CN222869198U - A heat dissipation chassis - Google Patents
A heat dissipation chassis Download PDFInfo
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- CN222869198U CN222869198U CN202421763904.5U CN202421763904U CN222869198U CN 222869198 U CN222869198 U CN 222869198U CN 202421763904 U CN202421763904 U CN 202421763904U CN 222869198 U CN222869198 U CN 222869198U
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Abstract
本实用新型属于电子器件散热技术领域，公开了一种散热机箱，包括箱体、第一导热结构、第二导热结构和第一风扇。箱体形成容纳发热元件的容纳空间。第一导热结构包括基板，基板形成箱体的部分侧壁，发热元件安装于基板上。第二导热结构位于容纳空间中，第二导热结构连接于基板，第二导热结构将容纳空间内空气中的热量经过基板传递到箱体外部。第一风扇连接于箱体的内壁，第一风扇对应设置于第二导热结构。该散热机箱能够增加箱体内部空气的热对流，实现热量的均匀扩散，增加箱体对外的辐射散热，提高散热效率。
The utility model belongs to the technical field of heat dissipation of electronic devices, and discloses a heat dissipation chassis, including a chassis, a first heat-conducting structure, a second heat-conducting structure and a first fan. The chassis forms a storage space for accommodating a heating element. The first heat-conducting structure includes a substrate, which forms part of the side wall of the chassis, and the heating element is mounted on the substrate. The second heat-conducting structure is located in the storage space, and the second heat-conducting structure is connected to the substrate. The second heat-conducting structure transfers the heat in the air in the storage space to the outside of the chassis through the substrate. The first fan is connected to the inner wall of the chassis, and the first fan is correspondingly arranged on the second heat-conducting structure. The heat dissipation chassis can increase the thermal convection of the air inside the chassis, realize uniform diffusion of heat, increase the external radiation heat dissipation of the chassis, and improve the heat dissipation efficiency.
Description
Technical Field
The utility model relates to the technical field of heat dissipation of electronic devices, in particular to a heat dissipation case.
Background
With the rapid development of electronic and electric technologies, the modularization and integration level of electronic devices are greatly improved, the higher the integration level is, the higher the heat generated by the electronic devices is, the working stability of the electronic devices is reduced, if the heat cannot be timely dissipated, the working reliability of the electronic devices is greatly reduced, even the electronic devices cannot normally operate, and in order to ensure that the heating electronic devices can normally operate, a heat dissipation machine box is usually arranged on the heating electronic devices, and the generated heat is discharged.
The heat dissipation machine box used at present carries out heat exchange between one side of the heat exchange plate and hot air flow in the machine box, and between the other side of the heat exchange plate and cold air flow outside the machine box, so that heat dissipation of heating electronic devices in the machine box is realized, the heat dissipation machine box is severely dependent on the surface of the machine box to carry out external radiation heat dissipation, and the heat dissipation efficiency is low.
Therefore, a radiator case is needed to solve the above-mentioned problems.
Disclosure of utility model
The utility model aims to provide a radiating machine case which can increase heat convection of air in the machine case and air flow outside the machine case, increase radiation heat dissipation of the machine case to the outside and improve heat dissipation efficiency.
To achieve the purpose, the utility model adopts the following technical scheme:
provided is a heat dissipating chassis including:
the box body forms an accommodating space for accommodating the heating element;
The first heat conduction structure comprises a substrate, wherein the substrate forms part of the side wall of the box body, and the heating element is arranged on the substrate;
The second heat conduction structure is positioned in the accommodating space and connected with the base plate, and the second heat conduction structure transfers heat in the air in the accommodating space to the outside of the box body through the base plate;
the first fan is connected to the inner wall of the box body, and the first fan is correspondingly arranged in the second heat conduction structure.
As an alternative scheme of heat dissipation machine case, heat dissipation machine case still includes wind channel bent plate, wind channel bent plate both ends connect in the base plate forms first wind channel, the second heat conduction structure is located in the first wind channel, first fan correspond set up in the air intake in first wind channel.
As an alternative of the heat dissipating chassis, the air duct bending plate includes a main body portion and a flaring portion, the main body portion forms the first air duct, and the flaring portion is connected to an end of the main body portion facing the first fan.
