CN222831538U - Monocrystalline silicon piece grinds machine - Google Patents
Monocrystalline silicon piece grinds machine Download PDFInfo
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- CN222831538U CN222831538U CN202421652106.5U CN202421652106U CN222831538U CN 222831538 U CN222831538 U CN 222831538U CN 202421652106 U CN202421652106 U CN 202421652106U CN 222831538 U CN222831538 U CN 222831538U
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- silicon piece
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The utility model discloses a monocrystalline silicon wafer grinding machine in the technical field of monocrystalline silicon wafer grinding, which comprises a workbench and a supporting plate welded on one side of the top of the workbench, wherein the top of the workbench is connected with two grinding frames through a rotating mechanism, the top ends of the two grinding frames are provided with clamping mechanisms for fixedly clamping monocrystalline silicon wafers, and the upper part of each clamping mechanism is provided with a grinding mechanism positioned in the side wall of the supporting plate and used for grinding the monocrystalline silicon wafers.
Description
Technical Field
The utility model relates to the technical field of monocrystalline silicon wafer grinding, in particular to a monocrystalline silicon wafer grinding machine.
Background
The monocrystalline silicon wafer is large silicon single crystal which is prepared by taking silicon with the purity of 99.99999 percent as a raw material through high-temperature smelting, wire drawing, crystal growth and other processes. The semiconductor material is one of semiconductor materials and has the characteristics of stable electrical property, good chemical stability, repeatable processing and the like. The monocrystalline silicon piece needs to be ground by a grinder before use.
However, in the existing monocrystalline silicon piece grinding machine, the monocrystalline silicon piece is placed in the grinding machine and matched with the grinding mechanism to finish the grinding operation, then the grinded monocrystalline silicon piece is taken down and the monocrystalline silicon piece to be ground is replaced, so that the labor intensity of workers is increased to a certain extent, the grinding efficiency is reduced, and when the monocrystalline silicon piece is fixedly clamped, a buffer structure is not arranged, so that when the clamping force is too large, the edge of the monocrystalline silicon piece is easily damaged, and the use of people is not facilitated.
Disclosure of utility model
The utility model aims to provide a monocrystalline silicon wafer grinder, which solves the problems in the prior art.
In order to achieve the purpose, the monocrystalline silicon piece grinding machine comprises a workbench and a supporting plate welded on one side of the top of the workbench, wherein the top of the workbench is connected with two grinding frames through a rotating mechanism, clamping mechanisms used for fixedly clamping monocrystalline silicon pieces are arranged at the top ends of the two grinding frames, and a grinding mechanism used for grinding the monocrystalline silicon pieces and positioned in the side wall of the supporting plate is arranged above the clamping mechanisms.
Preferably, waste collection drawers are arranged on the inner walls of the bottom ends of the two grinding frames.
Preferably, the rotating mechanism comprises a first motor, a rotating plate, a support and rollers, wherein the top of the workbench is fixedly provided with the first motor, the output end of the first motor is fixedly connected to the middle part of the bottom surface of the rotating plate through a rotating shaft, the support is symmetrically welded on two sides of the bottom surface of the rotating plate, the rollers are rotationally connected to the bottom ends of the support, round grooves matched with the rollers are formed in the top of the workbench, one ends of the rollers, far away from the support, extend to the inside of the round grooves and are rotationally connected with the round grooves, and the top ends of the two grinding frames are fixedly arranged on two sides of the top surface of the rotating plate.
Preferably, the clamping mechanism comprises two bidirectional screws, supporting rods, clamping plates and supporting plates, wherein the two mounting plates are symmetrically welded at the top ends of the grinding frames, the two bidirectional screws and the supporting rods are arranged between the side walls of the mounting plates, which are close to each other, one end of each bidirectional screw is rotationally connected to the side wall of one mounting plate through a bearing seat, the other end of each bidirectional screw penetrates through the other mounting plate and is welded with a torsion block, the two ends of each supporting rod are welded between the side walls of the mounting plates, the clamping plates are symmetrically arranged on the surfaces of the two bidirectional screws and the supporting plates, one end of each clamping plate is rotationally connected with each bidirectional screw through threads, the other end of each clamping plate is in sliding connection with the corresponding supporting rod, one side, which is far away from the mounting plate, of each clamping plate is connected with the corresponding supporting plate through a buffering component, and the grinding mechanism positioned inside the side wall of the supporting plate is arranged above the corresponding supporting plate.
