CN222681676U - Auxiliary molding device for injection mold - Google Patents
Auxiliary molding device for injection mold Download PDFInfo
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- CN222681676U CN222681676U CN202420825311.0U CN202420825311U CN222681676U CN 222681676 U CN222681676 U CN 222681676U CN 202420825311 U CN202420825311 U CN 202420825311U CN 222681676 U CN222681676 U CN 222681676U
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Abstract
The utility model belongs to the technical field of injection molds, and particularly relates to an auxiliary forming device of an injection mold, which comprises a first mold and a second mold, wherein the second mold is movably arranged on one side of the first mold, the inner cavities of the first mold and the second mold are respectively provided with a mounting groove, the bottoms of the inner cavities of the mounting grooves are respectively provided with a cooling liquid storage box, the surfaces of the cooling liquid storage boxes are respectively extended out of the inner cavities of the first mold and the second mold, the inner cavities of the mounting grooves are respectively provided with a circulating cooling pipe, the surfaces of the circulating cooling pipes are integrally formed with a contact plate, and the contact plate is abutted against the inner cavity surfaces of the first mold and the second mold.
Description
Technical Field
The utility model relates to the technical field of injection molds, in particular to an auxiliary shaper for an injection mold.
Background
Injection molding, also known as injection molding, is a method of injection and molding. The injection molding method has the advantages of high production speed, high efficiency, automation in operation, multiple patterns, various shapes, large size, accurate product size, easy updating of products, capability of forming products with complex shapes, suitability for mass production, complex-shape products and other molding processing fields, and capability of enabling the workpieces to be rapidly cooled and formed by accelerating the cooling of the die during injection molding of the workpieces.
The cooling device of the existing injection mold needs a circulating structure externally connected with cooling liquid, is large in size and inconvenient to use, and after the cooling liquid absorbs certain heat, the temperature of the cooling liquid can be increased, so that the cooling forming speed of a workpiece is reduced.
Disclosure of utility model
Object of the utility model
In order to solve the technical problems in the background technology, the utility model provides an auxiliary forming device of an injection mold, which is characterized in that cooling liquid is continuously circulated, meanwhile, the cooling capacity generated by a semiconductor refrigerating sheet can be transferred to the inner cavity of a cooling liquid storage box, the cooling liquid can be rapidly cooled, so that the cooling forming speed of a workpiece is improved, and cooling liquid circulation structures are respectively integrated in the inner cavity of the mold, so that the auxiliary forming device is small in size and more convenient to use, and the problems in the background technology are solved.
(II) technical scheme
In order to solve the technical problems, the utility model provides an auxiliary forming device of an injection mold, which comprises a first mold and a second mold, wherein the second mold is movably arranged on one side of the first mold, the inner cavities of the first mold and the second mold are respectively provided with a mounting groove, the bottoms of the inner cavities of the mounting grooves are respectively provided with a cooling liquid storage tank, and the surfaces of the cooling liquid storage tanks extend out of the cavities of the first mold and the second mold respectively;
The inner cavity of the mounting groove is provided with a circulating cooling pipe, the surface of the circulating cooling pipe is integrally formed with a contact plate, the contact plate is abutted against the surfaces of the inner cavities of the first die and the second die, the surfaces of the end parts of the cooling liquid storage box are provided with circulating water pumps, the liquid outlet ends of the circulating water pumps are respectively connected with one end of the circulating cooling pipe, and one end, far away from the circulating water pumps, of the circulating cooling pipe is communicated and connected with the bottom of the side wall of the cooling liquid storage box;
the surface of the cooling liquid storage box is movably provided with semiconductor refrigerating sheets.
Preferably, the surface of the cooling liquid storage box is coated with heat-conducting silicone grease, and the refrigeration surface of the semiconductor refrigeration piece is attached to the surface of the heat-conducting silicone grease.
Preferably, a plurality of groups of through inserting holes are formed in the surface of one side of the cooling liquid storage box at equal intervals, and heat conducting rods are inserted into the cavities of the through inserting holes.
Preferably, one end of the heat conducting rod is abutted against the surface of the refrigerating surface of the semiconductor refrigerating sheet, and the other end of the heat conducting rod is spliced in the inner cavity of the cooling liquid storage box.
Preferably, the side walls of the cooling liquid storage box are embedded with liquid level observation windows, and the liquid level observation windows are respectively arranged on one side of the surfaces of the first die and the second die.
Preferably, the top of the cooling liquid storage box is connected with a liquid injection pipe in a conducting mode, and the top of the liquid injection pipe is connected with a sealing cap in a threaded mode.
