CN222883012U - Vehicle-mounted equipment with heat dissipation waterproof structure - Google Patents

Abstract

The application provides an on-vehicle device with a heat dissipation waterproof structure, which comprises a display device, a semiconductor module and a heat dissipation assembly. The display device comprises a shell module, a display screen module arranged in the shell module and a main board assembly arranged in the shell module, wherein the main board assembly is electrically connected with the display screen module and is attached to the shell module, and heat can be generated when the main board assembly works. The semiconductor module is fixed outside the shell module and is electrically connected with the main board assembly, and the semiconductor module is provided with a refrigeration surface and a heating surface, and the refrigeration surface is attached to the shell module. The heat dissipation assembly is fixed outside the shell module and is attached to the heating surface. The heat transferred to the shell module by the main board assembly can be transferred to the heat dissipation assembly through the semiconductor module, and the heat dissipation assembly is used for transferring the heat to the outside. The application solves the heat dissipation problem of the vehicle-mounted flat plate in high power consumption and high temperature environment, and synchronously improves the waterproof problem of the active heat dissipation structure.

Description

Vehicle-mounted equipment with heat dissipation waterproof structure

Technical Field

The application belongs to the technical field of vehicle-mounted equipment, and particularly relates to vehicle-mounted equipment with a heat dissipation waterproof structure.

Background

At present, the power consumption of the vehicle-mounted panel complete machine used in industry and agriculture is high, and the heat source device of the CPU can cause the temperature inside the complete machine to rise, thereby affecting the performance of electronic devices, so the requirement on the heat dissipation performance of products is high, and therefore, heat dissipation holes are required to be formed. But the vehicle-mounted flat plate needs to stably run in rainy days, so that the requirement on the waterproof performance of the product is high. Therefore, the active heat dissipation and waterproof design is needed for the vehicle-mounted flat plate, the heat dissipation performance of the whole machine is improved, and the overall waterproof performance is improved.

Disclosure of utility model

In view of this, the present application provides an in-vehicle apparatus having a heat radiation waterproof structure, the in-vehicle apparatus comprising:

The display device comprises a shell module, a display screen module arranged in the shell module and a main board assembly arranged in the shell module, wherein the main board assembly is electrically connected with the display screen module and is attached to the shell module, and the main board assembly can generate heat when in operation;

The semiconductor module is fixed outside the shell module and electrically connected with the main board assembly, and is provided with a refrigerating surface and a heating surface, wherein the refrigerating surface is attached to the shell module, and

The heat dissipation assembly is fixed outside the shell module and is attached to the heating surface;

The heat of the main board assembly transferred to the shell module can be transferred to the heat dissipation assembly through the semiconductor module, and the heat dissipation assembly is used for transferring the heat to the outside.

According to the vehicle-mounted device with the heat dissipation waterproof structure, the semiconductor module is arranged, the active cooling function of the semiconductor module is utilized, heat generated by the main board module can be transferred to the semiconductor module through the shell module, then transferred to the heat dissipation module through the semiconductor module, and finally dissipated into the air through the heat dissipation module, so that the heat dissipation function is realized. In addition, the main board assembly and the heat dissipation assembly are designed in a separated mode, the main board assembly is arranged in the sealed shell module, the heat dissipation assembly is arranged outside the shell, the main board assembly forms an independent sealing body structure, rainwater is prevented from penetrating into the vehicle-mounted equipment, waterproof performance is achieved, and heat conduction stability of the heat dissipation piece is improved.

In summary, the application realizes the heat dissipation function by transferring the heat to the heat dissipation component by the semiconductor module on the basis of realizing the waterproof function through the design of separating the main board component from the heat dissipation component, thereby solving the heat dissipation problem of the vehicle-mounted flat plate in high-power consumption and high-temperature environments and synchronously improving the waterproof problem of the active heat dissipation structure.

The shell module comprises a front shell component and a rear shell component, the display screen module is assembled on the front shell component, a sealing space is formed by surrounding the front shell component and the rear shell component, the main board component is arranged in the sealing space, the main board component comprises a main board CPU module attached to the rear shell component, and the main board CPU module and the semiconductor module are correspondingly arranged.

