CN222754663U - Laser processing head and laser processing system for laser drilling - Google Patents

Laser processing head and laser processing system for laser drilling Download PDF

Info

Publication number
CN222754663U
CN222754663U CN202421517840.0U CN202421517840U CN222754663U CN 222754663 U CN222754663 U CN 222754663U CN 202421517840 U CN202421517840 U CN 202421517840U CN 222754663 U CN222754663 U CN 222754663U
Authority
CN
China
Prior art keywords
laser
optical element
laser processing
laser beam
processing head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202421517840.0U
Other languages
Chinese (zh)
Inventor
王政
白学坤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Evenoptics Technology Co ltd
Original Assignee
Shanghai Evenoptics Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Evenoptics Technology Co ltd filed Critical Shanghai Evenoptics Technology Co ltd
Priority to CN202421517840.0U priority Critical patent/CN222754663U/en
Application granted granted Critical
Publication of CN222754663U publication Critical patent/CN222754663U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Laser Beam Processing (AREA)

Abstract

本实用新型涉及激光加工技术领域,尤其是涉及一种用于激光打孔的激光加工头、激光加工系统。该激光加工头使用时固定于电机上,电机用于带动激光加工头上下移动,激光加工头包括外壳、旋转镜座以及第三光学元件;外壳固定于电机上,外壳下表面活动连接有旋转镜座,第三光学元件设置于旋转镜座下表面,并与旋转镜座偏心设置;其中,外壳、旋转镜座的中轴线与激光光束的光轴相同。本实用新型通过集成多种光学元件和自动控制系统,能够得到高效、高精度打孔加工的激光加工系统;该激光加工系统利用一系列光学元件,包括折射光学组件、衍射光学元件、聚焦透镜、旋转镜座和聚焦物镜等,能够将激光光束聚焦后在被加工工件上形成一定深度的改质区域。

The utility model relates to the field of laser processing technology, and in particular to a laser processing head and a laser processing system for laser drilling. The laser processing head is fixed on a motor when in use, and the motor is used to drive the laser processing head to move up and down. The laser processing head includes a housing, a rotating mirror seat, and a third optical element; the housing is fixed on the motor, and the rotating mirror seat is movably connected to the lower surface of the housing, and the third optical element is arranged on the lower surface of the rotating mirror seat and is eccentrically arranged with the rotating mirror seat; wherein, the central axis of the housing and the rotating mirror seat is the same as the optical axis of the laser beam. The utility model can obtain a laser processing system for efficient and high-precision drilling processing by integrating a variety of optical elements and an automatic control system; the laser processing system utilizes a series of optical elements, including a refractive optical component, a diffractive optical element, a focusing lens, a rotating mirror seat, and a focusing objective lens, etc., which can focus the laser beam to form a modified area of a certain depth on the workpiece being processed.

