CN222830530U - Stamping die rapid cooling device - Google Patents
Stamping die rapid cooling device Download PDFInfo
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- CN222830530U CN222830530U CN202421754913.8U CN202421754913U CN222830530U CN 222830530 U CN222830530 U CN 222830530U CN 202421754913 U CN202421754913 U CN 202421754913U CN 222830530 U CN222830530 U CN 222830530U
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- cooling water
- die holder
- water tank
- lower die
- cooling
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Abstract
本实用新型公开了一种冲压模具快速冷却装置，涉及冲压模具技术领域，包括工作台，工作台的上表面安装有下模座，下模座的上方设置有上模座，下模座和上模座之间安装有一组定位组件。通过工作台、下模座、上模座、定位组件、冷却水箱、冷却注水组件、回流组件以及制冷组件之间的配合设置，冷却水注水组件能够将冷却水注入到下模座和上模座的内部，使得冷却水与下模座和上模座进行热交换后通过回流组件回流至冷却水箱的内部，利用制冷组件，能够对冷却水箱中的冷却水进行制冷降温，避免冷却水的温度随着模具的温度升高而升高，能够实现对冲压模具的快速降温，能够保证对冲压模具的冷却效果。
The utility model discloses a rapid cooling device for a stamping die, which relates to the technical field of stamping dies, and comprises a workbench, wherein a lower die seat is installed on the upper surface of the workbench, an upper die seat is arranged above the lower die seat, and a group of positioning components are installed between the lower die seat and the upper die seat. Through the coordinated arrangement among the workbench, the lower die seat, the upper die seat, the positioning component, the cooling water tank, the cooling water injection component, the reflux component and the refrigeration component, the cooling water injection component can inject cooling water into the interior of the lower die seat and the upper die seat, so that the cooling water exchanges heat with the lower die seat and the upper die seat and then flows back to the interior of the cooling water tank through the reflux component. By using the refrigeration component, the cooling water in the cooling water tank can be cooled and cooled, so as to avoid the temperature of the cooling water from increasing as the temperature of the die increases, so as to realize rapid cooling of the stamping die and ensure the cooling effect of the stamping die.
Description
Technical Field
The utility model relates to the technical field of stamping dies, in particular to a rapid cooling device for a stamping die.
Background
The stamping is a forming processing method for obtaining a workpiece (stamping part) with a required shape and size by applying external force to plates, strips, pipes, sectional materials and the like by means of a press machine and a die to enable the plates, the strips, the pipes, the sectional materials and the like to generate plastic deformation or separation. The stamping and forging belong to plastic working (or pressure working), the stamping die is needed to be used when the stamping is carried out, the stamping die is special technological equipment for processing materials (metal or nonmetal) into parts (or semi-finished products) in the stamping, in the hot stamping process, a metal plate is heated first, then the heated metal plate is placed between an upper die seat and a lower die seat, the upper die seat moves downwards to extrude the metal plate, the hot stamping die has larger heat in use, a waterway is generally arranged in the die, and cooling is realized by using cooling liquid.
According to the patent of 202121983319.2, a cooling device of a stamping die is disclosed, and the cooling device comprises a piston pipe and a water tank, wherein cooling water is filled in the water tank, a water pump is fixedly arranged in the water tank, the output end of the water pump is fixedly connected with a water pipe, one end of the water pipe penetrates through the inner wall of the water tank and extends to the outside of the water tank, a first valve is fixedly arranged on the water pipe, one end of the water pipe, which is positioned at the outside of the water tank, is fixedly connected with a first branch pipe and a second branch pipe, the first branch pipe is fixedly connected with an upper die holder, and the second branch pipe is fixedly connected with a lower die holder.
By adopting the scheme, through setting up the piston pipe between mould and water tank, when the heat dissipation demand is less, utilize the action of upper die base reciprocates to drive the piston and reciprocate, and then carry cooling water in to first branch pipe and the second branch pipe, can satisfy the heat dissipation demand like this, can save electric energy reduction cost again, and is more practical, but above-mentioned scheme still has certain defect when using, above-mentioned scheme can not cool down cooling water when using, make the temperature of cooling water rise along with the temperature of mould rise after long-time use, be difficult to realize the rapid cooling to stamping die, influence stamping die's cooling effect, therefore, we provide a stamping die rapid cooling device, in order to solve above-mentioned technical problem.
Disclosure of utility model
The utility model aims to make up the defects of the prior art and provides a rapid cooling device for a stamping die.