The back shell assembly comprises a back shell, a back shell CPU step is arranged on one side, close to the sealing space, of the back shell assembly, the main board CPU module is attached to the back shell CPU step, a containing groove is arranged on one side, away from the sealing space, of the back shell assembly, the semiconductor module is arranged in the containing groove, and a refrigerating surface of the semiconductor module is attached to the bottom wall of the containing groove.

The rear shell assembly is provided with a rear shell electrifying lead through hole, the semiconductor module comprises an electrifying lead, and the electrifying lead penetrates through the rear shell electrifying lead through hole to be electrically connected with the main board assembly.

And a sealing filling piece is arranged in the rear shell power-on lead through hole so as to seal the rear shell power-on lead through hole.

The heat dissipation assembly comprises a heat dissipation piece fixed on the rear shell assembly, wherein the heat dissipation piece comprises a heat dissipation piece heat absorption table attached to the heating surface of the semiconductor module, and a plurality of heat dissipation piece fins arranged on the periphery of the heat dissipation piece heat absorption table in an array mode.

The heat dissipation assembly further comprises a fan arranged on the heat dissipation piece and deviating from the semiconductor module, the fan comprises a fan power-on lead, and the fan power-on lead penetrates through the rear shell assembly and is electrically connected to the main board assembly.

The rear shell assembly is an aluminum rear shell assembly and is of an integrated structure.

The vehicle-mounted equipment further comprises a protective cover covering the heat dissipation assembly, and the protective cover is fixed to the shell module.

The protection cover comprises a top wall and a side wall which is connected to the periphery of the top wall in a bending mode, the side wall is fixed to the shell module, the top wall is provided with a plurality of air outlets which are arranged in an array mode, and the side wall is provided with a plurality of air inlets which are arranged in an array mode.

Drawings

In order to more clearly explain the technical solutions in the embodiments of the present application, the drawings that are used in the embodiments of the present application will be described below.

Fig. 1 is a schematic perspective view of an in-vehicle apparatus according to an embodiment of the present application.

Fig. 2 is an exploded view of the in-vehicle apparatus shown in fig. 1.

Fig. 3 is a schematic diagram of a semiconductor module according to an embodiment of the application.

Fig. 4 is a schematic cross-sectional view of the in-vehicle apparatus shown in fig. 1.

Fig. 5 is a schematic perspective view of a motherboard assembly according to an embodiment of the application.

Fig. 6 is a schematic perspective view of a rear housing assembly according to an embodiment of the application.

Fig. 7 is a schematic perspective view of the rear housing assembly of fig. 6 from another perspective.

Fig. 8 is a schematic perspective view of a heat dissipation device according to an embodiment of the application.

Fig. 9 is a schematic perspective view of a fan according to an embodiment of the application.

Fig. 10 is a schematic perspective view of a protective cover according to an embodiment of the application.

Description of the reference numerals:

The vehicle-mounted device 1, the display device 100a, the display screen module 100, the front case assembly 200, the sealed space 200a, the main board assembly 300, the main board CPU module 310, the main board screw hole site 320, the case module 400a, the rear case assembly 400, the housing groove 410, the rear case energizing lead wire via 420, the rear case shield screw site 430, the rear case heat dissipation assembly screw site 440, the rear case CPU step 450, the rear case main board screw site 460, the rear case waterproof groove site 470, the seal packing 480, the semiconductor module 500, the heat generating surface 510, the cooling surface 520, the energizing lead wire 530, the heat dissipation assembly 600, the heat dissipation member 610, the heat dissipation member heat absorbing stage 611, the heat dissipation member fin 612, the heat dissipation member screw post 613, the fan 620, the fan blade 621, the fan energizing lead wire 622, the shield 700, the air outlet 710, the air intake 720, the rear case screw site 730, the top wall 740, the side wall 750, and the seal ring 800.

Detailed Description

The following are preferred embodiments of the present application, and it should be noted that modifications and variations can be made by those skilled in the art without departing from the principle of the present application, and these modifications and variations are also considered as the protection scope of the present application.