Description

Laser processing head and laser processing system for laser drilling
Technical Field
The utility model relates to the technical field of laser processing, in particular to a laser processing head and a laser processing system for laser drilling.
Background
Laser drilling technology is widely used in modern industry, especially in the fields of electronic products, optical devices and the like. Laser drilling is increasingly becoming an important tool in industrial processing due to its advantages of non-contact processing. Conventional laser drilling techniques typically use a single focal point for drilling, and have the disadvantages of being prone to causing microcracks in the material, being prone to forming elliptical holes through subsequent chemical etching, and long etching times.
Disclosure of utility model
In order to solve the problems, an object of the present utility model is to provide a laser processing head and a laser processing system for laser drilling. According to the utility model, high-speed precise drilling in the laser drilling process is realized by rotating the lens base.
Therefore, the utility model/utility model provides a laser drilling scheme, and by using the scheme, holes drilled in the material have a certain depth and are uniform, the etching processing time is shorter, and the laser high-speed precise drilling is realized.
The aim of the utility model can be achieved by the following technical scheme:
The first object of the present utility model is to provide a laser processing head for laser drilling, which is fixed on a motor in use, the motor is used for driving the laser processing head to move up and down, and the laser processing head comprises a housing, a rotary mirror base and a third optical element;
The shell is fixed on the motor, the lower surface of the shell is movably connected with the rotary mirror seat, and the third optical element is arranged on the lower surface of the rotary mirror seat and is eccentrically arranged with the rotary mirror seat;
the central axes of the shell and the rotary mirror seat are the same as the optical axis of the laser beam.
When in use, the laser beam passes through the third optical element to form a long focal depth focusing light spot;
The size and depth of focus of the final focused spot can be varied by adjusting the focal length of the third optical element, the numerical aperture of the third optical element.
In one embodiment of the present utility model, a distance between the central axis of the third optical element and the central axis of the rotary mirror base is 10 μm to 200 μm.
In one embodiment of the utility model, the first optical element and the second optical element are sequentially arranged at intervals in the inner cavity of the housing along the travelling direction of the laser beam.
When the device is used, a laser beam passes through the first optical element to form a long-focal-depth Bessel laser beam, the long-focal-depth Bessel laser beam is initially focused through the second optical element, and finally enters the third optical element to form a long-focal-depth focusing light spot;
The size and depth of focus of the final focused spot can be varied by adjusting the focal length of the second optical element, the focal length of the third optical element.
In one embodiment of the present utility model, the first optical element is selected from one of a refractive optical element or a diffractive optical element (having a unique phase distribution design, capable of performing a distribution modulation on an incident laser beam);
the second optical element is a focusing lens.
In one embodiment of the present utility model, the refractive optical element is a conical lens, and an included angle formed by a conical generatrix and a conical bottom surface of the conical lens is 0.5 ° to 20 °.
In one embodiment of the present utility model, the focal length of the second optical element is 35mm to 300mm.
In one embodiment of the utility model, the third optical element is a focusing objective.
In one embodiment of the present utility model, the focal length of the third optical element is 4mm to 25mm;
The numerical aperture of the third optical element is 0.2-0.95.
A second object of the present utility model is to provide a laser processing system comprising the laser processing head described above.
In one embodiment of the utility model, the laser processing system is arranged on an external objective table in use and connected with an external computer for realizing the processing of a processed workpiece placed on the upper surface of the objective table, and comprises a laser emitter,
The laser transmitter is used for transmitting laser beams, and a first reflecting mirror, a second reflecting mirror, a laser beam expander, a third reflecting mirror and a fourth reflecting mirror are sequentially arranged between the laser transmitter and the laser processing head along the transmitting direction of the laser beams;
Wherein the laser beam emitted by the laser emitter forms an included angle with the laser beam reflected by the second reflector and is parallel to the laser beam reflected by the second reflector;
The central axis of the laser beam passing through the laser beam expander is the same as the optical axis of the laser beam reflected by the second reflector, and an included angle exists between the central axis of the laser beam passing through the laser beam expander and the laser beam reflected by the third reflector and is perpendicular to the laser beam reflected by the fourth reflector;
the laser transmitter, the motor and the object stage are all connected with a computer.
A third object of the present utility model is to provide a processing method of a laser processing system, comprising the steps of:
The method comprises the steps of utilizing a computer to control a laser transmitter to emit laser beams, enabling the laser beams to enter a first reflecting mirror in a collimation mode, enabling the laser beams to enter a beam expanding mirror in a collimation mode through the first reflecting mirror and a second reflecting mirror in a beam expanding mode to expand the laser beams, enabling the laser beams to enter a third reflecting mirror in a collimation mode, enabling the laser beams to enter a laser processing head in a collimation mode through the third reflecting mirror and a fourth reflecting mirror in a collimation mode, or enabling the laser beams to form eccentric focusing light spots on a processed workpiece through a first optical element, a second optical element and a third optical element;