The quick cooling device for the stamping die comprises a workbench, wherein a lower die holder is arranged on the upper surface of the workbench, an upper die holder is arranged above the lower die holder, a group of positioning components are arranged between the lower die holder and the upper die holder, each positioning component comprises a positioning rod fixedly connected to the upper surface of the lower die holder, the top end of each positioning rod is in sliding connection with the bottom surface of the upper die holder, a reset plate is in sliding connection with the outer surface of each positioning rod, a reset spring is arranged on the bottom surface of each reset plate, the bottom ends of the reset springs are connected with the upper surface of the lower die holder, cooling cavities are respectively arranged in the lower die holder and the upper die holder, a cooling water tank is arranged on the upper surface of the workbench, and a cooling water injection component, a reflux component and a refrigerating component are arranged outside the cooling water tank.
Preferably, the cooling water injection assembly comprises a booster pump fixedly inlaid on the outer surface of the cooling water tank, a first water injection hose is fixedly communicated with the output end of the booster pump, one end, far away from the booster pump, of the first water injection hose is communicated with the inside of the lower die holder, a second water injection hose is fixedly communicated with the outer surface of the first water injection hose, and one end, far away from the first water injection hose, of the second water injection hose is communicated with the inside of the upper die holder.
Preferably, the reflux assembly comprises a reflux hose I fixedly communicated with the outer surface of the cooling water tank, a reflux hose II is fixedly communicated with the outer surface of the reflux hose I, and one end of the reflux hose I far away from the cooling water tank and one end of the reflux hose II far away from the cooling water tank are respectively communicated with the inside of the lower die holder and the inside of the upper die holder.
Preferably, the refrigeration assembly comprises a first heat conducting plate fixedly inlaid on the outer surface of the cooling water tank, a group of semiconductor refrigeration sheets are mounted on the outer surface of the first heat conducting plate, a second heat conducting plate is arranged on the right side of the first heat conducting plate, and the second heat conducting plate is connected with the semiconductor refrigeration sheets.
Preferably, the outer surface of the second heat conducting plate is fixedly connected with a group of radiating fins, the right side of the second heat conducting plate is provided with a group of radiating fans, and the radiating fans are connected with the radiating fins.
Preferably, the front surface of the cooling water tank is fixedly inlaid with a transparent plate, and the upper surface of the cooling water tank is provided with a water adding cover.
Preferably, the front of the cooling water tank is fixedly communicated with a drain pipe, and a valve is arranged on the outer surface of the drain pipe.
The beneficial effects are that:
compared with the prior art, the stamping die rapid cooling device has the following beneficial effects:
1. According to the utility model, through the cooperation arrangement among the workbench, the lower die holder, the upper die holder, the positioning component, the cooling water tank, the cooling water injection component, the reflux component and the refrigerating component, the cooling water injection component can inject cooling water into the lower die holder and the upper die holder, so that the cooling water flows back into the cooling water tank through the reflux component after heat exchange between the cooling water and the lower die holder and the upper die holder, the refrigerating component is utilized to cool the cooling water in the cooling water tank, the temperature of the cooling water is prevented from rising along with the temperature rise of the die, the rapid cooling of the stamping die can be realized, and the cooling effect of the stamping die can be ensured.
2. According to the utility model, through the matching arrangement of the lower die holder, the upper die holder, the cooling water tank, the booster pump, the water injection hose I, the water injection hose II, the reflux hose I, the reflux hose II, the heat conducting plate I, the semiconductor refrigerating sheet, the heat conducting plate II, the radiating fins and the radiating fan, the booster pump can be used for pressurizing cooling water in the cooling water tank and then injecting the cooling water into the lower die holder and the upper die holder, heat exchange is carried out between the cooling water and the lower die holder and the upper die holder, the cooling water after heat exchange can be refluxed into the cooling water tank through the reflux hose I and the reflux hose II, the semiconductor refrigerating sheet can be used for reducing the temperature of the heat conducting plate I, the heat conducting plate I can be used for continuously refrigerating and cooling the cooling water in the cooling water tank, the cooling water in the cooling water tank can be always kept in a low-temperature state, and rapid cooling of the stamping die can be realized.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic perspective view of another view of the present utility model;
FIG. 3 is a schematic view of the internal structure of the lower die holder of the present utility model;
Fig. 4 is a schematic perspective view of a refrigeration unit according to the present utility model.