Before the technical scheme of the application is described, the technical problems in the related art are described in detail.

Statistics of big data that more than about 40% of electronic product reliability (life) failures are caused by temperature problems, and the life is reduced by half every 10 degrees of temperature rise of electronic parts, wherein the capacitance effect is most obvious. In the present stage, the power consumption of the vehicle-mounted panel complete machine used in industry and agriculture is high, the temperature in the complete machine is increased due to the LCD screen and the CPU heating source device, the performance of the electronic device is affected, and the requirement on the heat dissipation performance of the product is high.

Waterproof active cooling flat plate is a main design difficulty, active cooling fan components need an air inlet and an air outlet, and vehicle-mounted flat plates can stably run even in rainy days, so that the waterproof performance requirement on products is high. Therefore, heat dissipation and water resistance are two factors which are mutually restricted, and in order to enable the vehicle-mounted 5G terminal to work stably under high temperature and rainy days, the vehicle-mounted 5G terminal is required to be subjected to active heat dissipation and water resistance design, so that the heat dissipation performance of the whole vehicle-mounted 5G terminal is improved, and meanwhile, the overall water resistance is improved.

In view of this, in order to solve the above-mentioned problems, the present embodiment provides a vehicle-mounted device with a heat dissipation and waterproof structure, please refer to fig. 1-4 together, fig. 1 is a schematic perspective view of a vehicle-mounted device according to an embodiment of the present application. Fig. 2 is an exploded view of the in-vehicle apparatus shown in fig. 1. Fig. 3 is a schematic diagram of a semiconductor module according to an embodiment of the application. Fig. 4 is a schematic cross-sectional view of the in-vehicle apparatus shown in fig. 1. The in-vehicle apparatus provided in this embodiment includes a display device 100a, a semiconductor module 500, and a heat sink assembly 600. The display device 100a includes a housing module 400a, a display screen module 100 mounted on the housing module 400a, and a motherboard assembly 300 disposed in the housing module 400a, wherein the motherboard assembly 300 is electrically connected to the display screen module 100 and is attached to the housing module 400a, and the motherboard assembly 300 can generate heat during operation. The semiconductor module 500 is fixed outside the housing module 400a and electrically connected to the motherboard assembly 300, the semiconductor module 500 has a cooling surface 520 and a heating surface 510, and the cooling surface 520 is attached to the housing module 400 a. The heat dissipation assembly 600 is fixed outside the housing module 400a and is attached to the heat generating surface 510. The heat transferred from the main board assembly 300 to the case module 400a can be transferred to the heat dissipation assembly 600 through the semiconductor module 500, and the heat dissipation assembly 600 is used to transfer the heat to the outside.

The in-vehicle device 1 according to the present embodiment is mainly a terminal device mounted on a vehicle, such as a car, an industrial and agricultural vehicle, and the present embodiment is schematically described only with respect to a vehicle-mounted flat panel, and therefore, the present embodiment can be also understood as an agricultural vehicle-mounted semiconductor active heat dissipation and waterproofing structure used for industrial and agricultural electronic products.

The display device 100a is a main body part of the in-vehicle apparatus 1, that is, the in-vehicle apparatus 1 is an apparatus having a display function, and the display apparatus includes a housing module 400a, and a display screen module 100 mounted on the housing module 400 a. The housing module 400a has a sealed space 200a therein, and various structural members, such as a main board assembly 300, a camera assembly, a battery, etc., can be installed in the sealed space 200 a. The main board assembly 300 may be disposed in the sealed space 200a in the housing module 400a, thereby realizing a waterproof function for the main board assembly 300.

It should be noted that, the main board assembly 300 is electrically connected to the display screen module 100, and the main board assembly 300 controls the display screen module 100 to display images when in operation, and meanwhile, the main board assembly 300 generates heat, which is continuously collected inside the display device 100a in the related art, so that the temperature of the vehicle-mounted device 1 is continuously increased, and thus the service life of the vehicle-mounted device 1 is affected. In addition, the main board assembly 300 is attached to the inner side surface of the housing module 400a, so that the heat generated by the main board assembly 300 can be transferred to the housing module 400a, thereby achieving the purpose of primary heat dissipation.