Preferably, the side walls of the abutting plates, which are close to each other, are all connected with anti-slip pads in an adhesive mode.
Preferably, the buffer assembly comprises buffer springs, guide rods and limiting blocks, one side, far away from the mounting plate, of the clamping plate is welded with two buffer springs, the other ends of the buffer springs are welded on the side wall of the abutting plate, the guide rods penetrating through the buffer springs are welded on the side wall of the abutting plate, one ends, far away from the abutting plate, of the guide rods penetrate through the clamping plate and the mounting plate and are welded with the limiting blocks, and the guide rods are in sliding connection with the clamping plate and the mounting plate.
Preferably, the grinding mechanism comprises a second motor, a threaded rod, a moving plate, a third motor and a grinding disc, wherein the second motor is installed on the top surface of the supporting plate through a bolt, the threaded rod is fixedly connected with an output shaft of the second motor, a rectangular groove is formed in the side wall of the supporting plate, one end of the rectangular groove is slidably connected with one end of the moving plate, one end of the threaded rod, far away from the second motor, penetrates through the supporting plate and the moving plate and is rotationally connected to the bottom surface of the inner wall of the rectangular groove through a bearing seat, the threaded rod is rotationally connected with the moving plate through threads, the third motor located above the abutting plate is fixedly installed at the other end of the bottom surface of the moving plate, and the grinding disc is fixedly installed at the output end of the third motor through a rotating shaft.
Compared with the prior art, the utility model has the beneficial effects that:
1. According to the monocrystalline silicon piece grinding machine, the monocrystalline silicon pieces above the two grinding frames can be sequentially subjected to almost uninterrupted grinding work by the aid of the rotating mechanism, so that the labor intensity of workers is reduced to a certain extent, and the grinding efficiency is improved.
2. According to the monocrystalline silicon piece grinding machine, the buffer assembly is arranged in the clamping mechanism, so that a part of overlarge clamping force generated in the clamping operation process of the clamping mechanism can be buffered and absorbed, and the situation that the clamped monocrystalline silicon piece is damaged at the edge can be prevented.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a side view of the overall structure of the present utility model;
FIG. 3 is a top view of the overall structure of the present utility model;
Fig. 4 is an enlarged view of a in fig. 3.
In the figure, 1, a workbench, 2, a supporting plate, 3, a grinding frame, 4, a waste collecting drawer, 9, a mounting plate, 10, a rectangular groove, 51, a first motor, 52, a rotating plate, 53, a support column, 54, a roller, 55, a round groove, 61, a bidirectional screw, 62, a supporting rod, 63, a clamping plate, 64, a collision plate, 65, a torsion block, 66, an anti-skid pad, 71, a buffer spring, 72, a guide rod, 73, a limiting block, 81, a second motor, 82, a threaded rod, 83, a moving plate, 84, a third motor, 85 and a grinding disc.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, in an embodiment of the present utility model, a single crystal silicon wafer grinder includes a workbench 1 and a support plate 2 welded to one side of the top of the workbench 1, two grinding frames 3 are connected to the top of the workbench 1 through a rotation mechanism, a single crystal silicon wafer is placed above the grinding frames 3, the rotation mechanism includes a first motor 51, a rotation plate 52, a support post 53 and a roller 54, the top of the workbench 1 is fixedly provided with the first motor 51, the output end of the first motor 51 is fixedly connected to the middle of the bottom surface of the rotation plate 52 through a rotation shaft, the two sides of the bottom surface of the rotation plate 52 are symmetrically welded with the support post 53, the bottom end of the support post 53 is rotationally connected with a roller 54, a round groove 55 matched with the roller 54 is provided at the top of the workbench 1, one end of the roller 54 far from the support post 53 extends into the round groove 55 and is rotationally connected with the round groove 55, and the top ends of the two grinding frames 3 are fixedly installed on the two sides of the top surface of the rotation plate 52.
