CN222813564U - Semiconductor duplex position material loading machine - Google Patents

Abstract

The utility model belongs to the technical field of semiconductor packaging feeding equipment, and specifically discloses a semiconductor double-station feeding machine, including a frame, a feeding workbench, a dispensing workbench, a crystal bonding workbench and a discharging workbench are sequentially arranged on the working panel of the frame along the lateral conveying direction of the material sheet, and two workstations are arranged in parallel on all workbenches, the dispensing workbench and the crystal bonding workbench are both slidably arranged on the working panel, a dispensing mechanism is arranged on the side of the dispensing workbench, two pairs of feeding rocking plates are arranged on the working panel, the crystal bonding workbench is located between the two pairs of feeding rocking plates, the same pair of feeding rocking plates are slidably arranged on the working panel, and a wafer suction mechanism is arranged between the same pair of feeding rocking plates and the crystal bonding workbench for longitudinal movement. The utility model realizes the simultaneous processing of two material sheets by arranging four workbenches with double stations on the working panel, coordinating the dispensing, crystal bonding and discharging actions, simplifying the process flow, and can greatly improve production efficiency and reduce labor costs.

Description

Semiconductor duplex position material loading machine

Technical Field

The utility model belongs to the technical field of semiconductor packaging and feeding equipment, and particularly relates to a semiconductor double-station feeding machine.

Background

In the semiconductor manufacturing industry, especially when the process flows of chip packaging, die bonding and the like are involved, the traditional single-station feeding machine often has the problems of low production efficiency, high manual dependency, complex process flow and the like. These problems not only limit the development speed of the semiconductor manufacturing industry, but also increase the production cost and waste of human resources.

At present, most of semiconductor feeding machines commonly used in the market are designed in a single-station mode, namely, only one material sheet can be processed at a time, and the design has obvious bottleneck in efficiency and productivity.

Accordingly, the inventors have devised a semiconductor loader to solve the above-mentioned problems.

Disclosure of utility model

The utility model aims to provide a semiconductor double-station feeding machine, which simplifies the process flow, can greatly improve the productivity efficiency and reduces the labor cost.

In order to achieve the above purpose, the utility model adopts a technical scheme that:

The utility model provides a semiconductor duplex position material loading machine, includes the frame, be equipped with pan feeding workstation, point gum workstation, die bond workstation and ejection of compact workstation in proper order along the horizontal direction of delivery of material piece on the work panel of frame, the pan feeding workstation the point gum workstation with all be equipped with two stations side by side on the ejection of compact workstation, the point gum workstation with die bond workstation all slide set up in on the work panel, the side of point gum workstation is equipped with the point gum mechanism, be equipped with two pairs of pay-off rocking discs on the work panel, the die bond workstation is located two pairs between the pay-off rocking discs, same pair of pay-off rocking disc horizontal slip set up in on the work panel, same pair of pay-off rocking disc with longitudinal movement is provided with wafer suction mechanism between the die bond workstation.

As an improvement of the semiconductor double-station feeding machine, the bottom of the dispensing workbench and the bottom of the die bonding workbench are respectively connected with the working panel in a transverse sliding manner through a sliding plate, and the dispensing workbench and the die bonding workbench are respectively arranged on the corresponding sliding plates in a longitudinal sliding manner.

As an improvement of the semiconductor double-station feeding machine, two dispensing and die-bonding tracks are transversely and alternately fixed on the working panel, each sliding plate is arranged on the two dispensing and die-bonding tracks in a sliding manner, and the two sliding plates are driven by the same dispensing and die-bonding driving source to reversely slide.

As an improvement of the semiconductor double-station feeding machine, the feeding workbench, the dispensing workbench, the die bonding workbench and the discharging workbench are identical in structure.

As an improvement of the semiconductor double-station feeding machine, the feeding workbench comprises a rack, two pairs of belt transmission structures are arranged on the rack in parallel, and the two pairs of belt transmission structures are arranged in the two stations in a one-to-one correspondence manner and driven to act by the same driving rotating shaft.