The semiconductor module 500 is a part manufactured from a semiconductor material and cooled by a semiconductor cooling technology, wherein semiconductor cooling is a technology for realizing cooling by using a thermoelectric effect of the semiconductor material. The basic principle is that when direct current passes through the thermocouple made of semiconductor materials, one end of the thermocouple absorbs heat, and the other end of the thermocouple releases heat, so that temperature difference is generated, and the refrigerating effect is realized. The semiconductor module 500 has the cooling surface 520 and the heating surface 510, and alternatively, the cooling surface 520 and the heating surface 510 may be disposed opposite to each other, or may be disposed adjacent to each other, or may be disposed in other manners.

In this embodiment, the semiconductor module 500 is fixed on the outer side of the housing module 400a and electrically connected to the motherboard assembly 300, so that the semiconductor module 500 is powered on, and the motherboard assembly 300 can be used to adjust the current of the semiconductor module 500, thereby adjusting the cooling effect. In the present embodiment, the cooling surface 520 of the semiconductor module 500 can be bonded to the case module 400 a. When the motherboard assembly 300 works, the generated heat can be transferred to the housing module 400a, and the cooling surface 520 of the semiconductor module 500 can absorb the heat on the housing module 400a to the semiconductor module 500, so that the heat is transferred to the semiconductor module 500. In other words, the semiconductor module 500 contacts the back shell assembly 400 through the thermoelectric effect, so as to cool the back shell assembly 400 and balance the hot spot, thereby achieving the purpose of active heat dissipation. The surface temperature of the rear case assembly 400 is adjusted by the semiconductor module 500 to protect the user from being scalded.

The heat dissipation assembly 600 is mainly used for achieving the purpose of heat dissipation, the heat dissipation assembly 600 can be fixed outside the shell module 400a and simultaneously is attached to the heating surface 510 of the semiconductor module 500, so that heat transferred to the semiconductor module 500 can be transferred to the heat dissipation assembly 600 through the heating surface 510, and the heat dissipation assembly 600 is utilized to transfer the heat generated by the main board assembly 300 to the outside air, so that the purpose of heat dissipation is achieved. In other words, the semiconductor module 500 generates heat at the contact surface with the heat sink 600 by cooling the contact surface with the rear case assembly 400 through the thermoelectric effect. Optionally, the heat dissipation assembly 600 is internally water-filled and sealed against external rain infiltration.

As can be seen from the above description, the vehicle-mounted device 1 with the heat dissipation and waterproof structure provided in this embodiment, by arranging the semiconductor module 500, can transfer the heat generated by the motherboard assembly 300 to the semiconductor module 500 through the housing module 400a by utilizing the active cooling function of the semiconductor module 500, and then transfer the heat to the heat dissipation assembly 600 through the semiconductor module 500, and finally dissipate the heat to the air through the heat dissipation assembly 600 to realize the heat dissipation function. In addition, the application separates the main board assembly 300 and the heat dissipation assembly 600 through the rear shell assembly 400, the main board assembly 300 is arranged in the sealed shell module 400a, the heat dissipation assembly 600 is arranged outside the shell, the main board assembly 300 forms an independent sealing structure to form a waterproof sealing closed loop, rainwater is prevented from penetrating into the vehicle-mounted equipment 1, waterproof performance is realized, and heat conduction stability of the heat dissipation element 610 is improved.

In summary, this embodiment provides an on-vehicle semiconductor initiative heat dissipation waterproof construction of agricultural machinery, through separating the design with mainboard subassembly 300 and heat dissipation subassembly 600, on the basis of realizing waterproof function, utilizes semiconductor module 500 to transmit the heat to the heat dissipation subassembly 600 and dispels the heat to realize the heat dissipation function, solved on-vehicle dull and stereotyped heat dissipation problem under high-power consumption and high temperature environment, synchronous improvement initiative heat dissipation structure waterproof problem.