In the figure, 1, a workbench, 2, a lower die holder, 3, an upper die holder, 4, a positioning component, 401, a positioning rod, 402, a reset plate, 403, a reset spring, 5, a cooling water tank, 6, a cooling water injection component, 601, a booster pump, 602, a water injection hose I, 603, a water injection hose II, 7, a reflow component, 701, a reflow hose I, 702, a reflow hose II, 8, a refrigeration component, 801, a heat conducting plate I, 802, a semiconductor refrigeration sheet, 803, a heat conducting plate II, 804, a heat radiating fin, 805, a heat radiating fan, 9, a transparent plate, 10, a water adding cover, 11, a drain pipe, 12, a valve, 13 and a cooling cavity.
Detailed Description
The principles and features of the present utility model are described below with reference to the drawings, the examples are illustrated for the purpose of illustrating the utility model and are not to be construed as limiting the scope of the utility model.
Referring to fig. 1-4, a stamping die rapid cooling device comprises a workbench 1, wherein a lower die holder 2 is arranged on the upper surface of the workbench 1, an upper die holder 3 is arranged above the lower die holder 2, cooling cavities 13 are formed in the lower die holder 2 and the upper die holder 3, the lower die holder 2 and the upper die holder 3 are matched, stamping processing can be conveniently performed on a workpiece by using the arranged lower die holder 2 and the upper die holder 3, cooling water can conveniently circulate from the lower die holder 2 and the upper die holder 3 by using the arranged cooling cavities 13, and cooling processing is conveniently performed on the lower die holder 2 and the upper die holder 3.
A group of positioning components 4 are installed between the lower die holder 2 and the upper die holder 3, the positioning components 4 comprise positioning rods 401 fixedly connected to the upper surface of the lower die holder 2, the top ends of the positioning rods 401 are slidably connected with the bottom surface of the upper die holder 3, the outer surfaces of the positioning rods 401 are slidably connected with reset plates 402, reset springs 403 are installed on the bottom surfaces of the reset plates 402, and the bottom ends of the reset springs 403 are connected with the upper surface of the lower die holder 2.
The locating hole with locating lever 401 looks adaptation has been seted up to the bottom surface of upper die base 3, can make the surface of locating lever 401 and the inner wall sliding connection of locating hole, when upper die base 3 moves down and carries out the punching press to the work piece, can make the top of locating lever 401 slide at the inner wall of locating hole, can fix a position between die holder 2 and upper die base 3, make reset plate 402 slide down at the surface of locating lever 401, can compress reset spring 403, under reset spring 403's elasticity effect, can make things convenient for reset plate 402 and upper die base 3 to reset.
The upper surface mounting of workstation 1 has coolant tank 5, utilize coolant tank 5 that sets up, can conveniently store the coolant water, transparent plate 9 has been fixedly inlayed in the front of coolant tank 5, utilize transparent plate 9 that sets up, can conveniently observe the water yield of coolant water of coolant tank 5 inside, conveniently in time add coolant water, coolant tank 5's upper surface mounting has water adding lid 10, the water filling mouth with water adding lid 10 looks adaptation has been seted up at coolant tank 5's upper surface, can make water adding lid 10 and the inner wall threaded connection of water filling mouth, the round anti-skidding line has been seted up at the surface of water adding lid 10, can conveniently open water adding lid 10 and add coolant water to coolant tank 5's inside.
The front of the cooling water tank 5 is fixedly communicated with a drain pipe 11, a valve 12 is arranged on the outer surface of the drain pipe 11, and the valve 12 is opened, so that cooling water in the cooling water tank 5 is discharged through the drain pipe 11, and the cooling water in the cooling water tank 5 can be replaced conveniently.
The cooling water injection assembly 6 is installed on the front of the cooling water tank 5, the cooling water injection assembly 6 is including fixedly inlaying in the booster pump 601 of cooling water tank 5 surface, the input of booster pump 601 is linked together with the inside of cooling water tank 5, the fixed intercommunication of output of booster pump 601 has water injection hose one 602, the one end that water injection hose one 602 kept away from booster pump 601 is linked together with the inside of die holder 2, the fixed intercommunication of surface of water injection hose one 602 has water injection hose two 603, and the one end that water injection hose one 602 was kept away from to water injection hose two 603 is linked together with the inside of upper die holder 3.
The booster pump 601 works to boost the pressure of the cooling water in the cooling water tank 5, and then the cooling water is respectively injected into the lower die holder 2 and the upper die holder 3 through the first water injection hose 602 and the second water injection hose 603, and heat exchange is carried out between the cooling water in the lower die holder 2 and the upper die holder 3 and the heat of the lower die holder 2 and the heat of the upper die holder 3.