The computer controls the up-and-down movement of the motor so as to control the up-and-down movement of the laser processing head to form a circular modified region with a certain depth on a processed workpiece;
The computer also realizes the adjustment of the position of the processed workpiece by controlling the movement of the position of the object stage.
The laser processing head (comprising the first optical element and the second optical element) can directly obtain a circular modified region with a certain depth (allowing the laser processing head not to move up and down by using a motor), and the laser processing head (not comprising the first optical element and the second optical element) needs to be matched with the motor to enable the focusing light spot to move up and down to form the circular modified region with a certain depth.
If necessary, the processed workpiece can be subjected to subsequent chemical corrosion and other treatment procedures, and finally circular small holes are formed on the processed workpiece.
Compared with the prior art, the utility model has the following beneficial effects:
(1) The laser processing system can obtain a laser processing system for high-efficiency and high-precision punching processing by integrating various optical elements and an automatic control system, and can form a modified region with a certain depth on a processed workpiece after focusing laser beams by utilizing a series of optical elements, including a refractive optical component, a diffractive optical element, a focusing lens, a rotary lens seat, a focusing objective lens and the like.
(2) The laser processing head can be suitable for ultrafast laser processing, such as high-speed punching, and the precision and the efficiency of laser punching are obviously improved.
Drawings
FIG. 1 is a schematic view of a laser processing head according to embodiment 1;
FIG. 2 is a schematic diagram of a structure of a rotary lens holder and a third optical element;
FIG. 3 is a schematic view of the laser processing head according to embodiment 2;
fig. 4 is a schematic structural diagram of a laser processing system according to embodiment 3;
FIG. 5 is a schematic diagram (I) of a processing track of a workpiece to be processed;
FIG. 6 is a schematic diagram of the processing track of the workpiece to be processed (II)
Reference numeral 1 in the figure, the outer casing; 2, a first optical element, 3, a second optical element, 4, a rotary lens seat, 5, a third optical element, 6, a motor, 100, a laser processing head, 200, a laser transmitter, 300A, a first reflecting mirror, 300B, a second reflecting mirror, 300C, a third reflecting mirror, 300D, a fourth reflecting mirror, 400, a laser beam expander, 500, a laser beam, 600, a processed workpiece, 700, an objective table, 800, a computer, 900, and a focusing light spot.
Detailed Description
The utility model will now be described in detail with reference to the drawings and specific examples.
In the description of the present utility model, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may, for example, be fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
In the following examples, unless otherwise specified, all components used are those conventionally commercially available in the art and are capable of performing the corresponding functions.
Example 1
The embodiment provides a laser processing head for laser drilling, as shown in fig. 1, the laser processing head is fixed on a motor 6 when in use, the motor 6 is used for driving a laser processing head 100 to move up and down, the laser processing head 100 comprises a shell 1, a rotary mirror seat 4 and a third optical element 5, wherein the shell 1 is fixed on the motor 6, the lower surface of the shell 1 is movably connected with the rotary mirror seat 4, and the third optical element 5 is arranged on the lower surface of the rotary mirror seat 4 and is eccentrically arranged with the rotary mirror seat 4 as shown in fig. 2;
The central axes of the shell 1 and the rotary mirror seat 4 are the same as the optical axis of the laser beam 500, when in use, the laser beam 500 passes through the third optical element 5 to form a long focal depth focusing light spot 900, and the size and focal depth of the final focusing light spot 900 can be changed by adjusting the focal length of the third optical element 5 and the numerical aperture of the third optical element 5.
Further, the distance between the central axis of the third optical element 5 and the central axis of the rotary lens seat 4 is 10 μm-200 μm, the third optical element 5 is a focusing objective lens, the focal length of the third optical element 5 is 4 mm-25 mm, and the numerical aperture of the third optical element 5 is 0.2-0.95.
As shown in fig. 2, the central axis of the rotating mirror base 414 is O 1, the central axis of the third optical element 5 is O 2, the distance between O 1、O2 is defined as the eccentric distance d, the computer 800 controls the rotating mirror base 4 to rotate around the optical axis to drive the third optical element 5 to rotate, the focusing light spot 900 moves circularly along with the rotating mirror base, a circular modified region is formed on the workpiece 600, and the smaller the eccentric distance d is, the smaller the radius of the circular modified region is, and the smaller the size of the focusing light spot 900 is not.
Example 2
The present embodiment provides a laser processing head for laser drilling, as shown in fig. 3, compared with embodiment 1, the laser processing head 100 of the present embodiment further includes a first optical element 2 and a second optical element 3 sequentially disposed at intervals in the direction in which the laser beam 500 travels in the inner cavity of the housing 1.
Further, the first optical element 2 is selected from one of a refractive optical element or a diffractive optical element (having a unique phase distribution design, capable of performing a distribution modulation of the incident laser beam 500), and the second optical element 3 is a focusing lens.
Furthermore, the refractive optical element may be a conic lens, the included angle formed by the conic generatrix and the conic bottom surface of the conic lens is 0.5-20 °, and the focal length of the second optical element 3 is 35-300 mm.
Example 3