Referring to fig. 2, fig. 4 to fig. 6 again, fig. 5 is a schematic perspective view of a motherboard assembly according to an embodiment of the application. Fig. 6 is a schematic perspective view of a rear housing assembly 400 according to an embodiment of the application. In this embodiment, the housing module 400a includes a front housing assembly 200 and a rear housing assembly 400, the display screen module 100 is mounted on the front housing assembly 200, the front housing assembly 200 and the rear housing assembly 400 enclose to form a sealed space 200a, and the main board assembly 300 is disposed in the sealed space 200 a. The motherboard assembly 300 includes a motherboard CPU module 310 attached to the back case assembly 400, where the motherboard CPU module 310 is disposed opposite to the semiconductor module 500.

The housing module 400a may be divided into a front housing assembly 200 and a rear housing assembly 400, the front housing assembly 200 and the rear housing assembly 400 have a certain accommodating space, the front housing assembly 200 and the rear housing assembly 400 may be assembled together to form a sealed space 200a, and the motherboard assembly 300 may be disposed in the sealed space 200 a. The display screen assembly is mounted on the front case assembly 200, the motherboard CPU module 310 in the motherboard assembly 300 is attached to the rear case assembly 400, and when the motherboard assembly 300 works, the motherboard CPU module 310 generates heat, and then transfers the heat to the rear case assembly 400, and then transfers the heat to the semiconductor module 500 through the rear case assembly 400.

Alternatively, the display module 100 may be fixed and sealed to the front case assembly 200 by a foam adhesive, and the jig is maintained for 15s.

Alternatively, the motherboard assembly 300 may be locked and fixed with the rear case motherboard screw locations 460 on the rear case assembly 400 by the motherboard screw locations 320 on the motherboard assembly 300.

Optionally, a rear case waterproof groove 470 is formed on the periphery of the rear case assembly 400, and the sealing ring 800 may be sleeved in the rear case waterproof groove 470, thereby improving the sealing performance of the housing module 400 a.

In addition, the embodiment also provides an assembly process of the whole machine, namely 1, firstly, the display screen module 100 is assembled on the front shell assembly 200, and the jig is kept for 15s. 2. The main board assembly 300 is then mounted to the back shell assembly 400, the locking screws are tightened, and the sealing ring 800 is then sleeved in the back shell waterproof slot 470 of the back shell assembly 400. 3. The semiconductor module 500 is assembled to the back case assembly 400, and then the heat sink assembly 600 is mounted to the back case assembly 400, and screw-fastened. The boot 700 is then assembled to the rear housing assembly 400 and secured by the locking screws. 4. And finally, the front shell assembly 200 of the assembled display screen module 100 is mounted on the rear shell assembly 400, and the whole structure assembly of the vehicle-mounted flat plate is completed by locking screws and fixing.

In this embodiment, the rear case assembly 400 is an aluminum rear case assembly 400, and the rear case assembly 400 is an integral structure. The rear shell assembly 400 is made of pure aluminum, is integrally machined and formed, and the heat conductivity coefficient of the shell is improved from 0.2 (W/m.K) of the plastic shell to 210W (m.K), so that the overall heat conductivity is enhanced. And the rear case assembly 400 has an all-metal structure, and the rear surface of the rear case assembly 400 is integrally contacted with the outside air in a large area, so that the overall heat dissipation performance is improved, and the external impact stress is improved, thereby protecting the internal main board assembly 300 and other components.

Referring to fig. 6-7, fig. 7 is a schematic perspective view of the rear housing assembly shown in fig. 6 from another perspective. In this embodiment, a rear case CPU step 450 is provided on a side of the rear case assembly 400 close to the sealed space 200a, and the motherboard CPU module 310 is attached to the rear case CPU step 450. The rear housing assembly 400 has a receiving groove 410 on a side facing away from the sealed space 200a, the semiconductor module 500 is disposed in the receiving groove 410, and the cooling surface 520 of the semiconductor module 500 is attached to the bottom wall of the receiving groove 410.

