CN222784839U

CN222784839U - An electronic device

Info

Publication number: CN222784839U
Application number: CN202421520976.7U
Authority: CN
Inventors: 倪昊; 薛欢欢; 陈良龙
Original assignee: Lenovo Beijing Ltd
Current assignee: Lenovo Beijing Ltd
Priority date: 2024-06-28
Filing date: 2024-06-28
Publication date: 2025-04-22
Anticipated expiration: 2034-06-28

Abstract

The application discloses electronic equipment, which comprises a case shell, a heating component, a heat dissipation component and an adjusting component, wherein the case shell is provided with an accommodating space, the heating component is arranged in the accommodating space and can generate heat, the heat dissipation component is arranged in the accommodating space, the heat dissipation component can drive air flow to dissipate heat of the heating component, the adjusting component is positioned between the heating component and the heat dissipation component, the adjusting component can adjust the air flow flowing to the heating component, and the disturbance degree of the heating component is reduced when the adjusted air flow passes through the heating component.

Description

Electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to electronic equipment.

Background

With the improvement of the performance of the server, the heat dissipation requirement is also improved, and the rotation speed of the fan of the air cooling server is higher and higher, so that the vibration/noise is improved.

Taking a hard disk in a server as an example, with the development of technology, the magnetic density of the disk is increased gradually, and the maximum allowable position tolerance of a read-write magnetic head is reduced, so that the hard disk is more sensitive to external disturbance with the capacity increase, and the performance of the hard disk is reduced.

Disclosure of utility model

In view of this, the present application provides an electronic apparatus that ensures the performance of a heat generating component.

In order to achieve the above purpose, the present application provides the following technical solutions:

An electronic device, comprising:

A case housing having an accommodation space;

The heating component is arranged in the accommodating space and can generate heat;

the heat dissipation assembly is arranged in the accommodating space and can drive air flow to dissipate heat of the heating assembly;

the adjusting component can adjust the airflow flowing to the heating component, and the disturbance degree of the heating component is reduced when the adjusted airflow passes through the heating component.

Optionally, in the electronic device, the adjusting component includes an adjusting component and a supporting component;

The supporting component can position the adjusting component between the heating component and the heat dissipation component, and the air flow flowing to the heating component can flow to the heating component through the adjustment of the adjusting component.

Optionally, in the electronic device, two ends of the supporting component are provided with connecting parts, and the connecting parts can be detachably connected with the side wall of the case shell;

The two ends of the supporting component are arranged along a first direction, the heating component and the heat dissipation component are arranged along a second direction, and the first direction is different from the second direction.

Optionally, in the electronic device, the supporting component includes a supporting portion, and the adjusting component is disposed on a side of the supporting component facing the heat dissipation component;

The supporting part is provided with a first avoidance hole, the adjusting part is provided with a second avoidance hole which is correspondingly arranged with the first avoidance hole, the first avoidance hole and the second avoidance hole form a first avoidance structure which is correspondingly arranged with a heat dissipation hole structure of the heating component, and the air flow can flow to the heating component through the first avoidance structure.

Optionally, in the electronic device, the number of the supporting portions is plural and the supporting portions are arranged along the first direction, and the supporting member further includes a bending portion connecting two adjacent supporting portions, and the bending portion can be bent along a direction perpendicular to the first direction.

Optionally, in the electronic device, the adjusting component has a hole structure;

The aperture structure may reduce noise transmitted to the heat generating component via the airflow and/or may reduce airflow disturbances of the airflow.

Optionally, in the electronic device, the supporting member has a supporting structure and a connecting structure, the supporting structure has a first surface and a second surface opposite to each other, the first surface faces away from the heat generating component, the connecting structure is located on the second surface, and the adjusting member is connected with the connecting structure;

the support structure is connected with the heating component.

Optionally, in the electronic device, the adjusting component is disposed on a side of the connection structure facing the heat dissipation component;

The connecting structure is provided with a first area and a second area, the first area can be connected with the adjusting part, the second area is provided with a second avoidance structure which is arranged corresponding to the radiating hole structure of the heating component, and the air flow can flow to the heating component through the second avoidance structure.

Optionally, in the electronic device, the supporting component further comprises an insert structure detachably connected with the connecting structure, wherein the insert structure is provided with a third area capable of being connected with the adjusting component;

The third area is larger than the fourth area, and the fourth area is an area where the first area is shielded by the plug-in structure and cannot be connected with the adjusting component.