This embodiment provides a laser processing system, as shown in fig. 4, which is disposed on an external stage 700 in use and connected to an external computer 800 for realizing processing of a workpiece 600 placed on the upper surface of the stage 700, the laser processing system including a laser transmitter 200 and the laser processing head 100 described in embodiment 1,
The laser transmitter 200 is used for transmitting a laser beam 500, and a first reflecting mirror 300A, a second reflecting mirror 300B, a laser beam expander 400, a third reflecting mirror 300C and a fourth reflecting mirror 300D are sequentially arranged between the laser transmitter 200 and the laser processing head 100 along the transmitting direction of the laser beam 500;
Wherein the laser beam 500 emitted by the laser emitter 200 forms an angle with the laser beam 500 reflected by the second reflecting mirror 300B and is parallel to the laser beam 500 reflected by the second reflecting mirror 300B, the central axis of the laser beam 500 by the laser beam expander 400 is the same as the optical axis of the laser beam 500 reflected by the second reflecting mirror 300B and forms an angle with the laser beam 500 reflected by the third reflecting mirror 300C and is perpendicular to the laser beam 500 reflected by the fourth reflecting mirror 300D, and the laser emitter 200, the motor 6 and the stage 700 are all connected with the computer 800.
Example 4
The present embodiment provides a processing method of a laser processing system (the laser processing system described in embodiment 3), including the steps of:
the computer 800 is used for controlling the laser transmitter 200 to transmit the laser beam 500, the laser beam 500 is collimated and enters the first reflector 300A, then is collimated and enters the beam expander through the first reflector 300A and the second reflector 300B to expand the laser beam 500, then is collimated and enters the third reflector 300C, and then is collimated and enters the laser processing head 100 through the third reflector 300C and the fourth reflector 300D, the laser beam 500 forms an eccentric focusing light spot 900 on the processed workpiece 600 through the third optical element 5;
The computer 800 allows movement of the control stage 700 position to effect adjustment of the position of the workpiece 600 being processed.
Example 5
The present embodiment provides a laser processing system, which is disposed on an external stage 700 in use and connected to an external computer 800 for realizing the processing of a workpiece 600 placed on the upper surface of the stage 700, the laser processing system comprising a laser transmitter 200 and the laser processing head 100 described in embodiment 2,
The laser transmitter 200 is used for transmitting a laser beam 500, and a first reflecting mirror 300A, a second reflecting mirror 300B, a laser beam expander 400, a third reflecting mirror 300C and a fourth reflecting mirror 300D are sequentially arranged between the laser transmitter 200 and the laser processing head 100 along the transmitting direction of the laser beam 500;
Wherein the laser beam 500 emitted by the laser emitter 200 forms an angle with the laser beam 500 reflected by the second reflecting mirror 300B and is parallel to the laser beam 500 reflected by the second reflecting mirror 300B, the central axis of the laser beam 500 by the laser beam expander 400 is the same as the optical axis of the laser beam 500 reflected by the second reflecting mirror 300B and forms an angle with the laser beam 500 reflected by the third reflecting mirror 300C and is perpendicular to the laser beam 500 reflected by the fourth reflecting mirror 300D, and the laser emitter 200, the motor 6 and the stage 700 are all connected with the computer 800.
Example 6
The present embodiment provides a processing method of a laser processing system (the laser processing system described in embodiment 5), comprising the steps of:
The computer 800 is used for controlling the laser transmitter 200 to transmit the laser beam 500, the laser beam 500 is collimated and enters the first reflector 300A, then is collimated and enters the beam expander through the first reflector 300A and the second reflector 300B to expand the laser beam 500, then is collimated and enters the third reflector 300C, then is collimated and enters the laser processing head 100 through the third reflector 300C and the fourth reflector 300D, the laser beam 500 passes through the Bessel laser beam 500 through the first optical element 2, the Bessel laser beam is preliminarily focused and adjusted through the second optical element 3 to adjust the divergence angle of the Bessel laser beam 500, and then forms an eccentric focusing light spot 900 on the processed workpiece 600 through the third optical element 5;
Wherein the computer 800 allows for adjustment of the position of the workpiece 600 being processed by controlling the movement of the stage 700 position.
As shown in fig. 5 and 6, C 1 and C 2 are optical axis positions, l 1 and l 2 are processing tracks formed by the focusing spot 900 when the rotary mirror base 4 rotates, where l 1 is a PSO (position synchronized output, position synchronous output) processing track generally used for glass, and l 2 is a continuous processing track of the laser focus when the rotary mirror base 4 rotates. If necessary, circular small holes can be finally formed on the processed material through treatment procedures such as subsequent chemical corrosion and the like.
In the above embodiment, the rotary mirror base 4 and the motor 6 are automatically controlled by the computer 800 during the processing, and the system in the computer 800 can automatically control the laser power, the rotation speed, the forward, backward, leftward, rightward displacement of the stage 700, and the height of the laser processing head 100 according to the requirement, so as to improve the punching processing speed, reduce the influence of the outside on the punching displacement process, and improve the punching precision.
The previous description of the embodiments is provided to facilitate a person of ordinary skill in the art in order to make and use the present utility model. It will be apparent to those skilled in the art that various modifications can be readily made to these embodiments and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present utility model is not limited to the above-described embodiments, and those skilled in the art, based on the explanation of the present utility model, should make improvements and modifications without departing from the scope of the present utility model.