The side of the back shell assembly 400, which is close to the sealing space 200a, i.e. the inner side of the back shell assembly 400 is provided with a convex back shell CPU step 450, and the main board CPU module 310 can be attached to the back shell CPU step 450, so that the attaching difficulty of the main board CPU module 310 and the back shell assembly 400 is reduced. Optionally, if a gap exists between the motherboard CPU module 310 and the rear case CPU step 450, the middle gap is filled with heat-conducting silica gel, air is removed, and the heat source conducts heat through the rear case. At this time, the main board CPU module 310 is not directly attached to the rear case CPU step 450, but is indirectly attached to the rear case CPU step 450 through heat-conducting silicone.

The rear housing assembly 400 may be disposed in the accommodating groove 410 on a side of the rear housing assembly 400 facing away from the sealed space 200a, so that the semiconductor module 500 may be disposed in the accommodating groove 410, the assembly difficulty of the semiconductor module 500 may be reduced, and the distance between the semiconductor module 500 and the motherboard CPU module 310 may be reduced. The bottom wall of the accommodating groove 410 is a rear shell semiconductor refrigeration surface, and the refrigeration surface 520 of the semiconductor module 500 can be adhered and fixed on the rear shell semiconductor refrigeration surface by adding heat conducting solder paste. At this time, the semiconductor module 500 is not directly attached to the rear-shell semiconductor cooling surface, but indirectly attached to the rear-shell semiconductor cooling surface through the thermal solder paste.

Referring to fig. 3 and 7 together, in the present embodiment, the rear case assembly 400 has a rear case power lead via 420, the semiconductor module 500 includes a power lead 530, and the power lead 530 is electrically connected to the motherboard assembly 300 through the rear case power lead via 420.

In this embodiment, the bottom wall of the accommodating groove 410 in the back shell assembly 400 may be provided with a back shell power lead via 420, and the power lead 530 of the semiconductor module 500 may pass through the back shell assembly 400 through the back shell power lead via 420 to be electrically connected to the motherboard assembly 300, so that the motherboard assembly 300 provides electrical energy. And the semiconductor module 500 can cover the rear case power lead via 420, so the rear case power lead via 420 is not exposed on the outer surface, thereby improving the appearance effect and sealing waterproof performance.

Referring to fig. 4 again, in the present embodiment, a sealing filler 480 is disposed in the rear case power lead via 420 to seal the rear case power lead via 420.

After the rear shell power-on lead via hole 420 is formed in the rear shell assembly 400 to enable the power-on lead 530 to pass through, a sealing filler 480 such as silica gel can be further arranged in the rear shell power-on lead via hole 420 to seal, so that the waterproof performance of the rear shell assembly 400 is improved, and the active heat dissipation stability is improved.

Referring to fig. 7-8, fig. 8 is a schematic perspective view of a heat sink according to an embodiment of the application. In this embodiment, the heat dissipating assembly 600 includes a heat dissipating member 610 fixed to the rear housing assembly 400, and the heat dissipating member 610 includes a heat dissipating member heat absorbing stage 611 attached to the heat generating surface 510 of the semiconductor module 500, and a plurality of heat dissipating member fins 612 arranged in an array and disposed at the periphery of the heat dissipating member heat absorbing stage 611.

The heat sink assembly 600 may include a heat sink 610, the heat sink 610 being secured to the rear housing assembly 400. Optionally, the heat sink screw 613 on the heat sink 610 is assembled with the rear housing heat sink screw 440 on the rear housing assembly 400 in a limited manner, and is fixed by screw locking. The heat sink 610 includes a heat sink 611, and the heat sink 611 can press the heat-generating surface 510 of the semiconductor module 500, so that the heat sink 610 is attached to the semiconductor module 500. The heat sink 610 further includes a plurality of heat sink fins 612, the plurality of heat sink fins 612 are disposed at the periphery of the heat sink 611, and conduct heat through the heat sink fins 612, and dissipate heat in the form of air convection through the gaps between the heat sink fins 612.