Drawings

In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic view of an installation of a first adjustment assembly according to an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a first adjusting component according to an embodiment of the present application;

FIG. 4 is a schematic diagram of an exploded view of a first adjustment assembly according to an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a second adjusting assembly according to an embodiment of the present application;

fig. 6 is a schematic partial structure of a second adjusting assembly according to an embodiment of the present application.

Detailed Description

The application discloses an electronic device, which ensures the performance of a heating component.

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

As shown in fig. 1, an embodiment of the present application provides an electronic device, which includes a chassis housing 100, a heating component 200, a heat dissipation component 300, and an adjustment component.

The case housing 100 has an accommodating space, the heat generating component 200 is arranged in the accommodating space and can generate heat, the heat radiating component 300 is arranged in the accommodating space and can drive air flow to radiate heat of the heat generating component 200, the adjusting component is arranged between the heat generating component 200 and the heat radiating component 300 and can adjust air flow flowing to the heat generating component 200, and the disturbance degree of the heat generating component 200 is reduced when the adjusted air flow passes through the heat generating component 200.

In the process that the heat dissipation assembly 300 drives the air flow to dissipate heat of the heat generation assembly 200, the air flow is influenced by noise carried by the air flow as a medium, air flow disturbance of the air flow, and other factors, so that the air flow causes disturbance of the heat generation assembly 200 when contacting with the heat generation assembly 200.

According to the electronic equipment provided by the embodiment of the application, through correspondingly adjusting the airflow flowing to the heating component 200, the disturbance degree of the heating component 200 caused by contact with the airflow can be effectively reduced on the basis that the airflow dissipates heat of the heating component 200, and the performance of the heating component 200 is further ensured.

In an embodiment in which the electronic device is a server, the heat generating component 200 may be a hard disk module. Specifically, hard disk modules, such as a 2U server, are disposed in the front, middle and rear of the server, and up to 40 2.5 "hdds (HARD DISK DRIVE, hard disk drives) and 20 3.5" hdds are disposed in the front, middle and rear. The middle hard disk module is the hard disk module most affected by vibration and noise, so the heating component 200 can be the middle hard disk module.

Of course, the heat generating component 200 may be other components that affect performance due to disturbance, and is not particularly limited herein and is within the scope of protection.

The heat dissipation assembly 300 may be a fan module.

In order to facilitate the adjustment of the air flow, the adjustment assembly comprises an adjustment component and a supporting component, wherein the supporting component can position the adjustment component between the heat generating assembly 200 and the heat dissipating assembly 300, and the air flow flowing to the heat generating assembly 200 can flow to the heat generating assembly 200 through the adjustment of the adjustment component. Since the adjusting member can adjust the air flow, the strength of its own structure may not satisfy the positioning effect. Through setting up adjusting part into the integrated configuration including adjusting part and supporting part for adjusting part satisfies the regulation to the air current can, and supporting part satisfies the support location demand.

Of course, the adjusting assembly may also include only an adjusting component, where the adjusting component is connected to an existing structure (such as the chassis housing 100, the heating assembly 200, or the heat dissipating assembly 300) in the electronic device, so as to achieve the function of positioning the adjusting component between the heating assembly 200 and the heat dissipating assembly 300.

As shown in fig. 1, the adjusting assembly may be a first adjusting assembly 400 or a second adjusting assembly 600, and the first adjusting assembly 400 is different from the second adjusting assembly 600 in structure. In the same electronic device, only the first adjustment assembly 400, only the second adjustment assembly 600, and both the first adjustment assembly 400 and the second adjustment assembly 600 may be provided.

As shown in fig. 1,2, 3 and 4, in the first embodiment, the adjusting component is a first adjusting component 400.

The support member 410 has connection parts 430 at both ends, the connection parts 430 being detachably connected to the side walls 110 of the cabinet housing 100, and the support member 410 has both ends arranged in a first direction, and the heat generating assembly 200 and the heat dissipating assembly 300 are arranged in a second direction, the first direction being different from the second direction.

Since the first direction is different from the second direction, the air flow flowing from the heat sink 300 to the heat generating component 200 can be effectively adjusted in a state where the first adjusting component 400 is located between the heat generating component 200 and the heat sink 300.

Preferably, the first direction is relatively perpendicular to the second direction. As shown in fig. 1, the first direction is the up-down direction of the view structure shown in fig. 1, and the second direction is the left-right direction of the view structure shown in fig. 1.