The back of the cooling water tank 5 is provided with a reflux component 7, the reflux component 7 comprises a reflux hose I701 fixedly communicated with the outer surface of the cooling water tank 5, a reflux hose II 702 is fixedly communicated with the outer surface of the reflux hose I701, and one end of the reflux hose I701 away from the cooling water tank 5 and one end of the reflux hose II 702 away from the cooling water tank 5 are respectively communicated with the inside of the lower die holder 2 and the inside of the upper die holder 3.
The cooling water after heat exchange with the lower die holder 2 and the upper die holder 3 can flow back to the inside of the cooling water tank 5 again through the first backflow hose 701 and the second backflow hose 702, so that the lower die holder 2 and the upper die holder 3 can be cooled conveniently, and the use effect of the lower die holder 2 and the upper die holder 3 can be ensured.
The right side face of the cooling water tank 5 is provided with a refrigerating assembly 8, the refrigerating assembly 8 comprises a first heat conducting plate 801 fixedly inlaid on the outer surface of the cooling water tank 5, a group of semiconductor refrigerating sheets 802 are arranged on the outer surface of the first heat conducting plate 801, a second heat conducting plate 803 is arranged on the right side of the first heat conducting plate 801, and the second heat conducting plate 803 is connected with the semiconductor refrigerating sheets 802. The cold junction of semiconductor refrigeration piece 802 contacts with heat conduction board one 801, and the hot junction of semiconductor refrigeration piece 802 contacts with heat conduction board two 803, and semiconductor refrigeration piece 802 work can make the temperature of heat conduction board one 801 reduce, with heat transfer to heat conduction board two 803 for heat conduction board one 801 can carry out continuous refrigeration cooling to the inside cooling water of coolant tank 5, can make the inside cooling water of coolant tank 5 remain low temperature state all the time, can realize the quick cooling to stamping die, can improve the cooling effect to stamping die. The outer surface of the second heat conducting plate 803 is fixedly connected with a group of radiating fins 804 which are arranged in an equidistant manner, the right side of the second heat conducting plate 803 is provided with a group of radiating fans 805, and the radiating fans 805 are connected with the radiating fins 804.
By utilizing the radiating fins 804, the heat of the second heat conducting plate 803 can be conveniently radiated, the running speed of air on the outer surface of the radiating fins 804 can be accelerated by the working of the radiating fan 805, and the radiating effect of the radiating fins 804 and the second heat conducting plate 803 can be improved, so that the refrigerating effect of the first semiconductor refrigerating plate 801 by the semiconductor refrigerating plate 802 can be ensured.
Working principle: when the device is used, firstly, the cooling water tank 5 is arranged on the upper surface of the workbench 1 for use, the end part of the water injection hose I602 and the end part of the water injection hose II 603 are respectively communicated with the inside of the lower die holder 2 and the inside of the upper die holder 3, the end parts of the reflux hose I701 and the reflux hose II 702 are respectively communicated with the lower die holder 2 and the upper die holder 3, the water adding cover 10 is opened, cooling water is added into the cooling water tank 5, when the lower die holder 2 and the upper die holder 3 perform stamping operation, heat generated during stamping can be transferred to the lower die holder 2 and the upper die holder 3, the booster pump 601 is started, the booster pump 601 can be used for respectively injecting the cooling water in the cooling water tank 5 into the inside of the lower die holder 2 and the inside of the upper die holder 3 through the water injection hose I602 and the water injection hose II 603, the cooling water in the inside of the lower die holder 2 and the upper die holder 3 can perform heat exchange with the heat of the lower die holder 2 and the upper die holder 3, the cooling water after heat exchange can flow back to the inside of the cooling water tank 5 through the first 701 and the second 702 backflow hoses, the lower die holder 2 and the upper die holder 3 can be conveniently cooled, the use effect of the lower die holder 2 and the upper die holder 3 can be ensured, when the device is used for a long time and the temperature of the cooling water in the cooling water tank 5 is increased, the power supply of the semiconductor refrigerating plate 802 and the cooling fan 805 is switched on, the semiconductor refrigerating plate 802 works to reduce the temperature of the first 801, the temperature of the second 803 is increased, the heat conducting plate second 803 can be conveniently cooled by using the arranged cooling fins 804, the cooling fan 805 works to accelerate the flow speed of air on the outer surface of the cooling fins 804, the heat dissipation effect of the cooling fins 804 and the second 803 can be improved, thereby can guarantee the refrigeration effect of semiconductor refrigeration piece 802 to heat conduction board one 801 for heat conduction board one 801 can carry out continuous refrigeration cooling to the inside cooling water of coolant tank 5, can make the inside cooling water of coolant tank 5 remain low temperature state all the time, can realize the rapid cooling to stamping die, can improve the cooling effect to stamping die.
