CN222882997U - Edge computing mini-host with heat dissipation function - Google Patents

Abstract

The utility model belongs to the field of edge computing technology, and in particular, relates to an edge computing mini host with a heat dissipation function. The utility model is active heat dissipation, and the heat generated by the core module of the Jetson platform is efficiently dissipated through the heat dissipation fan inside the host housing, thereby ensuring the efficient operation of the edge computing mini host. In addition, the utility model has a simple structure, is relatively easy to disassemble and repair, is compatible with different main control PCBAs, and can be customized according to needs, and has a wide range of applications.

Description

Edge computing mini-host with heat dissipation function

Technical Field

The utility model relates to the technical field of edge computing, in particular to an edge computing mini-host with a heat dissipation function.

Background

This section is intended to provide a background or context to the embodiments of the utility model that are recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.

The Jetson platform is an embedded system, and a large amount of heat is usually generated in the operation process, so that the equipment needs to be kept to normally operate through heat dissipation, a relatively large amount of heat dissipation modes are air cooling heat dissipation at present, and although the air cooling heat dissipation technology can effectively control the temperature of electronic components to a certain extent, the air cooling heat dissipation technology has the problems and disadvantages that 1) the efficiency is influenced by the temperature and the air flow, namely the air cooling heat dissipation efficiency is influenced by a plurality of factors such as the temperature and the air flow, and when the temperature is too high or the air flow is insufficient, the efficiency can be reduced, so that the performance and the service life of the equipment are influenced. 2) Noise, which is generated when the fan is operated, and which affects the comfort of the user when used for a long time. 3) The heat dissipation area is limited, the area of the heat sink is limited, and the heat dissipation requirement of high-power electronic components is difficult to process. 4) Location and space requirements-the mounting locations and surrounding space of the heat sink and fan need to be considered-for some small devices, especially mobile devices, it may not be well suited to use air-cooled heat dissipation techniques. 5) Energy consumption the use of fans requires additional energy consumption, thereby increasing the overall energy consumption of the device.

Based on the above problems, the prior art has yet to be further developed and improved.

Disclosure of utility model

The utility model aims to solve the problems and provide the edge computing mini-host with the heat dissipation function, which utilizes the structural design that air cooling heat dissipation is in a limited space range to effectively solve the heat dissipation, thereby ensuring that the main control PCBA can work normally.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows.

The utility model provides a mini host computer of edge calculation with heat dissipation function, includes host computer shell and is located the main control PCBA of host computer shell, the host computer shell is including upper cover, center and the drain pan that connects gradually, the upper cover is equipped with the grid board towards outside one side for ventilation and dustproof.

In some embodiments, the main control PCBA is provided with a Jetson platform core module and a fan which are arranged in a mutually-clinging manner, the Jetson platform core module is installed on the main control PCBA through a spring piece, and the fan is located above the Jetson platform core module.

In some embodiments, the Jetson platform core module and fan are located on a side of the master PCBA that is adjacent to the upper cover.

In some embodiments, the middle frame is provided with an interface baffle for an external interface to access the mini-host.

In some embodiments, the interface baffle is disposed on the middle frame by embedding.

In some embodiments, the heat dissipating fan surface is coated with a thermally conductive silicone.

In some embodiments, the bottom case and the master PCBA are connected by studs and screws.

In some embodiments, the upper cover, the middle frame, and the bottom case are connected by screws.

Compared with the prior art, the utility model has the following beneficial effects:

According to the utility model, passive heat dissipation and active heat dissipation are combined, and heat generated by the Jetson platform core module is efficiently dissipated through the heat dissipation fan in the host shell, so that efficient operation of the edge computing mini-host is ensured. In addition, the utility model has simple structure, convenient disassembly and maintenance, can be compatible with different main control PCBA, can be customized according to the requirement and has wide application range.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:

FIG. 1 is a schematic diagram of an edge computing mini-host with heat dissipation function according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of an edge computing mini-host with heat dissipation according to an embodiment of the present utility model;

FIG. 3 is an exploded view of an edge computing mini-host with heat dissipation in accordance with an embodiment of the present utility model;

fig. 4 is a layout assembly schematic diagram of an edge computing mini-host with heat dissipation function according to an embodiment of the utility model.

In the drawings, a host shell, a 2-upper cover, a 3-middle frame, a 4-bottom shell, a 5-interface baffle, a 6-main control PCBA, a 7-module, an 8-fan, a 9-Jetson platform core module, a 10-shrapnel, a 11-grid plate, 12-screws, 13-studs and 14-silica gel plugs are arranged.