Through the above arrangement, both ends of the adjustment assembly (first adjustment assembly 400) are detachably connected with the side walls 110 of the cabinet housing 100, respectively, so that the adjustment member 420 can be positioned between the heat generating assembly 200 and the heat dissipating assembly 300.

In a specific embodiment, as shown in fig. 2, the side wall 110 has a bayonet, and the connecting portion 430 has a clamping portion capable of mating with the bayonet. The operator can access the clamping portion from the outside of the side wall 110 (the outside of the accommodation space of the casing 100), thereby achieving the relative connection and disconnection of the side wall 110 and the connection portion 430 by moving the clamping portion with respect to the bayonet.

Further, the connection part 430 further has a pressing part, and the locking part can be relatively separated from the bayonet in a state that the pressing part is pressed by an external force, and can be locked with the bayonet in a state that the pressing part is not pressed, so that the connection part 430 is relatively connected with the sidewall 110. Through the arrangement, the disassembly and assembly operation of the adjustment assembly without tool installation is realized.

In order to ensure smooth flow of the air flow, the combined structure of the support member 410 and the adjustment member 420 has a first avoidance structure provided corresponding to the heat dissipation hole structure of the heat generating assembly 200, and the air flow can flow to the heat generating assembly 200 through the first avoidance structure.

Specifically, as shown in fig. 4, the support member 410 includes a support portion 411, the adjusting member 420 is disposed on a side of the support member 410 facing the heat dissipation assembly 300, the support portion 411 has a first avoidance hole 4111, the adjusting member 420 has a second avoidance hole 421 disposed corresponding to the first avoidance hole 4111, the first avoidance hole 4111 and the second avoidance hole form a first avoidance structure disposed corresponding to a heat dissipation hole structure of the heat dissipation assembly 200, and an air flow can flow toward the heat dissipation assembly 200 through the first avoidance structure.

In this embodiment, the first avoidance hole 4111 and the second avoidance hole 421 are square holes. The shape of which corresponds to the heat radiation hole structure of the heat generating component 200 so as to be able to guide the air flow to the heat radiation hole structure of the heat generating component 200.

The adjustment member 420 can be connected to the support 411 by means of adhesion, snap connection, or the like. Preferably, the lower edge of the supporting part 411 has a bent edge so as to support the bottom surface of the adjustment member 420, reducing the probability of the adjustment member 420 being separated from the supporting part 411.

Since the adjusting member 420 is disposed on the side of the supporting member 410 facing the heat dissipating assembly 300, the air flow contacts the side of the adjusting member 420 facing the heat dissipating assembly 300 before the air flow flows into the first avoiding structure, and in this process, the adjusting member 420 can adjust the air flow.

In addition, in the process that the air flow flows along the first avoidance structure, since the adjusting component 420 is provided with the second avoidance hole 421 which is arranged corresponding to the first avoidance hole 4111, in the process that the air flow enters the second avoidance hole 421, the air flow contacts with the inner wall of the second avoidance hole 421, and in the process, the adjusting component 420 can also adjust the air flow.

That is, the regulating member 420 has a first contact surface perpendicular to the flow direction of the air flow and a second contact surface along the flow direction of the air flow. The airflow flowing direction may be parallel to the second direction, and the airflow flows from the heat dissipating component 300 to the heat generating component 200, that is, the airflow flows along the arrangement direction of the heat dissipating component 300 and the heat generating component 200.

The two contact surfaces may be functional surfaces capable of adjusting the air flow, that is, the air flow can be adjusted in the process of contacting the air flow with the two surfaces, so that the disturbance degree of the heating assembly 200 caused by contacting the air flow is reduced.

Of course, only one of the contact surfaces may be used as the functional surface capable of adjusting the air flow. For example, the first contact surface is a functional surface, so that when the air flow contacts with the surface (the first contact surface) of the adjusting component 420 facing the heat dissipating assembly 300, the air flow can be adjusted, and then the adjusted air flow flows to the heat generating assembly 200 through the first avoiding structure formed by the second avoiding hole 421 and the first avoiding hole 4111. Or the second contact surface is a functional surface, and the air flow contacts with the surface of the adjusting component 420 facing the heat dissipating assembly 300 and flows to the first avoidance structure, and when passing through the second avoidance hole 421, the air flow contacts with the inner wall (second contact surface) of the second avoidance hole 421, so as to adjust the air flow.

In the present embodiment, the number of the adjusting members 420 may be plural so as to correspond to the plural heat dissipation hole structures of the heat generating components 200 or the heat dissipation hole structures of the plural heat generating components 200, respectively.