Referring to fig. 7 and fig. 9 together, fig. 9 is a schematic perspective view of a fan according to an embodiment of the application. In this embodiment, the heat dissipating assembly 600 further includes a fan 620 mounted on the heat dissipating member 610 facing away from the semiconductor module 500, the fan 620 includes a fan power lead 622, and the fan power lead 622 is electrically connected to the motherboard assembly 300 through the back case assembly 400.

The heat dissipating assembly 600 may further include a fan 620 in addition to the heat dissipating member 610, wherein the fan 620 is disposed on the back of the heat dissipating member 610 and may be fixed to the heat dissipating member 610 by riveting. The fan 620 includes a fan power lead 622, and the fan power lead 622 may also be electrically connected to the motherboard assembly 300 through the back case assembly 400, and the motherboard assembly 300 provides electrical energy to transform mechanical energy to drive the fan 620. The semiconductor module 500 can adjust the effect of the cooling surface 520 by the rotation speed of the fan 620, and the rotation speed of the fan 620 is controlled by the motherboard assembly 300.

Alternatively, the fan power lead 622 may also pass through the rear housing assembly 400 through the rear housing power lead via 420. The fan blades 621 of the fan 620 rotate to drive air circulation, and natural convection is changed into forced air convection heat dissipation, so that the purpose of active heat dissipation is achieved, the heat exchange coefficient between the heating surface 510 of the semiconductor module 500 and the heat dissipation piece 610 and the outside is improved, and the heat dissipation performance is further improved. In other words, the semiconductor module 500 actively cools down, and the fan 620 forces air to convect and dissipate heat, thereby improving heat exchange efficiency and overall heat conduction.

Referring to fig. 7 and fig. 10 together, fig. 10 is a schematic perspective view of a protection cover according to an embodiment of the application. In this embodiment, the in-vehicle apparatus 1 further includes a protection cover 700 covering the heat dissipating unit 600, and the protection cover 700 is fixed to the housing module 400a.

The in-vehicle apparatus 1 may further include a protection cover 700 in addition to the above-described components, and the protection cover 700 may be provided to cover the heat radiation assembly 600 so as to protect the heat radiation assembly 600. In other words, the protection cover 700 may be positioned at the back of the fan 620 in the heat dissipating assembly 600 and fixed to the housing module 400a to prevent the heat dissipating assembly 600 from being damaged. Therefore, the active heat dissipation and waterproof structure of the vehicle-mounted semiconductor of the agricultural machine provided in this embodiment mainly comprises the display screen module 100, the front shell assembly 200, the main board assembly 300, the rear shell assembly 400, the semiconductor module 500, the heat dissipation assembly 600 and the protection cover 700.

Optionally, the side of the back shell assembly 400 facing away from the sealing space 200a is recessed inwards, and the accommodating groove 410 is disposed in the recess, so that the semiconductor module 500, the heat dissipation assembly 600 and the protection cover 700 are also disposed in the recess, and the top surface of the protection cover 700 is flush with the top surface of the back shell assembly 400, thereby improving the flatness of the back shell assembly 400.

In this embodiment, the protection cover 700 includes a top wall 740 and a side wall 750 connected to the periphery of the top wall 740 in a bending manner, the side wall 750 is fixed to the housing module 400a, the top wall 740 is provided with a plurality of air outlets 710 arranged in an array manner, and the side wall 750 is provided with a plurality of air inlets 720 arranged in an array manner.

The protection cover 700 is composed of a top wall 740 and a side wall 750, the top wall 740 is arranged corresponding to the fan 620, a plurality of air outlets 710 arranged in an array can be arranged on the top wall 740, the side wall 750 is arranged corresponding to the side surfaces of the fan 620 and the heat dissipation part 610, and the side wall 750 can be provided with a plurality of air inlets 720 arranged in an array. In this embodiment, the air inlets 720 and the air outlets 710 of the protection cover 700 are arranged in a staggered manner, so that not only the air flow ventilation can be increased, but also the overall aesthetic degree of the vehicle-mounted product can be improved, and meanwhile, the internal heat dissipation assembly 600 is protected.