As an alternative of the heat dissipation case, the second heat conduction structure includes a heat conduction portion and a second heat dissipation fin, the heat conduction portion is connected to the substrate, and the second heat dissipation fin is connected to a surface of the heat conduction portion facing the first air duct.
As an alternative of the heat dissipation case, the heat dissipation case includes a plurality of second heat conduction structures, and the plurality of second heat conduction structures are connected to the substrate and located in the first air duct.
As an alternative to the heat dissipation case, the heat dissipation case includes a plurality of first fans, at least one of the first fans into the first air duct, and at least one of the first fans into the heating element.
As an alternative of the heat dissipation case, the first heat conduction structure further includes a first heat dissipation fin, and the first heat dissipation fin is connected to a surface of the substrate, which faces away from the case body.
As an alternative to the heat dissipating case, the heat dissipating case further includes a second fan, which is connected to the outside of the case and is used for blowing air to the first heat conducting structure.
As an alternative scheme of the heat dissipation case, the heat dissipation case further comprises an outer air channel plate, the outer air channel plate is connected to the outer side of the case, the outer air channel plate forms a second air channel, and the outer air channel plate covers the first heat conduction structure and the second fan.
As an alternative scheme of the heat dissipation case, the second air duct comprises an upper air duct and a lower air duct which are mutually communicated, the cross section area of the upper air duct is larger than that of the lower air duct, the second fan is located in the upper air duct, and the first heat conduction structure is located in the lower air duct.
The utility model has the beneficial effects that:
The utility model provides a heat dissipation case which comprises a case body, a first heat conduction structure, a second heat conduction structure and a first fan, wherein a heating element is arranged in an accommodating space formed by the case body, a base plate of the first heat conduction structure forms part of the side wall of the case body, the heating element is arranged on the base plate and can directly transfer heat to the first heat conduction structure, the first fan can fan the second heat conduction structure in the accommodating space, so that circulating flowing air flow can be formed in the accommodating space, the heat convection of air in the case body is increased, uniform heat diffusion is realized, the situation of local high temperature in the case body is reduced, the heating element can transfer heat to the circulating air flow, the circulating air flow can transfer heat to the second heat conduction structure, and the second heat conduction structure can transfer heat to the first heat conduction structure, so that the heat in the case body is further transferred to the outside of the case body. The heat dissipation case has good heat flow effect in the case body, ensures that the temperature of each part in the case body is uniform, is beneficial to guaranteeing the service life of each part, and improves the efficiency of heat transfer from the inside of the case body to the outside of the case body and the heat dissipation effect through the connection of the first heat conduction structure and the second heat conduction structure.
Drawings
Fig. 1 is a schematic diagram of a first heat conduction structure and a second heat conduction structure of a heat dissipation chassis provided by the present utility model;
FIG. 2 is a schematic diagram of the internal structure of a second air duct of the heat dissipating case provided by the present utility model;
fig. 3 is a schematic diagram of a box body of a heat dissipating box provided by the present utility model;
FIG. 4 is a schematic diagram of airflow in a heat dissipating chassis provided by the present utility model;
Fig. 5 is a schematic diagram of an air flow in an outer air duct board of a heat dissipating chassis according to the present utility model.
In the figure:
1. 11, accommodating space;
2. 21, the base plate 22, the first radiating fin;
3. 31, second radiating fins;
4. A first fan;
5. An air duct bending plate; 51, a first air duct, 52, a main body part, 53 and a flaring part;
6. a second fan;
7. an outer air duct plate, 71, a second air duct, 711, an upper air duct, 712, and a lower air duct.
Detailed Description
The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.
In the description of the present utility model, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may, for example, be fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
As shown in fig. 1 to 3, the heat dissipating case of the present embodiment includes a case 1, a first heat conductive structure 2, a second heat conductive structure 3, and a first fan 4. The case 1 forms an accommodating space 11 accommodating the heating element. The first heat conducting structure 2 includes a substrate 21, the substrate 21 forms part of the side wall of the case 1, and the heating element is mounted on the substrate 21. The second heat conducting structure 3 is located in the accommodating space 11, the second heat conducting structure 3 is connected to the base plate 21, and the second heat conducting structure 3 transfers heat in air in the accommodating space 11 to the outside of the box body 1 through the base plate 21. The first fan 4 is connected to the inner wall of the case 1, and the first fan 4 is correspondingly disposed on the second heat conducting structure 3.