Further, the supporting parts 410 further include bending parts 412 connecting two adjacent supporting parts 411, and the bending parts 412 can be bent in a direction perpendicular to the first direction. With the above arrangement, the distance between the two connection parts 430 can be adjusted by bending the bending part 412, thereby facilitating connection and disconnection of the connection parts 430 and the side walls 110.

In addition, by providing the bending portion 412, the supporting member 410 can have a certain elastic deformation in the first direction, so that the impact on the supporting member 410 in the initial state that the air flow contacts the supporting member 410 is avoided, and the structural stability of the supporting member 410 is improved.

The bending part 412 may be provided as an elastic bending part, that is, the bending part 412 may be bent to different degrees by being subjected to force when an external force is applied to the support member 410, so that the support member 410 is correspondingly deformed, and the bending part 412 may be restored to an initial bending degree by an elastic restoring force of itself when the external force is lost or weakened.

In one embodiment, the conditioning component has a hole-like structure that reduces noise transmitted by the air flow to the heat generating component 200. The hole-like structure may also be made to reduce airflow disturbances of the airflow.

In the process of flowing the air flow from the heat dissipation assembly 300 to the heat generation assembly 200, the effects of reducing noise and reducing air flow disturbance can be performed after the air flow contacts the hole-shaped structure of the adjusting component, so that the air flow is adjusted, and the adjusted air flow passes through the first avoiding structure to flow to the heat generation assembly 200.

In this embodiment, the adjusting member is preferably a sound absorbing cotton, and the hole structure is a pore structure of the sound absorbing cotton.

The air hole structure of the sound absorbing cotton can be used as an auxiliary channel for air flow to pass through, namely, in the process that the air flow flows from the heat dissipation assembly 300 to the heating assembly 200, a small part of air can flow to the first avoidance structure through the air hole structure of the sound absorbing cotton, and most of air passes through the first avoidance structure so as to reduce the resistance of the air flow passing through the adjusting assembly.

It is also possible that the hole-like structure is only used as an adjusting structure for adjusting the air flow, which does not pass through the hole-like structure.

Of course, in the embodiment without the second avoidance hole 421 and only with the first avoidance hole 4111, the adjusting member is sound absorbing cotton, and the air flow needs to pass through the air hole structure of the sound absorbing cotton entirely and flow through the first avoidance hole 4111 to the heat generating component 200.

The porous structure of the sound absorbing cotton can reduce the noise transmitted to the heating component 200 by taking air flow as a medium, and the specific principle is that sound waves (noise) of the air flow enter the inside of the pore structure of the sound absorbing cotton and are reflected for multiple times, so that the contact area between the sound waves and the sound absorbing cotton material is increased, the absorption efficiency of the sound waves is improved, and the solid material (fiber material) in the sound absorbing cotton can generate damping action on the sound waves, so that the sound waves are converted into tiny heat in the process of entering the inside of the pore structure of the sound absorbing cotton and contacting with the solid material, and the propagation of the sound waves is reduced.

The porous structure of the sound absorbing cotton can reduce air flow disturbance of air flow, and the specific principle is that the air flow enters the sound absorbing cotton from the air hole structure of the sound absorbing cotton, and the air flow can be reflected, refracted and diffused for many times when passing through the holes, so that the kinetic energy of the air flow is reduced, and the flow speed and the turbulence degree of the air flow are reduced.

Therefore, the sound absorbing cotton can absorb sound waves and reduce disturbance of air flow.

Of course, the adjusting component can also be provided as other components, such as an acoustic panel (acoustic panel) or an acoustic screen, by which the effect of absorbing sound and reducing noise is achieved.

The adjusting means may also be arranged as means capable of reducing turbulence in the air flow.

In the second embodiment, as shown in fig. 1 and 5, the adjusting component is a second adjusting component 600.

The supporting component is provided with a supporting structure 610 and a connecting structure 620, the supporting structure 610 is provided with a first surface and a second surface which are opposite, the first surface is opposite to the heating component 200, the connecting structure 620 is positioned on the second surface, the adjusting component is connected with the connecting structure 620, and the supporting structure 610 is connected with the heating component 200.

In the present embodiment, the positioning of the supporting member is achieved by the supporting structure 610 of the adjusting assembly being connected with the heat generating assembly 200, and the adjusting member is connected with the connecting structure 620, which achieves the operation of positioning the adjusting member between the heat generating assembly 200 and the heat dissipating assembly 300.