As an improvement of the semiconductor double-station feeding machine, two material sheet placing trays are arranged between the feeding ends of the working panel, the feeding workbench is arranged between the two material sheet placing trays, and the material sheets stored in the two material sheet placing trays are transferred to the feeding workbench through the feeding manipulator.

As an improvement of the semiconductor double-station feeding machine, two pairs of feeding rails are transversely and alternately fixed on the working panel, two pairs of feeding rocking discs are arranged on the two pairs of feeding rails in a one-to-one corresponding sliding manner, and the same pair of feeding rocking discs are driven by the same feeding driving source to reversely slide.

As an improvement of the semiconductor double-station feeding machine, one of the wafer sucking mechanisms is provided with an abnormality detection CCD machine, and the wafer sucking mechanism comprises a wafer sucking piece.

As an improvement of the semiconductor double-station feeding machine, a dispensing detection CCD machine is arranged above the dispensing workbench, a die bonding detection CCD machine is arranged above the die bonding workbench, a discharging conveyor belt is arranged at the discharging end of the working panel, and a discharging manipulator is arranged above the discharging conveyor belt.

As an improvement of the semiconductor double-station feeding machine, the discharging manipulator comprises a discharging sliding frame, a rotary cylinder and a discharging suction piece, wherein the discharging sliding frame is transversely and vertically arranged at the side of a discharging conveyor belt in a moving mode, the rotary cylinder is vertically arranged on the discharging sliding frame in a sliding mode, the discharging suction piece is arranged at the output end of the rotary cylinder, and the rotary cylinder drives the discharging suction piece to rotate by 90 degrees.

Compared with the prior art, the semiconductor double-station feeding machine has the advantages that the feeding workbench, the dispensing workbench, the die bonding workbench and the discharging workbench are arranged on the working panel, the double stations are arranged on each workbench, two tablets are conveyed to the dispensing workbench through the feeding workbench, the dispensing mechanism dispenses glue, the dispensing workbench conveys the dispensed tablets to the die bonding workbench, the wafer suction mechanism sucks wafers on the feeding rocking disc, the wafers are placed on the dispensed tablets to be subjected to die bonding, the die bonding workbench conveys the die bonding tablets to the discharging workbench, the simultaneous processing of the two tablets is realized, the process flow is simplified, the productivity efficiency can be greatly improved, and the labor cost is reduced.

Drawings

FIG. 1 is a top view of a semiconductor dual-station loader of the present utility model;

FIG. 2 is a perspective view of a semiconductor dual-station loader of the present utility model;

FIG. 3 is an enlarged view at A in FIG. 2;

fig. 4 is an enlarged view at B in fig. 2;

FIG. 5 is a perspective view of another view of the semiconductor dual-station loader of the present utility model;

FIG. 6 is an enlarged perspective view of the loading robot of the present utility model;

FIG. 7 is an enlarged perspective view of the die attach inspection CCD machine and two wafer pick-up mechanisms of the present utility model;

FIG. 8 is an enlarged perspective view of the outfeed robot of the present utility model;

FIG. 9 is an enlarged perspective view of a single table of the present utility model;

fig. 10 is an enlarged perspective view of another view of a single table of the present utility model.

Illustration of:

1. A frame; 11, a working panel; 12, a dispensing die-fixing slide rail, 13, a feeding slide rail, 14, a material sheet placing tray, 15, a discharging conveyor belt, 16, a material sheet, 2, a feeding workbench, 21, a dispensing workbench, 22, a die-fixing workbench, 23, a discharging workbench, 24, a slide plate, 241, a dispensing die-fixing linear motor, 242, a longitudinal moving slide rail, 25, a rack, 26, a forward moving motor, 27, a driving rotating shaft, 28, a conveying belt, 29, a driven rotating shaft, 3, a feeding mechanical arm, 31, a suction head, 32, a feeding linear motor, 33, a feeding slide rail, 4, a dispensing mechanism, 41, a dispensing linear motor, 42, a fixed plate, 421, a dispensing vertical moving slide rail, 43, a dispensing frame, 5, a dispensing detection CCD machine, 6, a feeding swing tray, 61, a wafer placing surface, 62, a feeding linear motor, 7, a wafer suction mechanism, 71, a wafer longitudinal moving linear motor, 72, a wafer suction piece, 73, a wafer carriage, 731, a wafer vertical moving slide rail, 74, a wafer vertical moving motor, 75, a detection machine, 8, a dispensing cylinder, a CCD (92), a discharge cylinder, a discharge vertical moving slide rail, a 93, a discharge cylinder, a discharge vertical moving slide rail, a discharge cylinder, a 93, a discharge vertical moving rail, a discharge cylinder, a 93.