When the rotary grinding device is used, the first motor 51 is started, the rotary plate 52 is driven to rotate along with the rotary plate when the output end of the first motor 51 rotates, so that the support column 53 drives the roller 54 to rotate in the circular groove 55 through the rotation of the rotary plate 52, the two grinding frames 3 synchronously rotate when the rotary plate 52 rotates, the monocrystalline silicon piece can be subjected to almost uninterrupted grinding operation, and the support column 53 and the roller 54 are used for providing stable support for the rotary plate 52, so that the rotary grinding device is more stable in rotation operation.
The bottom inner walls of the two grinding frames 3 are provided with waste collection drawers 4 for collecting the ground waste scraps.
The top of two grinding frames 3 is equipped with the fixture that is used for carrying out fixed centre gripping to monocrystalline silicon piece, fixture includes two-way screw rod 61, bracing piece 62, grip block 63 and conflict board 64, the equal symmetrical welding in top of two grinding frames 3 has mounting panel 9, be equipped with two-way screw rod 61 and bracing piece 62 side by side between the lateral wall that mounting panel 9 is close to, the one end of two-way screw rod 61 is rotated through the bearing frame and is connected on the lateral wall of one of them mounting panel 9, the other end of two-way screw rod 61 runs through another mounting panel 9 and welds and have the torsion block 65, the both ends welding of bracing piece 62 is between the lateral wall of mounting panel 9, the surperficial symmetry of two-way screw rod 61 and bracing piece 62 is equipped with grip block 63, the one end and the two-way screw rod 61 pass through threaded rotation connection, the other end and the bracing piece 62 sliding connection of grip block 63 are kept away from one side of mounting panel 9 through buffer assembly and are connected with conflict board 64, the equal bonding of lateral wall that conflict board 64 is close to is connected with slipmat 66 for increasing the frictional force between conflict board 64 and the monocrystalline silicon piece, thereby stability when being held.
The buffer assembly comprises buffer springs 71, guide rods 72 and limiting blocks 73, one side, far away from the mounting plate 9, of the clamping plate 63 is welded with the buffer springs 71 with two numbers, the other ends of the buffer springs 71 are welded on the side wall of the abutting plate 64, the side wall of the abutting plate 64 is welded with the guide rods 72 penetrating through the buffer springs 71, one end, far away from the abutting plate 64, of the guide rods 72 penetrates through the clamping plate 63 and the mounting plate 9 and is welded with the limiting blocks 73, and the guide rods 72 are in sliding connection with the clamping plate 63 and the mounting plate 9.
When the single crystal silicon wafer clamping device is used, a single crystal silicon wafer is taken up and placed between the abutting plates 64, then the torsion block 65 is rotated by one hand to enable the bidirectional screw 61 to rotate, one end of the clamping plate 63 connected with the bidirectional screw 61 is driven to move close to each other when the bidirectional screw 61 rotates, the other end of the clamping plate 63 slides on the surface of the supporting rod 62, the abutting plates 64 drive the anti-slip pads 66 to be in contact with the side walls of the single crystal silicon wafer and fixedly clamp the single crystal silicon wafer through the buffer springs 71 under the continuous movement of the clamping plates 63, the anti-slip pads 66 cannot be easily separated from the abutting plates 64, the buffer springs 71 are applied with extrusion force when the anti-slip pads 66 are in contact with the side walls of the single crystal silicon wafer, so that the buffer springs 71 are subjected to compression deformation, at the moment, the guide rods 72 can not only prevent the lateral deformation of the buffer springs 71, but also can guide the moving track of the abutting plates 64 through the elastic rebound effect of the single crystal silicon wafer clamping device, and simultaneously prevent the edge of the single crystal silicon wafer from being damaged due to the elastic rebound effect of the buffer springs 71.