Detailed Description

For the purpose of making apparent the objects, technical solutions and advantages of the present utility model, the present utility model will be further described in detail with reference to the following examples and the accompanying drawings, wherein the exemplary embodiments of the present utility model and the descriptions thereof are for illustrating the present utility model only and are not to be construed as limiting the present utility model. It should be noted that the present utility model is already in a practical development and use stage.

In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. In addition, the terms "first," "second," etc. of the present utility model are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed" on another element, it can be disposed on the surface or in the interior of the element.

Throughout the specification and claims, unless explicitly stated otherwise, the term "comprise" or variations thereof such as "comprises" or "comprising", etc. will be understood to include the stated element or component without excluding other elements or components.

Aiming at the problems that the efficiency of an air cooling heat dissipation structure adopted by an edge computer of the conventional Jetson platform is influenced by temperature and air flow, the noise is large, the heat dissipation area is limited, the position and space requirements are difficult to meet, the energy consumption is high and the like, the utility model provides an edge computing mini-host with a heat dissipation function, and the air cooling heat dissipation is utilized to effectively solve the heat dissipation structural design within a limited space range, so that the main control PCBA can work normally.

The embodiment of the utility model solves the technical problems by the following thought that 1) the efficiency is influenced by temperature and air flow, namely the air cooling heat dissipation efficiency is influenced by a plurality of factors such as temperature and air flow, and the design and matching of a radiator and a fan are not accurate enough. A solution to this problem is to design the heat sink close to the heat source as an efficient heat sink structure and tailor it to the use scenario of the user and the characteristics of the device. 2) Noise-the problem of noise generated by a fan is the mass and rotational speed of the fan. A method for solving this problem is to use a low noise fan and reduce the rotation speed of the fan by intelligent control so as to reduce noise as much as possible. 3) The heat dissipation area is limited, and the design and manufacturing cost of the heat sink cannot infinitely expand the area of the heat sink. The solution to this problem is to use a more efficient heat dissipation structure or increase the number of heat sinks, or to supplement it with other passive heat dissipation methods. 4) Position and space requirements the problem of position and space requirements is that the installation position and surrounding space of the fan and the radiator are not taken into account in the design of the device. The method for solving the problem is to reasonably layout and optimize the device hardware design stage, ensure that the radiator and the fan can be installed at proper positions and occupy smaller space. 5) Energy consumption the problem of the fan consuming additional energy is that the fan needs to be rotated to generate wind power, thereby consuming additional electric energy. The method for solving the problem is to adopt an intelligent fan control technology to adaptively adjust the rotating speed of the fan according to the load condition of equipment, thereby reducing the electric energy consumption as much as possible. In addition to the above-mentioned methods, in actually solving the air-cooled heat dissipation problem, there is also a need to optimize design and improve technology through continuous experiments and tests, thereby improving heat dissipation efficiency and reducing the influence of drawbacks.

The embodiment of the utility model comprises a middle frame, a radiator, an upper cover and a bottom shell, wherein the middle frame and the radiator are manufactured through an aluminum extrusion die, the upper cover and the bottom shell are manufactured through a plastic die, and accessories such as a fan, an elastic sheet, a screw, a heat conducting silica gel sheet and the like are assembled with a main control PCBA together, and the heating element and the radiator are tightly adhered together.

The mini-host combines the application scene of the edge calculation, integrates a plurality of common equipment interfaces such as a camera and a display interface, an Ethernet interface, an M.2 interface and the like, can meet most industrial scenes, can realize the miniaturization of the edge computer, saves the equipment volume and is applicable to more scenes.

Specifically, as shown in fig. 1 and 2, the edge computing mini-host with the heat dissipation function comprises a host shell 1 and a main control PCBA6 located in the host shell 1, wherein the host shell 1 comprises an upper cover 2, a middle frame 3 and a bottom shell 4 which are sequentially connected, and a grid plate 11 is arranged on one surface of the upper cover 2 facing the outer side and used for ventilation and dust prevention. Fig. 1 and 2 are schematic diagrams of the assembled present utility model, fig. 1 shows the present utility model from the perspective of the upper cover 2, and fig. 2 shows the present utility model from the perspective of the bottom cover 4. The upper cover 2, the middle frame 3 and the bottom shell 4 can be connected in a detachable manner (such as a screw 12, a clamping manner and the like) or in a fixed manner (such as bonding), and the three parts are connected through the screw 12, so that the subsequent PCBA board is convenient to add or reduce devices or maintenance operations. The present utility model is provided with a grating plate 11 on the outside of the upper cover 2 for ventilation and dust prevention.

In some embodiments, the present utility model is provided with a grating plate 11 on the outside of the upper cover 2 for ventilation and dust prevention.