The foregoing is only illustrative of the present utility model and is not to be construed as limiting thereof, but rather as various modifications, equivalent arrangements, improvements, etc., within the spirit and principles of the present utility model.
Claims (8)
1. The stamping die rapid cooling device comprises a workbench (1) and is characterized in that a lower die holder (2) and a cooling water tank (5) are arranged on the upper surface of the workbench (1), an upper die holder (3) is arranged above the lower die holder (2), a group of positioning components (4) are arranged between the lower die holder (2) and the upper die holder (3), each positioning component (4) comprises a positioning rod (401) fixedly connected to the upper surface of the lower die holder (2), the top end of each positioning rod (401) is in sliding connection with the bottom surface of the upper die holder (3), a reset plate (402) is slidably connected to the outer surface of each positioning rod (401), and a cooling water injection component (6), a reflux component (7) and a refrigerating component (8) are arranged outside the cooling water tank (5).
2. The rapid cooling device for the stamping die of claim 1, wherein a reset spring (403) is installed on the bottom surface of the reset plate (402), the bottom end of the reset spring (403) is connected with the upper surface of the lower die holder (2), and cooling cavities (13) are formed in the lower die holder (2) and the upper die holder (3).
3. The rapid cooling device for the stamping die, as set forth in claim 2, characterized in that the cooling water injection assembly (6) comprises a booster pump (601) fixedly inlaid on the outer surface of the cooling water tank (5), the output end of the booster pump (601) is fixedly communicated with a water injection hose I (602), one end of the water injection hose I (602) far away from the booster pump (601) is communicated with the inside of the lower die holder (2), the outer surface of the water injection hose I (602) is fixedly communicated with a water injection hose II (603), and one end of the water injection hose II (603) far away from the water injection hose I (602) is communicated with the inside of the upper die holder (3).
4. The rapid cooling device for the stamping die according to claim 2, wherein the reflow assembly (7) comprises a reflow hose I (701) fixedly communicated with the outer surface of the cooling water tank (5), a reflow hose II (702) is fixedly communicated with the outer surface of the reflow hose I (701), and one end of the reflow hose I (701) away from the cooling water tank (5) and one end of the reflow hose II (702) away from the cooling water tank (5) are respectively communicated with the inside of the lower die holder (2) and the inside of the upper die holder (3).
5. The rapid cooling device for the stamping die of claim 2, wherein the cooling assembly (8) comprises a first heat conducting plate (801) fixedly inlaid on the outer surface of the cooling water tank (5), a group of semiconductor cooling fins (802) are arranged on the outer surface of the first heat conducting plate (801), a second heat conducting plate (803) is arranged on the right side of the first heat conducting plate (801), and the second heat conducting plate (803) is connected with the semiconductor cooling fins (802).
6. The rapid cooling device for the stamping die of claim 5, wherein a group of radiating fins (804) is fixedly connected to the outer surface of the second heat conducting plate (803), a group of radiating fans (805) is arranged on the right side of the second heat conducting plate (803), and the radiating fans (805) are connected with the radiating fins (804).
7. The rapid cooling device for the stamping die, as claimed in claim 2, is characterized in that a transparent plate (9) is fixedly embedded on the front surface of the cooling water tank (5), and a water adding cover (10) is arranged on the upper surface of the cooling water tank (5).
8. The rapid cooling device for the stamping die, as claimed in claim 2, is characterized in that a drain pipe (11) is fixedly communicated with the front surface of the cooling water tank (5), and a valve (12) is arranged on the outer surface of the drain pipe (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421754913.8U CN222830530U (en) | 2024-07-23 | 2024-07-23 | Stamping die rapid cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421754913.8U CN222830530U (en) | 2024-07-23 | 2024-07-23 | Stamping die rapid cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222830530U true CN222830530U (en) | 2025-05-06 |
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ID=95531281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421754913.8U Active CN222830530U (en) | 2024-07-23 | 2024-07-23 | Stamping die rapid cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222830530U (en) |
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2024
- 2024-07-23 CN CN202421754913.8U patent/CN222830530U/en active Active
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