Detailed Description

Embodiments of the present utility model will now be described in detail with reference to the drawings, which are intended to be used as references and illustrations only, and are not intended to limit the scope of the utility model.

Referring to fig. 1 to 10, a semiconductor duplex position feeder includes a frame 1, a feeding table 2, a dispensing table 21, a die bonding table 22, a discharging table 23, a dispensing mechanism 4, two pairs of feeding rocking trays 6 and two wafer sucking mechanisms 7, the feeding table 2, the dispensing table 21, the die bonding table 22 and the discharging table 23 are sequentially arranged on a working panel 11 of the frame 1 along the transverse conveying direction of a material sheet 16, two stations are respectively arranged on the feeding table 2, the dispensing table 21, the die bonding table 22 and the discharging table 23 in parallel, the die bonding table 21 and the die bonding table 22 are respectively arranged on the working panel 11 in a sliding manner, the dispensing mechanism 4 is arranged beside the dispensing table 21, the two pairs of feeding rocking trays 6 are arranged on the working panel 11, the die bonding table 22 is arranged between the two pairs of feeding rocking trays 6, the same pair of feeding rocking trays 6 are transversely arranged on the working panel 11 in a sliding manner, and the same wafer sucking mechanism 7 is longitudinally arranged between the corresponding pair of feeding rocking trays 6 and the die bonding table 22.

Referring to fig. 1 and 2, the working panel 11 is located on the top surface of the frame 1, two material sheet placing trays 14 are disposed between the material inlet ends of the working panel 11, each material sheet placing tray 14 is in a shape of a U and is used for stacking a plurality of material sheets 16, the whole material inlet working table 2 is located between the two material sheet placing trays 14, two dispensing die-bonding sliding rails 12 are also transversely and alternately fixed on the working panel 11, two dispensing die-bonding sliding rails 12 are located between the material inlet working table 2 and the material outlet working table 23, two pairs of feeding sliding rails 13 are transversely and alternately fixed on the working panel 11, two dispensing die-bonding sliding rails 12 and die-bonding working table 22 are both located between the two pairs of feeding sliding rails 13, the same pair of feeding sliding rails 13 are alternately arranged, and a material outlet conveyor 15 is arranged at the material outlet end of the working panel 11.

Referring to fig. 1, fig. 2, fig. 9 and fig. 10, the four work tables of the feeding work table 2, the dispensing work table 21, the die bonding work table 22 and the discharging work table 23 are identical in structure, specifically, each work table comprises a table frame 25, a forward motor 26, a driving rotating shaft 27, two pairs of belt transmission structures and a driven rotating shaft 29, two work stations are formed by separating the tops of the table frames 25, the driving rotating shaft 27 is arranged at the feeding end of the table frame 25 in a longitudinal direction of the table frame 25, the driven rotating shaft 29 is arranged at the discharging end of the table frame 25 in a longitudinal direction of the table frame 25, the two pairs of belt transmission structures are arranged on the table frame 25 in parallel, the two pairs of belt transmission structures are arranged in the two work stations in a one-to-one correspondence manner and driven by the same driving rotating shaft 27, the two rectangular work pieces 16 are respectively supported by the two belt transmission structures, and a conveying belt 28 of each belt transmission structure is respectively sleeved on a driving wheel of the driving rotating shaft 27 and a driven wheel of the driven rotating shaft 29, the forward motor 26 is fixed at the feeding end of the table frame 25 and drives the driving rotating shaft 27 to rotate through the belt transmission to drive the driving rotating shaft 27, and further drive the driving belt transmission structures to move the two pairs of belt transmission structures synchronously, so that the two rectangular work pieces are moved.