Preferably, the surface of the heating surface of the semiconductor refrigeration piece is provided with a cooling fan, the surfaces of two sides of the cooling liquid storage box are rotationally provided with fixing buckles, and the fixing buckles are buckled on the surfaces of two ends of the semiconductor refrigeration piece.
The technical scheme of the utility model has the following beneficial technical effects:
1. According to the utility model, the cooling liquid is continuously circulated, heat in the first die cavity and the second die cavity can be taken away by the cooling liquid, rapid cooling and forming of the workpiece can be realized, the refrigerating surface of the semiconductor refrigerating sheet is contacted with the surface of the cooling liquid storage box through the heat-conducting silicone grease, the cold energy generated by the semiconductor refrigerating sheet can be transferred to the inner cavity of the cooling liquid storage box, the cooling liquid can be rapidly cooled, so that the cooling speed of the workpiece is improved, the cooling liquid circulation structure is respectively integrated in the inner cavities of the first die and the second die, the volume is small, and the use is more convenient.
2. According to the utility model, the heat conducting rod is spliced with the penetrating splicing hole, one end of the heat conducting rod is abutted against the surface of the refrigerating surface of the semiconductor refrigerating sheet, and the other end of the heat conducting rod is spliced in the inner cavity of the cooling liquid storage box, so that the cooling capacity transfer can be accelerated, and the cooling effect on cooling liquid is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of an auxiliary shaper for an injection mold according to the present utility model;
FIG. 2 is a schematic view of the internal structure of an auxiliary injection mold former according to the present utility model;
FIG. 3 is a schematic diagram of a cooling liquid storage tank of an auxiliary molding device of an injection mold;
Fig. 4 is an exploded view of a cooling liquid storage tank of an auxiliary molding machine for an injection mold according to the present utility model.
Reference numerals:
1. A first die; the device comprises a second mould, a cooling liquid storage tank, a circulating water pump, a circulating cooling pipe, a contact plate, a semiconductor refrigerating sheet, a heat dissipation fan, a heat conduction rod, a through inserting hole, heat conduction silicone grease, a liquid level observation window, a liquid injection pipe and a fixing buckle, wherein the second mould is a No. 3 cooling liquid storage tank, the circulating water pump, the circulating cooling pipe, the contact plate, the semiconductor refrigerating sheet, the heat dissipation fan, the heat conduction rod, the through inserting hole, the heat conduction silicone grease, the liquid level observation window, the liquid injection pipe and the fixing buckle.
Detailed Description
The objects, technical solutions and advantages of the present utility model will become more apparent by the following detailed description of the present utility model with reference to the accompanying drawings. It should be understood that the description is only illustrative and is not intended to limit the scope of the utility model. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the present utility model.
As shown in fig. 1-4, the auxiliary forming device for the injection mold provided by the utility model comprises a first mold 1 and a second mold 2, wherein the second mold 2 is movably arranged on one side of the first mold 1, the inner cavities of the first mold 1 and the second mold 2 are respectively provided with a mounting groove, the bottoms of the inner cavities of the mounting grooves are respectively provided with a cooling liquid storage tank 3, and the surfaces of the cooling liquid storage tanks 3 extend out of the cavities of the first mold 1 and the second mold 2 respectively;
The inner cavity of the mounting groove is provided with a circulating cooling pipe 5, the surface of the circulating cooling pipe 5 is integrally formed with a contact plate 6, the contact plate 6 is abutted against the surfaces of the inner cavities of the first die 1 and the second die 2, the end surfaces of the cooling liquid storage box 3 are provided with a circulating water pump 4, the liquid outlet ends of the circulating water pump 4 are respectively connected with one end of the circulating cooling pipe 5, and one end, far away from the circulating water pump 4, of the circulating cooling pipe 5 is communicated and connected with the bottom of the side wall of the cooling liquid storage box 3;
The surface of the cooling liquid storage tank 3 is movably provided with a semiconductor refrigerating sheet 7.