Alternatively, the boot 700 may be secured by screw locking with the rear housing screw locations 730 on the side walls 750 and the rear housing boot screw locations 430 on the rear housing assembly 400.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, connected, detachably connected, or integrated. It may be a mechanical connection that is made, or may be an electrical connection. Can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

The foregoing has outlined rather broadly the more detailed description of embodiments of the application in order that the principles and embodiments of the application may be better understood, and in order that the present application may be better understood. However, the content of the present specification should not be construed as limiting the present application, and those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the application. Such modifications and variations of the present application are within the scope of the appended claims and their equivalents.

Claims (10)

1. An in-vehicle apparatus having a heat radiation waterproof structure, characterized by comprising:

The display device comprises a shell module, a display screen module arranged in the shell module and a main board assembly arranged in the shell module, wherein the main board assembly is electrically connected with the display screen module and is attached to the shell module, and the main board assembly can generate heat when in operation;

The semiconductor module is fixed outside the shell module and electrically connected with the main board assembly, and is provided with a refrigerating surface and a heating surface, wherein the refrigerating surface is attached to the shell module, and

The heat dissipation assembly is fixed outside the shell module and is attached to the heating surface;

The heat of the main board assembly transferred to the shell module can be transferred to the heat dissipation assembly through the semiconductor module, and the heat dissipation assembly is used for transferring the heat to the outside.

2. The vehicle-mounted device with the heat dissipation and waterproof structure according to claim 1, wherein the shell module comprises a front shell module and a rear shell module, the display screen module is arranged on the front shell module, the front shell module and the rear shell module are enclosed to form a sealed space, the main board module is arranged in the sealed space, the main board module comprises a main board CPU module attached to the rear shell module, and the main board CPU module and the semiconductor module are arranged in a positive correspondence mode.

3. The vehicle-mounted device with the heat dissipation and waterproof structure according to claim 2, wherein a rear shell CPU step is arranged on one side, close to the sealing space, of the rear shell assembly, the main board CPU module is attached to the rear shell CPU step, a containing groove is arranged on one side, away from the sealing space, of the rear shell assembly, the semiconductor module is arranged in the containing groove, and a refrigerating surface of the semiconductor module is attached to the bottom wall of the containing groove.

4. The vehicle-mounted device with a heat dissipating waterproof structure of claim 2, wherein the rear case assembly has a rear case power lead via, and the semiconductor module includes a power lead electrically connected to the motherboard assembly through the rear case power lead via.

5. The vehicle-mounted device with the heat radiation waterproof structure according to claim 4, wherein a sealing filler is provided in the rear case energizing lead via to seal the rear case energizing lead via.

6. The vehicle-mounted device with the heat dissipation waterproof structure according to claim 2, wherein the heat dissipation assembly comprises a heat dissipation piece fixed on the rear shell assembly, and the heat dissipation piece comprises a heat dissipation piece heat absorption table attached to the heat generation surface of the semiconductor module and a plurality of heat dissipation piece fins arranged on the periphery of the heat dissipation piece heat absorption table in an array manner.

7. The vehicle-mounted device with a heat dissipating waterproof structure of claim 6, wherein the heat dissipating assembly further comprises a fan mounted to the heat dissipating member facing away from the semiconductor module, the fan comprising a fan power lead electrically connected to the motherboard assembly through the rear housing assembly.

8. The vehicle-mounted device having a heat radiation waterproof structure according to claim 2, wherein the rear case assembly is an aluminum rear case assembly, and the rear case assembly is an integrated structure.

9. The vehicle-mounted device with the heat radiation waterproof structure according to claim 1, further comprising a protective cover covering the heat radiation assembly, the protective cover being fixed to the housing module.

10. The vehicle-mounted device with the heat dissipation and waterproof structure according to claim 9, wherein the protection cover comprises a top wall and a side wall which is connected to the periphery of the top wall in a bending mode, the side wall is fixed to the shell module, the top wall is provided with a plurality of air outlets which are arranged in an array mode, and the side wall is provided with a plurality of air inlets which are arranged in an array mode.