Referring to fig. 1, 2 and 3, a sliding plate 24 is respectively disposed at the bottom of the dispensing table 21 and the bottom of the die bonding table 22, two longitudinally moving sliding rails 242 are disposed on the top surface of each sliding plate 24 along the longitudinal direction thereof, and the dispensing table 21 and the die bonding table 22 are respectively and longitudinally slidably disposed on the longitudinally moving sliding rails 242 of the corresponding sliding plate 24, so that the dispensing table 21 and the die bonding table 22 can longitudinally slide relative to the working panel 11, the two sliding plates 24 are respectively and transversely slidably disposed on the two dispensing die bonding sliding rails 12, so that the bottom of the dispensing table 21 and the bottom of the die bonding table 22 are transversely and slidably connected with the working panel 11 through the corresponding sliding plates 24, so that the dispensing table 21 and the die bonding table 22 can both transversely slide relative to the working panel 11.

Referring to fig. 2 and 6, the sheets 16 stored in the two sheet placing trays 14 are transferred to the feeding workbench 2 by a feeding manipulator 3, the feeding manipulator 3 includes a feeding linear motor 32 and a suction head 31, two ends of the feeding linear motor 32 are respectively connected with the working panel 11 of the frame 1 through support columns, so that the feeding linear motor 32 is longitudinally arranged above the feeding workbench 2, a feeding sliding rail 33 is arranged on a side surface of the feeding linear motor 32, a feeding frame is arranged on the feeding sliding rail 33, the suction head 31 is arranged at the tail end of the feeding frame, the feeding linear motor 32 drives the feeding frame and the suction head 31 to longitudinally slide along the feeding sliding rail 33 together, and the sheets 16 in the two sheet placing trays 14 are sucked onto the feeding workbench 2.

Referring to fig. 2 and 4, the dispensing mechanism 4 includes a linear dispensing motor 41 and three dispensing frames 43, a fixed plate 42 is vertically disposed on the working panel 11, two dispensing vertical moving rails 421 are disposed on the fixed plate 42 at intervals, the linear dispensing motor 41 is vertically slidably disposed on the two dispensing vertical moving rails 421 and is driven by the dispensing motor to move up and down, the three dispensing frames 43 are disposed on the linear dispensing motor 41 at intervals, each dispensing frame 43 is provided with a dispensing head, the dispensing motor drives the linear dispensing motor 41, the three dispensing frames 43 and the three dispensing heads together slide up and down along the dispensing vertical moving rails 421 through a screw rod, the linear dispensing motor 41 drives the three dispensing frames 43 and the three dispensing heads together to move laterally (left and right), the dispensing detection CCD 5 is disposed above the dispensing table 21, and the dispensing detection CCD 5 is disposed on the right side of the dispensing mechanism 4, and the dispensing detection CCD 5 is used for detecting the dispensing state of the dispensing chips 16.

Referring to fig. 1, 2 and 5, each feeding rocker 6 is T-shaped and has a wafer placement surface 61 on the top for placing a wafer, two pairs of feeding rockers 6 are slidably disposed on two pairs of feeding slide rails 13 in one-to-one correspondence, the same pair of feeding rockers 6 are driven to slide reversely by the same feeding driving source, in this embodiment, the feeding driving source is preferably a feeding linear motor 62, the feeding linear motor 62 is specifically a bidirectional linear motor, each feeding linear motor 62 is located between the same pair of feeding slide rails 13, and the same feeding linear motor 62 drives a pair of feeding rockers 6 to move away or move closer synchronously.