After the first die 1 and the second die 2 are closed, the cooling liquid in the cooling liquid storage tank 3 is pumped by respectively controlling the circulating water pump 4, the cooling liquid is injected into the circulating cooling pipe 5, the cooling liquid flows back into the cooling liquid storage tank 3 from the other end of the circulating cooling pipe 5, the surface of the circulating cooling pipe 5 is contacted with the surfaces of the inner walls of the first die 1 and the second die 2 through the contact plate 6, the contact area between the circulating cooling pipe 5 and the inner walls of the first die 1 and the second die 2 can be increased, the cooling liquid is continuously circulated, the heat in the die cavities of the first die 1 and the second die 2 can be taken away by the cooling liquid, the rapid cooling forming of a workpiece can be realized, the refrigerating surface of the semiconductor refrigerating sheet 7 is contacted with the surface of the cooling liquid storage tank 3 through the heat-conducting silicone grease 11, the cold generated by the semiconductor refrigerating sheet 7 can be transferred into the inner cavity of the cooling liquid storage tank 3, the cooling liquid can be rapidly cooled, the cooling speed of the workpiece can be increased,
In this embodiment, as shown in fig. 3 and fig. 4, the surface of the cooling liquid storage tank 3 is coated with heat-conducting silicone grease 11, the cooling surface of the semiconductor refrigeration sheet 7 is attached to the surface of the heat-conducting silicone grease 11, a plurality of groups of penetrating insertion holes 10 are formed in the surface of one side of the cooling liquid storage tank 3 at equal intervals, the inner cavities of the penetrating insertion holes 10 are respectively inserted with a heat conducting rod 9, one end of each heat conducting rod 9 is abutted to the surface of the cooling surface of the semiconductor refrigeration sheet 7, and the other end of each heat conducting rod 9 is inserted into the inner cavity of the cooling liquid storage tank 3.
It should be noted that, the heat conducting rod 9 is inserted into the through insertion hole 10, and one end of the heat conducting rod is abutted against the surface of the refrigerating surface of the semiconductor refrigerating sheet 7, and the other end of the heat conducting rod is inserted into the inner cavity of the cooling liquid storage box 3, so that the cooling capacity transfer can be accelerated, and the cooling effect on the cooling liquid can be improved.
In this embodiment, as shown in fig. 3 and fig. 4, the side walls of the cooling liquid storage tank 3 are embedded with liquid level observation windows 12, the liquid level observation windows 12 are respectively connected with one side of the surfaces of the first die 1 and the second die 2 in a conducting manner, the top of the cooling liquid storage tank 3 is connected with a liquid injection pipe 13, and the top of the liquid injection pipe 13 is connected with a sealing cap in a threaded manner.
The liquid level observation window 12 may penetrate the liquid level of the cooling liquid, and after the cooling liquid is lost, the cooling liquid may be rapidly replenished through the liquid filling pipe 13.
In this embodiment, as shown in fig. 3 and fig. 4, the heat dissipation fans 8 are installed on the surface of the heating surface of the semiconductor refrigeration sheet 7, and the fixing buckles 14 are rotatably disposed on the surfaces of both sides of the cooling liquid storage tank 3, and the fixing buckles 14 are buckled on the surfaces of both ends of the semiconductor refrigeration sheet 7.
The semiconductor refrigeration sheet 7 is fixed by the fixing buckle 14, so that the semiconductor refrigeration sheet 7 can be conveniently detached.
The working principle and the using flow of the utility model are as follows: after the first die 1 and the second die 2 are matched, cooling liquid in the cooling liquid storage tank 3 is extracted by respectively controlling the circulating water pump 4, the cooling liquid is injected into the circulating cooling pipe 5, the cooling liquid flows back into the cooling liquid storage tank 3 from the other end of the circulating cooling pipe 5, the surface of the circulating cooling pipe 5 is contacted with the surfaces of the inner walls of the first die 1 and the second die 2 through the contact plate 6, the contact area between the circulating cooling pipe 5 and the inner walls of the first die 1 and the second die 2 can be increased, the cooling liquid is continuously circulated, heat in the die cavities of the first die 1 and the second die 2 can be taken away by the cooling liquid, rapid cooling forming of workpieces can be realized, the refrigerating surface of the semiconductor refrigerating sheet 7 is contacted with the surface of the cooling liquid storage tank 3 through the heat conduction silicone grease 11, and the cooling capacity generated by the semiconductor refrigerating sheet 7 can be transferred to the inner cavity of the cooling liquid storage tank 3, the cooling liquid can be rapidly cooled to improve the cooling speed of the workpiece, the heat conducting rod 9 is spliced with the penetrating spliced holes 10, one end of the heat conducting rod is abutted against the surface of the cooling surface of the semiconductor refrigerating sheet 7, the other end of the heat conducting rod is spliced in the inner cavity of the cooling liquid storage box 3, the cooling capacity transfer can be accelerated to improve the cooling effect of the cooling liquid, the cooling fan 8 can cool the heating surface of the semiconductor refrigerating sheet 7, the semiconductor refrigerating sheet 7 can be fixed through the fixing buckle 14, the semiconductor refrigerating sheet 7 can be conveniently detached, the liquid level observation window 12 can penetrate the liquid level of the cooling liquid, the cooling liquid can be rapidly supplemented through the liquid injection pipe 13 after the cooling liquid is consumed, the cooling liquid circulation structure is respectively integrated in the inner cavities of the first die 1 and the second die 2, the volume is small, the use is more convenient.