In the heat dissipation case, a heating element is arranged in an accommodating space 11 formed by a case body 1, a base plate 21 of a first heat conduction structure 2 forms part of the side wall of the case body 1, the heating element is arranged on the base plate 21 and can directly transfer heat to the first heat conduction structure 2, a first fan 4 can fan air into a first air duct 51, so that circulating flowing air flow can be formed between the inside of the first air duct 51 and the outside of the first air duct 51 in the accommodating space 11, the heat convection of air in the case body 1 is increased, uniform heat diffusion is realized, the situation of local high temperature in the case body 1 is reduced, the heating element can transfer heat to circulating air flow, the circulating air flow can transfer heat to a second heat conduction structure 3, the second heat conduction structure 3 can transfer heat to the first heat conduction structure 2, and the heat in the case body 1 is further transferred to the outside of the case body 1. This heat dissipation machine case has good heat flow effect in box 1 to through the connection of first heat conduction structure 2 and second heat conduction mechanism 3, improve the efficiency of the heat transfer in the box 1 to the box 1 outside, improve the radiating effect.
Optionally, the heat dissipation case includes a plurality of first fans 4, at least one first fan 4 fans into the first air duct 51, and at least one first fan 4 fans into the heating element. The first fan 4 for fanning the heating element is arranged, so that the heat dissipation efficiency of the heating element to the air can be improved, the flow speed of the air flow in the accommodating space 11 can be increased, the heat transfer efficiency in the box body 1 is improved, and the uniform diffusion of the temperature of each element in the box body 1 is further ensured. In this embodiment, two first fans 4 are disposed on two sides of the substrate 21 in a staggered manner, and the fan directions of the two first fans 4 are opposite, so as to enhance the circulation effect of the air flow.
Further, this heat dissipation machine case still includes wind channel bent plate 5, wind channel bent plate 5 both ends are connected in base plate 21 and are formed first wind channel 51, second heat conduction structure 3 is located first wind channel 51, first fan 4 corresponds the air intake that sets up in first wind channel 51, can fan in first wind channel 51, gather the air that flows in first wind channel 51 for the air can be more concentrated to the heat transfer of second heat conduction structure 3, improve to the thermal efficiency, also can keep apart the flow path that forms the air outside wind channel bent plate 5 simultaneously, make the air can regular circulation flow.
Optionally, the air duct bending plate 5 includes a main body portion 52 and a flaring portion 53, the main body portion 52 forms a first air duct 51, the flaring portion 53 is connected to one end of the main body portion 52 facing the first fan 4, the flaring portion 53 is used for enlarging an air inlet of the first air duct 51, and when the first fan 4 fans air in the flaring portion 53, the air inlet of the first air duct 51 can be increased, and the flow rate of circulating air flow in the accommodating space 11 can be improved. When the airflow flows from the flare 53 into the main body 52, the airflow flow velocity in the main body 52 can be increased due to the smaller airflow passage cross-sectional area, so that the airflow velocity in the accommodating space 11 can be further increased, and the heat dissipation efficiency in the case 1 can be improved.
Further, the heat dissipation chassis includes a plurality of second heat conduction structures 3, the plurality of second heat conduction structures 3 are connected to the substrate 21 and located in the first air duct 51, and the plurality of second heat conduction structures 3 can simultaneously transfer heat to the first heat conduction structures 2, so that the efficiency of heat dissipation from the interior of the chassis 1 to the exterior is improved. In this embodiment, three second heat conducting mechanisms 3 are provided, and three second heat conducting mechanisms 3 are provided along the direction of the air flow in the first air duct, and in some other embodiments, the number of second heat conducting mechanisms 3 may be two, four, five, or the like.
Alternatively, the second heat conducting structure 3 includes a heat conducting portion (not shown in the drawings) connected to the base plate 21 and a second heat radiating fin 31 connected to a side of the heat conducting portion facing the first air duct 51. The second heat dissipation fins 31 are arranged in a plurality, the second heat dissipation fins 31 are arranged at intervals in the direction perpendicular to the air flow in the first air duct 51 and extend along the air flow direction, and the heat transferred from the air flow to the second heat dissipation fins 31 is increased by increasing the contact area between the second heat conduction structure 3 and the air flow in the first air duct 51, so that the heat transfer efficiency of the second heat conduction structure 3 to the first heat conduction structure 2 is improved.