Referring to fig. 2, 5 and 7, a wafer longitudinal moving linear motor 71 is supported and connected on the working panel 11 through an n-shaped fixing frame, two wafer sucking mechanisms 7 are all arranged on the wafer longitudinal moving linear motor 71 and driven to longitudinally move by the wafer longitudinal moving linear motor 71, one wafer sucking mechanism 7 is provided with an abnormality detecting CCD machine 75, each wafer sucking mechanism 7 comprises a wafer longitudinal moving motor 74, a wafer sliding frame 73 and a wafer sucking member 72, the wafer sliding frame 73 is arranged on the wafer longitudinal moving motor 74, two wafer vertical moving sliding rails 731 are vertically arranged on the wafer sliding frame 73, the wafer sucking member 72 vertically slides along the two wafer vertical moving sliding rails 731, the abnormality detecting CCD machine 75 is fixed on the wafer sucking member 72 corresponding to the wafer sucking mechanism 7, a wafer fixing detecting CCD machine 8 is arranged above the wafer fixing table 22 and is fixed on the fixing frame and is positioned above the wafer sucking mechanism 7, the wafer longitudinal moving linear motor 71 drives the two wafer sliding frame 73, the two wafer sliding frame 72 and the two wafer sucking member 72 are longitudinally moved, the wafer sucking member 72 is correspondingly arranged on the wafer feeding table 6, and the wafer is fixed on the wafer feeding table 16, and the wafer is fixed on the wafer feeding table 6.

Referring to fig. 1, fig. 2, fig. 5 and fig. 8, a discharging manipulator 9 is disposed above the discharging conveyor belt 15, the discharging manipulator 9 includes a discharging traversing motor 93, a discharging traversing motor 95, a discharging carriage 94, a rotary cylinder 92 and a discharging sucking member 91, the discharging carriage 94 is transversely and vertically movably disposed on a discharging fixing plate beside the discharging conveyor belt 15, the discharging traversing motor 93 is fixed on the discharging fixing plate, a discharging traversing rail 941 is transversely disposed on the discharging fixing plate, the discharging carriage 94 is transversely slidably disposed on the discharging traversing rail 941, the discharging traversing motor 95 is fixed on the discharging carriage 94, two discharging traversing rails 942 are disposed on the front face of the discharging carriage 94 at a vertical interval, the rotary cylinder 92 is vertically slidably disposed on the two discharging traversing rails 942, the discharging sucking member 91 is disposed at an output end of the rotary cylinder 92, the discharging traversing motor 93 drives the discharging traversing motor 95, the discharging carriage 94, the rotary cylinder 92 and the discharging sucking member 91 to transversely move together through a belt transmission, and drives the discharging carriage 94 and the rotary cylinder 92 to suck the discharging cylinder 92 through another belt transmission and the rotary cylinder 92, and the discharging traversing member 91 is vertically moved together (i.e. the rotary cylinder 91 is vertically driven to vertically move together).

Referring to fig. 1 to 10, the working principle of the semiconductor double-station feeding machine of the utility model is as follows:

The material sheets 16 are placed in two material sheet placing trays 14, the feeding mechanical arm 3 absorbs the two material sheets 16, the material sheets are placed on two stations of the feeding working table 2, the feeding working table 2 conveys the material sheets 16 to the dispensing working table 21, the dispensing working table 21 moves to the dispensing mechanism 4 to perform dispensing action, the dispensing is completed, the dispensing working table 21 moves to the position below the dispensing detection CCD machine 5 to perform detection, the detection is completed, the dispensing working table 21 conveys the material sheets 16 to the die bonding working table 22, the wafer absorbing mechanism 7 absorbs the two material sheets 16 with wafers fixed on the die bonding working table 22 from the two pairs of feeding rocking discs 6 respectively, the die bonding working table 22 moves to the position below the die bonding detection CCD machine 8 to perform die bonding detection, the die bonding working table 22 moves to the position near the discharging working table 23 to convey the two material sheets 16 to the discharging working table 23, the discharging mechanical arm 9 absorbs the two material sheets 16 from the discharging working table 23, the discharging mechanical arm 9 rotates 90 degrees and then moves the material sheets 16 to the discharging conveyor belt 15.

According to the semiconductor double-station feeding machine, the feeding workbench 2, the dispensing workbench 21, the die bonding workbench 22 and the discharging workbench 23 are arranged on the working panel 11, four workbenches are arranged on each workbenches, two material sheets 16 are conveyed to the dispensing workbench 21 from the feeding workbench 2, the dispensing mechanism 4 dispenses glue, the dispensing workbench 21 conveys the dispensed material sheets 16 to the die bonding workbench 22, the wafer suction mechanism 7 sucks wafers on the feeding rocking disc 6, the wafers are placed on the dispensed material sheets 16 for die bonding, the die bonding workbench 22 conveys the die bonded material sheets to the discharging workbench 23, simultaneous processing of the two material sheets 16 is realized, the process flow is simplified, the productivity efficiency can be greatly improved, and the labor cost is reduced.

