CN222803085U - A hybrid high-frequency double-layer circuit board with thermal insulation structure - Google Patents
A hybrid high-frequency double-layer circuit board with thermal insulation structure Download PDFInfo
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- CN222803085U CN222803085U CN202421310570.6U CN202421310570U CN222803085U CN 222803085 U CN222803085 U CN 222803085U CN 202421310570 U CN202421310570 U CN 202421310570U CN 222803085 U CN222803085 U CN 222803085U
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Abstract
本实用新型公开了一种具有隔热结构的混压高频双层线路板，包括第一隔热板以及第二隔热板，所述第一隔热板以及第二隔热板之间通过两个弹性伸缩杆固定连接，且第一隔热板以及第二隔热板内均通过四个绝缘杆分别固定安装有上线路板和下线路板，所述上线路板和下线路板相对的一侧均固定连接有散热鳍片。本实用新型设计相对简单，这种简洁的结构使得制造、装配和维护更为容易，同时也降低了成本；隔热结构在拆装时只需下压隔热板并拉出即可，这种设计使得线路板的更换和维修变得非常便捷；散热鳍片设计在外侧，能够有效地将热量导出并散发到外部环境中，同时，隔热夹板的设计也进一步增强了隔热效果，保证了线路板的稳定运行。
The utility model discloses a hybrid high-frequency double-layer circuit board with a heat insulation structure, including a first heat insulation board and a second heat insulation board, the first heat insulation board and the second heat insulation board are fixedly connected by two elastic telescopic rods, and the first heat insulation board and the second heat insulation board are respectively fixedly installed with an upper circuit board and a lower circuit board by four insulating rods, and the upper circuit board and the lower circuit board are fixedly connected with heat dissipation fins on opposite sides. The design of the utility model is relatively simple, and this concise structure makes manufacturing, assembly and maintenance easier, while also reducing costs; the heat insulation structure only needs to press down the heat insulation board and pull it out when disassembling and assembling, and this design makes the replacement and maintenance of the circuit board very convenient; the heat dissipation fins are designed on the outside, which can effectively export and dissipate heat to the external environment. At the same time, the design of the heat insulation splint further enhances the heat insulation effect and ensures the stable operation of the circuit board.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a mixed-voltage high-frequency double-layer circuit board with a heat insulation structure.
Background
The double-layer circuit board is provided with copper on both sides and with metallized holes, namely copper on both sides, and the double-layer circuit board is more suitable for being used on a circuit which is more complex than a single-layer board because the double-layer board has the advantages of convenient and concise wiring, lower wiring labor intensity and shorter wiring length, and solves the difficulty of staggered wiring in the single-layer board;
The chinese patent with the application number 202222895312.6 discloses a mixed voltage high frequency double-deck circuit board with heat insulation structure, and it has solved the problem that circuit board body worked in the thermal environment for a long time, can cause the silica gel on circuit board body surface to produce the problem that comes unstuck and heat produces the influence to the circuit board, but it has following problem:
1. Difficulty in assembly and disassembly, as the design is more complex, the assembly and disassembly process may be more difficult;
2. The complexity of adjustment, namely the heat insulation effect is required to be adjusted through the adjusting bolts 507. This requires additional operating steps and may require specialized tools.
Disclosure of utility model
The utility model aims to provide a mixed-voltage high-frequency double-layer circuit board with a heat insulation structure, so as to solve the problems in the prior art.
The mixed high-frequency double-layer circuit board with the heat insulation structure comprises a first heat insulation board and a second heat insulation board, wherein the first heat insulation board and the second heat insulation board are fixedly connected through two elastic telescopic rods, an upper circuit board and a lower circuit board are respectively and fixedly arranged in the first heat insulation board and the second heat insulation board through four insulating rods, radiating fins are fixedly connected to the opposite sides of the upper circuit board and the lower circuit board, one opposite sides of the two radiating fins penetrate through the outer parts of the first heat insulation board and the second heat insulation board respectively, an upper heat insulation clamping plate and a lower heat insulation clamping plate are respectively arranged at the top of the upper circuit board and the bottom of the lower circuit board, a side plate is fixedly connected to the left end of the top of the lower heat insulation clamping plate, and a clamping column is arranged at the right end of the upper heat insulation clamping plate and the lower heat insulation clamping plate.