Specifically, the casing 100 of the electronic device includes a casing having a housing cavity and an upper cover disposed on the casing, where the upper cover seals the housing cavity to form a housing space for housing the heating element 200, the heat dissipating element 300, and the adjusting element.

In the process that the adjusting component is mounted in the accommodating cavity, the connecting structure 620 is inserted between the heating component 200 and the heat dissipating component 300, the second face of the supporting structure 610 contacts with one face (top face) of the heating component 200 facing the opening of the accommodating cavity, and the inner wall of the upper cover contacts with the first face of the supporting structure 610 through the connection of the upper cover and the housing, so that the supporting structure 610 is clamped between the upper cover and the heating component 200, and then a positioning effect is achieved. Through the arrangement, the disassembly and assembly operation of the tool-free adjusting component in the limited space is realized.

In this embodiment, other components, such as the heat dissipation fins 500, are further included between the heat generating component 200 and the heat dissipation component 300, the second surface of the supporting structure 610 contacts with the heat generating component 200 and the top surface of the heat dissipation fins 500, and the connecting structure 620 is located between the heat generating component 200 and the heat dissipation fins 500.

In this embodiment, the adjusting component is disposed on a side of the connecting structure 620 facing the heat dissipating assembly 300, and the connecting structure 620 has a first area and a second area, wherein the first area can be connected with the adjusting component, the second area has a second avoiding structure disposed corresponding to the heat dissipating hole structure of the heat generating assembly 200, and the air flow can flow to the heat generating assembly 200 through the second avoiding structure. That is, the air flow is adjusted by contacting the adjusting member, and then flows through the second avoiding structure of the second region and flows toward the heat generating module 200.

Specifically, the connection structure 620 is a grid structure, the real part is a first area, and the hollow part is a second area.

For easy adjustment, the support member further includes an insert structure 630 detachably connected to the connection structure 620, wherein the insert structure 630 has a third area capable of being connected to the adjustment member, and the third area is larger than a fourth area, and the fourth area is an area where the first area is shielded by the insert structure 630 and cannot be connected to the adjustment member.

That is, in a state where the insert structure 630 is connected with the connection structure 620, the total area that can be connected with the adjustment member increases.

Through the above arrangement, whether the insert structure 630 is installed or not can be selected according to specific requirements, so that the total area of the adjusting component is controlled and the adjusting effect on the air flow is adjusted.

In this embodiment, the connection structure 620 is a grid structure, the insert structure 630 can be mounted on a solid portion of the grid structure, the solid portion of the insert structure 630 is blocked by the insert structure 630 and cannot be connected to the adjusting component, and a third area capable of being connected to the adjusting component is formed on the surface of the adjusting component.

Of course, in a specific arrangement, in a state in which the insert structure 630 is connected to the connection structure 620, the adjustment member may be provided only on the insert structure 630, that is, only on the third region, and the adjustment member may not be provided on the connection structure 620. Adjustment features may also be provided on both the connection structure 620 and the insert structure 630.

It is also possible to provide an adjusting member on the connection structure 620 in a state where the connection structure 620 is not connected to the card structure 630.

The connection structure 620 has a third face facing the heat dissipating assembly 300, and the adjustment component may be attached to the third face of the connection structure 620 by adhesive, snap fit, or other positioning means. Also, the interposer structure 630 is also connected to the third face of the connection structure 620. Wherein, the insert structure 630 has a side facing the third surface of the connection structure 620, and other outer surfaces of the insert structure 630 can be connected with the adjusting component, wherein the adjusting component can be connected with the insert structure 630 by adhesion, buckling or other positioning members.

That is, in a state where the connection structure 620 is connected to the card structure 630, the total area where the adjustment member can be provided is increased. That is, the insert structure 630 serves as a member for increasing the area to which the adjusting member can be connected, and the adjusting member can be disposed on the insert structure 630 so as to be capable of increasing the total area of the adjusting member by being engaged with the connection structure 620, so that the degree of freedom for adjusting the total amount of the connecting adjusting member can be increased, and the total amount of the adjusting member disposed on the adjusting assembly (the second adjusting assembly 600) and the disposition position of the adjusting member can be adjusted according to the actual demand. Specifically, when the heat generating component 200 has a higher anti-disturbance requirement (for example, when the heat generating component 200 is a hard disk module and the capacity is larger), the total amount of the adjusting components can be increased, and the adjusting components are disposed on the connection structure 620 and the plug-in structure 630 as described above.