The top of contradicting board 64 is equipped with the grinding machanism that is used for grinding monocrystalline silicon piece that is located backup pad 2 lateral wall inside, grinding machanism includes second motor 81, threaded rod 82, movable plate 83, third motor 84 and grinding disc 85, the second motor 81 is installed through the bolt to the top surface of backup pad 2, the output shaft fixedly connected with threaded rod 82 of second motor 81, rectangular channel 10 has been seted up to the lateral wall of backup pad 2, the inside sliding connection of rectangular channel 10 has the one end of movable plate 83, the one end that the second motor 81 was kept away from to threaded rod 82 runs through backup pad 2 and movable plate 83 and rotates the inner wall bottom surface of connecting at rectangular channel 10 through the bearing frame, and threaded rod 82 and movable plate 83 pass through threaded rotation connection, the bottom surface other end fixed mounting of movable plate 83 has the third motor 84 that is located contradicting board 64 top, the output of third motor 84 has grinding disc 85 through pivot fixed mounting.
When the grinding device is used, the second motor 81 is started, the threaded rod 82 is driven to rotate along with the threaded rod 82 when the output shaft of the second motor 81 rotates, so that one end of the moving plate 83 connected with the threaded rod is moved downwards in the rectangular groove 10, the grinding disc 85 is moved downwards synchronously along with the moving plate 83 through the third motor 84 in the moving downwards process, and after the grinding disc 85 is moved downwards to be in contact with the surface of a monocrystalline silicon piece, the third motor 84 is started to enable the grinding disc 85 to rotate, so that the surface of the monocrystalline silicon piece is ground.
Working principle: when the monocrystalline silicon piece grinds machine is used, firstly, place monocrystalline silicon piece between the conflict plates 64, then the other hand rotates the torsion block 65 and makes the bi-directional screw 61 drive the clamping plate 63 to be close to and move towards the lateral wall of monocrystalline silicon piece, make the conflict plate 64 drive the anti-slip pad 66 to contact with the lateral wall of monocrystalline silicon piece and carry out fixed clamping to monocrystalline silicon piece through the buffer assembly when the clamping plate 63 moves, the anti-slip pad 66 contacts with the lateral wall of monocrystalline silicon piece, the buffer spring 71 takes compression deformation, simultaneously guide rod 72 moves in a sliding way towards one side far away from the mounting plate 9, at this time, not only can buffer and absorb a part of overlarge clamping force of the abutment plate 64 through the elastic action of the buffer spring 71, but also can make monocrystalline silicon piece be stably clamped between the conflict plates 64, after monocrystalline silicon piece is fixed between the conflict plates 64 above two grinding frames 3 in turn, thereby enabling the threaded rod 82 to rotate, and enabling the third motor 84 to drive the grinding disc 85 to move downwards when the grinding disc 85 contacts with the surface of monocrystalline silicon piece, the grinding disc 85 is nearly rotates, the grinding efficiency is improved, and the waste silicon piece can be recovered when the grinding disc is in a rotary motion, and the grinding work is carried out on the surface of the grinding disc is nearly to be finished, and the waste silicon piece is recovered, and the grinding work is carried out by the grinding disc is nearly is finished.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (7)
1. The utility model provides a monocrystalline silicon piece grinds machine, includes workstation (1) and welds backup pad (2) in workstation (1) top one side, its characterized in that:
The top of workstation (1) is connected with grinding frame (3) that is two in quantity through slewing mechanism, two the top of grinding frame (3) is equipped with the fixture that is used for carrying out fixed centre gripping to monocrystalline silicon piece, the top of fixture is equipped with the grinding mechanism that is used for grinding monocrystalline silicon piece that is located backup pad (2) lateral wall inside.
2. The monocrystalline silicon piece grinding machine according to claim 1, wherein waste collection drawers (4) are arranged on the inner walls of the bottom ends of the two grinding frames (3).