Compared with the prior art, the utility model has the beneficial effects that:
The utility model has relatively simple design, and the simple structure makes the manufacture, assembly and maintenance easier, and simultaneously reduces the cost;
The heat insulation structure only needs to press down the heat insulation plate and pull out the heat insulation plate when the heat insulation structure is disassembled and assembled, and the design ensures that the circuit board is very convenient to replace and maintain;
The heat radiating fins are designed on the outer side, so that heat can be effectively led out and radiated to the external environment, and meanwhile, the heat insulation effect is further enhanced by the design of the heat insulation clamping plate, and the stable operation of the circuit board is ensured;
The utility model has small space occupation and relatively compact structure, which is an important advantage in application scenes with limited space.
Drawings
FIG. 1 is a schematic illustration of the present utility model;
FIG. 2 is a perspective view of the lower insulating clamping plate, upper insulating clamping plate and side plates of the present utility model;
FIG. 3 is a schematic left-hand view of the present utility model;
Fig. 4 is a left side view of the first heat shield, the second heat shield and the resilient telescoping rod of the present utility model.
The heat insulation board comprises a first heat insulation board, a second heat insulation board, an elastic telescopic rod, an upper circuit board, a lower circuit board, a heat dissipation fin, a lower heat insulation clamping plate, an upper heat insulation clamping plate, a side plate, a tightening bolt, a rectangular bearing block, a clamping column, a threaded hole, a clamping groove, a mounting hole and a clamping groove.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical scheme, which is a mixed-voltage high-frequency double-layer circuit board with a heat insulation structure, comprising a first heat insulation board 1 and a second heat insulation board 2, wherein the first heat insulation board 1 and the second heat insulation board 2 are fixedly connected through two elastic telescopic rods 3, an upper circuit board 4 and a lower circuit board 5 are respectively and fixedly installed in the first heat insulation board 1 and the second heat insulation board 2 through four insulating rods, heat dissipation fins 6 are respectively and fixedly connected to opposite sides of the upper circuit board 4 and the lower circuit board 5, opposite sides of the two heat dissipation fins 6 respectively penetrate to the outer parts of the first heat insulation board 1 and the second heat insulation board 2, an upper heat insulation clamping plate 8 and a lower heat insulation clamping plate 7 are respectively arranged at the top of the upper circuit board 4 and the bottom of the lower circuit board 5, a side plate 9 is fixedly connected to the left end of the top of the lower heat insulation clamping plate 7, and a clamping column 12 is arranged at the right end of the upper heat insulation clamping plate 8 and the lower heat insulation clamping plate 7.
The top of the first heat insulating plate 1 and the bottom of the second heat insulating plate 2 are provided with through grooves, the area of each through groove is slightly larger than that of the upper circuit board 4, and the through grooves are designed to facilitate the disassembly and assembly of the circuit boards.
The opposite sides of the first heat insulating plate 1 and the second heat insulating plate 2 are provided with notches matched with the heat radiation fins 6, and the heat radiation fins 6 are positioned outside the partition plate to radiate heat better.
The intermediate position of the right end at the top of the first heat insulating plate 1 and the intermediate position of the right end at the bottom of the second heat insulating plate 2 are fixedly connected with rectangular bearing blocks 11, the right ends of clamping columns 12 are fixedly connected with the rectangular bearing blocks 11, clamping grooves 14 matched with the clamping columns 12 are formed in the right ends of the upper heat insulating clamping plates 8 and the lower heat insulating clamping plates 7, and the clamping columns 12 can limit and fix the upper heat insulating clamping plates 8.
The upper heat insulation clamping plate 8 is fixedly connected with the side plate 9 through a tightening bolt 10, and the upper heat insulation clamping plate 8 can be conveniently disassembled and assembled through the tightening of the tightening bolt 10.