In this embodiment, the first heat conducting structure 2 is a radiator, the second heat conducting structure 3 is connected to the substrate 21 of the first heat conducting structure 2 through a connecting piece, so that too many adjustments do not need to be made on the original heating element inside the box 1 and the layout of the second heat conducting structure 3, so that the heat dissipation requirements of most of the box 1 can be met, the structure is simple, and the manufacturing process is mature. Alternatively, the second heat conductive structure 3 may be connected to the substrate 21 by welding, riveting or bolting, etc., so as to facilitate the installation of the second heat conductive structure 3.
In order to improve the efficiency of the second heat conduction structure 3 transferring heat to the first heat conduction structure 2, in some other embodiments, the first heat conduction structure 2 and the second heat conduction structure 3 are arranged as an integrated structure, so that the efficiency of heat dissipation from the inside of the box body 1 to the outside is improved, meanwhile, the production process can be simplified, and the manufacturing cost is saved.
Further, the first heat conducting structure 2 further includes a first heat dissipating fin 22, and the first heat dissipating fin 22 is connected to a surface of the base plate 21 facing away from the case 1. The first heat radiating fins 22 can increase the contact area between the first heat conducting structure 2 and the air, and improve the heat radiating efficiency of the first heat conducting structure 2 in the air. Specifically, the plurality of first heat dissipation fins 22 are provided, and the plurality of first heat dissipation fins 22 are arranged at intervals in the direction perpendicular to the fan direction of the second fan 6 and extend towards the fan direction, so that the flow speed of the cold air on the surface of the first heat dissipation fins 22 is ensured to the maximum extent, and the heat dissipation effect of the first heat conduction structure 2 is ensured.
Further, the heat dissipation case further comprises a second fan 6, the second fan 6 is connected to the outside of the case 1 and is used for blowing air to the first heat conduction structure 2, so that the air flow speed of the surface of the first heat conduction structure 2 is improved, and the heat dissipation effect of the first heat conduction structure 2 is further improved.
Optionally, the heat dissipating chassis includes a plurality of second fans 6, and the plurality of second fans 6 are connected to the outside of the case 1, so as to improve the efficiency of heat transfer from the first heat conducting structure 2 to the control. In the present embodiment, four second fans 6 are provided, and in some other embodiments, two, three, five, etc. second fans 6 may be provided.
Further, the heat dissipation case further comprises an outer air duct plate 7, the outer air duct plate 7 is connected to the outer side of the case body 1, the outer air duct plate 7 forms a second air duct 71, the outer air duct plate 7 is covered on the first heat conduction structure 2 and the second fan 6, circulating flow of air outside the second air duct 71 and the outer air duct plate 7 is achieved under the operation of the second fan 6, heat transfer of the first heat conduction structure 2 and cold air is facilitated, and heat dissipation efficiency is improved.
Further, the second air duct 71 includes an upper air duct 711 and a lower air duct 712 that are mutually communicated, the cross-sectional area of the upper air duct 711 is larger than that of the lower air duct 712, the second fan 6 is located in the upper air duct 711, the first heat conducting structure 2 is located in the lower air duct 712, and when cold air enters the lower air duct 712 from the upper air duct 711, the air flow velocity in the lower air duct 712 is larger than that in the upper air duct 711 due to the reduced cross-sectional area of the air duct, which is beneficial to improving the heat dissipation efficiency of the first heat conducting structure 2.
Referring to fig. 4 and 5, in the heat dissipating chassis provided in the present embodiment, a heating element is mounted on the top of a substrate 21, a second heat conducting structure 3 is connected to the bottom of the substrate 21, that is, the heating element is mounted above the second heat conducting structure 3, one first fan 4 is mounted on the left side of the second heat conducting structure 3, and the other first fan 4 is mounted on the right side of the heating element. When the heating element works to generate heat, the heating element transfers heat to the air in the accommodating space 11, the first fan 4 positioned on the right side of the heating element fans the heating element to enable the air on the surface of the heating element to flow, the first fan 4 on the left side of the second heat conduction structure 3 can fan the first air duct 51, the two first fans 4 can enable the air in the accommodating space 11 to circularly flow inside and outside the first air duct 51, and the heat in the air transfers heat to the second radiating fins 31 in the first air duct 51, so that the circulation transfer of the heat inside the box 1 is realized. The heat on the second radiating fin 31 is transferred to the bottom of the base plate 21 through the heat conducting part, the heating element can also directly transfer heat to the top of the base plate 21, the heat of the base plate 21 is transferred to the first radiating fin 22, the second fan 6 is arranged below the first heat conducting structure 2, the second fan 6 fans the first radiating fin 22 in the second air duct 71, so that the air on the surface of the first radiating fin 22 flows, the heat transfer from the first radiating fin 22 to the cold air in the second air duct 71 is realized, the circulation heat dissipation outside the box body 1 is realized, and the heat dissipation to the heating element is finally realized.
It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.
Claims (10)
1. A heat dissipating chassis, comprising:
a case (1), the case (1) forming an accommodating space (11) accommodating the heating element;
A first heat conduction structure (2), wherein the first heat conduction structure (2) comprises a base plate (21), the base plate (21) forms part of the side wall of the box body (1), and the heating element is mounted on the base plate (21);
The second heat conduction structure (3), the second heat conduction structure (3) is located in the accommodating space (11), the second heat conduction structure (3) is connected to the base plate (21), and the second heat conduction structure (3) transfers heat in the air in the accommodating space (11) to the outside of the box body (1) through the base plate (21);
The first fan (4), first fan (4) connect in the inner wall of box (1), first fan (4) correspond set up in second heat conduction structure (3).
2. The heat dissipation chassis according to claim 1, further comprising an air duct bending plate (5), wherein two ends of the air duct bending plate (5) are connected to the base plate (21) to form a first air duct (51), the second heat conduction structure (3) is located in the first air duct (51), and the first fan (4) is correspondingly arranged at an air inlet of the first air duct (51).
3. The heat dissipation chassis according to claim 2, wherein the air duct bending plate (5) includes a main body portion (52) and a flaring portion (53), the main body portion (52) forms the first air duct (51), and the flaring portion (53) is connected to an end of the main body portion (52) facing the first fan (4).
4. The heat dissipation chassis according to claim 2, wherein the second heat conduction structure (3) includes a heat conduction portion and a second heat dissipation fin (31), the heat conduction portion is connected to the base plate (21), and the second heat dissipation fin (31) is connected to a face of the heat conduction portion facing the first air duct (51).
5. The heat dissipating chassis according to claim 2, wherein the heat dissipating chassis comprises a plurality of the second heat conducting structures (3), the plurality of the second heat conducting structures (3) being connected to the substrate (21) and located in the first air duct (51).
6. The heat dissipating chassis according to claim 2, wherein the heat dissipating chassis comprises a plurality of the first fans (4), at least one of the first fans (4) fanning into the first air duct (51), at least one of the first fans (4) fanning into the heat generating element.
7. The heat dissipation chassis according to claim 1, wherein the first heat conduction structure (2) further comprises a first heat dissipation fin (22), and the first heat dissipation fin (22) is connected to a surface of the substrate (21) facing away from the case (1).
8. The heat dissipating chassis according to claim 1, further comprising a second fan (6), said second fan (6) being connected outside said housing (1) and being adapted to blow air towards said first heat conducting structure (2).
9. The heat dissipation chassis according to claim 8, further comprising an outer air duct plate (7), the outer air duct plate (7) being connected to the outside of the case (1), the outer air duct plate (7) forming a second air duct (71), the outer air duct plate (7) being covered by the first heat conducting structure (2) and the second fan (6).
10. The heat dissipation chassis according to claim 9, wherein the second air duct (71) comprises an upper air duct (711) and a lower air duct (712) which are communicated with each other, a cross-sectional area of the upper air duct (711) is larger than a cross-sectional area of the lower air duct (712), the second fan (6) is located in the upper air duct (711), and the first heat conduction structure (2) is located in the lower air duct (712).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421763904.5U CN222869198U (en) | 2024-07-24 | 2024-07-24 | A heat dissipation chassis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421763904.5U CN222869198U (en) | 2024-07-24 | 2024-07-24 | A heat dissipation chassis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222869198U true CN222869198U (en) | 2025-05-13 |
Family
ID=95615756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421763904.5U Active CN222869198U (en) | 2024-07-24 | 2024-07-24 | A heat dissipation chassis |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222869198U (en) |
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2024
- 2024-07-24 CN CN202421763904.5U patent/CN222869198U/en active Active
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