Claims (10)

1.一种用于激光打孔的激光加工头,使用时固定于电机(6)上,电机(6)用于带动激光加工头(100)上下移动,其特征在于,激光加工头(100)包括外壳(1)、旋转镜座(4)以及第三光学元件(5);1. A laser processing head for laser drilling, which is fixed on a motor (6) when in use, and the motor (6) is used to drive the laser processing head (100) to move up and down, characterized in that the laser processing head (100) comprises a housing (1), a rotating mirror seat (4) and a third optical element (5); 所述外壳(1)固定于电机(6)上,所述外壳(1)下表面活动连接有旋转镜座(4),所述第三光学元件(5)设置于旋转镜座(4)下表面,并与旋转镜座(4)偏心设置;The housing (1) is fixed on the motor (6); the lower surface of the housing (1) is movably connected to a rotating mirror seat (4); the third optical element (5) is arranged on the lower surface of the rotating mirror seat (4) and is eccentrically arranged with respect to the rotating mirror seat (4); 其中,外壳(1)、旋转镜座(4)的中轴线与激光光束(500)的光轴相同。The central axis of the housing (1) and the rotating mirror seat (4) is the same as the optical axis of the laser beam (500). 2.根据权利要求1所述的一种用于激光打孔的激光加工头,其特征在于,所述第三光学元件(5)的中轴线与旋转镜座(4)的中轴线的间距为10μm~200μm。2. A laser processing head for laser drilling according to claim 1, characterized in that the distance between the central axis of the third optical element (5) and the central axis of the rotating mirror seat (4) is 10 μm to 200 μm. 3.根据权利要求1所述的一种用于激光打孔的激光加工头,其特征在于,沿激光光束(500)行进的方向,外壳(1)的内腔依次间隔设置有第一光学元件(2)和第二光学元件(3)。3. A laser processing head for laser drilling according to claim 1, characterized in that, along the direction of travel of the laser beam (500), the inner cavity of the shell (1) is provided with a first optical element (2) and a second optical element (3) in sequence. 4.根据权利要求3所述的一种用于激光打孔的激光加工头,其特征在于,所述第一光学元件(2)选自折射光学元件或衍射光学元件中的一种;4. A laser processing head for laser drilling according to claim 3, characterized in that the first optical element (2) is selected from one of a refractive optical element or a diffractive optical element; 所述第二光学元件(3)为聚焦透镜。The second optical element (3) is a focusing lens. 5.根据权利要求4所述的一种用于激光打孔的激光加工头,其特征在于,第二光学元件(3)的焦距为35mm~300mm。5. A laser processing head for laser drilling according to claim 4, characterized in that the focal length of the second optical element (3) is 35 mm to 300 mm. 6.根据权利要求1所述的一种用于激光打孔的激光加工头,其特征在于,所述第三光学元件(5)为聚焦物镜。6. A laser processing head for laser drilling according to claim 1, characterized in that the third optical element (5) is a focusing objective lens. 7.根据权利要求6所述的一种用于激光打孔的激光加工头,其特征在于,第三光学元件(5)的焦距为4mm~25mm。7. A laser processing head for laser drilling according to claim 6, characterized in that the focal length of the third optical element (5) is 4 mm to 25 mm. 8.根据权利要求6所述的一种用于激光打孔的激光加工头,其特征在于,第三光学元件(5)的数值孔径为0.2~0.95。8. A laser processing head for laser drilling according to claim 6, characterized in that the numerical aperture of the third optical element (5) is 0.2 to 0.95. 9.一种激光加工系统,其特征在于,包括权利要求1~8任一所述的激光加工头(100)。9. A laser processing system, characterized by comprising the laser processing head (100) according to any one of claims 1 to 8. 10.根据权利要求9所述的一种激光加工系统,使用时设置于外部载物台(700)上,并与外部计算机(800)相连接,用于实现载物台(700)上表面放置的被加工工件(600)的加工,其特征在于,所述激光加工系统包括激光发射器(200),10. A laser processing system according to claim 9, which is arranged on an external stage (700) and connected to an external computer (800) when in use, and is used to process a workpiece (600) placed on the upper surface of the stage (700), characterized in that the laser processing system comprises a laser emitter (200), 激光发射器(200)用于发射激光光束(500),沿激光光束(500)发射方向,激光发射器(200)和激光加工头(100)之间依次设置有第一反射镜(300A)、第二反射镜(300B)、激光扩束镜(400)、第三反射镜(300C)和第四反射镜(300D);The laser emitter (200) is used to emit a laser beam (500), and along the emission direction of the laser beam (500), a first reflector (300A), a second reflector (300B), a laser beam expander (400), a third reflector (300C) and a fourth reflector (300D) are sequentially arranged between the laser emitter (200) and the laser processing head (100); 其中,经由激光发射器(200)发射的激光光束(500)与经由第二反射镜(300B)反射的激光光束(500)存在夹角,与经由第二反射镜(300B)反射的激光光束(500)平行;There is an angle between the laser beam (500) emitted by the laser emitter (200) and the laser beam (500) reflected by the second reflector (300B), and the laser beam (500) is parallel to the laser beam (500) reflected by the second reflector (300B); 经由激光扩束镜(400)的激光光束(500)的中轴线与经由第二反射镜(300B)反射的激光光束(500)的光轴相同,与经由第三反射镜(300C)反射的激光光束(500)存在夹角,与经由第四反射镜(300D)反射的激光光束(500)垂直;The central axis of the laser beam (500) passing through the laser beam expander (400) is the same as the optical axis of the laser beam (500) reflected by the second reflector (300B), is at an angle with the laser beam (500) reflected by the third reflector (300C), and is perpendicular to the laser beam (500) reflected by the fourth reflector (300D); 激光发射器(200)、电机(6)和载物台(700)均与计算机(800)相连接。The laser emitter (200), the motor (6) and the stage (700) are all connected to the computer (800).
CN202421517840.0U 2024-06-30 2024-06-30 Laser processing head and laser processing system for laser drilling Active CN222754663U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202421517840.0U CN222754663U (en) 2024-06-30 2024-06-30 Laser processing head and laser processing system for laser drilling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202421517840.0U CN222754663U (en) 2024-06-30 2024-06-30 Laser processing head and laser processing system for laser drilling