3. The monocrystalline silicon piece grinds machine according to claim 1, wherein the rotating mechanism comprises a first motor (51), a rotating plate (52), a support column (53) and a roller (54), the first motor (51) is fixedly arranged at the top of the workbench (1), the output end of the first motor (51) is fixedly connected to the middle part of the bottom surface of the rotating plate (52) through a rotating shaft, the support column (53) is symmetrically welded on two sides of the bottom surface of the rotating plate (52), the roller (54) is rotatably connected to the bottom end of the support column (53), a round groove (55) matched with the roller (54) is formed in the top of the workbench (1), one end of the roller (54) far away from the support column (53) extends into the round groove (55) and is rotatably connected with the round groove (55), and the top ends of the two grinding frames (3) are fixedly arranged on two sides of the top surface of the rotating plate (52).
4. The monocrystalline silicon piece grinds machine according to claim 1, wherein the fixture comprises a bidirectional screw rod (61), a supporting rod (62), a clamping plate (63) and a supporting plate (64), the two top ends of the grinding frames (3) are symmetrically welded with the mounting plates (9), the bidirectional screw rod (61) and the supporting rod (62) are arranged between the side walls of the mounting plates (9) which are close to each other side by side, one end of the bidirectional screw rod (61) is rotationally connected to the side wall of one mounting plate (9) through a bearing seat, the other end of the bidirectional screw rod (61) penetrates through the other mounting plate (9) to be welded with a torsion block (65), two ends of the supporting rod (62) are welded between the side walls of the mounting plate (9), the surfaces of the bidirectional screw rod (61) and the supporting rod (62) are symmetrically provided with the clamping plate (63), one end of the clamping plate (63) is rotationally connected with the bidirectional screw rod (61) through threads, the other end of the clamping plate (63) is slidingly connected with the supporting rod (62), one side of the clamping plate (63) which is far away from the mounting plate (9) is connected with the supporting plate (64) through a buffering component, and the supporting plate (64) is arranged above the supporting plate (64) and is arranged on the side wall of the grinding mechanism.
5. A silicon wafer grinder as set forth in claim 4 wherein the adjacent side walls of the interference plate (64) are bonded with a non-slip pad (66).
6. A silicon wafer grinding machine according to claim 4, wherein the buffer assembly comprises buffer springs (71), guide rods (72) and limiting blocks (73), one sides of the clamping plates (63) away from the mounting plates (9) are welded with the buffer springs (71) in number, the other ends of the buffer springs (71) are welded on the side walls of the abutting plates (64), the side walls of the abutting plates (64) are welded with the guide rods (72) penetrating through the buffer springs (71), one ends of the guide rods (72) away from the abutting plates (64) penetrate through the clamping plates (63) and the mounting plates (9) and are welded with the limiting blocks (73), and the guide rods (72) are in sliding connection with the clamping plates (63) and the mounting plates (9).
7. The monocrystalline silicon piece grinds machine according to claim 4, wherein the grinding mechanism comprises a second motor (81), a threaded rod (82), a movable plate (83), a third motor (84) and a grinding disc (85), the second motor (81) is mounted on the top surface of the supporting plate (2) through bolts, the threaded rod (82) is fixedly connected with an output shaft of the second motor (81), a rectangular groove (10) is formed in the side wall of the supporting plate (2), one end of the movable plate (83) is slidingly connected to the inside of the rectangular groove (10), one end of the threaded rod (82) far away from the second motor (81) penetrates through the supporting plate (2) and the movable plate (83) and is connected to the bottom surface of the inner wall of the rectangular groove (10) through bearing blocks in a rotating mode, the threaded rod (82) is connected with the movable plate (83) through threads in a rotating mode, the third motor (84) located above the abutting plate (64) is fixedly mounted on the other end of the bottom surface of the movable plate (83), and the grinding disc (85) is fixedly mounted on the output end of the third motor (84).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421652106.5U CN222831538U (en) | 2024-07-12 | 2024-07-12 | Monocrystalline silicon piece grinds machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421652106.5U CN222831538U (en) | 2024-07-12 | 2024-07-12 | Monocrystalline silicon piece grinds machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222831538U true CN222831538U (en) | 2025-05-06 |
Family
ID=95529945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421652106.5U Active CN222831538U (en) | 2024-07-12 | 2024-07-12 | Monocrystalline silicon piece grinds machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222831538U (en) |
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2024
- 2024-07-12 CN CN202421652106.5U patent/CN222831538U/en active Active
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