gaseous state to a liquid state. The condenser 330 is higher than the substrate 100 such that the liquid working medium in the condenser 330 falls into the chamber of the substrate 100 due to gravity. The liquid working medium falling into the chamber is again transformed into a gaseous state by heat transfer of the object to be cooled, and flows into the condenser 330 through the first pipe 210. And thus, the object to be cooled is continuously and stably cooled. The siphon radiator with the structure has high radiating efficiency, belongs to passive radiating, does not need Villa power input, and can save energy. Compared with a common air-cooled radiator, the heat exchange efficiency can be improved, and compared with a liquid-cooled radiator, the cost can be saved.
In some embodiments of the present utility model, both the base plate 100 and the condenser 330 are vertically disposed, and the bottom end of the condenser 330 is higher than the top end of the base plate 100.
As shown in fig. 1 and fig. 2, the bottom end of the condenser 330 is higher than the top end of the substrate 100, and the condenser 330 and the substrate 100 are all vertically arranged, so that the liquid working medium in the condenser 330 more easily falls into the cavity of the substrate 100, the fluidity of the working medium is improved, and the heat exchange efficiency is increased.
Further, the condenser 330 includes a plate-fin heat exchanger. The plate-fin heat exchanger includes a first header 331, a second header 334, and a plurality of flat tubes 332. The first collecting pipe 331 is located above the second collecting pipe 334, and the condenser 330 is connected to the second end of the first pipeline 210 through the first collecting pipe 331 and connected to the first end of the second pipeline 220 through the second collecting pipe 334. The flat tubes 332 are vertically arranged, and the top end and the bottom end of each flat tube 332 are respectively connected with the first collecting pipe 331 and the second collecting pipe 334 so as to be communicated with the first collecting pipe 331 and the second collecting pipe 334.
As shown in fig. 1 and 5, the working medium in the base plate 100 flows into the first header 331 of the plate-fin heat exchanger of the condenser 330 through the first pipe 210, then flows into the flat pipe 332 communicating with the first header 331, then flows into the second header 334 from the flat pipe 332, and finally flows into the base plate 100 from the second header 334 again, thereby realizing the circulation flow.
The heat exchange area of the plate-fin radiator is larger, so that the heat exchange efficiency can be increased, and the cooling efficiency of a working medium is improved.
Further, the plate fin heat exchanger further comprises a plurality of sets of connection tabs 333. The plurality of groups of connecting pieces 333 are respectively disposed in a plurality of gaps between the plurality of flat tubes 332 in a one-to-one correspondence.
As shown in fig. 1 and 5, the connection piece 333 is formed in a wave shape, thereby increasing a heat exchange area and improving heat exchange efficiency.
Optionally, condenser 330 includes a fan 320. The fan 320 is disposed at the front side or the rear side of the plate fin heat exchanger.
Further, the condenser 330 also includes a fan housing 310. The fan housing 310 covers a side of the plate-fin heat exchanger facing the fan 320, and the fan housing 310 is formed with a wind hole, and the fan 320 covers the wind hole to blow or suck wind to the wind hole.
As shown in fig. 2, two air holes are provided on the air cover 310, and two fans 320 are provided on the air holes in a one-to-one correspondence, so as to blow or suck air against the air holes. Thereby concentrating the wind power of the fan 320 on the plate-fin heat exchanger and improving the cooling effect of the air cooling on the plate-fin heat exchanger. Moreover, the contamination of the plate fin heat exchanger can be reduced by the louver 310.
Further, the siphon radiator further comprises two brackets 400. The two brackets 400 are respectively located at the bottom ends of the wind housing 310 and are spaced apart along the length direction of the wind housing 310, and the sides of the two brackets 400 are respectively connected with two ends of the substrate 100 in the length direction.
As shown in fig. 1 and 2, two brackets 400 support the hood 310, the hood 310 covers the plate fin heat exchanger, and the sides of the two brackets 400 are respectively connected to both ends of the substrate 100 in the length direction, so that the structure of the siphon radiator can be stabilized.
In some embodiments of the present utility model, the substrate 100 includes a first heat dissipation plate 110 and a second heat dissipation plate 120. The first heat dissipation plate 110 is vertically disposed and includes a first surface and a second surface disposed front and back, the first surface of the first heat dissipation plate 110 is formed with a mounting area, and the second surface thereof is formed with a plurality of fins 111 or pin fins. The second heat dissipation plate 120 is connected to the first heat dissipation plate 110, a groove 121 is formed on one surface of the second heat dissipation plate 120, and the groove 121 covers the fins 111 or pin fins.
As shown in fig. 3, a mounting region to which an object to be cooled is connected is formed on a first surface of the first heat dissipation plate 110. The fins 111 and pin fins are formed on the second surface of the first heat dissipation plate 110, so that the contact area of the first heat dissipation plate 110 and the working medium can be increased, thereby improving heat exchange efficiency.
As shown in fig. 4, the grooves 121 on the surface of the second heat dissipation plate 120 are combined with the first heat dissipation plate 110 to form a chamber capable of accommodating a working medium. The fins 111 and pin fins are in sufficient contact with the working medium within the chamber.
Further, the fins 111 are formed as vertically disposed strip plates, and a plurality of strip plates are disposed at intervals along the length direction of the first heat dissipation plate 110.
As shown in fig. 3, the strip plate forms fins 111, and a plurality of fins 111 are provided at intervals along the longitudinal direction of the heat dissipation plate. The working medium flows from the bottom ends of the fins 111 into the top ends of the fins 111.
In some embodiments of the present utility model, the first and second pipelines 210 and 220 each include a plurality of first and second pipelines 210 and 220 each disposed at intervals along the length direction of the substrate 100.
As shown in fig. 1, there are 5 first lines 210 and 6 second lines 220. The plurality of first pipelines 210 and the plurality of second pipelines 220 can improve heat exchange efficiency, so that heat can be dissipated to the larger substrate 100, and more objects to be cooled can be dissipated through the substrate 100.
The foregoing is only illustrative of the present utility model and is not to be construed as limiting thereof, but rather as various modifications, equivalent arrangements, improvements, etc., within the spirit and principles of the present utility model.