In order to more clearly show the internal structure of the present utility model, please refer to fig. 3, fig. 3 shows an exploded view of an edge computing mini-host with heat dissipation function in this embodiment, in some embodiments, in order to further enhance heat dissipation efficiency, the main control PCBA6 is equipped with a Jetson platform core module 9 and a fan 8 that are disposed in close proximity to each other, the Jetson platform core module 9 is mounted on the main control PCBA6 through a spring 10, and the fan 8 is located above the Jetson platform core module 9. The spring plate 10 is made of stainless steel. Optionally, the core modules 9 and the spring plates 10 of the fans 8 and Jetson are assembled together by screws 12 to form a module 7, as shown in fig. 4, so that the simulation host of the embodiment is assembled by the module 7, the left baffle, the right baffle and the bottom shell 4, and has simple structure and convenient disassembly and maintenance. The heat generated by the Jetson platform core module 9 is discharged to the grating plate 11 through the fan 8, the grating plate 11 absorbs heat, the effect of air guiding can be achieved besides dust prevention, the heat is regularly guided out, and the heat dissipation efficiency is improved. Optionally, the bottom case 4 and the main control PCBA6 are connected by a stud 13 and a screw 12. The upper cover 2, the middle frame 3 and the bottom shell 4 are connected through screws 12.

In some embodiments, to further enhance the heat dissipation efficiency, the Jetson platform core module 9 and fan 8 are located on the side of the master PCBA6 that is adjacent to the upper cover 2. The heat discharged by the fan 8 is further led out of the main machine shell in a relay mode, so that the heat dissipation efficiency is enhanced.

In some embodiments, the middle frame 3 is provided with an interface baffle 5 for an external interface to access the mini-host. The number of the interface baffles 5 can be one or more, for example, the interface baffles 5 are respectively arranged on two opposite sides of the middle frame 3, and the number and the shape of the interfaces can be set according to requirements. Alternatively, the interface baffle 5 may be directly disposed on the middle frame 3, or may be disposed on the middle frame 3 in an embedded manner. In addition, optionally, the side of the middle frame 3 may be provided with a plurality of through holes for the external wires or plugs to pass through, so that the silica gel plug 14 can be plugged when not in use at ordinary times to prevent dust from entering.

In some embodiments, in order to enhance the heat dissipation efficiency, the surface of the heat dissipation fan 8 is coated with heat conductive silicone grease, so that the heat absorption capacity of the heat dissipation fan 8 and the heat dissipation efficiency are further improved.

Optionally, copper blocks can be correspondingly replaced according to different heating elements within a certain size range to be compatible with different main control PCBA6, the left baffle and the right baffle are aluminum profiles, and the openings on the side surfaces can be customized by self.

It should be noted that, for the sake of simplicity of description, the foregoing embodiments are all described as a series of combinations of actions, but it should be understood by those skilled in the art that the present application is not limited by the order of actions described, as some steps may be performed in other order or simultaneously according to the present application. Further, those skilled in the art will also appreciate that the embodiments described in the specification are all preferred embodiments, and that the acts and modules referred to are not necessarily required for the present application.

The foregoing detailed description of the utility model has been presented for purposes of illustration and description, and it should be understood that the foregoing is by way of illustration and example only, and is not intended to limit the scope of the utility model.

Claims (8)

1. An edge computing mini host with heat dissipation function, characterized in that it includes a host shell and a main control PCBA located in the host shell, the host shell includes an upper cover, a middle frame and a bottom shell connected in sequence, and the upper cover is provided with a grille plate on the outer side for ventilation and dust prevention. 2. According to claim 1, an edge computing mini host with heat dissipation function is characterized in that the main control PCBA is equipped with a Jetson platform core module and a fan that are closely arranged to each other, the Jetson platform core module is installed on the main control PCBA through a spring clip, and the fan is located above the Jetson platform core module. 3. An edge computing mini host with heat dissipation function according to claim 2, characterized in that the Jetson platform core module and the fan are located on a side of the main control PCBA close to the upper cover. 4. According to the edge computing mini host with heat dissipation function described in claim 1, it is characterized in that the middle frame is provided with an interface baffle for allowing an external interface to access the mini host. 5. An edge computing mini host with heat dissipation function according to claim 4, characterized in that the interface baffle is embedded in the middle frame. 6. An edge computing mini host with heat dissipation function according to claim 2 or 3, characterized in that the surface of the fan is coated with thermal grease. 7. An edge computing mini host with heat dissipation function according to claim 6, characterized in that the bottom shell and the main control PCBA are connected by studs and screws. 8. An edge computing mini host with heat dissipation function according to claim 7, characterized in that the upper cover, the middle frame and the bottom shell are connected by screws.