Publications (1)

Publication Number Publication Date
CN222754663U true CN222754663U (en) 2025-04-15

Family

ID=95314744

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202421517840.0U Active CN222754663U (en) 2024-06-30 2024-06-30 Laser processing head and laser processing system for laser drilling

Country Status (1)

Country Link
CN (1) CN222754663U (en)

Similar Documents

Publication Publication Date Title
CN201783759U (en) Optical fiber laser or disc laser dynamic focusing scanning spot trajectory processing system
CN103658975B (en) Laser beam splitting and processing device
JP5114874B2 (en) Laser welding method and laser welding apparatus
CN111496393A (en) Taper-controllable micro-group hole efficient laser processing method
CN106312335B (en) A kind of laser drill and drilling fill system and method
CN110695523B (en) Laser scanning device
CN206241474U (en) A kind of laser processing device
CN101419336A (en) Mirror-vibrating laser three-dimensional scanning system
CN105163897A (en) Coordination of beam angle and workpiece movement for taper control
CN104668785A (en) Laser rapid drilling device and laser rapid drilling method
CN101913024A (en) Optical fiber laser or disk laser dynamic focus scanning point track processing system and method
CN106994561A (en) A kind of dynamic rotary marking control system and control method
CN114080293B (en) Laser processing device, laser processing system, rotator unit device, laser processing method, and probe card production method
CN114535788B (en) A statically focused glass nanosecond laser hole cutting system and hole cutting method
CN110133842B (en) Galvanometer scanning device and system
CN113634769A (en) Metal SLM printing system based on Gaussian beam and beam shaping composite beam
CN115453767A (en) A kind of point ring distribution laser optical system and using method
CN101380696A (en) A thin-walled tube laser micro-cutting device and method
CN117718610A (en) Laser drilling optical system, drilling equipment and drilling method
CN222754663U (en) Laser processing head and laser processing system for laser drilling
WO2022142296A1 (en) Oblique cutting compensation method and system for transparent brittle material
CN205393786U (en) Laser processing head and laser processing device
CN118699608A (en) Laser processing head and laser processing system for laser drilling
CN119016862A (en) A femtosecond laser processing device for processing curved spiral grooves
CN115446481B (en) Precise laser deep hole machining device and machining method

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant