CN222851405U - A solid crystal transfer mechanism - Google Patents

Abstract

The utility model relates to the technical field of crystal bonding equipment, and specifically discloses a crystal bonding transfer mechanism, comprising a plurality of crystal bonding platforms arranged at intervals and a support transfer manipulator for performing support transfer operations between the crystal bonding platforms. The crystal bonding transfer mechanism provided by the utility model can effectively solve the problem of low crystal bonding precision caused by using an assembly line for crystal bonding.

Description

Solid brilliant transfer mechanism

Technical Field

The utility model relates to the technical field of die bonding equipment, in particular to a die bonding transfer mechanism.

Background

One of the working procedures of the Mini-LED die bonding operation is to put RGB three-color chips into a bracket one by one in sequence. Currently, the bracket is generally placed on a production line:

The support moves to the R chip die bonding equipment along with the assembly line, and the R chip die bonding equipment is placed into the R chip;

The bracket moves to the G chip die bonding equipment along with the assembly line, and the G chip die bonding equipment is placed into the G chip;

and finally, the bracket moves to the die bonding equipment of the chip B along with the assembly line, and the die bonding equipment of the chip B is placed into the chip B.

The following problems exist in using the assembly line to perform the stent transferring operation:

Accurate location is difficult to realize in assembly line pay-off, namely, when the assembly line sent the support to solid brilliant equipment department, only sent a roughly solid brilliant scope with the support to can not transport the support to a certain position accurately, because support positioning accuracy is lower, solid brilliant precision is also lower.

Therefore, the existing bracket transferring mode needs to be improved so as to solve the problem that the die bonding precision is lower due to die bonding by using a production line.

The above information disclosed in this background section is only included to enhance understanding of the background of the disclosure and therefore may contain information that does not form the prior art that is presently known to those of ordinary skill in the art.

Disclosure of utility model

The utility model aims to provide a die bonding transfer mechanism which can effectively solve the problem of lower die bonding precision caused by die bonding by using a production line.

In order to achieve the above purpose, the utility model provides a die bonding transfer mechanism, which comprises a plurality of die bonding platforms arranged at intervals and a bracket transfer manipulator for carrying out bracket transfer operation between the die bonding platforms.

Optionally, the bracket transferring manipulator comprises a clamping mechanism and a manipulator linear driving mechanism for driving the clamping mechanism to reciprocate along the arrangement direction of the die bonding platforms.

Optionally, the clamping mechanism includes:

The transverse sliding plate is arranged at the driving end of the linear driving mechanism of the manipulator;

the longitudinal sliding plate is slidably arranged on the transverse sliding plate;

The longitudinal driving mechanism is arranged on the transverse sliding plate and used for driving the longitudinal sliding plate to slide up and down relative to the transverse sliding plate;

The clamping assemblies are arranged oppositely and are connected with the longitudinal sliding plate in a sliding manner;

The clamping linear driving mechanism is arranged on the longitudinal sliding plate, is in transmission connection with the two clamping assemblies and is used for driving the two clamping assemblies to be close to each other and clamp the bracket or to be far away from each other and release the bracket.

Optionally, the clamping assembly includes:

the sliding arm is in sliding connection with the longitudinal sliding plate, and a plurality of mounting holes are formed in the sliding arm;

the fixed clamping block is fixedly arranged at one end of the sliding arm;

the adjustable clamping blocks are fixedly arranged on any mounting hole.

Optionally, both the fixed clamping block and the adjustable clamping block are provided with positioning clamping grooves for clamping the bracket.

Optionally, a material sensor for detecting the material of the bracket is arranged at the bottom of the positioning clamping groove.

Optionally, the clamping linear driving mechanism includes:

The double-headed motor is arranged on the longitudinal sliding plate;

The first screw rod is connected with one driving end of the double-headed motor, and is in threaded connection with one sliding arm;

The second screw rod is connected with the other driving end of the double-headed motor, and is in threaded connection with the other sliding arm;

wherein, the screw thread direction of the first lead screw and the second lead screw is opposite.

Optionally, the die bonding platform includes the workstation that is used for accepting the support and is located the electronic cross slip table of workstation below.

Optionally, the electric cross sliding table comprises a first sliding table linear driving mechanism for driving the workbench to reciprocate along a first direction and a second sliding table linear driving mechanism for driving the workbench to reciprocate along a second direction;

wherein the first direction is perpendicular to the second direction.

The die bonding transfer mechanism has the beneficial effects that when the die bonding transfer mechanism is needed to transfer the bracket, the bracket is taken out from one die bonding platform by the bracket transfer manipulator and then placed on the other die bonding platform, and the material transfer operation precision of the manipulator is higher, so that the bracket transfer manipulator can accurately transfer the bracket to each die bonding platform, and the positioning precision of the bracket can be improved, and the die bonding precision is further improved.

Therefore, the die bonding transfer mechanism provided by the utility model can effectively solve the problem of lower die bonding precision caused by die bonding by using the assembly line.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.

FIG. 1 is a schematic diagram of a die attach mechanism according to an embodiment;

fig. 2 is a schematic structural diagram of a clamping mechanism according to an embodiment.

In the figure:

100. a die bonding platform;

200. a stent transferring manipulator;

1. The clamping mechanism comprises a clamping mechanism, a transverse sliding plate, a 102, a longitudinal sliding plate, a 103, a longitudinal driving mechanism, a 104, a clamping assembly, a 1041, a sliding arm, a 1041a, a mounting hole, a 1042, a fixed clamping block, a 1043, an adjustable clamping block, a 1044, a positioning clamping groove, a 1045, a material sensor, a 105, a clamping linear driving mechanism, a 1051, a double-head motor, a 1052, a first screw rod, a 1053 and a second screw rod;

2. a manipulator linear driving mechanism;

3. A work table;

4. The device comprises an electric cross sliding table, a first sliding table linear driving mechanism, a second sliding table linear driving mechanism and a first sliding table linear driving mechanism.

Detailed Description

In order to make the objects, features and advantages of the present utility model more obvious and understandable, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model, and it is apparent that the embodiments described below are only some embodiments of the present utility model, not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it will be understood that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

Furthermore, the terms "long," "short," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship based on that shown in the drawings, for convenience of description of the present utility model, and are not intended to indicate or imply that the apparatus or elements referred to must have this particular orientation, operate in a particular orientation configuration, and thus should not be construed as limiting the utility model.

The present utility model will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments are not intended to limit the utility model and structural, methodological, or functional modifications of these embodiments that may be made by one of ordinary skill in the art are included within the scope of the utility model.

The utility model provides a die bonding and transferring mechanism which is suitable for an application scene of transferring operation on a bracket in the die bonding process of a Mini-LED, and can effectively solve the problem of lower die bonding precision caused by die bonding by using a production line

Referring to fig. 1, in this embodiment, the die bonding transfer mechanism includes a plurality of die bonding stages 100 disposed at intervals and a carrier transfer robot 200 for performing carrier transfer operations between the die bonding stages 100.

Specifically, when the support needs to be transferred, the support transfer manipulator 200 takes the support out of one die bonding platform 100 and then places the support on another die bonding platform 100, and the material transfer precision of the manipulator is high, so that the support transfer manipulator 200 can accurately transfer the support onto each die bonding platform 100, and the positioning precision of the support can be improved, and the die bonding precision is improved.

Therefore, the die bonding transfer mechanism provided by the utility model can effectively solve the problem of lower die bonding precision caused by die bonding by using the assembly line.

In this embodiment, the rack transferring robot 200 includes a clamping mechanism 1 and a linear driving mechanism 2 for driving the clamping mechanism 1 to reciprocate along the arrangement direction of the die bonding stages 100.

Referring to fig. 2, the clamping mechanism 1 includes a transverse slide 101, a longitudinal slide 102, a longitudinal drive 103, a clamping assembly 104 disposed in opposition, and a clamping linear drive 105.

The transverse sliding plate 101 is mounted on the driving end of the manipulator linear driving mechanism 2. The longitudinal slide 102 is slidably mounted on the transverse slide 101. The longitudinal driving mechanism 103 is mounted on the transverse sliding plate 101 and is used for driving the longitudinal sliding plate 102 to slide up and down relative to the transverse sliding plate 101;

The clamping assembly 104 is slidably coupled to the longitudinal slide 102. The clamping linear driving mechanism 105 is mounted on the longitudinal sliding plate 102 and is in transmission connection with the two clamping assemblies 104, and is used for driving the two clamping assemblies 104 to approach each other and clamp the bracket or to separate from each other and release the bracket.

The clamping assembly 104 includes a sliding arm 1041, a fixed clamp block 1042, and an adjustable clamp block 1043. The sliding arm 1041 is slidably connected with the longitudinal sliding plate 102, and the sliding arm 1041 is provided with a plurality of mounting holes 1041a, the fixed clamping block 1042 is fixedly mounted at one end of the sliding arm 1041, and the adjustable clamping block 1043 is fixedly mounted on any one of the mounting holes 1041a (the distance between the two clamping blocks can be adjusted by mounting the adjustable clamping block to different mounting holes 1041a so as to adapt to different bracket size requirements). Both the fixed clamp 1042 and the adjustable clamp 1043 are provided with a positioning slot 1044 into which the bracket is clamped. The bottom of the positioning clamping groove 1044 is provided with a material sensor 1045 for detecting the material of the bracket.

Specifically, the clamping linear driving mechanism 105 includes a double-headed motor 1051, a first screw 1052, and a second screw 1053. The double-headed motor 1051 is mounted to the longitudinal slide 102. The first screw rod 1052 is connected to one driving end of the double-headed motor 1051, and the first screw rod 1052 is screwed to one of the slide arms 1041. The second screw rod 1053 is connected with the other driving end of the double-headed motor 1051, and the second screw rod 1053 is in threaded connection with the other sliding arm 1041. Wherein the threads of both the first screw 1052 and the second screw 1053 are opposite in direction.

When the mechanical arm linear driving mechanism 2 drives the clamping mechanism 1 to move to the die bonding platform 100, the longitudinal driving mechanism 103 drives the clamping assemblies 104 to move downwards to be parallel to the bracket, the double-headed motor 1051 rotates to drive the two clamping assemblies 104 to approach each other, meanwhile, the material sensor 1045 detects the position of the bracket, and when the bracket is detected to be clamped into the positioning clamping groove 1044, the double-headed motor 1051 can stop rotating. Then, after the vertical driving mechanism 103 drives the clamping assembly 104 to separate from the die bonding platform 100 upwards, the mechanical arm linear driving mechanism 2 transfers the bracket onto another die bonding platform 100, thereby completing the bracket transferring operation.

Optionally, the die bonding platform 100 includes a workbench 3 for receiving a bracket and an electric cross sliding table 4 located below the workbench 3. Specifically, the electric cross sliding table 4 comprises a first sliding table linear driving mechanism 401 for driving the workbench 3 to reciprocate along a first direction and a second sliding table linear driving mechanism 402 for driving the workbench 3 to reciprocate along a second direction, wherein the first direction is perpendicular to the second direction. The electric cross sliding table 4 can adjust the position of the workbench 3 in the front-back and left-right directions so as to adjust the position of the bracket according to the die bonding requirement of die bonding equipment, and further improve the positioning precision.

In this embodiment, each of the linear driving mechanisms is a motor screw assembly, so as to improve displacement control accuracy. Of course, in some other embodiments, each of the linear driving machines may be a cylinder, an electric cylinder, a belt linear driving assembly, etc., which is not limited to the present utility model.

In summary, the die bonding transfer mechanism provided in this embodiment has the following beneficial effects:

① The bracket transferring manipulator 200 can precisely transfer the bracket to each die bonding platform 100, so that the positioning accuracy of the bracket can be improved, and the die bonding accuracy can be further improved;

② After the material sensor 1045 detects that the bracket is clamped into the positioning clamping groove 1044, the double-headed motor 1051 can be stopped, so that the bracket is prevented from being damaged;

③ The electric cross sliding table 4 can adjust the position of the workbench 3 in the front-back and left-right directions so as to adjust the position of the bracket according to the die bonding requirement of die bonding equipment, and further improve the positioning precision.

It should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is for clarity only, and that the skilled artisan should recognize that the embodiments may be combined as appropriate to form other embodiments that will be understood by those skilled in the art.

The above list of detailed descriptions is only specific to practical embodiments of the present utility model, and they are not intended to limit the scope of the present utility model, and all equivalent embodiments or modifications that do not depart from the spirit of the present utility model should be included in the scope of the present utility model.

Claims (8)

1. The die bonding and transferring mechanism is characterized by comprising a plurality of die bonding platforms (100) which are arranged at intervals and a bracket transferring manipulator (200) for carrying out bracket transferring operation between the die bonding platforms (100);

The support transfer manipulator (200) comprises a clamping mechanism (1) and a manipulator linear driving mechanism (2) for driving the clamping mechanism (1) to reciprocate along the arrangement direction of each die bonding platform (100).

2. The die attach transfer mechanism of claim 1, wherein the clamping mechanism (1) comprises:

the transverse sliding plate (101) is arranged on the driving end of the manipulator linear driving mechanism (2);

A longitudinal slide plate (102), the longitudinal slide plate (102) being slidably mounted on the transverse slide plate (101);

The longitudinal driving mechanism (103) is arranged on the transverse sliding plate (101) and is used for driving the longitudinal sliding plate (102) to slide up and down relative to the transverse sliding plate (101);

Two clamping assemblies (104) which are arranged oppositely, wherein the clamping assemblies (104) are connected with the longitudinal sliding plate (102) in a sliding way;

The clamping linear driving mechanism (105) is arranged on the longitudinal sliding plate (102) and is in transmission connection with the two clamping assemblies (104) and used for driving the two clamping assemblies (104) to be close to each other and clamp the bracket or to be far away from each other and release the bracket.

3. The die attach transfer mechanism of claim 2, wherein the clamping assembly (104) comprises:

the sliding arm (1041), the sliding arm (1041) is connected with the longitudinal sliding plate (102) in a sliding way, and a plurality of mounting holes (1041 a) are formed in the sliding arm (1041);

A fixed clamp block (1042), wherein the fixed clamp block (1042) is fixedly arranged at one end of the sliding arm (1041);

And the adjustable clamping blocks (1043) are fixedly arranged on any mounting hole (1041 a) of the adjustable clamping blocks (1043).

4. A die attach transfer mechanism as claimed in claim 3, wherein both the fixed clamp block (1042) and the adjustable clamp block (1043) are provided with a positioning clamp groove (1044) into which the bracket is clamped.

5. The die attach transfer mechanism of claim 4, wherein a material sensor (1045) for detecting a material of the support is disposed at a bottom of the positioning groove (1044).

6. A die attach transfer mechanism as claimed in claim 3, wherein the clamp linear drive mechanism (105) comprises:

-a double-ended motor (1051), said double-ended motor (1051) being mounted on said longitudinal slide (102);

A first screw rod (1052), wherein the first screw rod (1052) is connected with one driving end of the double-headed motor (1051), and the first screw rod (1052) is in threaded connection with one of the sliding arms (1041);

The second screw rod (1053), the second screw rod (1053) is connected with the other driving end of the double-headed motor (1051), and the second screw rod (1053) is in threaded connection with the other sliding arm (1041);

wherein the thread directions of the first screw rod (1052) and the second screw rod (1053) are opposite.

7. The die attach transfer mechanism of claim 1 wherein the die attach table (100) comprises a table (3) for receiving a carrier and an electrically powered cross slide table (4) located below the table (3).

8. The die bonding transfer mechanism according to claim 7, wherein the electric cross slide table (4) comprises a first slide table linear driving mechanism (401) for driving the work table (3) to reciprocate in a first direction, and a second slide table linear driving mechanism (402) for driving the work table (3) to reciprocate in a second direction;

wherein the first direction is perpendicular to the second direction.