It is to be understood that the above-described embodiments of the present utility model are merely illustrative of or explanation of the principles of the present utility model and are in no way limiting of the utility model. Accordingly, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the present utility model should be included in the scope of the present utility model. Furthermore, the appended claims are intended to cover all such changes and modifications that fall within the scope and boundary of the appended claims or the equivalents of such scope and boundary.
Claims (7)
1. The auxiliary forming device of the injection mold comprises a first mold (1) and a second mold (2), wherein the second mold (2) is movably arranged on one side of the first mold (1), and the auxiliary forming device is characterized in that mounting grooves are formed in inner cavities of the first mold (1) and the second mold (2), a cooling liquid storage tank (3) is arranged at the bottom of each inner cavity of the mounting groove, and cavities of the first mold (1) and the second mold (2) extend out of the surfaces of the cooling liquid storage tank (3) respectively;
the inner cavity of the mounting groove is provided with a circulating cooling pipe (5), the surface of the circulating cooling pipe (5) is integrally formed with a contact plate (6), the contact plate (6) is abutted against the surfaces of the inner cavities of a first die (1) and a second die (2), the end surfaces of the cooling liquid storage box (3) are provided with a circulating water pump (4), the liquid outlet ends of the circulating water pump (4) are respectively connected with one end of the circulating cooling pipe (5), and one end, far away from the circulating water pump (4), of the circulating cooling pipe (5) is respectively connected with the bottom of the side wall of the cooling liquid storage box (3) in a conducting manner;
The surface of the cooling liquid storage box (3) is movably provided with semiconductor refrigerating sheets (7).
2. The auxiliary forming device for the injection mold according to claim 1, wherein the surfaces of the cooling liquid storage tanks (3) are coated with heat-conducting silicone grease (11), and the refrigerating surface of the semiconductor refrigerating sheet (7) is attached to the surface of the heat-conducting silicone grease (11).
3. The auxiliary shaper for the injection mold according to claim 2, wherein a plurality of groups of penetrating insertion holes (10) are formed in one side surface of the cooling liquid storage box (3) at equal intervals, and heat conducting rods (9) are inserted into inner cavities of the penetrating insertion holes (10).
4. An auxiliary shaper for an injection mold according to claim 3, wherein one end of the heat conducting rod (9) is abutted against the surface of the refrigerating surface of the semiconductor refrigerating sheet (7), and the other end of the heat conducting rod (9) is inserted into the inner cavity of the cooling liquid storage tank (3).
5. The auxiliary forming device for the injection mold according to claim 4, wherein the side walls of the cooling liquid storage tank (3) are embedded with liquid level observation windows (12), and the liquid level observation windows (12) are respectively connected with one side of the surfaces of the first mold (1) and the second mold (2).
6. The auxiliary injection mold forming device according to claim 5, wherein the top parts of the cooling liquid storage tanks (3) are respectively connected with a liquid injection pipe (13) in a conducting mode, and the top parts of the liquid injection pipes (13) are respectively connected with a sealing cap in a threaded mode.
7. The auxiliary forming device for the injection mold according to claim 6, wherein the heat radiating fans (8) are arranged on the surfaces of the heating surfaces of the semiconductor refrigerating sheets (7), fixing buckles (14) are rotatably arranged on the surfaces of two sides of the cooling liquid storage tank (3), and the fixing buckles (14) are buckled on the surfaces of two ends of the semiconductor refrigerating sheets (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420825311.0U CN222681676U (en) | 2024-04-20 | 2024-04-20 | Auxiliary molding device for injection mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420825311.0U CN222681676U (en) | 2024-04-20 | 2024-04-20 | Auxiliary molding device for injection mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222681676U true CN222681676U (en) | 2025-03-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420825311.0U Active CN222681676U (en) | 2024-04-20 | 2024-04-20 | Auxiliary molding device for injection mold |
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| Country | Link |
|---|---|
| CN (1) | CN222681676U (en) |
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2024
- 2024-04-20 CN CN202420825311.0U patent/CN222681676U/en active Active
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