The above disclosure is illustrative of the preferred embodiments of the present utility model and should not be construed as limiting the scope of the utility model, which is defined by the appended claims.

Claims (10)

1. The utility model provides a semiconductor duplex position material loading machine, includes the frame, its characterized in that, be equipped with pan feeding workstation, point on the work panel of frame in proper order along the horizontal direction of delivery of material piece and glue workstation, die bond workstation and ejection of compact workstation, the pan feeding workstation the point glue workstation the die bond workstation with all be equipped with two stations side by side on the ejection of compact workstation, the point glue workstation with die bond workstation all slide set up in on the work panel, the side of point glue workstation is equipped with the point and glues the mechanism, be equipped with two pairs of pay-off rocking discs on the work panel, die bond workstation is located two pairs between the pay-off rocking disc, same pair of pay-off rocking disc lateral sliding set up in on the work panel, same pair of the pay-off rocking disc with longitudinal movement is provided with the wafer and absorbs the mechanism between the die bond workstation.

2. The semiconductor duplex position feeder according to claim 1, wherein the bottom of the dispensing table and the bottom of the die bonding table are respectively connected with the working panel in a sliding manner in a transverse direction, and the dispensing table and the die bonding table are respectively arranged on the corresponding sliding plates in a sliding manner in a longitudinal direction.

3. The semiconductor duplex position feeder according to claim 2, wherein two dispensing die-bonding slide rails are transversely and alternately fixed on the working panel, each slide plate is slidably arranged on two dispensing die-bonding slide rails, and the two slide plates are driven by the same dispensing die-bonding driving source to slide reversely.

4. The semiconductor duplex position material loading machine of claim 1, wherein the structures of the feeding workbench, the dispensing workbench, the die bonding workbench and the discharging workbench are all the same.

5. The semiconductor double-station feeding machine according to claim 4, wherein the feeding workbench comprises a rack, two pairs of belt transmission structures are arranged on the rack in parallel, and the two pairs of belt transmission structures are arranged in the two stations in a one-to-one correspondence manner and driven to act by the same driving rotating shaft.

6. The semiconductor duplex position feeder according to claim 1, wherein two material sheet placing trays are arranged between the material feeding ends of the working panel, the material feeding workbench is arranged between the two material sheet placing trays, and the material sheets stored in the two material sheet placing trays are transferred onto the material feeding workbench through the material feeding manipulator.

7. The semiconductor duplex position feeder according to claim 1, wherein two pairs of feeding slide rails are transversely and alternately fixed on the working panel, the two pairs of feeding rocker plates are slidably arranged on the two pairs of feeding slide rails in one-to-one correspondence, and the same pair of feeding rocker plates are driven by the same feeding driving source to reversely slide.

8. The semiconductor dual-station feeding machine according to claim 1, wherein one of the wafer sucking mechanisms is provided with an abnormality detection CCD machine, and the wafer sucking mechanism includes a wafer sucking member.

9. The semiconductor double-station feeding machine according to claim 1, wherein a dispensing detection CCD machine is arranged above the dispensing workbench, a die bonding detection CCD machine is arranged above the die bonding workbench, a discharging conveyor belt is arranged at the discharging end of the working panel, and a discharging manipulator is arranged above the discharging conveyor belt.

10. The semiconductor duplex position material loading machine of claim 9, wherein the ejection of compact manipulator includes ejection of compact balladeur train, revolving cylinder and ejection of compact suction piece, ejection of compact balladeur train horizontal and vertical removal set up in the side of ejection of compact conveyer belt, revolving cylinder vertical slip set up in on the ejection of compact balladeur train, the ejection of compact suction piece set up in revolving cylinder's output, revolving cylinder drive ejection of compact suction piece rotates 90 degrees.