When the heat generating component 200 has a higher heat dissipation requirement (for example, when the heat generating component 200 is a hard disk module and the heat dissipation capacity is larger), the obstruction to the air flow needs to be reduced, and the adjusting component may be only arranged on the connecting structure 620, so that the air flow is reduced to be obstructed by the adjusting component, and thus the air flows to the heat generating component 200 through the second avoiding structure in the second area.

As shown in fig. 6, the connection structure 620 has a fastening structure 621, and the insert structure 630 has a fastening portion 631, and the fastening portion 631 is fastened into the fastening structure 621.

In order to facilitate the clamping of the clamping portion 631 into the fastening structure 621, the clamping portion 631 is generally a cylindrical structure, and the fastening structure 621 is a C-shaped ring structure with an opening, and through elastic deformation of the fastening structure 621, the clamping portion 631 enters the inside of the C-shaped ring structure from the opening of the C-shaped ring structure, and due to the fact that the inner wall of the C-shaped ring structure is tightly held against the outer wall of the clamping portion 631, the clamping portion 631 easily rotates in the fastening structure 621 under the action of gravity of the plug-in structure 630 or pressure and the like when contacting with air current, so that the positioning effect of the plug-in structure 630 is affected. For example, in the embodiment where the insert structure 630 has the clamping portion 631 at the end near the connection structure 620, the other end of the insert structure 630 extends away from the connection structure 620, such that the extending direction from the one end to the other end of the insert structure 630 is perpendicular to the third face of the connection structure 620, and the center of gravity of the insert structure 630 is located between the one end to the other end of the insert structure 630, under the action of gravity, the other end of the insert structure 630 is easy to move downward, so as to drive the clamping portion 631 to rotate in the clamping structure 621, and after the insert structure 630 rotates and tilts by a certain angle, the insert structure 630 is easy to cover the second avoidance structure of the second area of the connection structure 620. Therefore, in order to improve the positioning effect, the locking portion 631 is fixed to the locking structure 621 by the positioning connector 640. The positioning connector 640 may be a screw, so as to facilitate positioning the connection structure 620 and the insert structure 630, thereby avoiding the insert structure 630 from moving relative to the connection structure 620 to block the second avoidance structure.

In this embodiment, the adjusting member has a hole structure, and the hole structure can reduce noise transmitted to the heat generating component 200 by using the air flow as a medium, and can also enable the hole structure to reduce air flow disturbance of the air flow.

The adjusting member may be a sound absorbing cotton, a sound absorbing plate (sound insulating plate), a sound insulating screen, or the like. The air hole structure of the sound absorbing cotton can be used as an auxiliary channel for air flow to pass through, namely, in the process that the air flow flows from the heat dissipation assembly 300 to the heating assembly 200, a small part of air can flow to the second avoidance structure through the air hole structure of the sound absorbing cotton, and a large part of air passes through the second avoidance structure so as to reduce the resistance of the air flow passing through the adjusting assembly.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic device, comprising:

A case housing having an accommodation space;

2. The electronic device of claim 1, wherein the adjustment assembly comprises an adjustment member and a support member;

3. The electronic apparatus according to claim 2, wherein both ends of the supporting member have connection portions detachably connectable with side walls of the cabinet housing;

4. The electronic device according to claim 3, wherein the supporting member includes a supporting portion, and the adjusting member is provided at a side of the supporting member facing the heat dissipating assembly;

5. The electronic device according to claim 4, wherein the number of the supporting portions is plural and arranged in the first direction, the supporting member further includes a bending portion connecting adjacent two of the supporting portions, the bending portion being capable of bending in a direction perpendicular to the first direction.

6. The electronic device according to claim 4 or 5, wherein the regulating member has a hole-like structure;

7. The electronic device of claim 2, wherein the support member has a support structure and a connection structure, the support structure has a first surface and a second surface opposite to each other, the first surface faces away from the heat generating component, the connection structure is located on the second surface, and the adjustment member is connected with the connection structure;

the support structure is connected with the heating component.

8. The electronic device of claim 7, wherein the adjustment member is disposed on a side of the connection structure facing the heat dissipation assembly;

9. The electronic device of claim 8, wherein the support member further comprises an insert structure removably coupled to the coupling structure, the insert structure having a third region connectable to the adjustment member;

10. The electronic device according to claim 8 or 9, wherein the regulating member has a hole-like structure;