The upper heat insulation clamping plate 8 is provided with a threaded hole 13 matched with the tightening bolt 10.
Two mounting holes 15 are formed in the left side of the side plate 9, and the mounting holes 15 are formed to fix the whole device.
When the heat insulation plate is used, the first heat insulation plate 1 is pressed down, so that the elastic telescopic rod 3 is in a compressed state, and as shown in fig. 1, the first heat insulation plate 1 is clamped between the upper heat insulation clamping plate 8 and the lower heat insulation clamping plate 7, and the clamping grooves 14 at the right ends of the upper heat insulation clamping plate 8 and the lower heat insulation clamping plate 7 are aligned with the clamping columns 12 to be clamped.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The mixed-voltage high-frequency double-layer circuit board with the heat insulation structure comprises a first heat insulation board (1) and a second heat insulation board (2), and is characterized in that the first heat insulation board (1) and the second heat insulation board (2) are fixedly connected through two elastic telescopic rods (3), an upper circuit board (4) and a lower circuit board (5) are fixedly installed in the first heat insulation board (1) and the second heat insulation board (2) respectively through four insulating rods, heat dissipation fins (6) are fixedly connected to one sides, opposite to the upper circuit board (4) and the lower circuit board (5), of the two heat dissipation fins (6) respectively penetrate through the outer parts of the upper circuit board (4) and the lower circuit board (5), an upper heat insulation clamping plate (8) and a lower heat insulation clamping plate (7) are respectively arranged at the top of the upper circuit board (4) and the bottom of the lower circuit board (5), a side plate (9) is fixedly connected to the left end of the top of the lower heat insulation clamping plate (7), and a clamping post (12) is arranged at the right end of the upper heat insulation clamping plate (8) and the lower heat insulation clamping plate (7).
2. The mixed-voltage high-frequency double-layer circuit board with the heat insulation structure according to claim 1 is characterized in that through grooves are formed in the top of the first heat insulation board (1) and the bottom of the second heat insulation board (2), and the area of each through groove is slightly larger than that of the upper circuit board (4).
3. The mixed-voltage high-frequency double-layer circuit board with the heat insulation structure according to claim 1, wherein the opposite sides of the first heat insulation board (1) and the second heat insulation board (2) are provided with notches matched with the heat radiation fins (6).
4. The mixed-voltage high-frequency double-layer circuit board with the heat insulation structure according to claim 1, wherein the middle position of the right end of the top of the first heat insulation board (1) and the middle position of the right end of the bottom of the second heat insulation board (2) are fixedly connected with rectangular bearing blocks (11), the right ends of clamping columns (12) are fixedly connected with the rectangular bearing blocks (11), and clamping grooves (14) matched with the clamping columns (12) are formed in the right ends of the upper heat insulation clamping plates (8) and the lower heat insulation clamping plates (7).
5. The mixed-voltage high-frequency double-layer circuit board with the heat insulation structure according to claim 1, wherein the upper heat insulation clamping plate (8) is fixedly connected with the side plate (9) through a tightening bolt (10).
6. The mixed-voltage high-frequency double-layer circuit board with the heat insulation structure according to claim 1, wherein the upper heat insulation clamping plate (8) is provided with threaded holes (13) matched with the tightening bolts (10).
7. The mixed-voltage high-frequency double-layer circuit board with the heat insulation structure according to claim 1, wherein two mounting holes (15) are formed in the left side of the side plate (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421310570.6U CN222803085U (en) | 2024-06-11 | 2024-06-11 | A hybrid high-frequency double-layer circuit board with thermal insulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421310570.6U CN222803085U (en) | 2024-06-11 | 2024-06-11 | A hybrid high-frequency double-layer circuit board with thermal insulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222803085U true CN222803085U (en) | 2025-04-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421310570.6U Active CN222803085U (en) | 2024-06-11 | 2024-06-11 | A hybrid high-frequency double-layer circuit board with thermal insulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222803085U (en) |
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2024
- 2024-06-11 CN CN202421310570.6U patent/CN222803085U/en active Active
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